AXE7, 8 For board-to-FPC A35S Series Narrow pitch connectors (0.35mm pitch) FEATURES 1. Small size (Terminal pitch: 0.35 mm, width: 2.5 mm and Mated height: 0.8 mm) When mated, the footprint is reduced by approx. 10% from A4S series (60 pin contacts), contributing to the functionality enhancement and size reduction of end equipment. 2. " " ensures high resistance to various environments in lieu of its spacesaving footprint. Ni barrier construction Bellows contact construction (Against solder rise!) (Against dropping!) 0m 2. Header m m 5m 2. Socket Suction face: 0.7mm Porosity treatment (Against corrosive gases!) ) s) cts act nta cont o c n pin 0 pi (60 m (6 Socket m m 0m .85 .5 12 S 14 A4 Soldering terminals at each corner RoHS compliant 2. 5m m Suction face: 0.7mm m 0m 2. ts) ts) tac tac on con c pin pin (60 60 Header m m( m m .15 .8 12 S 13 A4 Soldering terminals at each corner V notch and Double contact constructions (Against foreign particles and flux!) 3. Low-profile connector with up to 120 pin contacts. 4. Soldering terminals at each corner enhance mounting strength. 5. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. 6. Gull-wing-shaped terminals to facilitate visual inspections. APPLICATIONS Suitable for board-to-FPC connections in mobile equipment that requires size and thickness reduction and functionality enhancement. ORDERING INFORMATION AXE 1 2 4 7: Narrow Pitch Connector A35S (0.35 mm pitch) Socket 8: Narrow Pitch Connector A35S (0.35 mm pitch) Header Number of pins (2 digits) Mated height <Socket> / <Header> 1: For mated height 0.8 mm Functions 2: Without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 4: Base: Ni plating, Surface: Au plating (for Ni barrier available) <Header> 4: Base: Ni plating, Surface: Au plating ACCTB2E 201201-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e AXE7, 8 PRODUCT TYPES Mated height Number of pins 0.8mm 24 30 34 50 60 64 100 120 Part number Socket AXE724124 AXE730124 AXE734124 AXE750124 AXE760124 AXE764124 AXE700124 AXE7A2124 Packing Header AXE824124 AXE830124 AXE834124 AXE850124 AXE860124 AXE864124 AXE800124 AXE8A2124 Inner carton (1-reel) Outer carton 5,000 pieces 10,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units Samples for mounting check: 50-connector units. Please contact our sales office. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. 3. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Specifications 0.25A/pin contact (Max. 4 A at total pin contacts) 60V AC/DC Breakdown voltage 150V AC for 1 min. Insulation resistance Min. 1,000M (initial) Contact resistance Max. 100m Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Max. 0.981N/pin contacts x pin contacts (initial) Min. 0.165N/pin contacts x pin contacts Soldering heat resistance Storage temperature Environmental characteristics Thermal shock resistance (header and socket mated) Lifetime characteristics Unit weight Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No freezing at low temperatures. No dew condensation. -55C to +85C Peak temperature: 260C or less (on the surface of the PC board around the connector terminals) 300C within 5 sec. 350C within 3 sec. -55C to +85C (product only) -40C to +50C (emboss packing) Insertion and removal life 30 times Infrared reflow soldering Soldering iron No freezing at low temperatures. No dew condensation. Sequence 1. -55 -30 C, 30 minutes 2. ~ , Max. 5 minutes 3. 85 +30 C, 30 minutes 4. ~ , Max. 5 minutes 5 cycles, insulation resistance min. 100M, contact resistance max. 100m H2S resistance (header and socket mated) Saltwater spray resistance (header and socket mated) No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 250V DC megger (applied for 1 min.) Min. 0.20N/pin contacts 120 hours, insulation resistance min. 100M, contact resistance max. 100m 24 hours, insulation resistance min. 100M, contact resistance max. 100m 48 hours, contact resistance max. 100m Humidity resistance (header and socket mated) Conditions Bath temperature 402C, humidity 90 to 95% R.H. Bath temperature 352C, saltwater concentration 51% Bath temperature 402C, gas concentration 31 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours 60 pin contact type: Socket: 0.03 g Header: 0.02 g 2. Material and surface treatment Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Copper alloy Surface treatment -- Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e ACCTB2E 201201-T AXE7, 8 DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e Socket (Mated height: 0.8 mm) 0.70 (Suction face) CAD Data Terminal coplanarity A 0.77 B0.1 0.08 0.350.05 (Contact and soldering terminals) 2.50 1.72 (0.39) 2.20 0.120.03 Dimension table (mm) (0.90) 2.50 Y note 1.06 Z note 0.300.03 C0.1 General tolerance: 0.2 Number of pins/ dimension 24 6.55 3.85 5.45 30 34 50 60 64 100 120 7.60 8.30 11.10 12.85 13.55 19.85 23.35 4.90 5.60 8.40 10.15 10.85 17.15 20.65 6.50 7.20 10.00 11.75 12.45 18.75 22.25 A B C Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected. Header (Mated height: 0.8 mm) 0.70 (Suction face) CAD Data Terminal coplanarity 0.65 A 0.08 B0.1 (Post and soldering terminals) 2.00 (0.36) 1.42 1.28 0.350.05 0.120.03 0.84 0.120.03 (0.31) 1.46 Soldering terminals Soldering terminals Dimension table (mm) C0.1 General tolerance: 0.2 Number of pins/ dimension 24 A B C 5.85 3.85 5.25 30 34 50 60 64 100 120 6.90 7.60 10.40 12.15 12.85 19.15 22.65 4.90 5.60 8.40 10.15 10.85 17.15 20.65 6.30 7.00 9.80 11.55 12.25 18.55 22.05 Header 0.800.1 * Socket and Header are mated Socket ACCTB2E 201201-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e AXE7, 8 EMBOSSED TAPE DIMENSIONS (Unit: mm) * Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) * Specifications for taping (In accordance with JIS C 0806-1999. However, not applied to the mounting-hole pitch of some connectors.) Tape II (A +0.3 -0.1 ) (A0.3) (B) (D1) (4.0) Top cover tape Embossed carrier tape (2.0) (4.0) (C) (1.75) (2.0) Leading direction after packaging (C) (1.75) 380 dia. Tape I Embossed mounting-hole 8.0 8.0 Taping reel 1. 1. 5 +0 5 +0 0 .1 0 .1 di di a. a. * Dimension table (Unit: mm) Type/Mated height Number of pins Type of taping A B C D Quantity per reel Common for sockets and headers 0.8mm 24 30 to 64 100 120 Tape I Tape I Tape II Tape II 16.0 24.0 32.0 44.0 -- -- 28.4 40.4 7.5 11.5 14.2 20.2 17.4 25.4 33.4 45.4 5,000 5,000 5,000 5,000 * Connector orientation with respect to embossed tape feeding direction Type Common for A35S Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. NOTES 2.400.03 (0.65) 0.450.03 0. 30 0.900.03 1.350.03 1.100.03 0.600.03 0.350.03 0.200.03 (0.53) 1.660.03 1.900.03 (0.50) 0.350.03 0.200.03 0.200.03 Recommended PC board pattern (TOP VIEW) 1.060.03 (0.92) * Header (Mated height: 0.8 mm) Recommended PC board pattern (TOP VIEW) 2.900.03 * Socket (Mated height: 0.8 mm) C 0.700.03 : Insulatin area 0.350.01 0.180.01 (0.50) 1.300.01 2.300.01 0.180.01 0.600.01 (0.53) 0.350.01 1.660.01 Metal mask thickness: When 120m (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) (0.39) 2.020.01 2.800.01 Recommended metal mask opening pattern Metal mask thickness: When 120m (Terminal opening ratio: 70%) (Metal-part opening ratio: 100%) 1.060.01 (0.92) Recommended metal mask opening pattern 2.900.01 Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. C 30 0. 0.900.01 1.350.01 0.450.01 0.700.01 Please refer to the latest product specifications when designing your product. Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e ACCTB2E 201201-T NOTES FOR USING ADVANCED SERIES NARROW-PITCH CONNECTORS (Common) Terminal Paste solder PC board foot pattern * Consult us when using a screen-printing thickness other than that recommended. * Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. * The recommended reflow temperature profile is given in the figure below * The temperature is measured on the surface of the PC board near the connector terminal. * Some solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. * When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive (Double reflow soldering on the same side is possible) 3) Reworking on a soldered portion * Finish reworking in one operation. * For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts. * Use a soldering iron whose tip temperature is within the temperature range specified in the specifications. Do not drop or handle the connector carelessly. Otherwise, the terminals may become deformed due to excessive force or applied solderability may be degraded during reflow. Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. When removing the connector, be sure not to tilt the connector exceeding 15 degrees widthwise. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them. Recommended reflow temperature profile When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces. The soldered areas should not be subjected to forces. Notes when using a FPC. * When the connector is soldered to an FPC board, during insertion and removal forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Make sure that the reinforcing plate is larger than the outline of the recommended PC board pattern (Outline + approx. 1 mm). The reinforcing plate is made of SUS, glass epoxy or polyimide that is 0.2 to 0.3 mm thick. This connector employs a simple locking structure. However, the connector may come off depending on the size and weight of the FPC, layout and reaction force of FPC, or by drop impact. Make sure to fully check the equipment's condition. To prevent any problem with loose connectors, adopt measures to prevent the connector from coming off inside the equipment. Other Notes When coating the PC board after soldering the connector (to prevent the deterioration of insulation), perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching. Please refer to the latest product specifications when designing your product. 15 degrees or less Connector mounting Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. Soldering 1) Manual soldering. * Due to the connector's low profile, if an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. * Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. * Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use. * Be aware that a load applied to the connector terminals while soldering may displace the contact. * Thoroughly clean the iron tip. 2) Reflow soldering * Screen-printing is recommended for printing paste solder. * To determine the relationship between the screen opening area and the PCboard foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Temperature 260C 230C 180C 150C Peak temperature Preheating 220C 200C 25 sec. 60 to 120 sec. 70 sec. Time ACCTB11E 201201-T Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e