CMZ12 to CMZ51 TOSHIBA Zener Diode Silicon Diffused Type CMZ12 to CMZ51 Surge absorber Unit: mm * Average power dissipation :P=2W * Zener voltage : VZ = 12 to 51 V * Suitable for compact assembly due to small surface mount package "M-FLATTM" (Toshiba package name) Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Power dissipation P 2 (Note 1) W Junction temperature Tj -40 to 150 C Tstg -40 to 150 C Storage temperature range 1. 2. Note 1: Ta = 30C Device mounted on a ceramic board Board size : 50 mm x 50 mm Land Pattern size : 2 mm x 2 mm Board thickness : 0.64 mm Anode Cathode JEDEC JEITA TOSHIBA 3-4E1S Weight: 0.023 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Land Pattern Dimensions (for reference only) 2.1 Unit: mm 1.4 3.0 1.4 Start of commercial production 2002-10 1 2015-05-15 CMZ12 to CMZ51 Electrical Characteristics (Ta = 25C) Zener Voltage Vz (V) Type Zener Impedance rd () Measurement Current IZ (mA) Min Typ. Max Max CMZ12 10.8 12 13.2 10 30 CMZ13 11.7 13 14.3 10 CMZ15 13.5 15 16.5 CMZ16 14.4 16 17.6 CMZ18 16.2 18 CMZ20 18.0 CMZ24 CMZ27 Measurement Current IZ (mA) Temperature Coefficient Of Zener T (mV/C) Forward Voltage VF (V) Measurement Current IF (A) Reverse Current IR (A) Max Measurement Voltage VR (V) Typ. Max Max 10 8 13 1.2 0.2 10 8 30 10 9 14 1.2 0.2 10 9 10 30 10 11 17 1.2 0.2 10 10 10 30 10 12 19 1.2 0.2 10 11 19.8 10 30 10 14 23 1.2 0.2 10 13 20 22.0 10 30 10 16 26 1.2 0.2 10 14 21.6 24 26.4 10 30 10 20 32 1.2 0.2 10 17 24.3 27 29.7 10 30 10 23 36 1.2 0.2 10 19 CMZ30 27.0 30 33.0 10 30 10 25 40 1.2 0.2 10 21 CMZ33 29.7 33 36.3 10 30 10 26 41 1.2 0.2 10 26.4 CMZ36 32.4 36 39.6 9 30 9 28 45 1.2 0.2 10 28.8 CMZ39 35.1 39 42.9 8 35 8 30 48 1.2 0.2 10 31.2 CMZ43 38.7 43 47.3 7 40 7 33 53 1.2 0.2 10 34.4 CMZ47 42.3 47 51.7 6 65 6 38 60 1.2 0.2 10 37.6 CMZ51 45.9 51 56.1 6 65 6 43 68 1.2 0.2 10 40.8 Marking Cathode mark and Lot code Part No. (or abbreviation code) Abbreviation Code Part No. Abbreviation Code Part No. 12 CMZ12 30 CMZ30 13 CMZ13 33 CMZ33 15 CMZ15 36 CMZ36 16 CMZ16 39 CMZ39 18 CMZ18 43 CMZ43 20 CMZ20 47 CMZ47 24 CMZ24 51 CMZ51 27 CMZ27 2 2015-05-15 CMZ12 to CMZ51 Handling Precaution 1) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. P : We recommend that the worst case power dissipation be no greater than 50% of the absolute maximum rating of power dissipation. Carry out adequate heat design. PRSM : We recommend that a device be used within the recommended area in the figure, PRSM-tw. Tj : Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 120C. 2) Thermal resistance between junction and ambient fluctuates depending on the device's mounting condition. When using a device, design a circuit board and a land pattern size to match the appropriate thermal resistance value. 3) Please refer to the Rectifiers databook for further information. 3 2015-05-15 CMZ12 to CMZ51 Ta max - P 160 120 Non-repetitive peak reverse Power dissipation PRSM (W) 140 Maximum allowable temperature Ta max (C) PRSM - tW 100 80 60 40 PRSM tW Ta = 25C Rectangular pulse Recommended 100 20 10 0 0 0.4 0.8 1.2 Power dissipation 1.6 P 2 0.1 2.4 1 Pulse width (W) T - VZ 25 (typ.) 10 tW (ms) T - VZ 50 (typ.) CMZ30 to CMZ51 Temperature coefficient of Zener voltage T (mV/C) CMZ12 to CMZ27 Temperature coefficient of Zener voltage T (mV/C) (reference value) 1000 Device mounted on a ceramic board: board size : 50 mm x 50 mm Land Pattern size : 2.0 mm x 2.0 mm board thickness : 0.64 mm 20 15 10 5 45 40 35 30 25 0 10 14 18 22 Zener voltage VZ 26 26 (V) 30 34 38 42 Zener voltage 46 50 54 58 VZ (V) rth (j-a) - t Transient thermal impedance rth (j-a) (C/W) 1000 Device mounted on a glass-epoxy board: Board size : 50 mm x 50 mm Land Pattern size : 2.1 mm x 1.4 mm Board thickness : 1.6 mm 100 10 1 0.1 0.001 Device mounted on a glass-epoxy board: Board size : 50 mm x 50 mm Land Pattern size : 6.0 mm x 6.0 mm Board thickness : 1.6 mm Device mounted on a ceramic board: Board size : 50 mm x 50 mm Land Pattern size : 2.0 mm x 2.0 mm Board thickness : 0.64 mm 0.01 0.1 1 10 100 1000 Time t (s) 4 2015-05-15 CMZ12 to CMZ51 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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