Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
AXE7, 8
ACCTB2E 201201-T
ORDERING INFORMATION
For board-to-FPC
A35S Series
Narrow pitch connectors
(0.35mm pitch)
FEATURES
1. Small size (Terminal pitch: 0.35 mm,
width: 2.5 mm and Mated height: 0.8
mm)
When mated, the footprint is reduced by
approx. 10% from A4S series (60 pin
contacts), contributing to the functionality
enhancement and size reduction of end
equipment.
2. “ ”
ensures high resistance to various
environments in lieu of its space-
saving footprint.
3. Low-profile connector with up to
120 pin contacts.
4. Soldering terminals at each corner
enhance mounting strength.
5. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
6. Gull-wing-shaped terminals to
facilitate visual inspections.
APPLICATIONS
Suitable for board-to-FPC connections
in mobile equipment that requires size
and thickness reduction and
functionality enhancement.
Socket Header
2.0mm
2.5mm
RoHS compliant
Suction face: 0.7mm
Suction face: 0.7mm
2.5mm
2.0mm
Header
Socket
Soldering terminals
at each corner
Soldering terminals
at each corner
12.85 mm (60 pin contacts)
A4S 14.50 mm (60 pin contacts)
12.15 mm (60 pin contacts)
A4S 13.8 mm (60 pin contacts)
Bellows contact
construction
(Against dropping!)
Ni barrier
construction
(Against solder rise!)
Porosity treatment
(Against corrosive gases!)
V notch and Double contact constructions
(Against foreign particles and flux!)
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
7: Narrow Pitch Connector A35S (0.35 mm pitch) Socket
8: Narrow Pitch Connector A35S (0.35 mm pitch) Header
Mated height
<Socket> / <Header>
1: For mated height 0.8 mm
AXE 421
Number of pins (2 digits)
Functions
2: Without positioning bosses
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
AXE7, 8
ACCTB2E 201201-T
PRODUCT TYPES
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Mated height Number of pins Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.8mm
24 AXE724124 AXE824124
5,000 pieces 10,000 pieces
30 AXE730124 AXE830124
34 AXE734124 AXE834124
50 AXE750124 AXE850124
60 AXE760124 AXE860124
64 AXE764124 AXE864124
100 AXE700124 AXE800124
120 AXE7A2124 AXE8A2124
Item Specifications Conditions
Electrical
characteristics
Rated current 0.25A/pin contact (Max. 4 A at total pin contacts)
Rated voltage 60V AC/DC
Breakdown voltage 150V AC for 1 min. No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 100mΩBased on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 0.981N/pin contacts × pin contacts (initial)
Composite removal force Min. 0.165N/pin contacts × pin contacts
Contact holding force
(Socket contact) Min. 0.20N/pin contacts Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient temperature –55°C to +85°C No freezing at low temperatures. No dew condensation.
Soldering heat resistance
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals) Infrared reflow soldering
300°C within 5 sec. 350°C within 3 sec. Soldering iron
Storage temperature –55°C to +85°C (product only)
–40°C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Sequence
1. –55 °C, 30 minutes
2. ~ , Max. 5 minutes
3. 85 °C, 30 minutes
4. ~ , Max. 5 minutes
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Bath temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 100mΩ
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics Insertion and removal life 30 times Repeated insertion and removal speed of max. 200 times/
hours
Unit weight 60 pin contact type: Socket: 0.03 g Header: 0.02 g
Part name Material Surface treatment
Molded
portion
LCP resin
(UL94V-0) —
Contact and
Post Copper alloy
Contact portion:
Base: Ni plating, Surface: Au plating
Te r minal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
0
−3
+3
0
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
AXE7, 8
ACCTB2E 201201-T
DIMENSIONS (Unit: mm)
• Socket and Header are mated
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e
Socket (Mated height: 0.8 mm)
0.08
(Contact and soldering terminals)
Te r minal coplanarity
Y note
Z note
0.77
2.20
A
B±0.1
0.12±0.03
0.35±0.05
0.70 (Suction face)
0.30±0.03
C±0.1
(0.90)
1.06
(0.39)
2.50
2.50
1.72
General tolerance: ±0.2
Note: Since the soldering terminals has a single-piece construction, sections Y and Z are electrically connected.
Dimension table (mm)
Number of pins/
dimension A B C
24 6.55 3.85 5.45
30 7.60 4.90 6.50
34 8.30 5.60 7.20
50 11.10 8.40 10.00
60 12.85 10.15 11.75
64 13.55 10.85 12.45
100 19.85 17.15 18.75
120 23.35 20.65 22.25
CAD Data
Header (Mated height: 0.8 mm)
0.08
(Post and soldering terminals)
Te r minal coplanarity
Soldering terminals
Soldering terminals
0.65
0.12±0.03
C±0.1
(0.31)
0.84
1.46
1.42
0.70 (Suction face)
0.12±0.03
0.35±0.05
B±0.1
A
(0.36)
2.00
1.28
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension A B C
24 5.85 3.85 5.25
30 6.90 4.90 6.30
34 7.60 5.60 7.00
50 10.40 8.40 9.80
60 12.15 10.15 11.55
64 12.85 10.85 12.25
100 19.15 17.15 18.55
120 22.65 20.65 22.05
CAD Data
Socket
Header
0.80±0.1
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
AXE7, 8
ACCTB2E 201201-T
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Dimension table (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
NOTES
Type/Mated height Number of pins Type of taping A B C D Quantity per reel
Common for sockets and headers
0.8mm
24 Tape I 16.0 — 7.5 17.4 5,000
30 to 64 Tape I 24.0 — 11.5 25.4 5,000
100 Tape II 32.0 28.4 14.2 33.4 5,000
120 Tape II 44.0 40.4 20.2 45.4 5,000
• Specifications for taping
(In accordance with JIS C 0806-1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(A±0.3)
8.0 (2.0) (4.0)
(B)
(C)
(1.75)
Leading direction after packaging
(A )
+0.3
−0.1
8.0 (2.0) (4.0)
(C)
(1.75)
Tape I Tape II
1.5+0.1
0 dia.
1.5+0.1
0 dia.
Embossed mounting-hole
Taping reel
Top cover tape
Embossed carrier tape
(D±1)
380 dia.
Type
Direction
of tape progress
Common for A35S
Socket Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
• Socket (Mated height: 0.8 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
• Header (Mated height: 0.8 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask opening pattern
Metal mask thickness: When 120µm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.20±0.03
1.06±0.03
2.90±0.03
(0.50)
(0.92)
0.35±0.03
0.90±0.03
1.35±0.03
1.90±0.03
0.20±0.03
C 0.30
: Insulatin
area
1.06±0.01
2.90±0.01
1.35±0.01
0.90±0.01
0.35±0.01
(0.92)
C 0.30
2.80±0.01
0.18±0.01
(0.39)
2.02±0.01
Please refer to the latest product
specifications when designing your
product.
0.35±0.03
0.45±0.03
0.70±0.03
0.60±0.03
1.66±0.03
(0.53)
(0.65)
1.10±0.03
2.40±0.03
0.20±0.03
(0.53)
(0.50)
0.70±0.01
0.60±0.01
1.66±0.01
0.45±0.01
0.35±0.01
2.30±0.01
0.18±0.01
1.30±0.01
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e
ACCTB11E 201201-T
NOTES FOR USING ADVANCED SERIES
NARROW -PITCH CONNECT ORS
(Common)
Connector mounting
Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
Soldering
1) Manual soldering.
• Due to the connector’s low profile, if an
excessive amount of solder is applied
during manual soldering, the solder may
creep up near the contact points, or
solder interference may cause imperfect
contact.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire ma y adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
• To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. A v oid an excessiv e
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
Recommended reflow temperature profile
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• Some solder and flux types may cause
serious solder creeping. Solder and flux
characteristics should be taken into
consideration when setting the reflow
soldering conditions.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
Do not drop or handle the
connector carelessly. Otherwise, the
terminals may become deformed due
to excessive force or applied
solderability may be degraded during
reflow.
Do not insert or remove the
connector when it is not soldered.
Forcibly applied external pressure on
the terminals can weaken the
adherence of the terminals to the
molded part or cause the terminals to
lose their evenness.
Excessive prying-force applied to
one end may cause product breakage
and separation of the solder joints at
the terminal.
When removing the connector, be
sure not to tilt the connector
exceeding 15 degrees widthwise.
Excessive force applied for insertion
in a pivot action as shown may also
cause product breakage.
Align the header and socket positions
before connecting them.
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive forces.
Notes when using a FPC.
• When the connector is soldered to an
FPC board, during insertion and removal
forces may be applied to the terminals
and cause the soldering to come off. It is
recommended to use a reinforcement
board on the backside of the FPC board
to which the connector is being
connected. Mak e sure that the reinforcing
plate is larger than the outline of the
recommended PC board pattern (Outline
+ appro x. 1 mm). The reinforcing plate is
made of SUS, glass epoxy or polyimide
that is 0.2 to 0.3 mm thick.
This connector employs a simple locking
structure. However, the connector may
come off depending on the size and
weight of the FPC, layout and reaction
force of FPC, or by drop impact. Make
sure to fully check the equipment’s
condition. To prevent any problem with
loose connectors, adopt measures to
prevent the connector from coming off
inside the equipment.
Other Notes
When coating the PC board after
soldering the connector (to prevent the
deterioration of insulation), perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
Terminal Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Time
Temperature Peak temperature
200°C
220°C
Upper limit (Soldering heat resistance)
260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limit (Solder wettability)
15 degrees
or less
Please refer to the latest product
specifications when designing your
product.
The soldered areas should not be subjected to forces.
