M12L64164A-6TIG2M - Elite Semiconductor Memory Technology, Inc.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 1/45

SDRAM 1M x 16 Bit x 4 Banks

Synchronous DRAM

FEATURES

y JEDEC standard 3.3V power supply

y LVTTL compatible with multiplexed address

y Four banks operation

y MRS cycle with address key programs

- CAS Latency (2 & 3)

- Burst Length (1, 2, 4, 8 & full page)

- Burst Type (Sequential & Interleave)

y All inputs are sampled at the positive going edge of the

system clock

y DQM for masking

y Auto & self refresh

y 15.6

μ

s refresh interval

ORDERING INFORMATION

PRODUCT NO. MAX

FREQ. PACKAGE Comments

M12L64164A-5TIG2M 200MHz 54 TSOP II Pb-free

M12L64164A-6TIG2M 166MHz 54 TSOP II Pb-free

M12L64164A-7TIG2M 143MHz 54 TSOP II Pb-free

M12L64164A-5BIG2M 200MHz 54 VBGA Pb-free

M12L64164A-6BIG2M 166MHz 54 VBGA Pb-free

M12L64164A-7BIG2M 143MHz 54 VBGA Pb-free

GENERAL DESCRIPTION

The M12L64164A is 67,108,864 bits synchronous high data rate Dynamic RAM organized as 4 x 1,048,576 words by

16 bits. Synchronous design allows precise cycle controls with the use of system clock I/O transactions are possible on

every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same

device to be useful for a variety of high bandwidth, high performance memory system applications.

PIN CONFIGURATION (TOP VIEW) BALL CONFIGURATION (TOP VIEW)

(TSOPII 54L, 400milX875mil Body, 0.8mm Pin Pitch ) (BGA54, 8mmX8mmX1mm Body, 0.8mm Ball Pitch)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

VDD

DQ0

VDDQ

DQ1

DQ2

VSSQ

DQ3

DQ4

VDDQ

DQ5

DQ6

VSSQ

DQ7

VDD

LDQM

WE

CAS

RAS

CS

BA0

BA1

A10/AP

A0

A1

A2

A3

VDD

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

VSS

DQ15

VSSQ

DQ14

DQ13

VDDQ

DQ12

DQ11

VSSQ

DQ10

DQ9

VDDQ

DQ8

VSS

NC

UDQM

CLK

CKE

NC

A11

A9

A8

A7

A6

A5

A4

VSS

VSS DQ 15

DQ14 DQ13

DQ12 DQ11

DQ10 DQ9

DQ8 NC

UDQM CLK

NC A11

A8 A7

VSS A5

VDDQ DQ0

VSSQ DQ2

VDDQ DQ4

VDD LDQM

CAS RAS

BA1

BA0

A0 A1

A3 A2

123456789

A

B

C

D

E

F

G

H

J

VSSQ

VDDQ

VSSQ

VDDQ

VSS

CKE

A9

A6

A4

VDD

DQ 1

DQ3

DQ7

WE

CS

A10

VDD

VSSQ DQ6 DQ5

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 2/45

FUNCTIONAL BLOCK DIAGRAM

PIN FUNCTION DESCRIPTION

PIN NAME INPUT FUNCTION

CLK System Clock Active on the positive going edge to sample all inputs

CS Chip Select Disables or enables device operation by masking or enabling all

inputs except CLK , CKE and L(U)DQM

CKE Clock Enable

Masks system clock to freeze operation from the next clock cycle.

CKE should be enabled at least one cycle prior new command.

Disable input buffers for power down in standby.

A0 ~ A11 Address Row / column address are multiplexed on the same pins.

Row address : RA0~RA11, column address : CA0~CA7

BA1 , BA0 Bank Select Address Selects bank to be activated during row address latch time.

Selects bank for read / write during column address latch time.

RAS Row Address Strobe

Latches row addresses on the positive going edge of the CLK with

RAS low.

Enables row access & precharge.

CAS Column Address Strobe

Latches column address on the positive going edge of the CLK with

CAS low.

Enables column access.

WE Write Enable

Enables write operation and row precharge.

Latches data in starting from CAS , WE active.

L(U)DQM Data Input / Output Mask Makes data output Hi-Z, tSHZ after the clock and masks the output.

Blocks data input when L(U)DQM active.

DQ0 ~ DQ15 Data Input / Output Data inputs / outputs are multiplexed on the same pins.

VDD / VSS Power Supply / Ground Power and ground for the input buffers and the core logic.

VDDQ / VSSQ Data Output Power / Ground Isolated power supply and ground for the output buffers to provide

improved noise immunity.

NC No Connection This pin is recommended to be left No Connection on the device.

L(U)DQM

DQ

Mode

Register

Control Logic

Column

Address

Buffer

&

Refresh

Counter

Row

Address

Buffer

&

Refresh

Counter

Bank D

Row Decoder

Bank A

Bank B

Bank C

Sense Amplifier

Column Decoder

Data Control Circuit

Latch Circuit

Input & Output

Buffer

Address

Clock

Generator

CLK

CKE

Command Decoder

CS

RAS

CAS

WE

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 3/45

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL VALUE UNIT

Voltage on any pin relative to VSS VIN, VOUT -1.0 ~ 4.6 V

Voltage on VDD supply relative to VSS VDD, VDDQ -1.0 ~ 4.6 V

Storage temperature TSTG -55 ~ +150 C°

Power dissipation PD 1 W

Short circuit current IOS 50 mA

Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATING are exceeded.

Functional operation should be restricted to recommended operating condition.

Exposure to higher than recommended voltage for extended periods of time could affect device reliability.

DC OPERATING CONDITION

Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -40 to 85 C°)

PARAMETER SYMBOL MIN TYP MAX UNIT NOTE

Supply voltage VDD, VDDQ 3.0 3.3 3.6 V

Input logic high voltage VIH 2.0 VDD+0.3 V 1

Input logic low voltage VIL -0.3 0 0.8 V 2

Output logic high voltage VOH 2.4 - - V IOH = -2mA

Output logic low voltage VOL - - 0.4 V IOL = 2mA

Input leakage current IIL -5 - 5 μA 3

Output leakage current IOL -5 - 5 μA 4

Note: 1. VIH(max) = 4.6V AC for pulse width ≤ 10ns acceptable.

2. VIL(min) = -1.5V AC for pulse width ≤ 10ns acceptable.

3. Any input 0V ≤ VIN

≤

VDD, all other pins are not under test = 0V.

4. Dout is disabled, 0V ≤ VOUT ≤ VDD.

CAPACITANCE (VDD = 3.3V, TA = 25 C°, f = 1MHz)

PARAMETER SYMBOL MIN MAX UNIT

Input capacitance (A0 ~ A11, BA0 ~ BA1) CIN1 2 4 pF

Input capacitance

(CLK, CKE, CS , RAS , CAS , WE &

L(U)DQM)

CIN2 2 4 pF

Data input/output capacitance (DQ0 ~ DQ15) COUT 2 6 pF

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 4/45

DC CHARACTERISTICS

Recommended operating condition unless otherwise noted，TA = -40 to 85 C°

VERSION

PARAMETER SYMBOL TEST CONDITION -5 -6 -7

UNIT NOTE

Operating Current

(One Bank Active) I

CC1 Burst Length = 1, tRC ≥ tRC(min), IOL = 0 mA,

tCC = tCC (min) 100 85 85 mA

1,2

ICC2P CKE ≤VIL(max), tCC = tCC (min) 2

Precharge Standby Current

in powe

r

-down mode I

CC2PS CKE & CLK

≤

VIL(max), tCC =

∞

1

mA

ICC2N CKE ≥ VIH(min), CS ≥ VIH(min), tCC = tCC (min)

Input signals are changed one time during 2CLK 20

Precharge Standby Current

in non power-down mode I

CC2NS CKE ≥ VIH(min), CLK

≤

VIL(max), tCC =

∞

input signals are stable 10

mA

ICC3P CKE ≤VIL(max), tCC = tCC (min) 10

Active Standby Current

in powe

r

-down mode I

CC3PS CKE & CLK

≤

VIL(max), tCC =

∞

10

mA

ICC3N

CKE ≥VIH(min), CS ≥ VIH(min), tCC=15ns

Input signals are changed one time during 2clks

All other pins ≥ V

DD-0.2V or ≤ 0.2V

30 mA

Active Standby Current

in non powe

r

-down mode

(One Bank Active)

I

CC3NS CKE ≥ VIH(min), CLK

≤

VIL(max), tCC =

∞

input signals are stable 25 mA

Operating Current

(Burst Mode) I

CC4 IOL = 0 mA, Page Burst, All Bank active

Burst Length = 4, CAS Latency = 3 180 150 140 mA 1,2

Refresh Current ICC5 tRFC ≥ tRFC(min), tCC = tCC(min) 180 150 140 mA

Self Refresh Current ICC6 CKE ≤0.2V 1 mA

Note: 1. Measured with outputs open.

2. Input signals are changed one time during 2 CLKS.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 5/45

AC OPERATING TEST CONDITIONS (VDD = 3.3V ±0.3V ，TA = -40 to 85 C°)

PARAMETER VALUE UNIT

Input levels (Vih/Vil) 2.4/0.4 V

Input timing measurement reference level 1.4 V

Input rise and fall-time tr/tf = 1/1 ns

Output timing measurement reference level 1.4 V

Output load condition See Fig. 2

(Fig. 1) DC Output Load Circuit (Fig. 2) AC Output Load Circuit

OPERATING AC PARAMETER

(AC operating conditions unless otherwise noted)

VERSION

PARAMETER SYMBOL

-5 -6 -7

UNIT NOTE

Row active to row active delay tRRD(min) 10 12 14 ns 1

RAS to CAS delay tRCD(min) 15 18 20 ns 1

Row precharge time tRP(min) 15 18 20 ns 1

tRAS(min) 38 40 42 ns 1

Row active time

tRAS(max) 100 us

@ Operating tRC(min) 53 58 63 ns 1

Row cycle time @ Auto refresh tRFC(min) 55 60 70 ns 1,5

Last data in to col. address delay tCDL(min) 1 CLK 2

Last data in to row precharge tRDL(min) 2 CLK 2

Last data in to burst stop tBDL(min) 1 CLK 2

Col. address to col. address delay tCCD(min) 1 CLK 3

CAS latency = 3 2

Number of valid

Output data CAS latency = 2 1

ea 4

Note:

1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then

rounding off to the next higher integer.

2. Minimum delay is required to complete with.

3. All parts allow every cycle column address change.

4. In case of row precharge interrupt, auto precharge and read burst stop.

5. A new command may be given tRFC after self refresh exit.

Output

870

VOH (DC) =2.4V , IOH = -2 mA

VOL (DC) =0.4V , IOL = 2 mA Output

50pF

Z0 =50

50pF

50

Vtt = 1.4V

3.3V

1200Ω

Ω

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 6/45

AC CHARACTERISTICS (AC operating condition unless otherwise noted)

-5 -6 -7

PARAMATER SYMBOL MIN MAX MIN MAX MIN MAX

UNIT NOTE

CAS latency = 3 5 6 7

CLK cycle time

CAS latency = 2

tCC

10

1000

10

1000

10

1000 ns 1

CAS latency = 3 4.5 5.5 6

CLK to valid

output delay CAS latency = 2 tSAC 6 6 6

ns 1,2

CAS latency = 3 2.0 2.5 2.5

Output data

hold time CAS latency = 2 tOH 2.0 2.5 2.5 ns 2

CLK high pulse width tCH 2.5 2.5 2.5 ns 3

CLK low pulse width tCL 2.5 2.5 2.5 ns 3

Input setup time tSS 1.5 1.5 1.5 ns 3

Input hold time tSH 1 1 1 ns 3

CLK to output in Low-Z tSLZ 0 0 0 ns 2

CAS latency = 3 4.5 5.5 6

CLK to output

in Hi-Z CAS latency = 2

tSHZ

6 6 6

ns -

Note: 1. Parameters depend on programmed CAS latency.

2. If clock rising time is longer than 1ns. (tr/2 - 0.5) ns should be considered.

3. Assumed input rise and fall time (tr & tf) =1ns.

If tr & tf is longer than 1ns, transient time compensation should be considered,

i.e., [(tr + tf)/2 – 1] ns should be added to the parameter.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 7/45

SIMPLIFIED TRUTH TABLE

COMMAND CKEn-1 CKEn CS RAS CAS WE DQM BA0

BA1 A10/AP A11,

A9~A0 Note

Register Mode Register set H X L L L L X OP CODE 1,2

Auto Refresh H 3

Entry H L L L L H X X 3

L H H H X 3

Refresh Self

Refresh

Exit L H H X X X X X 3

Bank Active & Row Addr. H X L L H H X V Row Address

Auto Precharge Disable L 4

Read &

Column Address Auto Precharge Enable

H X L H L H X V

H

Column

Address

(A0~A7) 4,5

Auto Precharge Disable L 4

Write &

Column Address Auto Precharge Enable

H X L H L L X V

H

Column

Address

(A0~A7) 4,5

Burst Stop H X L H H L X X 6

Bank Selection V L

Precharge

All Banks

H X L L H L X

X H

X

H X X X

Entry H L

L V V V

X

Clock Suspend or

Active Power Down

Exit L H

X X X X X

X

H X X X

Entry H L

L H H H

X

H X X X

Precharge Power Down Mode

Exit L H

L V V V

X

DQM H X V X 7

H X X X

No Operating Command H X

L H H H

X X

(V = Valid, X = Don’t Care. H = Logic High, L = Logic Low)

Note: 1.OP Code: Operating Code

A0~A11 & BA0, BA1: Program keys. (@ MRS)

2.MRS can be issued only at all banks precharge state.

A new command can be issued after 2 CLK cycles of MRS.

3.Auto refresh functions are as same as CBR refresh of DRAM.

The automatical precharge without row precharge of command is meant by “Auto”.

Auto/self refresh can be issued only at all banks idle state.

4.BA0, BA1 : Bank select addresses.

If both BA0 and BA1 are “Low” at read, write, row active and precharge, bank A is selected.

If both BA0 is “Low” and BA1 is “High” at read, write, row active and precharge, bank B is selected.

If both BA0 is “High” and BA1 is “Low” at read, write, row active and precharge, bank C is selected.

If both BA0 and BA1 are “High” at read, write, row active and precharge, bank D is selected

If A10/AP is “High” at row precharge, BA0 and BA1 is ignored and all banks are selected.

5.During burst read or write with auto precharge, new read/write command can not be issued.

Another bank read/write command can be issued after the end of burst.

New row active of the associated bank can be issued at tRP after the end of burst.

6.Burst stop command is valid at every burst length.

7.DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (write DQM latency is 0), but

makes Hi-Z state the data-out of 2 CLK cycles after.(Read DQM latency is 2)

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 8/45

MODE REGISTER FIELD TABLE TO PROGRAM MODES

Register Programmed with MRS

Address BA0, BA1 A11~A10/AP A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

Function RFU RFU W.B.L TM CAS Latency BT Burst Length

Test Mode CAS Latency Burst Type Burst Length

A8 A7 Type A6 A5 A4 Latency A3 Type A2 A1 A0 BT = 0 BT = 1

0 0 Mode Register Set 0 0 0 Reserved 0 Sequential 0 0 0 1 1

0 1 Reserved 0 0 1 Reserved 1 Interleave 0 0 1 2 2

1 0 Reserved 0 1 0 2 0 1 0 4 4

1 1 Reserved 0 1 1 3

0 1 1 8 8

Write Burst Length 1 0 0 Reserved 1 0 0 Reserved Reserved

A9 Length 1 0 1 Reserved 1 0 1 Reserved Reserved

0 Burst 1 1 0 Reserved 1 1 0 Reserved Reserved

1 Single Bit 1 1 1 Reserved

1 1 1 Full Page Reserved

Full Page Length: 256

Note: 1. RFU (Reserved for future use) should stay “0” during MRS cycle.

2. If A9 is high during MRS cycle, “Burst Read Single Bit Write” function will be enabled.

3. The full column burst (256 bit) is available only at sequential mode of burst type.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 9/45

BURST SEQUENCE (BURST LENGTH = 4)

Initial Address

A1 A0

Sequential Interleave

0 0 0 1 2 3 0 1 2 3

0 1 1 2 3 0 1 0 3 2

1 0 2 3 0 1 2 3 0 1

1 1 3 0 1 2 3 2 1 0

BURST SEQUENCE (BURST LENGTH = 8)

Initial Address

A2 A1 A0

Sequential Interleave

0 0 0 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7

0 0 1 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6

0 1 0 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5

0 1 1 3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4

1 0 0 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3

1 0 1 5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2

1 1 0 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1

1 1 1 7 0 1 2 3 4 5 6 7 6 5 4 3 2 1 0

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 10/45

DEVICE OPERATIONS

CLOCK (CLK)

The clock input is used as the reference for all SDRAM

operations. All operations are synchronized to the positive

going edge of the clock. The clock transitions must be

monotonic between VIL and VIH. During operation with CKE

high all inputs are assumed to be in valid state (low or high)

for the duration of setup and hold time around positive edge

of the clock for proper functionality and Icc specifications.

CLOCK ENABLE(CKE)

The clock enable (CKE) gates the clock onto SDRAM. If

CKE goes low synchronously with clock (set-up and hold

time same as other inputs), the internal clock suspended

from the next clock cycle and the state of output and burst

address is frozen as long as the CKE remains low. All other

inputs are ignored from the next clock cycle after CKE goes

low. When all banks are in the idle state and CKE goes low

synchronously with clock, the SDRAM enters the power

down mode from the next clock cycle. The SDRAM remains

in the power down mode ignoring the other inputs as long as

CKE remains low. The power down exit is synchronous as

the internal clock is suspended. When CKE goes high at

least “1CLK + tSS” before the high going edge of the clock,

then the SDRAM becomes active from the same clock edge

accepting all the input commands.

BANK ADDRESSES (BA0,BA1)

This SDRAM is organized as four independent banks of

1,048,576 words x 16 bits memory arrays. The BA0 and BA1

inputs are latched at the time of assertion of RAS and

CAS to select the bank to be used for the operation. The

banks addressed BA0 and BA1 are latched at bank active,

read, write, mode register set and precharge operations.

ADDRESS INPUTS (A0~A11)

The 20 address bits are required to decode the 1,048,576

word locations are multiplexed into 12 address input pins

(A0~A11). The 12 row addresses are latched along with

RAS and BA0~BA1 during bank active command. The 8 bit

column addresses are latched along with CAS , WE and

BA0,BA1 during read or with command.

NOP and DEVICE DESELECT

When RAS , CAS and WE are high, The SDRAM

performs no operation (NOP). NOP does not initiate any new

operation, but is needed to complete operations which

require more than single clock cycle like bank activate, burst

read, auto refresh, etc. The device deselect is also a NOP

and is entered by asserting CS high. CS high disables

the command decoder so that RAS , CAS , WE and all

the address inputs are ignored.

POWER-UP

1.Apply power and start clock, Attempt to maintain CKE

= “H”, DQM = “H” and the other pins are NOP

condition at the inputs.

2.Maintain stable power, stable clock and NOP input

condition for minimum of 200us.

3.Issue precharge commands for all banks of the

devices.

4.Issue 2 or more auto-refresh commands.

5.Issue a mode register set command to initialize the

mode register.

cf.) Sequence of 4 & 5 is regardless of the order.

The device is now ready for normal operation.

MODE REGISTER SET (MRS)

The mode register stores the data for controlling the

various operating modes of SDRAM. It programs the

CAS latency, burst type, burst length, test mode and

various vendor specific options to make SDRAM useful

for variety of different applications. The default value of

the mode register is not defined, therefore the mode

register must be written after power up to operate the

SDRAM. The mode register is written by asserting low

on CS , RAS , CAS and WE (The SDRAM should

be in active mode with CKE already high prior to writing

the mode register). The state of address pins A0~A11

and BA0~BA1 in the same cycle as CS , RAS , CAS

and WE going low is the data written in the mode

register. Two clock cycles is required to complete the

write in the mode register. The mode register contents

can be changed using the same command and clock

cycle requirements during operation as long as all banks

are in the idle state. The mode register is divided into

various fields into depending on functionality. The burst

length field uses A0~A2, burst type uses A3, CAS

latency (read latency from column address) use A4~A6,

vendor specific options or test mode use A7~A8,

A10/AP~A11 and BA0~BA1. The write burst length is

programmed using A9. A7~A8, A10/AP~A11 and BA0,

BA1 must be set to low for normal SDRAM operation.

Refer to the table for specific codes for various burst

length, burst type and CAS latencies.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 11/45

DEVICE OPERATIONS (Continued)

BANK ACTIVATE

The bank activate command is used to select a random row

in an idle bank. By asserting low on RAS and CS with

desired row and bank address, a row access is initiated. The

read or write operation can occur after a time delay of

tRCD(min) from the time of bank activation. tRCD is the internal

timing parameter of SDRAM, therefore it is dependent on

operating clock frequency. The minimum number of clock

cycles required between bank activate and read or write

command should be calculated by dividing tRCD(min) with

cycle time of the clock and then rounding of the result to the

next higher integer. The SDRAM has four internal banks in

the same chip and shares part of the internal circuitry to

reduce chip area, therefore it restricts the activation of four

banks simultaneously. Also the noise generated during

sensing of each bank of SDRAM is high requiring some time

for power supplies to recover before another bank can be

sensed reliably. tRRD(min) specifies the minimum time

required between activating different bank. The number of

clock cycles required between different bank activation must

be calculated similar to tRCD specification. The minimum time

required for the bank to be active to initiate sensing and

restoring the complete row of dynamic cells is determined by

tRAS(min). Every SDRAM bank activate command must

satisfy tRAS(min) specification before a precharge command

to that active bank can be asserted. The maximum time any

bank can be in the active state is determined by tRAS(max)

and tRAS(max) can be calculated similar to tRCD specification.

BURST READ

The burst read command is used to access burst of data on

consecutive clock cycles from an active row in an active

bank. The burst read command is issued by asserting low on

CS and RAS with WE being high on the positive edge

of the clock. The bank must be active for at least tRCD(min)

before the burst read command is issued. The first output

appears in CAS latency number of clock cycles after the

issue of burst read command. The burst length, burst

sequence and latency from the burst read command is

determined by the mode register which is already

programmed. The burst read can be initiated on any column

address of the active row. The address wraps around if the

initial address does not start from a boundary such that

number of outputs from each I/O are equal to the burst

length programmed in the mode register. The output goes

into high-impedance at the end of burst, unless a new burst

read was initiated to keep the data output gapless. The burst

read can be terminated by issuing another burst read or

burst write in the same bank or the other active bank or a

precharge command to the same bank. The burst stop

command is valid at every page burst length.

BURST WRITE

The burst write command is similar to burst read command

and is used to write data into the SDRAM on consecutive

clock cycles in adjacent addresses depending on burst

length and burst sequence. By asserting low on CS ,

CAS and WE with valid column address, a write

burst is initiated. The data inputs are provided for the

initial address in the same clock cycle as the burst write

command. The input buffer is deselected at the end of

the burst length, even though the internal writing can be

completed yet. The writing can be complete by issuing a

burst read and DQM for blocking data inputs or burst

write in the same or another active bank. The burst stop

command is valid at every burst length. The write burst

can also be terminated by using DQM for blocking data

and procreating the bank tRDL after the last data input to

be written into the active row. See DQM OPERATION

also.

DQM OPERATION

The DQM is used mask input and output operations. It

works similar to OE during operation and inhibits

writing during write operation. The read latency is two

cycles from DQM and zero cycle for write, which means

DQM masking occurs two cycles later in read cycle and

occurs in the same cycle during write cycle. DQM

operation is synchronous with the clock. The DQM

signal is important during burst interrupts of write with

read or precharge in the SDRAM. Due to asynchronous

nature of the internal write, the DQM operation is critical

to avoid unwanted or incomplete writes when the

complete burst write is required. Please refer to DQM

timing diagram also.

PRECHARGE

The precharge is performed on an active bank by

asserting low on clock cycles required between bank

activate and clock cycles required between bank

activate and CS , RAS , WE and A10/AP with valid

BA0~BA1 of the bank to be procharged. The precharge

command can be asserted anytime after tRAS(min) is

satisfy from the bank active command in the desired

bank. tRP is defined as the minimum number of clock

cycles required to complete row precharge is calculated

by dividing tRP with clock cycle time and rounding up to

the next higher integer. Care should be taken to make

sure that burst write is completed or DQM is used to

inhibit writing before precharge command is asserted.

The maximum time any bank can be active is specified

by tRAS(max). Therefore, each bank activate command.

At the end of precharge, the bank enters the idle state

and is ready to be activated again. Entry to power-down,

Auto refresh, Self refresh and Mode register set etc. is

possible only when all banks are in idle state.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 12/45

DEVICE OPERATIONS (Continued)

AUTO PRECHARGE

The precharge operation can also be performed by using

auto precharge. The SDRAM internally generates the timing

to satisfy tRAS(min) and “tRP” for the programmed burst length

and CAS latency. The auto precharge command is issued at

the same time as burst write by asserting high on A10/AP,

the bank is precharge command is asserted. Once auto

precharge command is given, no new commands are

possible to that particular bank until the bank achieves idle

state.

All BANKS PRECHARGE

All banks can be precharged at the same time by using

Precharge all command. Asserting low on CS , RAS , and

WE with high on A10/AP after all banks have satisfied

tRAS(min) requirement, performs precharge on all banks. At

the end of tRP after performing precharge all, all banks are in

idle state.

AUTO REFRESH

The storage cells of SDRAM need to be refreshed every

64ms to maintain data. An auto refresh cycle accomplishes

refresh of a single row of storage cells. The internal counter

increments automatically on every auto refresh cycle to

refresh all the rows. An auto refresh command is issued by

asserting low on CS , RAS and CAS with high on CKE

and WE . The auto refresh command can only be asserted

with all banks being in idle state and the device is not in

power down mode (CKE is high in the previous cycle). The

time required to complete the auto refresh operation is

specified by tRFC(min). The minimum number of clock cycles

required can be calculated by driving tRFC with clock cycle

time and them rounding up to the next higher integer. The

auto refresh command must be followed by NOP’s until the

auto refresh operation is completed. The auto refresh is the

preferred refresh mode when the SDRAM is being used for

normal data transactions. The auto refresh cycle can be

performed once in 15.6us.

SELF REFRESH

The self refresh is another refresh mode available in the

SDRAM. The self refresh is the preferred refresh mode

for data retention and low power operation of SDRAM.

In self refresh mode, the SDRAM disables the internal

clock and all the input buffers except CKE. The refresh

addressing and timing is internally generated to reduce

power consumption. The self refresh mode is entered

from all banks idle state by asserting low on CS ,

RAS , CAS and CKE with high on WE . Once the self

refresh mode is entered, only CKE state being low

matters, all the other inputs including clock are ignored

to remain in the refresh.

The self refresh is exited by restarting the external clock

and then asserting high on CKE. This must be followed

by NOP’s for a minimum time of tRFC before the SDRAM

reaches idle state to begin normal operation. 4K cycles

of burst auto refresh is required immediately before self

refresh entry and immediately after self refresh exit.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 13/45

COMMANDS

Mode register set command

(CS ,RAS ,CAS ,WE = Low)

The M12L64164A has a mode register that defines how the device operates. In

this command, A0 through A11, BA0 and BA1 are the data input pins. After power on,

the mode register set command must be executed to initialize the device.

The mode register can be set only when all banks are in idle state. During 2CLK

following this command, the M12L64164A cannot accept any other commands.

Activate command

( CS , RAS = Low, CAS , WE = High)

The M12L64164A has four banks, each with 4,096 rows.

This command activates the bank selected by BA1 and BA0 (BS) and a row

address selected by A0 through A11.

This command corresponds to a conventional DRAM’s RAS falling.

Precharge command

( CS , RAS , WE = Low, CAS = High )

This command begins precharge operation of the bank selected by BA1 and BA0

(BS). When A10 is High, all banks are precharged, regardless of BA1 and BA0.

When A10 is Low, only the bank selected by BA1 and BA0 is precharged.

After this command, the M12L64164A can’t accept the activate command to the

precharging bank during tRP (precharge to activate command period).

This command corresponds to a conventional DRAM’s RAS rising.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 14/45

Write command

( CS , CAS , WE = Low, RAS = High)

If the mode register is in the burst write mode, this command sets the burst start

address given by the column address to begin the burst write operation. The first

write data in burst can be input with this command with subsequent data on following

clocks.

Read command

( CS , CAS = Low, RAS , WE = High)

Read data is available after CAS latency requirements have been met.

This command sets the burst start address given by the column address.

CBR (auto) refresh command

( CS , RAS , CAS = Low, WE , CKE = High)

This command is a request to begin the CBR refresh operation. The refresh

address is generated internally.

Before executing CBR refresh, all banks must be precharged.

After this cycle, all banks will be in the idle (precharged) state and ready for a

row activate command.

During tRFC period (from refresh command to refresh or activate command), the

M12L64164A cannot accept any other command.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 15/45

Self refresh entry command

( CS , RAS , CAS , CKE = Low , WE = High)

After the command execution, self refresh operation continues while CKE

remains low. When CKE goes to high, the M12L64164A exits the self refresh mode.

During self refresh mode, refresh interval and refresh operation are performed

internally, so there is no need for external control.

Before executing self refresh, all banks must be precharged.

Burst stop command

( CS , WE = Low, RAS , CAS = High)

This command terminates the current burst operation.

Burst stop is valid at every burst length.

No operation

(CS = Low , RAS , CAS , WE = High)

This command is not an execution command. No operations begin or terminate

by this command.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 16/45

BASIC FEATURE AND FUNCTION DESCRIPTIONS

1. CLOCK Suspend

2. DQM Operation

*Note: 1. CKE to CLK disable/enable = 1CLK.

2. DQM masks data out Hi-Z after 2CLKs which should masked by CKE ”L”.

3. DQM masks both data-in and data-out.

CLK

CMD

DQM

DQ(CL2)

DQ(CL3)

RD

Q0 Q2 Q3

Q1 Q2 Q3D0 D1 D3

D1 D3

D0

WR

Mask ed by DQ M

Mas ke d by DQM

CLK

CMD

DQM

DQ(CL2)

DQ(CL3)

CKE

RD

Q0 Q2 Q4

Hi-Z Hi-Z Hi-Z

Q6 Q7 Q8

Q5 Q6 Q7

Q1 Q3

Hi-Z Hi-Z Hi-Z

Hi-Z

1)Write Mask (BL=4) 2)Read Mask (BL=4)

DQM to Data-in Mask=0 DQM to Data-out Mask=2

3)DQM with clcok suspended (Full Page Read)

*Note2

Internal

CLK

Q9

Q8

CLK

CMD

CK E

Internal

CLK

DQ (C L2)

DQ (C L3)

RD

Q2Q0 Q1 Q3

Q0 Q1 Q3D0 D1 D2 D3

D1 D2 D3

D0

WR

Masked by CKE

1) Cl ock Su sp end ed D urin g W ri

t

e(B

L

=4) 2 ) Clo ck Su s pe nd ed Dur ing R ead (BL =4 )

Not Written Suspended Dout

Q2

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 17/45

3. CAS Interrupt (I)

*Note: 1. By “interrupt” is meant to stop burst read/write by external before the end of burst.

By ” CAS interrupt ”, to stop burst read/write by CAS access; read and write.

2. tCCD:CAS to CAS delay. (=1CLK)

3. tCDL: Last data in to new column address delay. (=1CLK)

CLK

CMD

ADD

DQ(CL2)

DQ(CL3)

RD

QB0 QB2

QA0

CLK

CMD

ADD

DQ

WR

DA 0 DB0 DB 1

RD

AB

QB1 QB3

QB0 QB2

QA0 QB3

QB1

tCCD

*Note 2

WR

tCCD *Note 2

AB

tCD L

*Note 3

WR RD

tCC D * No t e 2

AB

DA0 DB0 DB1

tCD L

*Note 3

DA0 DB 0 DB1

DQ (C L3 )

DQ(CL2)

1) Re ad i nte rr upt ed b y R ea d ( BL=4)

2)Write inte rrup ted by Writ e (BL= 2) 3)Writ e inte rr upte d b y Rea d ( BL=2)

*N

o

t

e1

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 18/45

4. CAS Interrupt (II) : Read Interrupted by Write & DQM

CLK

i)CMD

DQM

DQ D1 D3

D0 D2

WR

ii)CMD

DQM

DQ

iii)CMD

DQM

DQ

iv)CMD

DQM

DQ

D1 D3

D0 D2

RD WR

D1 D3

D0 D2

D1 D3

D0 D2

RD WR

Hi-Z

Q0

*Note1

Hi-Z

(a)CL=2,BL=4

RD

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 19/45

*Note: 1. To prevent bus contention, there should be at least one gap between data in and data out.

5. Write Interrupted by Precharge & DQM

CLK

CMD

DQM

DQ

*Note3

*Note2

Masked by DQM

WR PRE

D0 D1 D3

t

RDL(min)

*Note: 1. To prevent bus contention, DQM should be issued which makes at least one gap between data in and data out.

2. To inhibit invalid write, DQM should be issued.

3. This precharge command and burst write command should be of the same bank, otherwise it is not precharge interrupt

but only another bank precharge of four banks operation.

CLK

i)CMD

ii)CMD

iii)CMD

iv)CMD

DQM

DQ

D1 D3

D1

D0 D2

D3

D0 D2

WR

(b)CL=3,BL=4

RD WR

D1 D3

D0 D2

D1 D3

D0 D2

RD WR

Hi-Z

D1 D3

D0 D2

Q0

*Note1

v)CMD

DQM

DQ

RD WR

Hi-Z

RD

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 20/45

6. Precharge

.

7. Auto Precharge

*Note: 1. tRDL: Last data in to row precharge delay.

2. Number of valid output data after row precharge: 1,2 for CAS Latency = 2,3 respectively.

3. The row active command of the precharge bank can be issued after tRP from this point.

The new read/write command of other activated bank can be issued from this point.

At burst read/write with auto precharge, CAS interrupt of the same/another bank is illegal.

CLK

CMD

DQ D0 D1 D2 D3

WR

tRDL

*Note1

CLK

CMD

DQ(CL2) Q0 Q1 Q2 Q3

RD PRE

DQ(CL3) Q0 Q1 Q2 Q3

PRE

1)No

r

mal W

r

ite (BL=4) 2)Normal Read (BL=4)

CL=2

PRE CL=3

*Note2

CLK

CMD

DQ D0 D1 D2 D3

WR

CLK

CMD

DQ(CL2) D0 D1 D2 D3

RD

DQ(CL3)

*Note3

Auto Precharge starts

D0 D1 D2 D3

*Note3

Auto Precharge starts

1

)

No

r

mal W

r

ite

(

BL=4

)

2

)

No

r

mal Read

(

BL=4

)

tRDL (min)

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 21/45

8. Burst Stop & Interrupted by Precharge

9. MRS

*Note: 1. tBDL: 1 CLK; Last data in to burst stop delay.

Read or write burst stop command is valid at every burst length.

2. Number of valid output data after burst stop: 1, 2 for CAS latency = 2, 3 respectiviely.

3. Write burst is terminated. tRDL determinates the last data write.

4. DQM asserted to prevent corruption of locations D2 and D3.

5. Precharge can be issued here or earlier (satisfying tRAS min delay) with DQM.

6. PRE: All banks precharge, if necessary.

MRS can be issued only at all banks precharge state.

CLK

CMD

DQ (C L2 )

DQ(CL3)

CLK

CMD

DQM

DQ D0 D1 D2 D3

WR STOP

*N ote1

Q0 Q1

RD STOP

*Note2

1)W ri

t

eBurs

t

S

t

o

p

(BL=8)

2)Read Burst Stop (BL=4)

CLK

CMD

DQ(CL2)

CLK

CMD

DQ M

DQ D0 D1 Mask Mask

WR

Q0 Q1

RD PRE

1)W ri

t

ein

t

erru

p

t

ed

b

y

p

recharge (BL=4)

2)Read interrupted by precharge (BL=4)

*Note2

PRE

*Note4

*Note3

DQ(CL3)

*N ote5

Q2

Q1 Q2 Q3

Q0

tRDL

tBDL

D4 D5

Q3

CLK

CMD PRE

*N o t e6

MRS ACT

tRP 2CLK

1)M

o

de Regis

t

er Se

t

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 22/45

10. Clock Suspend Exit & Power Down Exit

11. Auto Refresh & Self Refresh

*Note: 1. Active power down: one or more banks active state.

2. Precharge power down: all banks precharge state.

3. The auto refresh is the same as CBR refresh of conventional DRAM.

No precharge commands are required after auto refresh command.

During tRFC from auto refresh command, any other command can not be accepted.

4. Before executing auto/self refresh command, all banks must be idle state.

5. MRS, Bank Active, Auto/Self Refresh, Power Down Mode Entry.

6. During self refresh entry, refresh interval and refresh operation are performed internally.

After self refresh entry, self refresh mode is kept while CKE is low.

During self refresh entry, all inputs expect CKE will be don’t cared, and outputs will be in Hi-Z state.

For the time interval of tRFC from self refresh exit command, any other command can not be accepted.

4K cycles of burst auto refresh is required immediately before self refresh entry and immediately after self refresh exit.

CLK

CKE

Internal

CLK

CMD RD

tSS

*Note1

CLK

CKE

Internal

CLK

CMD ACT

tSS

*Note2

NOP

1)Clock Suspend(=

A

ctive Powe

r

Down)Exit 2)Powe

r

Down (=P

r

echa

r

ge Powe

r

Down )

CLK

CMD PRE AR

CKE

CMD

tRP tRFC

*Note5

*N ote4

CLK

CMD PRE SR

CKE

CMD

tRP tRFC

*N ote4

1)Auto Re fresh & Self Refresh

2)Self Refresh

*N

o

t

e

3

*Note6

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 23/45

12. About Burst Type Control

Sequential Counting

At MRS A3 = “0”. See the BURST SEQUENCE TABLE. (BL = 4,8)

BL = 1, 2, 4, 8 and full page.

Basic

MODE

Interleave Counting At MRS A3 = “1”. See the BURST SEQUENCE TABLE. (BL = 4,8)

BL = 4, 8 At BL =1, 2 interleave Counting = Sequential Counting

Random

MODE

Random Column Access

tCCD = 1 CLK

Every cycle Read/Write Command with random column address can realize

Random Column Access.

That is similar to Extended Data Out (EDO) Operation of conventional DRAM.

13. About Burst Length Control

1 At MRS A210 = “000”

At auto precharge. tRAS should not be violated.

2 At MRS A210 = “001”

At auto precharge. tRAS should not be violated.

4 At MRS A210 = “010”

8 At MRS A210 = “011”

Basic

MODE

Full Page At MRS A210 = “111”

At the end of the burst length, burst is warp-around.

Random

MODE Burst Stop t

BDL = 1, Valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively.

Using burst stop command, any burst length control is possible.

RAS Interrupt

(Interrupted by

Precharge)

Before the end of burst. Row precharge command of the same bank stops read /write burst

with auto precharge.

t

RDL = 1 with DQM , Valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively.

During read/write burst with auto precharge, RAS interrupt can not be issued.

Interrupt

MODE

CAS Interrupt

Before the end of burst, new read/write stops read/write burst and starts new read/write

burst.

During read/write burst with auto precharge, CAS interrupt can not be issued.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 24/45

FUNCTION TRUTH TABLE (TABLE 1)

Current

State CS RAS CAS WE BA ADDR ACTION Note

H X X X X X NOP

L H H H X X NOP

L H H L X X ILLEGAL 2

IDLE L H L X BA CA, A10/AP ILLEGAL 2

L L H H BA RA Row (&Bank) Active; Latch RA

L L H L BA A10/AP NOP 4

L L L H X X Auto Refresh or Self Refresh 5

L L L L OP code OP code Mode Register Access 5

H X X X X X NOP

L H H H X X NOP

L H H L X X ILLEGAL 2

Row L H L H BA CA, A10/AP Begin Read; latch CA; determine AP

Active L H L L BA CA, A10/AP Begin Write; latch CA; determine AP

L L H H BA RA ILLEGAL 2

L L H L BA A10/AP Precharge

L L L X X X ILLEGAL

H X X X X X NOP (Continue Burst to End Æ Row Active)

L H H H X X NOP (Continue Burst to End Æ Row Active)

L H H L X X Term burst Æ Row active

Read L H L H BA CA, A10/AP Term burst, New Read, Determine AP

L H L L BA CA, A10/AP Term burst, New Write, Determine AP 3

L L H H BA RA ILLEGAL 2

L L H L BA A10/AP Term burst, Precharge timing for Reads

L L L X X X ILLEGAL

H X X X X X NOP (Continue Burst to End Æ Row Active)

L H H H X X NOP (Continue Burst to End Æ Row Active)

L H H L X X Term burst Æ Row active

Write L H L H BA CA, A10/AP Term burst, New Read, Determine AP 3

L H L L BA CA, A10/AP Term burst, New Write, Determine AP 3

L L H H BA RA ILLEGAL 2

L L H L BA A10/AP Term burst, Precharge timing for Writes 3

L L L X X X ILLEGAL

H X X X X X NOP (Continue Burst to End Æ Row Active)

Read with L H H H X X NOP (Continue Burst to End Æ Row Active)

Auto L H H L X X ILLEGAL

Precharge L H L X BA CA, A10/AP ILLEGAL

L L H X BA RA, RA10 ILLEGAL 2

L L L X X X ILLEGAL

H X X X X X NOP (Continue Burst to End Æ Row Active)

Write with L H H H X X NOP (Continue Burst to End Æ Row Active)

Auto L H H L X X ILLEGAL

Precharge L H L X BA CA, A10/AP ILLEGAL

L L H X BA RA, RA10 ILLEGAL 2

L L L X X X ILLEGAL

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 25/45

Current

State CS RAS CAS WE BA ADDR ACTION Note

H X X X X X NOP Æ Idle after tRP

Read with L H H H X X NOP Æ Idle after tRP

Auto L H H L X X ILLEGAL 2

Precharge L H L X BA CA ILLEGAL 2

L L H H BA RA ILLEGAL 2

L L H L BA A10/AP NOP Æ Idle after tRP 4

L L L X X X ILLEGAL

H X X X X X NOP Æ Row Active after tRCD

L H H H X X NOP Æ Row Active after tRCD

Row L H H L X X ILLEGAL 2

Activating L H L X BA CA ILLEGAL 2

L L H H BA RA ILLEGAL 2

L L H L BA A10/AP ILLEGAL 2

L L L X X X ILLEGAL

H X X X X X NOP Æ Idle after tRFC

L H H X X X NOP Æ Idle after tRFC

Refreshing L H L X X X ILLEGAL

L L H X X X ILLEGAL

L L L X X X ILLEGAL

H X X X X X NOP Æ Idle after 2clocks

Mode L H H H X X NOP Æ Idle after 2clocks

Register L H H L X X ILLEGAL

Accessing L H L X X X ILLEGAL

L L X X X X ILLEGAL

Abbreviations: RA = Row Address BA = Bank Address

NOP = No Operation Command CA = Column Address AP = Auto Precharge

*Note: 1. All entries assume the CKE was active (High) during the precharge clock and the current clock cycle.

2. Illegal to bank in specified state; Function may be legal in the bank indicated by BA, depending on the state of the bank.

3. Must satisfy bus contention, bus turn around, and/or write recovery requirements.

4. NOP to bank precharge or in idle state. May precharge bank indicated by BA (and A10/AP).

5. Illegal if any bank is not idle.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 26/45

FUNCTION TRUTH TABLE (TABLE2)

Current

State

CKE

( n-1 )

CKE

n CS RAS CAS WE ADDR ACTION Note

H X X X X X X INVALID

L H H X X X X Exit Self Refresh Æ Idle after tRFC (ABI) 6

Self L H L H H H X Exit Self Refresh Æ Idle after tRFC (ABI) 6

Refresh L H L H H L X ILLEGAL

L H L H L X X ILLEGAL

L H L L X X X ILLEGAL

L L X X X X X NOP (Maintain Self Refresh)

H X X X X X X INVALID

All L H H X X X X Exit Self Refresh Æ ABI 7

Banks L H L H H H X Exit Self Refresh Æ ABI 7

Precharge L H L H H L X ILLEGAL

Power L H L H L X X ILLEGAL

Down L H L L X X X ILLEGAL

L L X X X X X NOP (Maintain Low Power Mode)

H H X X X X X Refer to Table1

H L H X X X X Enter Power Down 8

H L L H H H X Enter Power Down 8

H L L H H L X ILLEGAL

All H L L H L X X ILLEGAL

Banks H L L L H H RA Row (& Bank) Active

Idle H L L L H H X NOP

H L L L L H X Enter Self Refresh 8

H L L L L L OP Code Mode Register Access

L L X X X X X NOP

Any State H H X X X X X Refer to Operations in Table 1

other than H L X X X X X Begin Clock Suspend next cycle 9

Listed L H X X X X X Exit Clock Suspend next cycle 9

above L L X X X X X Maintain Clock Suspend

Abbreviations: ABI = All Banks Idle, RA = Row Address

*Note: 6.CKE low to high transition is asynchronous.

7.CKE low to high transition is asynchronous if restart internal clock.

A minimum setup time 1CLK + tSS must be satisfy before any command other than exit.

8.Power down and self refresh can be entered only from the all banks idle state.

9.Must be a legal command.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 27/45

Single Bit Read-Write-Read Cycle (Same Page) @ CAS Latency = 3, Burst Length = 1

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 28/45

Note: 1. All input expect CKE & DQM can be don’t care when CS is high at the CLK high going edge.

2. Bank active @ read/write are controlled by BA0, BA1.

BA0 BA1 Active & Read/Write

0 0 Bank A

0 1 Bank B

1 0 Bank C

1 1 Bank D

3. Enable and disable auto precharge function are controlled by A10/AP in read/write command

A10/AP BA0 BA1 Operating

0 0 Disable auto precharge, leave A bank active at end of burst.

0 1 Disable auto precharge, leave B bank active at end of burst.

1 0 Disable auto precharge, leave C bank active at end of burst.

0

1 1 Disable auto precharge, leave D bank active at end of burst.

0 0 Enable auto precharge , precharge bank A at end of burst.

0 1 Enable auto precharge , precharge bank B at end of burst.

1 0 Enable auto precharge , precharge bank C at end of burst.

1

1 1 Enable auto precharge , precharge bank D at end of burst.

4. A10/AP and BA0, BA1 control bank precharge when precharge is asserted.

A10/AP BA0 BA1 Precharge

0 0 0 Bank A

0 0 1 Bank B

0 1 0 Bank C

0 1 1 Bank D

1 X X All Banks

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 29/45

Power Up Sequence

0

1

2

3

4

5

6

7

8

9

1

0

11 1

2

1

3

1

4

1

5

1

6

1

7

1

8

1

9

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

t

RP

Key RAa

BA0

BA1

RAa

High-Z

Precharge

(All Banks)

Auto Refresh Auto Refresh Mode Register Set

Row Active

(A-Bank)

: Don't care

t

RFC

t

RFC

High level is necessary

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 30/45

Read & Write Cycle at Same Bank @ Burst Length = 4

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

BA0

BA1

CL =2

CL =3

Row Active

( A - Bank )

Read

(A-Bank)

Write

(A-Bank)

Row Active

(A-Bank) Precharge

(A - Bank)

:Don't Care

Qa1 Qa2 Qa3 Qb1 Qb2 Qb3Qb0Qa0

Ra

*Note2

Rb Cb0

Ra Ca0

HIGH

t

RCD

t

RDL

0123456789

10 11 12 13 14 15 16 17 18 19

Rb

*Note3

Qa1 Qa2 Qa3 Qb1 Qb2 Qb3Qb0Qa0

t

RDL

*Note3

Precharge

(A-Bank)

*Note: 1. Minimum row cycle times is required to complete internal DRAM operation.

2. Row precharge can interrupt burst on any cycle. [CAS Latency-1] number of valid output data is

available after Row precharge. Last valid output will be Hi-Z (tSHZ) after the clock.

3. Output will be Hi-Z after the end of burst. (1, 2, 4, 8 & Full page bit burst)

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 31/45

Page Read & Write Cycle at Same Bank @ Burst Length = 4

0 123 456 78910111213141516171819

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

CL =2

CL =3

*Note3

Row Active

(A-Bank)

Read

(A-Bank)

Read

(A-Bank)

Write

( A - Bank )

Write

(A-Bank)

Precharge

(A - Bank)

:Don't Care

Qa0 Qa1 Qb0 Qb1 Dd0 Dd1

t

CDL

Dc1

Dc0

Qa1 Qb0 Qb1 Qb2 Dc1 Dd0 Dd1

Dc0

Qa0

Ra

*Note2

Cc Cd

Ra Ca Cb

*Note1

HIGH

t

RCD

t

RDL

BA1

Note: 1. To Write data before burst read ends. DQM should be asserted three cycles prior to write command to avoid

bus contention.

2. Row precharge will interrupt writing. Last data input, tRDL before row precharge, will be written.

3. DQM should mask invalid input data on precharge command cycle when asserting precharge before

end of burst. Input data after Row precharge cycle will be masked internally.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 32/45

Page Read Cycle at Different Bank @ Burst Length = 4

Row Active

( A-Bank)

Row Active

(B-Bank)

Read

(A-Bank)

Row Active

(C-Bank)

Read

(B-Bank)

Precharge

(A-Bank)

Row Active

(D-Bank)

Read

(C-Bank)

Precharge

(B-Bank)

Read

(D-Bank)

Precharge

(C-Bank)

Precharge

(D-Bank)

:Don't Care

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

CL=2

DQM

A10/AP

BA0

BA1

CL=3

RBb CAa RCc CBb RDd CCc CDd

*Note1

*Note2

RAa

RDd

QBb0 QBb2 QCc0 QCc1 QCc2 QDd0 QDd1 QDd2

QAa1

QAa0 QAa2 QBb1

QAa0 QAa1 QAa2 QBb0 QCc1 QCc2 QDd0 QDd2

QDd1

QBb1 QCc0

QBb2

RAa RBb RCc

HIGH

DQ

Note: 1. CS can be don’t cared when RAS , CAS and WE are high at the clock high going edge.

2. To interrupt a burst read by row precharge, both the read and the precharge banks must be the same.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 33/45

Page Write Cycle at Different Bank @ Burst Length = 4

0

1

2

3

4

5

6

7

8

9

1

0

11 1

2

1

3

1

4

1

5

1

6

1

7

1

8

1

9

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

BA0

BA1

: Don't care

*Note1

RAa RBb CAa CBb RDd CCc

RCc CDd

*Note2

DAa1

DAa0 DBb0 DBb1 DBb3 DDd0DDd1

DAa2 DBb2 DCc0 DCc1

RAa RBb RCc RDd

DAa3 CDd2

t

CDL

Row Active

(A-Bank)

Row Active

(B-Bank)

Write

(A-Bank)

Write

(B-Bank)

Row Active

(C-Bank)

Write

(C-Bank)

Precharge

(All Banks)

Row Active

(D-Bank)

Write

(D-Bank)

HIGH

t

RDL

*Note: 1. To interrupt burst write by Row precharge, DQM should be asserted to mask invalid input data.

2. To interrupt burst write by Row precharge, both the write and the precharge banks must be the same.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 34/45

Read & Write Cycle at Different Bank @ Burst Length = 4

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

CL =2

CL =3

Row Active

(A-Bank)

Read

(B-Bank)

:Don't Care

QAa1 QAa2 QAa3 Ddb1 DDb2 DDd3

DDb0

QAa0

RAa

CBc

RAa CAa

QAa1 QAa2 QAa3 Ddb1 DDb2 DDd3

DDb0

QAa0

Write

(D-Bank)

HIGH

RDb CDb RBc

RBb RAc

QBc0 QBc1 QBc2

QBc0 QBc1

Read

(A-Bank)

Row Active

(D-Bank)

Precharge

(A-Bank)

Row Active

(B-Bank)

tCDL *Note1

192103 4 5 6 7 8 11 12 13 14 1715 18

16 19

0

BA0

BA1

*Note: 1. tCDL should be met to complete write.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 35/45

Read & Write cycle with Auto Precharge @ Burst Length = 4

0 12345 67 8910111213141516171819

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

CL =2

CL =3

Row Active

(A-Bank)

Row Active

(D-Bank)

Auto Precharge

Start Point

Read with

Auto Precharge

(A-Bank)

Auto Precharge

Start Point

(D-Bank)

:Don't Care

QAa1 QAa2 QAa3 Ddb1 DDb2 DDd3

DDb0

QAa0

Ra

Cb

Ra Ca

Rb

QAa1 QAa2 QAa3 Ddb1 DDb2 DDd3

DDb0

QAa0

Write with

Auto Precharge

(D-Bank)

HIGH

BA0

BA1

*Note: 1. tCDL should be controlled to meet minimum tRAS before internal precharge start.

(In the case of Burst Length = 1 & 2)

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 36/45

Clock Suspension & DQM Operation Cycle @ CAS Latency = 2, Burst Length = 4

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

Ra Ca Cb Cc

Ra

Qa0 Qa1 Qa2 Qa3

t

SHZ

Qb1Qb0

t

SHZ

Dc0 Dc2

*Note1

Row Active Read Clock

Supension

Read

Read DQM

Write

DQM

Clock

Suspension

Write

DQM

:Don't Care

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

BA0

BA1

*Note: 1. DQM is needed to prevent bus contention

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 37/45

Read interrupted by Precharge Command & Read Burst Stop Cycle @ Burst Length = Full page

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

RAa CAa CAb

RAa

QAa0 QAa1 QAb1

QAb0 QAb2

*Note1

Row Active

(A-Bank)

Read

(A-Bank)

Burst Stop Read

(A-Bank)

:Don't Care

HIGH

CL=2

CL=3

QAa2 QAa3 QAa4 QAb3 QAb4 QAb5

QAa0 QAa1 QAb1QAb0 QAb2

QAa2 QAa3 QAa4 QAb3 QAb4 QAb5

11

22

Precharge

(A-Bank)

BA0

BA1

*Note: 1. About the valid DQs after burst stop, it is same as the case of RAS interrupt.

Both cases are illustrated above timing diagram. See the label 1, 2 on them.

But at burst write, Burst stop and RAS interrupt should be compared carefully.

Refer the timing diagram of “Full page write burst stop cycles”.

2. Burst stop is valid at every burst length.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 38/45

Write interrupted by Precharge Command & Write Burst Stop Cycle @ Burst Length = Full page

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

BA0

BA1

RAa CAa CAb

RAa

DAa0 DAa1 DAb1

DAb0 DAb2

Row Active

(A-Bank)

Write

(A-Bank)

Burst Stop Write

(A-Bank)

:Don't Care

HIGH

DAa2 DAa3 DAa4 DAb3 DAb4 DAb5

Precharge

(A-Bank)

t

BDL

t

RDL

*Note1

19210

34

5678 11 12 13 14 17

15 1816 19

0

*Note: 1. Data-in at the cycle of interrupted by precharge can not be written into the corresponding memory cell. It is defined by

AC parameter of tRDL.

DQM at write interrupted by precharge command is needed to prevent invalid write.

DQM should mask invalid input data on precharge command cycle when asserting precharge before end of burst. Input

data after Row precharge cycle will be masked internally.

2. Burst stop is valid at every burst length.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 39/45

Active/Precharge Power Down Mode @ CAS Latency = 2, Burst Length = 4

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

BA1

Active

Power-down

Exit

Precharge

: Don't care

*Note3

*Note2

*Note1

t

SS

t

SS

t

SS

Qa0 Qa1 Qa2

t

SHZ

Precharge

Power-Down

Entry Precharge

Power-Down

Exit

Row Active

Active

Power-down

Entry

Read

0123456789

10 11 12 13 14 15 16 17 18 19

BA0

Ra

Ra Ca

*Note: 1. All banks should be in idle state prior to entering precharge power down mode.

2. CKE should be set high at least 1CLK + tSS prior to Row active command.

3. Can not violate minimum refresh specification. (64ms)

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 40/45

Self Refresh Entry & Exit Cycle

01 234 567 8910111213141516171819

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

A10/AP

BA0, BA1

Self Refresh Entry Auto Refresh

: Don't care

*Note2

*Note1

t

SS

*Note3

*Note4

t

RFC

min

*Note6

Self Refresh Exit

Hi-Z

*Note5

*Note7

*Note: TO ENTER SELF REFRESH MODE

1. CS , RAS & CAS with CKE should be low at the same clock cycle.

2. After 1 clock cycle, all the inputs including the system clock can be don’t care except for CKE.

3. The device remains in self refresh mode as long as CKE stays “Low”.

cf.) Once the device enters self refresh mode, minimum tRAS is required before exit from self refresh.

TO EXIT SELF REFRESH MODE

4. System clock restart and be stable before returning CKE high.

5. CS starts from high.

6. Minimum tRFC is required after CKE going high to complete self refresh exit.

7. 4K cycles of burst auto refresh is required immediately before self refresh entry and immediately after self refresh exit.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 41/45

Mode Register Set Cycle Auto Refresh Cycle

CLOCK

CKE

CS

RAS

CAS

ADDR

WE

DQ

DQM

:Don't Care

HIGH

0 12 34 5 6 01 23 45 67 8 910

HIGH

Key Ra

HI-Z HI-Z

*Note2

*Note1

*Note3

t

RFC

MRS New

Command Auto Refresh New Command

All banks precharge should be completed before Mode Register Set cycle and auto refresh cycle.

MODE REGISTER SET CYCLE

*Note: 1. CS , RAS , CAS , & WE activation at the same clock cycle with address key will set internal mode register.

2. Minimum 2 clock cycles should be met before new RAS activation.

3. Please refer to Mode Register Set table.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 42/45

PACKING DIMENSIONS

54-LEAD TSOP(II) SDRAM (400mil) (1:3)

A

A2

D

DETAIL "A"

Seating plane

θ

Y

b1

SECTION B-B

b

WITH PLANTING

BASE METAL

c

c1

see detail A

E

E1

e

1

b

27

54 28

Pin 1 identifier

-C-

A1

L

L1

B

Symbol Dimension in mm Dimension in inch

Min Norm Max Min Norm Max

A

1.20

0.047

A1 0.05 0.10 0.15 0.002 0.004 0.006

A2 0.95 1.00 1.05 0.037 0.039 0.041

b 0.30 0.45 0.012 0.018

b1 0.30 0.35 0.40 0.012 0.014 0.016

c 0.12 0.21 0.005 0.008

c1 0.10 0.127 0.16 0.004 0.005 0.006

D 22.22 BSC 0.875 BSC

E 11.76 BSC 0.463 BSC

E1 10.16 BSC 0.400 BSC

L 0.40 0.50 0.60 0.016 0.020 0.024

L1 0.80 REF 0.031 REF

e 0.80 BSC 0.031 BSC

Y

0.1

0.004

Θ 0° 8° 0° 8°

Controlling dimension : Millimeter

(Revision date : May 25 2012)

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 43/45

PACKING DIMENSIONS

54-BALL SDRAM ( 8x8 mm )

Symbol Dimension in mm Dimension in inch

Min Norm Max Min Norm Max

A

1.00

0.039

A1 0.20 0.25 0.30 0.008 0.010 0.012

A2 0.61 0.66 0.71 0.024 0.026 0.028

Φb 0.30 0.35 0.40 0.012 0.014 0.016

D 7.90 8.00 8.10 0.311 0.315 0.319

E 7.90 8.00 8.10 0.311 0.315 0.319

D1

6.40

0.252

E1

6.40

0.252

e

0.80

0.031

Controlling dimension : Millimeter.

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 44/45

Revision History

Revision Date Description

1.0 2009.11.06 Original

1.1 2010.03.29 Add package description into pin / ball configuration

1.2 2012.06.07

Modify Page 42

θ=10 to 8°

b,b1=0.25 to 0.3mm

ESMT

M12L64164A (2M)

Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jun. 2012

Revision: 1.2 45/45

Important Notice

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any means without the prior permission of ESMT.

The contents contained in this document are believed to be accurate at the

time of publication. ESMT assumes no responsibility for any error in this

document, and reserves the right to change the products or specification in

this document without notice.

The information contained herein is presented only as a guide or examples

for the application of our products. No responsibility is assumed by ESMT for

any infringement of patents, copyrights, or other intellectual property rights of

third parties which may result from its use. No license, either express ,

implied or otherwise, is granted under any patents, copyrights or other

intellectual property rights of ESMT or others.

Any semiconductor devices may have inherently a certain rate of failure. To

minimize risks associated with customer's application, adequate design and

operating safeguards against injury, damage, or loss from such failure,

should be provided by the customer when making application designs.

ESMT's products are not authorized for use in critical applications such as,

but not limited to, life support devices or system, where failure or abnormal

operation may directly affect human lives or cause physical injury or property

damage. If products described here are to be used for such kinds of

application, purchaser must do its own quality assurance testing appropriate

to such applications.