1Meg SRAM/8Meg FLASH, 70 - 100ns, TSOP STACK 30A195-00 A 1 Megabit SRAM / 8 Megabit FLASH DP3SZ128512X816NY5 ADVANCED INFORMATION DESCRIPTION: The DP3SZ128512X816NY5 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' TSOP stacking technology. The Module packs 1-Megabit of CMOS SRAM and 8-Megabits of FLASH EEPROM in an area of 0.546 in2, while maintaining a total height of .094 inches maximum. FUNCTIONAL BLOCK DIAGRAM The DP3SZ128512X816NY5 module contains two individual TSOP packages, one TSOP containing a 128Kx8 SRAM memory device and on TSOP containing a 512Kx16 FLASH memory device. Using the TSOP Stack family of modules offer a higher board density of memory than available with conventional through-hole, surface mount or hybrid techniques. FEATURES: * Access Time: 70, 80, 100ns max. * Single 3.3 Volt Supply * Fully Static Operation - No clock or refresh required * TTL Compatible Inputs and Outputs * Common Data Inputs and Outputs * 10,000 Erase/Program Cycles (min.) * Package: 56-Pin TSOP Stack FUNCTIONAL BLOCK DIAGRAM PIN NAMES A0 - A18 I/O0 - I/O15 FCS RAMCS BYTE RY/BY WE OE VDD VSS N.C. 30A195-00 REV. A Address Inputs Data Input/Output FLASH Chip Enable SRAM Low Chip Enable Select 8-Bit or 16-Bit Mode (FLASH) Ready/Busy Output (FLASH) Write Enable Output Enable Power (+5V) Ground No Connect This document contains information on a product under consideration for development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right to change or discontinue information on this product without prior notice. 1 DP3SZ128512X816NY5 Dense-Pac Microsystems, Inc. ADVANCED INFORMATION ORDERING INFORMATION MECHANICAL DRAWING Dense-Pac Microsystems, Inc. 7321 Lincoln Way Garden Grove , California 92841-1431 (714) 898-0007 (800) 642-4477 (Outside CA) FAX: (714) 897-1772 http://www.dense-pac.com 2 30A195-00 REV. A