4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 Features 3.0V Core Async/Page PSRAM Memory MT45V256KW16PEGA Features Figure 1: * Asynchronous and page mode interface * Random access time: 55ns and 70ns * VCC, VCCQ voltages - 2.7-3.6V VCC - 2.7-3.6V VCCQ * Page mode read access - 16-word page size - Interpage read access: 55ns and 70ns - Intrapage read access: 15ns and 20ns * Low power consumption - Asynchronous READ: <30mA - Intrapage READ: <18mA - Standby: <140A - Deep power-down (DPD): <45A (TYP at 25C) * Low-power features - Partial-array refresh (PAR) - DPD mode Options Designator * Configuration - 256K x 16 * Package - 48-ball VFBGA ("green") * Access time - 55ns - 70ns * Operating temperature range - Wireless (-30C to +85C) - Industrial (-40C to +85C) PDF: 09005aef832450a3/Source: 09005aef82f264aa 8mb_4mb_ap_3v_psram_p22z__1.fm - Rev. B 4/08 EN 48-Ball VFBGA Ball Assignments 1 2 3 4 5 6 A LB# OE# A0 A1 A2 ZZ# B DQ8 UB# A3 A4 CE# DQ0 C DQ9 DQ10 A5 A6 DQ1 DQ2 D VssQ DQ11 A17 A7 DQ3 Vcc E VccQ DQ12 NC A16 DQ4 Vss F DQ14 DQ13 A14 A15 DQ5 DQ6 G DQ15 NC A12 A13 WE# DQ7 H DNU A8 A9 A10 A11 NC MT45V256KW16PE Top view (Ball down) GA -55 -70 Part Number Example: MT45V256KW16PEGA-55WT WT IT 1 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 Table of Contents Table of Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Designator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 List of Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Ball Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Device Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Power-Up Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Bus Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Asynchronous Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Page Mode READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 LB#/UB# Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Low-Power Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Standby Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Partial-Array Refresh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Deep Power-Down Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Configuration Register Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Access Using ZZ# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Software Access to the Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Maximum and Typical Standby Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Timing Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 PDF: 09005aef832450a3/Source: 09005aef82f264aa 4mb_ap_3v_psram_p22zTOC.fm - Rev. B 4/08 EN 2 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 List of Figures List of Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: 48-Ball VFBGA Ball Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Functional Block Diagram 256K x 16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Part Number Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Power-Up Initialization Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 WRITE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Page Mode READ Operation (ADV = LOW). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Software Access PAR Functionality. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Configuration Register Bit Mapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Load Configuration Register Operation Using ZZ#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Load Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Read Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Typical Refresh Current vs. Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 AC Input/Output Reference Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Output Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Power-Up Initialization Period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Load Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Deep Power-Down Entry and Exit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Single READ Operation (WE# = VIH). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Page Mode READ Operation (WE# = VIH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 WRITE Cycle (WE# Control) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 WRITE Cycle (CE# Control) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 WRITE Cycle (LB#/UB# Control). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 48-Ball VFBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 PDF: 09005aef832450a3/Source: 09005aef82f264aa 4mb_ap_3v_psram_p22zLOF.fm - Rev. B 4/08 EN 3 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 List of Tables List of Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: VFBGA Ball Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Electrical Characteristics and Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Deep Power-Down Specifications and Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Capacitance Specifications and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 READ Cycle Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 WRITE Cycle Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Load Configuration Register Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Deep Power-Down Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Initialization Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 PDF: 09005aef832450a3/Source: 09005aef82f264aa 4mb_ap_3v_psram_p22zLOT.fm - Rev. B 4/08 EN 4 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 General Description General Description Micron(R) PSRAM products are high-speed, CMOS memory devices developed for lowpower, portable applications. The MT45V256KW16PE is a 4Mb DRAM core device organized as 256K x 16 bits. These devices include the industry-standard, asynchronous memory interface found on other low-power SRAM or pseudo-SRAM (PSRAM) offerings. For seamless operation on an asynchronous memory bus, PSRAM products incorporate a transparent self refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device read/write performance. A user-accessible configuration register (CR) defines how the PSRAM device performs on-chip refresh and whether page mode read accesses are permitted. This register is automatically loaded with a default setting during power-up and can be updated at any time during normal operation. Special attention has been focused on current consumption during self refresh. This product includes two system-accessible mechanisms to minimize refresh current. Setting sleep enable (ZZ#) to LOW enables one of two low-power modes: partial-array refresh (PAR) or deep power-down (DPD). PAR limits refresh to only that part of the DRAM array that contains essential data. DPD halts refresh operation altogether and is used when no vital information is stored in the device. The system-configurable refresh mechanisms are accessed through the CR. Functional Block Diagram Figure 2: Functional Block Diagram 256K x 16 A[17:0] Address decode logic Configuration register (CR) 256K x 16 DRAM memory array Input/ output MUX and buffers DQ[7:0] DQ[15:8] CE# WE# OE# UB# Control logic LB# ZZ# Notes: 1. Functional block diagrams illustrate simplified device operation. See the ball description table, bus operations table, and timing diagrams for detailed information. PDF: 09005aef832450a3/Source: 09005aef82f264aa 8mb_4mb_ap_3v_psram_p22z__2.fm - Rev. B 4/08 EN 5 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 Ball Descriptions Ball Descriptions Table 1: VFBGA Ball Descriptions VFBGA Ball Assignment Symbol Type Description D3, E4, F4, F3, G4, G3, H5, H4, H3, H2, D4, C4, C3, B4, B3, A5, A4, A3 B5 A[17:0] Input Address inputs: Inputs for the address accessed during READ or WRITE operations. The address lines are also used to define the value to be loaded into the CR. CE# Input A1 A2 LB# OE# Input Input B2 G5 A6 UB# WE# ZZ# Input Input Input G1, F1, F2, E2, D2, C2, C1, B1, G6, F6, F5, E5, D5, C6, C5, B6 D6 E1 E6 D1 E3, G2, H6 H1 DQ[15:0] Input/ Output Chip enable: Activates the device when LOW. When CE# is HIGH, the device is disabled and goes into standby power mode. Lower byte enable: DQ[7:0]. Output enable: Enables the output buffers when LOW. When OE# is HIGH, the output buffers are disabled. Upper byte enable: DQ[15:8]. Write enable: Enables WRITE operations when LOW. Sleep enable: When ZZ# is LOW, the CR can be loaded, or the device can enter one of two low-power modes (DPD or PAR). Data inputs/outputs. VCC VCCQ VSS VSSQ NC DNU Supply Supply Supply Supply - - PDF: 09005aef832450a3/Source: 09005aef82f264aa 8mb_4mb_ap_3v_psram_p22z__2.fm - Rev. B 4/08 EN Device power supply (2.7-3.6V): Power supply for device core operation. I/O power supply (2.7-3.6V): Power supply for input/output buffers. VSS must be connected to ground. VSSQ must be connected to ground. No connect: Not internally connected. Do not use: DNUs must be left unconnected or tied to ground. 6 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 Bus Operations Bus Operations Table 2: Bus Operations Mode Standby Read Write No operation PAR DPD Load configuration register Notes: Power CE# WE# OE# LB#/UB# ZZ# DQ[15:0]1 Notes Standby Active Active Idle Partial-array refresh Deep power-down Active H L L L H H L X H L X X X L X L X X X X X X L L X X X X H H H H L L L High-Z Data-out Data-in X High-Z High-Z High-Z 2, 5 1, 4 1, 3, 4 4, 5 6 6 1. When LB# and UB# are in select mode (LOW), DQ[15:0] are affected. When LB# alone is in select mode, only DQ[7:0] are affected. When UB# alone is in the select mode, only DQ[15:8] are affected. 2. When the device is in standby mode, control inputs (WE#, OE#), address inputs, and data inputs/outputs are internally isolated from any external influence. 3. When WE# is active, the OE# input is internally disabled and has no effect on the I/Os. 4. The device will consume active power in this mode whenever addresses are changed. 5. VIN = VCCQ or 0V; all device balls must be static (unswitched) to achieve minimum standby current. 6. DPD is enabled when configuration register bit CR[4] is "0"; otherwise, PAR is enabled. PDF: 09005aef832450a3/Source: 09005aef82f264aa 8mb_4mb_ap_3v_psram_p22z__2.fm - Rev. B 4/08 EN 7 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 Part Numbering Information Part Numbering Information Micron PSRAM devices are available in several configurations and densities (see Figure 3). Figure 3: Part Number Chart MT 45 V 256K W 16 PE GA -55 Micron Technology WT ES Production Status Blank = Production Product Family ES = Engineering sample 45 = PSRAM memory MS = Mechanical sample Operating Core Voltage Operating Temperature V = 2.7V-3.6V WT = -30C to +85C IT = -40C to +85C Address Locations Standby Power Options K = Kilobits Blank = Standard Operating Voltage Access/Cycle Time W = 2.7V-3.6V 55 = 55ns Bus Configuration 70 = 70ns 16 = x16 READ/WRITE Operation Mode PE = Asynchronous/Page Package Codes GA = VFBGA "Green" (6 x 8 grid, 0.75mm pitch, 6.0mm x 8.0mm x 1.0mm) 48-ball Valid Part Number Combinations After building the part number using the part numbering chart, visit the Micron Web site at www.micron.com/psram to verify that the part number is offered and valid. If the device required is not on this list, contact the factory. Device Marking Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting of a five-digit alphanumeric code is used. The abbreviated device marks are cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: www.micron.com/decoder. To view the location of the abbreviated mark on the device, refer to customer service note CSN-11, "Product Mark/Label," at www.micron.com/csn. PDF: 09005aef832450a3/Source: 09005aef82f264aa 8mb_4mb_ap_3v_psram_p22z__2.fm - Rev. B 4/08 EN 8 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 Functional Description Functional Description In general, MT45V256KW16PE devices are high-density alternatives to SRAM and PSRAM products that are popular in low-power, portable applications. MT45V256KW16PE devices contain an 4,194,304-bit DRAM core organized as 262,144 addresses by 16 bits. These devices include the industry-standard, asynchronous memory interface found on other low-power SRAM or PSRAM offerings. Page mode access is also supported as a bandwidth-enhancing extension to the asynchronous read protocol. Power-Up Initialization Micron PSRAM products include an on-chip voltage sensor that is used to launch the power-up initialization process. Initialization will load the CR with its default setting. VCC and VCCQ must be applied simultaneously, and when they reach a stable level above 1.7V, the device will require 150s to complete its self-initialization process (see Figure 4). During the initialization period, CE# should remain HIGH. When initialization is complete, the device is ready for normal operation. Figure 4: Power-Up Initialization Timing Vcc (MIN) Vcc, VccQ = 2.7V tPU Device ready for normal operation Bus Operating Modes The MT45V256KW16PE PSRAM product incorporates the industry-standard, asynchronous interface. This bus interface supports asynchronous READ and WRITE operations as well as page mode READ operation for enhanced bandwidth. The supported interface is defined by the value loaded into the CR. Asynchronous Mode Micron PSRAM products power up in the asynchronous operating mode. This mode uses the industry-standard SRAM control interface (CE#, OE#, WE#, and LB#/UB#). READ operations are initiated by bringing CE#, OE#, and LB#/UB# LOW while keeping WE# HIGH (see Figure 5 on page 10). Valid data will be driven out of the I/Os after the specified access time has elapsed. WRITE operations occur when CE#, WE#, and LB#/ UB# are driven LOW (see Figure 6 on page 10). During WRITE operations, the level of OE# is a "Don't Care"; WE# overrides OE#. The data to be written is latched on the rising edge of CE#, WE#, or LB#/UB#, whichever occurs first. WE# LOW time must be limited to t CEM. PDF: 09005aef832450a3/Source: 09005aef82f264aa 8mb_4mb_ap_3v_psram_p22z__2.fm - Rev. B 4/08 EN 9 Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2007 Micron Technology, Inc. All rights reserved. 4Mb: 3.0V Core Async/Page PSRAM Memory 256K x 16 Bus Operating Modes Figure 5: READ Operation CE# OE# WE# Address Data Valid address Valid data LB#/UB# tRC = READ cycle time Don't Care Figure 6: WRITE Operation CE# OE#