InvenSense (NYSE: INVN) is the leading provider of MotionTracking™ devices for the consumer
electronics market. The company’s patented and patent-pending MotionFusion™ technology and Nasiri-
Fabrication™ platform address the emerging needs of many mass-market consumer applications including
smart phones, tablets, gaming devices, optical image stabilization and remote controls for smart TVs, that
require improved performance, enhanced features, and new and more intuitive motion and gesture-based
motion-interface solutions. InvenSense is headquartered in Sunnyvale, California. More information can be
found at http://www.invensense.com.
SDK Hardware Components
About InvenSense
LOCATIONS
InvenSense Headquarters
1197 Borregas Avenue
Sunnyvale, CA 94089, U.S.A.
+1.408.988.7339 Main
+1.408.988.8104 Fax
InvenSense Taiwan
1F, 9 Prosperity 1
st
Road
Hsinchu Science Park
30076, Taiwan
+886.3.6686999 Main
+866.3.6686777 Fax
InvenSense Japan G.K.
Nisso Building No. 16, 2F
3-8-8 Shin Yokohama
Kohoku-ku, Yokohama
222-0033, Japan
+81.045.308.9721 Main
+81.045.534.3005 Fax
InvenSense Korea
#601, Jungle Bldg. 206-17
Nonhyun-Dong, Gangnam-
Gu, Seoul 135-833, Korea
+82.2.541.2900 Main
+82.2.541.2955 Fax
InvenSense Dubai
InvenSense Int’l FZE
Office 206, C Wing
Dubai Silicon Oasis
P.O. Box 341166
Dubai, U.A.E.
InvenSense China
16F, No.20 Building, No.487,
Tianlin Road, Caohejing Hi-
Tech Park, Xuhui District,
Shanghai 200233
For sales inquiries, contact:
sales@invensense.com
© Copyright 2012 InvenSense, Inc.
The information in this document is preliminary and subject to change without notice. InvenSense assumes no
liability for infringement of any patent, intellectual property or use of any information contained herein.
InvenSense, MotionTracking, MotionProcessing, MotionProcessor, Nasiri-Fabrication, MotionFusion,
MotionApps, MotionFit, DMP and the InvenSense logo are trademarks of InvenSense, Inc. Other company and
product names may be trademarks of the respective companies with which they are associated
.
Product Brief
MPU-9150 9-axis MotionTracking™ Device
•
Single-chip, digital-output, nine-axis MEMS
gyroscope, accelerometer and compass IC
optimized for wearable sensor applications.
•
Integrated Digital Motion Processor (DMP™)
to perform 9-axis MotionFusion™ inside the
MPU.
•
I
2
C interface. Temperature sensor that
enables software temperature compensation
for gyro bias.
•
Embeds AK8975 compass sensor die that
incorporates magnetic sensors for detecting
terrestrial magnetism in the X-axis, Y-axis and
Z-axis.
MSP430 Microcontroller
•
MSP430 MCU from TI. Supports Code
composer Studio (CCS) tool chain for
software development.
•
The device features a powerful 16-bit RISC
CPU, 16-bit registers and constant generators
that contribute to maximum code efficiency.
Pressure sensor
•
BMP085 from Bosch, is based on piezo
resistive technology for EMC robustness, high
accuracy, linearity and long term stability.
•
Low altitude noise of 0.25m at fast conversion
time.
•
I
2
C interface.
Radio Module
•
BT2.1 +EDR compliant.
•
Up to 10m distance, and low power
consumption modes (50mA active, 30uA deep
sleep mode).
Serial Flash
•
256Mbit serial flash interfaces to MCU
through SPI interface.
Rechargeable Battery
•
110 mAh rechargeable battery. Provides > 24
hours of activity logging. 4 hours of streaming
time.
Micro USB connector
•
For charging battery and wired connectivity.
SDK Software Components
Embedded MotionApps™ Lite
•
Software provides 10-axis MotionFusion™
and calibration algorithms that run on the
DMP (inside MPU) and MSP430.
•
MotionFusion™ running on the DMP lowers
the utilization on the microcontroller and
provides headroom for the application.
Calibration algorithms require no user
intervention and provide a robust 10-axis
motion interface solution.
Software Tool Chain support
Optimized for low cost CCS tool chain (from TI).
Drivers
SDK includes drivers for serial interfaces,
Bluetooth module and serial flash.
PB-MPU-9150IMF-00-01 v1.0