INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1394-R03 1
CPC1394
Single-Pole, Normally Open
4-Pin OptoMOS® Relay
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Pb
Part Number Description
CPC1394G 4-Pin DIP (100/Tube)
CPC1394GV 4-Pin DIP V-Bend (100/Tube)
CPC1394GR 4-Pin Surface Mount (100/Tube)
CPC1394GRTR 4-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Blocking Voltage 600 VP
Load Current 120 mArms / mADC
On-Resistance (max) 35
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
The CPC1394 is a single-pole, normally-open
(1-Form-A) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient GaAlAS infrared LED, controls the
optically coupled output.
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
• 5000Vrms Input/Output Isolation
• 600VP Blocking Voltage
• 100% Solid State
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin Package
• Machine Insertable, Wave Solderable
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
1
23
4
+ Control
– Control
Load
Load
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2R03
CPC1394
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Ratings Units
Peak Blocking Voltage 600 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1100 mW
Total Package Dissipation 2550 mW
Isolation Voltage, Input to Output 5000 Vrms
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.00 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous - IL- - 120 mArms / mADC
Peak t=10ms ILPK - - ±400 mAP
On-Resistance 1IL=120mA RON -2635
Off-State Leakage Current VL=600VPILEAK -- 1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.85 5
ms
Turn-Off toff - 0.46 3
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -50 - pF
Input Characteristics
Input Control Current to Activate 2IL=120mA IF- 0.45 2
mA
Input Control Current to Deactivate - IF0.2 0.4 -
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance - CI/O -3 - pF
1 Measurement taken within 1 second of on-time.
2 For temperatures >60ºC, a LED current of 4mA is recommended.
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CPC1394
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PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
LED Current (mA)
0 1020304050
Turn-On Time (ms)
0
1
2
3
4
5
Typical Turn-On
vs. LED Forward Current
(IL=70mA, TA=25ºC)
LED Current (mA)
0 1020304050
Turn-Off (ms)
0.45
0.47
0.49
0.51
0.53
0.55
Typical Turn-Off
vs. LED Forward Current
(IL=70mA, TA=25ºC)
LED Forward Voltage (V)
-40 -20 0 20 40 60 80 100
Forward Current (mA)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Typical IF for Switch Operation
vs. Temperature
(IL=70mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.5
1.0
1.5
2.0
2.5
3.0
Typical Turn-On vs. Temperature
(IL=70mA)
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
200
300
400
500
600
700
800
900
Typical Turn-Off vs. Temperature
(IL=70mA)
IF=2mA
IF=5mA
LED Forward Voltage (V)
1.230 1.235 1.240 1.245 1.250 1.255
Device Count (N)
0
5
10
15
20
25
30
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
Turn-On Time (ms)
0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00
Device Count (N)
0
5
10
15
20
Typical Turn-On Time
(N=50, IF=5mA, IL=120mA, TA=25ºC)
Turn-Off Time (ms)
0.34 0.37 0.40 0.43 0.46 0.49 0.52 0.55
Device Count (N)
0
5
10
15
20
25
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mA, TA=25ºC)
LED Current (mA)
0.30 0.35 0.40 0.45 0.50 0.55 0.60
Device Count (N)
0
5
10
15
20
Typical IF for Switch Operation
(N=50, IL=120mA, TA=25ºC)
On-Resistance (:)
25.50 25.75 26.00 26.25 26.50 26.75 27.00
Device Count (N)
0
5
10
15
20
25
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=120mA, TA=25ºC)
Blocking Voltage (VP)
680 685 690 695 700 705 710 715
Device Count (N)
0
5
10
15
20
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
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4R03
CPC1394
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
15
20
25
30
35
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=70mA)
Load Voltage (V)
-4 -3 -2 -1 0 1 2 3 4
Load Current (A)
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
Typical Load Current
vs. Load Voltage
(IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
70
80
90
100
110
120
130
Maximum Load Current
vs. Temperature
(IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
Typical Blocking Voltage
vs. Temperature
600
625
650
675
700
725
750
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
20
40
60
80
100
Typical Leakage vs. Temperature
(VL=600V)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve
INTEGRATED CIRCUITS DIVISION
CPC1394
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R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1394G / CPC1394GV / CPC1394GR MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1394G / CPC1394GV / CPC1394GR 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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6R03
CPC1394
MECHANICAL DIMENSIONS
PC Board Pattern (Top View)
Dimensions
mm
(inches)
PIN 1
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
0.991
(0.039)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010)
9.144 ± 0.508
(0.360 ± 0.020)
7.620 ± 0.250
(0.300 ± 0.010)
7.620 ± 0.127
(0.300 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005) 3.175
(0.125)
0.508
(0.020)
2.159
(0.085)
Dimensions
mm
(inches)
PC Board Pattern (Top View)
10.160 ± 0.127
(0.400 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010) 10.160 ± 0.508
(0.400 ± 0.020)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.050
(0.250 ± 0.002)
4.572 ± 0.050
(0.180 ± 0.002)
0.991
(0.039)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.050
(0.100 ± 0.002) 2.92
(0.115)
0.127
(0.005)
1.778
(0.070)
Pin 1
CPC1394G
CPC1394GV
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1394-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012
For additional information please visit our website at: www.ixysic.com
7
CPC1394
Dimensions
mm
(inches)
PCB Land Pattern
PIN #1
6.350 ± 0.127
(0.250 ± 0.005)
0.991
(0.039)
9.525
(0.375)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.254
(0.025 ± 0.010)
0.254
(0.010)
3.300 ± 0.050
(0.130 ± 0.002)
3.480 ± 0.076
(0.137 ± 0.003)
2.287
(0.09)
8.80
(0.346)
1.60
(0.063)
0.95
(0.037)
9º ± 1º
(ALL)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
Dimensions
mm
(inches)
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max) K0=4.20
(0.165)
K1=3.70
(0.146)
W=16.00±0.30
(0.630±0.012)
A0=10.01
(0.394)
P=12.00
(0.472)
B0=5.00
(0.197)
CPC1394GR
CPC1394GRTR Tape & Reel
