H4006501CID - EM Microelectronic

EM MICROELECTRONIC-MARIN SA H4006

13.56 MHz 64 Data bit Read Only

Contactless Identification Device

Features

nOperating frequency range 10 MHz to

15 MHz

n RF interface optimized for 13.56 MHz

operation

n Laser programmed memory array (64 data

bit + 16 CRC bit)

n Modulator switch designed to preserve

supply voltage

n Miller coding

n Default data rate is 26484 Baud

n Other data rates possible (mask

programmable)

n On chip rectifier

n On chip resonant capacitor

n On chip supply buffer capacitor

Description

The H4006 is a CMOS integrated circuit

intended for use in electronic Read Only

transponders.

The exited coil connected to the device

generates the power supply via a Graetz bridge

and an integrated decoupling capacitor. The

clock used for the logic is also extracted from the

coil. The logic is mainly composed by a miller

code generator and the LROM control. The

memory is factory programmed so that each IC is

unique.

Applications

n Logistics automation

n Anticounterfeiting

n Access control

n Industrial transponder

Typical Operating Configuration

H4006

L: typical 1.4 µH for fo = 13.56 MHz

Figure 1

Pad Assignment

H4006

VSS

TESTn

TOUT

VDD

C1 C2

Figure 2

EM MICROELECTRONIC-MARIN SA H4006

Absolute Maximum Ratings

Parameter Symbol Conditions

Maximum DC Current

forced on COIL1 and

COIL2

Power Supply

Storage Temperature

Electrostatic discharge

maximum to MIL-STD-883C

method 3015

ICMAX

VDD

Tst

VESD

±30mA

-0.3V to 7.5V

-55 to +200°C

2000V

Table 1

Stresses above these listed maximum ratings may

cause permanent damage to the device.

Exposure beyond specified operating conditions

may affect device reliability or cause

malfunction.

Operating Conditions

Parameter Symbol Min. Typ. Max. Units

Operating Temp.

Maximum Coil

Current

AC Voltage on

Coil

Supply Frequency

Top

Icoil

Vcoil

fcoil

-40

-10

14*

13.56

+85

°C

Vpp

MHz

Table 2

*) The AC Voltage on Coil is limited by the on

chip voltage limitation circuitry. This is

according to the parameter Icoil.

Handling Procedures

This device has built-in protection against high

static voltages or electric fields; however due to

the unique properties of this device, anti-static

precautions should be taken as for any other

CMOS component.

System Principle

H4006

Oscillator Antenna

Driver

Demodulator

Filter &

Gain

Data

Decoder

Data received

from transponder

Transceiver Transponder

Signal on

Transponder coil

Signal on

Transceiver coil

DataRF Carrier

Signals on coils

Figure 3

EM MICROELECTRONIC-MARIN SA H4006

Electrical Characteristics

VDD = 2V, VSS = 0V, fC1 = 13.56MHz sine wave, VC1 = 1.0Vpp centered at (VDD - VSS)/2, Ta = 25°C

unless otherwise specified

Parameter Symbol Test Conditions Min. Typ. Max. Units

Supply Voltage VDD 1.9 1) V

Supply current IDD 60 150 µA

Rectifier Voltage Drop VREC IC1C2 = 1mA, modulator switch on

VREC = (VC1-VC2) - (VDD - V SS)

1.8 V

Modulator ON DC

voltage drop 2) VON1

VON2

IVDD VSS = 1mA

IVDD VSS = 10mA

1.9

2.4

2.3

2.8

3.3

Power on reset 3) VR

VR - V MIN

1.2

0.1

1.4

0.25

1.7

0.5

Coil1 - Coil2 Capacitance CRES Vcoil=100mVRMS f=10kHz 92.6 94.5 96.4 pF

Series resistance of CRES RS3Ω

Power Supply Capacitor Csup 140 pF

1) Maximum voltage is defined by forcing 10 mA on C1 - C2 Table 3

2) Measured between VDD and VSS

3) According to Figure 7

Block Diagram

Clock extractor

Divider Chain

Sequencer Miller Code

Generator

Power

Reset LASER

ROM

Modulator

HF Rectifier

Power Management

VDD

VSS

CSUP

AC2

AC1

CRES

Figure 4

EM MICROELECTRONIC-MARIN SA H4006

General description

The transponder will be activated when

illuminated by a RF field of sufficient power and

at any frequency that is compatible with its

associated antenna and its internal power supply

circuit input characteristics. The chip will Power-

on-Reset itself when powered by this incoming

energy that exceeds its reset threshold. After

resetting itself the chip will start to transmit its

memory contents as a stream of Miller code. The

memory contents is transmitted by modifying the

antenna matching impedance at its internal

clock rate, thereby causing varying amounts of

RF energy to be reflected from the antenna. This

impedance variation will be achieved by

connecting a modulating device across the

antenna terminals. When switched on the

modulating device will present a low impedance

to the antenna. This will cause a change in the

matching of the antenna and therefore in the

amount of RF energy reflected by the transponder

to the reader. This reflected signal combines with

the transmitted signal in the receiver to yield an

amplitude modulated signal representative of the

IC memory contents. The “ON” impedance of the

modulating device needs to be comparable to

about 100 Ohms to affect the matching of the

antenna and therefore its reflectivity.

The RF signal received from the transponder

antenna will serve several purposes :

•power the chip

•provide a global reset to the chip through its

POR (Power-On-Reset) function

•provide a carrier for the data transmission

•provide the input of the internal clock

generation circuit (frequency division)

Functional description

Output Sequence

Transmission from the transponder will be

accomplished through variation of the antenna

load impedance by switching the modulating

device ON and OFF.

Output sequence is composed of cycles which

are repeated. Each cycle is composed of 82 bits

Standard Message Structure (STDMS) which is

Miller coded and a pause (LW) during which the

modulating device is OFF (see figure 6 for details

of Miller code).

The pause (LW) is 9bits length.

The 82 bit STDMS consists of 1 start bit, 64 data

bits, 16 CRC bits and 1 stop bit.

Start bit (1) Data(64) CRC

(16)

Stop bit

(1)

LW(9)

Table 4

Memory organisation

As already mentioned above the 82 bits are

stored in laser programmed ROM (LROM). The 82

bits of this LROM is partioned as

followed (see table 5):

Wafer Number 5 bits

Factory reserved 4 bits

IC name 10 bits

Customer ID 13 bits

Extended lot number 18 bits

IC position 14 bits

Cyclic redundancy check 16 bits

Start and stop bits 2 bits

First bit sent is bit 0.

EM MICROELECTRONIC-MARIN SA H4006

Memory Map

0 1 2 3 4 5

start Wafer Number

6789

Factory Reserved

10 11 12 13 14 15 16 17 18 19

IC Name

20 21 22 23 24 25 26 27 28 29 30 31 32

Customer ID

33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50

Extended lot number

51 52 53 54 55 56 57 58 59 60 61 62 63 64

IC position

65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81

Cyclic redundancy check stop

Table 5

Wafer number

Each wafer has a number between 1 and 25. This

5 bit wafer number contains the wafer number

where the IC was.

Factory reserved bits

These 4 bits are reserved. Default value is 0hex.

IC name bits

They contains the 3 first characters device name.

For this device, the value is 006hex.

Customer ID bits

This field contains a code which is defined by

EM Microelectronic-Marin S.A. For standard

version, the code is 0001hex.

Extended lot number

The code on the chips is unique and reflects the

production lot number system of EM

Microelectronic. This numbering allows full

traceability of each chip.

IC position

These 14 bits give the precise position on the

processed wafer.

Cyclic redundancy check

The shift register is reset to all zero with each

Stop Bit.

CRC code is calculated on 64 data bits. The CRC

code is calculated according to CCITT / ISO

3309 - 1984 standarts. See figure 5 for principle

block schematic and generating polynomial of

the CRC code.

Start and stop bits

Start bit is set to logic 1 and stop bit is set to logic

EM MICROELECTRONIC-MARIN SA H4006

CRC Block Diagram

15 14 111213 45678910 0123

data input

BCC REGISTER

SERIAL QUOTIENT

X16X12X5

FEEDBACK

BEFORE

SHIFT

CRC-CCITT GENERATING POLYNOMIAL = X16 + X12 + X5 + X0

=BCC(Block Check Characters) REGISTER STAGE

= EXCLUSIVE - OR

LSBMSB

Figure 5

EM MICROELECTRONIC-MARIN SA H4006

RF Interface

Resonant capacitor, Rectifier, Limiter and

Modulator Switch form the unit which is

interfacing to the incoming RF signal. These

blocks are interdependent so they are developed

as unit. They interface to the antenna which

typical characteristics are:

Ls ≈ 1400 nH

Rs ≈ 3 Ohms

30 < Q < 40 at 13.56 MHz.

Resonant Capacitor

The capacitor value is adjusted by laser fusing. It

can be trimmed in factory by 1pF steps to

achieve the absolute value of 94.5pF typically.

This option, which is available on request, allows

a smaller capacitor tolerance over the whole

production.

Rectifier and Limiter

A full wave rectifier (Graetz Bridge) is used to

provide supply voltage to the IC. The reverse

breakdown of the diodes is also used to protect

the IC from overvoltages.

Modulator Switch

Due to the low impedance of the antenna and

resonant capacitor the Modulator Switch has to

present low RF impedance when switched ON

(about 100 ohms).

The minimum time period with the Modulator

Switch ON is 38 µs. At lower data rates this time

is even much longer. The current consumption of

divider chain running at 13 MHz is near 60 µA.

Putting together this two figures it is clear that it is

not possible to supply the IC during the time the

Modulator Switch is ON from the integrated

Supply Buffer Capacitor which value is

approximately 140 pF. The IC has to get power

from the RF field also during the time the

Modulator Switch is ON.

This problem is solved by putting the Modulator

Switch on the output of the Rectifier (between

VDD and VSS) and regulating its ON resistance in

function of supply voltage. When the supply

voltage is high the ON impedance is low. When

the supply voltage drops near the region where

the operation of the IC at 13.56 MHz is not

guaranteed the ON impedance is increased in

order to prevent further drop.

NRZ-L

STREAM

DM-M

CODED

1 11111 00000

Bit i-1 Bit i

x 1 no transition at the beginning of Bit i, transition in the middle of Bit i

0 0 transition at the beginning of Bit i, no transition in the middle of Bit i

1 0 no transition at the beginning of Bit i, no transition in the middle of Bit i

Figure 6

EM MICROELECTRONIC-MARIN SA H4006

Power Supply Management

For a correct operation, the device must be

initialised. When the transponder is put in the RF

field, the supply voltage increases until it achieves Vr

limit (see Figure 7). During this time and for an

additionnal 64 bit period, the modulator switch is on

and the device initialises its internal logic.

At this point, the data transmission starts and runs

while the supply voltage is higher than Vmin. If the

supply voltage decreases under this limit, the device

is again in an initialising state and the modulator is on.

Vmax (voltage clipping)

Vmin

Vr (Read wake up)

chip operating voltage range : from Vmin to Vmax

chip on board supply voltage

time

supply voltage

VDD

time

modulator

ON/OFF

OFF

ON READ

64 bits

period

Figure 7

EM MICROELECTRONIC-MARIN SA H4006

Miller Encoder

The input to Miller encoder is NRZ data coming

from LROM. The output is coded according to

Miller format and is driving the modulator Switch.

See figure 6 for example of Miller code.

Clock Generation

The clock of the logic is extracted from the RF

signal. The clock extracted from RF signal is

driving the divider chain consisting of toggle flip-

flops. The output of this divider chain is data

clock with which the data from Laser ROM

(LROM) is addressed, encoded and sent to

Modulator Switch.

The layout of divider chain is designed in a way

that different data rates can be chosen with metal

mask (options).

The following division factors are possible on

request:

128, 256, 1024, 2048, 4094 and 8192.

The standard is 512.

Others

As mentioned in Output Sequence, during the

pause (LW) the Modulator Switch is OFF. When

observing the pause duration one has to

remember that the time with Modulator Switch

OFF effectively observed can vary due to

different terminations of STDMS. The stop bit at

0 can be represented either by Modulator Switch

ON or OFF depending on the data. The start bit

at 1 adds 1/2 of data period OFF (transition in the

middle of bit period).

Figure below show the four possible terminations

of STDMS and its influence on entire period

passed by Modulator Switch OFF. Level LOW

represents Modulator Switch OFF. LDB stands for

last data bit.

LDB

Last data

bit

Stop bit

at 0

Pause 8 +1 bit periods Start bit

at 1

This transition is not due to Miller encoding.

Figure 8

Pad Description

Name Description

C2 connection to antenna

C1 connection to antenna

VDD positive supply

Tout test output

TESTn test input with pull up

VSS negative supply

Table 6

EM MICROELECTRONIC-MARIN SA H4006

EM MICROELECTRONIC-MARIN SA CH-2074 Marin, Switzerland Tel. +41 32 755 51 11, Fax. +41 32 755 5403

Pad position

137 339 189

259

150 150

1041

317

160

141

1600

VSS TESTn

H4006

VDD

TOUT

Dimensions in µm

PCB package

4.0 mm

8.0 mm

1.0 mm max.

E M

Coil2 Coil1

Dimensions in mm

CID package

FRONT VIEW

4±0.2

6±0.2

8.5±0.3

0.4±0.1

0.5±

0.12

R0.5±0.1

TOP VIEW

1.3±

0.05

1.3±

0.05

0.485±0.015

0.127±0.012

Dimensions in mm

MARKING

AREA

Coil2 Coil1

Ordering Information

The H4006 is available in :

- Chip form * H4006 501 IC

- CIDpack H4006 501 CID

- PCB package H4006 501 COB

*Chip will be delivered in wafer form.

Thickness of the wafer: 180 µm ± 20 µm (7 mils)

EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely

embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the

specifications without notice at any time. You are strongly urged to ensure that the information given has not been