R
D
R
D
DE
RE
Y
Z
B
A
GND
VCC
R
D
R
DY
Z
B
A
VCC
GND
VCC
SN65HVD70,
SN65HVD73, and
SN65HVD76
SN65HVD71,
SN65HVD74, and
SN65HVD77
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Folder
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Software
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SN65HVD7x 3.3-V Full-Duplex RS-485 Transceivers With ±12-kV IEC ESD
These devices each combine a differential driver and
1 Features a differential receiver, which operate from a single
1• 1/8 Unit-Load Options Available 3.3-V power supply. Each driver and receiver has
– Up to 256 Nodes on the Bus separate input and output pins for full-duplex bus
communication designs. These devices all feature a
• Bus I/O Protection wide common-mode voltage range which makes the
– > ±30-kV HBM protection devices suitable for multi-point applications over long
– > ±12-kV IEC61000-4-2 Contact Discharge cable runs.
– > ±4-kV IEC61000-4-4 Fast Transient Burst The SN65HVD71, SN65HVD74, and SN65HVD77
• Extended Industrial Temperature Range: devices are fully enabled with no external enabling
pins.
–40°C to 125°C
• Large Receiver Hysteresis (70 mV) for Noise The SN65HVD70, SN65HVD73, and SN65HVD76
Rejection devices have active-high driver enables and active-
low receiver enables. A low, less than 5-µA standby
• Low Power Consumption current can be achieved by disabling both the driver
– < 1.1-mA Quiescent Current During Operation and receiver.
– Low Standby Supply Current: 10 nA Typical, These devices are characterized from –40°C to
< 5 µA (maximum) 125°C.
• Glitch-Free Power-Up and Power-Down Protection
for Hot-Plugging Applications Device Information(1)
• 5-V Tolerant Logic Inputs Compatible With 3.3-V PART NUMBER PACKAGE BODY SIZE (NOM)
or 5-V Controllers SN65HVD71 MSOP (8) 3.00 mm × 3.00 mm
SN65HVD74
• Signaling Rate Options Optimized for: SOIC (8) 4.90 mm × 3.91 mm
SN65HVD77
400 kbps (70, 71), 20 Mbps (73, 74), 50 Mbps SN65HVD70 MSOP (10) 3.00 mm × 3.00 mm
(76, 77) SN65HVD73 SOIC (14) 8.65 mm × 3.91 mm
SN65HVD76
2 Applications (1) For all available packages, see the orderable addendum at
the end of the datasheet.
• E-meters
• Industrial Automation Block Diagram
• Building Automation
• Security and Surveillance
• Encoders and Decoders
3 Description
These devices extend the RS-485 portfolio with a
family of full-duplex transceivers with robust 3.3-V
drivers and receivers and high levels of ESD
protection. The ESD protection includes > ±30-kV
HBM and > ±12-kV IEC61000-4-2 contact discharge.
The large receiver hysteresis of the SN65HVD7x
devices provides immunity to conducted differential
noise and the wide operating temperature enables
reliability in harsh operating environments. The
SN65HVD7x devices are offered in a standard SOIC
package as well as in a small-footprint MSOP
package.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
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,
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Table of Contents
1 Features.................................................................. 19 Detailed Description............................................ 16
9.1 Overview................................................................. 16
2 Applications ........................................................... 19.2 Functional Block Diagram....................................... 16
3 Description............................................................. 19.3 Feature Description................................................. 16
4 Revision History..................................................... 29.4 Device Functional Modes........................................ 16
5 Device Comparison Table..................................... 310 Application and Implementation........................ 19
6 Pin Configuration and Functions......................... 310.1 Application Information.......................................... 19
7 Specifications......................................................... 610.2 Typical Application................................................ 19
7.1 Absolute Maximum Ratings ...................................... 611 Power Supply Recommendations ..................... 25
7.2 Handling Ratings....................................................... 612 Layout................................................................... 25
7.3 Recommended Operating Conditions....................... 612.1 Layout Guidelines ................................................. 25
7.4 Thermal Information — D Packages......................... 712.2 Layout Example .................................................... 26
7.5 Thermal Information — DGS and DGK Packages.... 713 Device and Documentation Support ................. 27
7.6 Power Dissipation ..................................................... 713.1 Device Support...................................................... 27
7.7 Electrical Characteristics........................................... 713.2 Related Links ........................................................ 27
7.8 Switching Characteristics — 400 kbps...................... 813.3 Trademarks........................................................... 27
7.9 Switching Characteristics — 20 Mbps ...................... 913.4 Electrostatic Discharge Caution............................ 27
7.10 Switching Characteristics — 50 Mbps .................... 913.5 Glossary................................................................ 27
7.11 Typical Characteristics.......................................... 10 14 Mechanical, Packaging, and Orderable
8 Parameter Measurement Information ................ 12 Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (August 2014) to Revision E Page
• Updated the MSOP–10 logic diagram.................................................................................................................................... 4
Changes from Revision C (July 2014) to Revision D Page
• Updated the Device Comparison Table.................................................................................................................................. 3
Changes from Revision B (July 2014) to Revision C Page
• Updated SN65HVD70 and SN65HVD71 specifications to production values........................................................................ 3
Changes from Revision A (June 2014) to Revision B Page
• Updated the Device Comparison Table.................................................................................................................................. 3
• SN65HVD74 device status changed from Product Preview to Production Data.................................................................... 3
Changes from Original (May 2014) to Revision A Page
• Changed device status from Product Preview to Production Data for mixed status ............................................................. 1
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D
Z
Y
6
5
3
R
B
A
7
8
2
1
2
3
4
8
7
6
5
R
D
VCC
B
A
Z
Y
GND
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5 Device Comparison Table
PART NUMBER(1) SIGNALING RATE DUPLEX ENABLES PACKAGE NODES
SOIC-14
SN65HVD70 up to 400 kbps Full DE, RE 256
MSOP-10
SOIC-8
SN65HVD71 up to 400 kbps Full None 256
MSOP-8
SOIC-14
SN65HVD73 up to 20 Mbps Full DE, RE 256
MSOP-10
SOIC-8
SN65HVD74 up to 20 Mbps Full None 256
MSOP-8
SOIC-14
SN65HVD76 up to 50 Mbps Full DE, RE 96
MSOP-10
SOIC-8
SN65HVD77 up to 50 Mbps Full None 96
MSOP-8
(1) For device status, see the Mechanical, Packaging, and Orderable Information section.
6 Pin Configuration and Functions
SN65HVD71, SN65HVD74, SN65HVD77
8-Pin SOIC, D Package, and 8-Pin MSOP, DGK Package
(Top View)
Pin Functions — SOIC-8 and MSOP-8
PIN TYPE DESCRIPTION
NAME NO.
VCC 1 Supply 3-V to 3.6-V supply
R 2 Digital output Receive data output
D 3 Digital input Driver data input
GND 4 Reference potential Local device ground
Y 5 Bus output Digital bus output, Y (Complementary to Z)
Z 6 Bus output Digital bus output, Z (Complementary to Y)
B 7 Bus input Digital bus input, B (Complementary to A)
A 8 Bus input Digital bus input, A (Complementary to B)
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D
R VCC
Z
Y
B
A
DE
RE
GND
1
2
3
4
56
7
8
9
10
3
4
2
1
6
7
9
8
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SN65HVD70, SN65HVD73, SN65HVD76
10-Pin MSOP, DGS Package
(Top View)
Pin Functions — MSOP–10
PIN TYPE DESCRIPTION
NAME NO.
R 1 Digital output Receive data output
RE 2 Digital input Receive enable Low
DE 3 Digital input Driver enable High
D 4 Digital input Driver data input
GND 5 Reference potential Local device ground
Y 6 Bus output Digital bus output, Y (Complementary to Z)
Z 7 Bus output Digital bus output, Z (Complementary to Y)
B 8 Bus input Digital bus input, B (Complementary to A)
A 9 Bus input Digital bus input, A (Complementary to B)
VCC 10 Supply 3-V to 3.6-V supply
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1
2
3
4
5
6
7
14
13
12
11
10
9
8
NC
R
RE
DE
D
GND
GND
VCC
VCC
A
B
Z
Y
NC
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14-Pin SOIC, D Package
(Top View)
NC = no internal connection
Pin Functions — SOIC-14
PIN TYPE DESCRIPTION
NAME NO.
1
NC No connect Not connected
8
R 2 Digital output Receive data output
RE 3 Digital input Receive enable Low
DE 4 Digital input Driver enable High
D 5 Digital input Driver data input
6(1)
GND Reference potential Local device ground
7(1)
Y 9 Bus output Digital bus output, Y (Complementary to Z)
Z 10 Bus output Digital bus output, Z (Complementary to Y)
B 11 Bus input Digital bus input, B (Complementary to A)
A 12 Bus input Digital bus input, A (Complementary to B)
13(2)
VCC Supply 3-V to 3.6-V supply
14(2)
(1) Pin 6 and pin 7 are connected internally.
(2) Pin 13 and pin 14 are connected internally.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VCC –0.5 5.5 V
Voltage Range at any bus pin (A, B, Y, or Z) –13 16.5 V
Input voltage Range at any logic pin (D, DE, or RE) –0.3 5.7 V
Voltage input range, transient pulse, any bus pin (A, B, Y, or Z) through 100 Ω–100 100 V
Output current Receiver output –24 24 mA
Junction temperature, TJ170 °C
Continuous total power dissipation See the Thermal
Information table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
Human body model (HBM), per JEDEC specification JESD22-A114, all pins –8 8 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins –1.5 1.5 kV
Machine model (MM), all pins –300 300 V
V(ESD) Electrostatic discharge IEC 61000-4-2 ESD (Air-Gap Discharge), bus pins and GND(1)(2) –12 12 kV
IEC 61000-4-2 ESD (Contact Discharge), bus pins and GND –12 12 kV
IEC 61000-4-4 EFT (Fast transient or burst), bus pins and GND –4 4 kV
IEC 60749-26 ESD (Human Body Model), bus pins and GND(2) –30 30 kV
(1) By inference from contact-discharge results, see the Application and Implementation section
(2) Limited by tester capability.
7.3 Recommended Operating Conditions
MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
VIInput voltage at any bus pin (separately or common mode) (1) –7 12 V
VIH High-level input voltage (Driver, driver enable, and receiver enable inputs) 2 VCC V
VIL Low-level input voltage (Driver, driver enable, and receiver enable inputs) 0 0.8 V
VID Differential input voltage –12 12 V
IOOutput current, Driver –60 60 mA
IOOutput current, Receiver –8 8 mA
RLDifferential load resistance 54 60 Ω
CLDifferential load capacitance 50 pF
HVD70, HVD71 400 kbps
1/tUI Signaling rate HVD73, HVD74 20 Mbps
HVD76, HVD77 50
TA(2) Operating free-air temperature (See the Application and Implementation for thermal –40 125 °C
information)
TJJunction Temperature –40 150 °C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating because of internal power dissipation should be
considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which
disables the driver outputs when the junction temperature reaches 170°C.
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7.4 Thermal Information — D Packages
THERMAL METRIC D D Unit
(8 PINS) (14 PINS)
RθJA Junction-to-ambient thermal resistance 110.7 83.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.7 42.9
RθJB Junction-to-board thermal resistance 51.3 37.8
ψJT Junction-to-top characterization parameter 9.2 9.3
ψJB Junction-to-board characterization parameter 50.7 37.5
TJ(TSD) Thermal shut-down junction temperature 170 °C
7.5 Thermal Information — DGS and DGK Packages
THERMAL METRIC DGS DGK Unit
(10 PINS) (8 PINS)
RθJA Junction-to-ambient thermal resistance 165.5 168.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.7 62.2
RθJB Junction-to-board thermal resistance 86.4 89.5
ψJT Junction-to-top characterization parameter 1.4 7.4
ψJB Junction-to-board characterization parameter 84.8 87.9
TJ(TSD) Thermal shut-down junction temperature 170 °C
7.6 Power Dissipation
PARAMETER TEST CONDITIONS VALUE UNITS
HVD70, HVD71 150
RL= 300 Ω,
Unterminated HVD73, HVD74 180 mW
CL= 50 pF (driver)
Power Dissipation HVD76, HVD77 220
driver and receiver enabled,
VCC = 3.6 V, TJ= 150°C HVD70, HVD71 190
50% duty cycle square-wave signal at RL= 100 Ω,
PD RS-422 load HVD73, HVD74 220 mW
signaling rate: CL= 50 pF (driver)
• HVD70 and HVD71 at 400 kbps HVD76, HVD77 250
• HVD73 and HVD74 at 20 Mbps HVD70, HVD71 230
• HVD76 and HVD77 at 50 Mbps RL= 54 Ω,
RS-485 load HVD73, HVD74 255 mW
CL= 50 pF (driver) HVD76, HVD77 285
7.7 Electrical Characteristics
over recommended operating range (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RL= 60 Ω, 375 Ωon each 1.5 2 V
output to –7 V to 12 V, See Figure 15
|VOD| Driver differential output voltage magnitude RL= 54 Ω(RS-485), See Figure 16 1.5 2 V
RL= 100 Ω(RS-422) TJ≥0°C, 2 V
VCC ≥3.2 V, See Figure 16
Change in magnitude of driver differential output
Δ|VOD| RL= 54 Ω, CL= 50 pF, See Figure 16 –50 0 50 mV
voltage
VOC(SS) Steady-state common-mode output voltage 1 VCC / 2 3 V
Change in differential driver output common-mode
ΔVOC Center of two 27-Ωload resistors, See Figure 16 –50 0 50 mV
voltage
VOC(PP) Peak-to-peak driver common-mode output voltage 500 mV
COD Differential output capacitance 15 pF
Positive-going receiver differential input voltage
VIT+ See (1) -70 –20 mV
threshold
Negative-going receiver differential input voltage
VIT– –200 -140 See (1) mV
threshold
Receiver differential input voltage threshold hysteresis
Vhys 40 70 mV
(VIT+ – VIT–)
(1) Under any specific conditions, VIT+ is assured to be at least Vhys higher than VIT–.
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Electrical Characteristics (continued)
over recommended operating range (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH Receiver high-level output voltage IOH = –8 mA 2.4 VCC–0.3 V
VOL Receiver low-level output voltage IOL = 8 mA 0.2 0.4 V
Driver input, driver enable, and receiver enable input
II–3 3 µA
current
Receiver output high-impedance HVD70, HVD73,
IOZ VO= 0 V or VCC, RE = VCC –1 1 µA
current HVD76
IOS Driver short-circuit output current –150 150 mA
VI= 12 V 75 125
HVD70,
HVD73 VI= –7 V –100 –40
VCC = 0 to ROC (max),
IIBus input current (disabled driver) µA
DE = GND VI= 12 V 240 333
HVD76 VI= –7 V –267 –180
Driver and receiver DE = VCC, RE = GND, 750 1100 µA
enabled No load
Driver enabled, receiver DE = VCC, RE = VCC,350 650 µA
disabled No load
ICC Supply current (quiescent) Driver disabled, receiver DE = GND, RE = GND, 650 800 µA
enabled No load
Driver and receiver DE = GND, D = open, 0.1 5 µA
disabled RE = VCC, No load
Supply current (dynamic) See the Typical Characteristics section
Tsd Thermal Shut-down junction temperature 170 °C
7.8 Switching Characteristics — 400 kbps
400-kbps devices (SN65HVD70, SN65HVD71) bit time ≥2 µs (over recommended operating conditions)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DRIVER
tr, tfDriver differential output rise/fall time 100 400 750 ns
tPHL, tPLH Driver propagation delay RL= 54 Ω, CL= 50 pF See Figure 17 350 550 ns
tSK(P) Driver pulse skew, |tPHL – tPLH| 40 ns
tPHZ, tPLZ Driver disable time 50 200 ns
See Figure 18
HVD70 Receiver enabled 300 750 ns
and Figure 19
tPZH, tPZL Driver enable time Receiver disabled 3 8 µs
RECEIVER
tr, tfReceiver output rise/fall time 13 25 ns
tPHL, tPLH Receiver propagation delay time CL= 15 pF See Figure 20 70 110 ns
tSK(P) Receiver pulse skew, |tPHL – tPLH| 7 ns
tPLZ, tPHZ Receiver disable time 45 60 ns
tPZL(1), Driver enabled See Figure 21 20 115 ns
HVD70
tPZH(1) 3 8 µs
Receiver enable time
tPZL(2),Driver disabled See Figure 22
tPZH(2)
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7.9 Switching Characteristics — 20 Mbps
20-Mbps devices (SN65HVD73, SN65HVD74) bit time ≥50 ns (over recommended operating conditions)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DRIVER
tr, tfDriver differential output rise/fall time 4 7 14 ns
tPHL, tPLH Driver propagation delay RL= 54 Ω, CL= 50 pF See Figure 17 4 10 20 ns
tSK(P) Driver pulse skew, |tPHL – tPLH| 0 4 ns
tPHZ, tPLZ Driver disable time 12 25 ns
See Figure 18 and
HVD73 Receiver enabled 10 20 ns
Figure 19
tPZH, tPZL Driver enable time Receiver disabled 3 8 µs
RECEIVER
tr, tfReceiver output rise/fall time 5 10 ns
tPHL, tPLH Receiver propagation delay time CL= 15 pF See Figure 20 60 90 ns
tSK(P) Receiver pulse skew, |tPHL – tPLH| 0 5 ns
tPLZ, tPHZ Receiver disable time 17 25 ns
HVD73 Driver enabled See Figure 21 12 90 ns
tpZL(1), tPZH(1) Receiver enable time
tPZL(2), tPZH(2) Driver disabled See Figure 22 3 8 µs
7.10 Switching Characteristics — 50 Mbps
50-Mbps devices (SN65HVD76, SN65HVD77) bit time ≥20 ns (over recommended operating conditions)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DRIVER
tr, tfDriver differential output rise/fall time 2 3 6 ns
tPHL, tPLH Driver propagation delay RL= 54 Ω, CL= 50 pF See Figure 17 3 10 16 ns
tSK(P) Driver pulse skew, |tPHL – tPLH| 0 3.5 ns
tPHZ, tPLZ Driver disable time 10 20 ns
See Figure 18 and
HVD76 Receiver enabled 10 20 ns
Figure 19
tPZH, tPZL Driver enable time Receiver disabled 3 8 µs
RECEIVER
tr, tfReceiver output rise/fall time 1 3 6 ns
tPHL, tPLH Receiver propagation delay time CL= 15 pF See Figure 20 25 40 ns
tSK(P) Receiver pulse skew, |tPHL – tPLH| 0 2 ns
tPLZ, tPHZ Receiver disable time 8 15 ns
HVD76 Driver enabled See Figure 21 8 90 ns
tpZL(1), tPZH(1) Receiver enable time
tPZL(2), tPZH(2) Driver disabled See Figure 22 3 8 µs
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Driver Common-Mode Voltage (V)
Driver Differential-Output Voltage (V)
-7 -5 -3 -1 1 3 5 7 9 11
1.9
1.95
2
2.05
2.1
2.15
2.2
D003
Supply Voltage (V)
Driver Output Current (mA)
0 0.5 1 1.5 2 2.5 3 3.5
0
5
10
15
20
25
30
35
40
45
50
D004
Driver Output Current (mA)
Driver Output Voltage (V)
0 10 20 30 40 50 60 70 80 90 100
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3
3.3
3.6
D001
VOH
VOL
Driver Output Current (mA)
Driver Differential-Output Voltage (V)
0 10 20 30 40 50 60 70 80 90 100
0
0.5
1
1.5
2
2.5
3
3.5
D002
100 : Load Line
60 : Load Line
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7.11 Typical Characteristics
Figure 1. Driver Output Voltage vs Driver Output Current Figure 2. Driver Differential-Output Voltage vs Driver Output
Current
Figure 3. Driver Differential-Output Voltage vs Driver Figure 4. Driver Output Current vs Supply Voltage
Common-Mode Voltage
Figure 5. SN65HVD70, SN65HVD71 Driver Rise and Fall Time Figure 6. SN65HVD70, SN65HVD71 Driver Propagation Delay
vs Temperature vs Temperature
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Signaling Rate (Mbps)
Supply Current (mA)
0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4
41
41.2
41.4
41.6
41.8
42
D013
Signaling Rate (Mbps)
Supply Current (mA)
0 2 4 6 8 10 12 14 16 18 20
0
10
20
30
40
50
60
70
80
D007
Temperature (qC)
Driver Rise and Fall Time (ns)
-40 -20 0 20 40 60 80 100 120
0
0.5
1
1.5
2
2.5
3
3.5
4
D011
Temperature (qC)
Driver Propagation Delay (ns)
-40 -20 0 20 40 60 80 100 120
0
2
4
6
8
10
12
D012
Temperature (qC)
Driver Rise and Fall Time (ns)
-40 -20 0 20 40 60 80 100 120
0
1
2
3
4
5
6
7
8
9
10
D005
Temperature (qC)
Driver Propagation Delay (ns)
-40 -20 0 20 40 60 80 100 120
0
2
4
6
8
10
12
14
D006
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Typical Characteristics (continued)
Figure 7. SN65HVD73, SN65HVD74 Driver Rise and Fall Time Figure 8. SN65HVD73, SN65HVD74 Driver Propagation Delay
vs Temperature vs Temperature
Figure 9. SN65HVD76, SN65HVD77 Driver Rise and Fall Time Figure 10. SN65HVD76, SN65HVD77 Driver Propagation
vs Temperature Delay vs Temperature
VCC = 3.3 V TA= 25°C
Figure 11. SN65HVD70, SN65HVD71 Supply Current vs Figure 12. SN65HVD73, SN65HVD74 Supply Current vs
Signal Rate Signal Rate
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Product Folder Links: SN65HVD70 SN65HVD71 SN65HVD73 SN65HVD74 SN65HVD76 SN65HVD77
VOC
VOD
0 V or 3 V
Y
Z
V(Y)
V(Z)
VOC(PP) DVOC(SS)
VOC
CL
D
Y
RL / 2
Z
S0302-01
RL / 2
60 1%W ±
VOD
0 V or 3 V
_
+–7 V < V(test) < 12 V
DE
VCC
Y
Z
D
375 1%W ±
375 1%W ±
S0301-01
Signaling Rate (Mbps)
Supply Current (mA)
0 5 10 15 20 25 30 35 40 45 50
0
10
20
30
40
50
60
70
80
D014
Differential Input Voltage (mV)
Receiver output, R (V)
-150 -130 -110 -90 -70 -50
0
0.5
1
1.5
2
2.5
3
3.5
4
D008
VCM = 12 V
VCM = 0 V
VCM = -7 V
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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Typical Characteristics (continued)
VCC = 3.3 V TA= 25°C
Figure 13. SN65HVD76, SN65HVD77 Supply Current vs Figure 14. Receiver Output vs Input
Signal Rate
8 Parameter Measurement Information
The input generator rate is 100 kbps with 50% duty cycle, than 6-ns rise and fall times, and 50-Ωoutput
impedance.
Figure 15. Measurement of Driver Differential Output Voltage With Common-Mode Load
Figure 16. Measurement of Driver Differential and Common-Mode Output With RS-485 Load
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Input
Generator 50 W
VO
1.5 V
0 V
50% 50%
3 V
VOH
VOL
50%
10%
50%
tPLH tPHL
tf
tr
90%
VI
VO
C = 15 pF 20%
L±
C Includes Fixture
and Instrumentation
Capacitance
L
A
B
RE
VI
R
0 V
90%
10%
S0306-01
Input
Generator 50 W
3 V VO
S1
3 V
50%
50%
50%
tPZL tPLZ
10%
»3 V
0 V
VOL
VI
VO
R = 110
1%
LW
±
CL = 50 pF 20%±
C Includes Fixture
and Instrumentation
Capacitance
L
D
Y
Z
DE
VI
»3 V
S0305-01
3 V
0 V
VOH
»0 V
tPHZ
tPZH
50% 50%
VI
VO50%
90%
R = 110
1%
LW
±
Input
Generator 50 W
3 V
S1
C = 50 pF 20%
L±
C Includes Fixture
and Instrumentation
Capacitance
L
DY
Z
DE
VO
VI
S0304-01
Y
50%
Z
W
W
»
»
50%
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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Parameter Measurement Information (continued)
Figure 17. Measurement of Driver Differential Output Rise and Fall Times and Propagation Delays
D at 3 V to test non-inverting output, D at 0 V to test inverting output.
Figure 18. Measurement of Driver Enable and Disable Times with Active-High Output and Pulldown Load
D at 0 V to test non-inverting output, D at 3 V to test inverting output.
Figure 19. Measurement of Driver Enable and Disable Times with Active-Low Output and Pullup Load
Figure 20. Measurement of Receiver Output Rise and Fall Times and Propagation Delays
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50 W
VO
RE
R
A
B
3 V
0 V or 3 V
VCC
50% 50%
tPZH(1) tPHZ
50%
90%
3 V
0 V
VOH
»0 V
VO
C = 15 pF 20%
L±
C Includes Fixture
and Instrumentation
Capacitance
L
VI
DE
D1 k 1%W ±
VI
S1
D at 3 V
S1 to GND
tPZL(1) tPLZ
50%
10%
VCC
VOL
VO
D at 0 V
S1 to VCC
Input
Generator
S0307-01
Y
Z
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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www.ti.com
Parameter Measurement Information (continued)
Figure 21. Measurement of Receiver Enable and Disable Times With Driver Enabled
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Input
Generator 50 W
VO
RE
R
A
B
VCC
50%
50%
50%
tPZH(2)
3 V
0 V
VOH
GND
VI
VO
VO
0 V or 1.5 V
1.5 V or 0 V C = 15 pF 20%±
L
C Includes Fixture
L
and Instrumentation
Capacitance
VI
1 kW ± 1%
A at 1.5 V
B at 0 V
S1 to GND
tPZL(2)
VCC
VOL
A at 0 V
B at 1.5 V
S1 to VCC
S1
S0308-01
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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Parameter Measurement Information (continued)
Figure 22. Measurement of Receiver Enable Times With Driver Disabled
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Product Folder Links: SN65HVD70 SN65HVD71 SN65HVD73 SN65HVD74 SN65HVD76 SN65HVD77
R
D
R
D
DE
RE
Y
Z
B
A
GND
VCC
R
D
R
DY
Z
B
A
VCC
GND
VCC
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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9 Detailed Description
9.1 Overview
The SN65HVD70, SN65HVD71, SN65HVD73, SN65HVD74, SN65HVD76, and SN65HVD77 devices are low-
power, full-duplex RS-485 transceivers available in three speed grades suitable for data transmission up to 400
kbps, 20 Mbps, and 50 Mbps.
The SN65HVD71, SN65HVD74, and SN65HVD77 are fully enabled with no external enabling pins. The
SN65HVD70, SN65HVD73, and SN65HVD76 have active-high driver enables and active-low receiver enables. A
standby current of less than 5 µA can be achieved by disabling both driver and receiver.
9.2 Functional Block Diagram
Figure 23. Block Diagram Figure 24. Block Diagram
SN65HVD70, SN65HVD73, and SN65HVD76 SN65HVD71, SN65HVD74, and SN65HVD77
9.3 Feature Description
Internal ESD protection circuits protect the transceiver against Electrostatic Discharges (ESD) according to
IEC61000-4-2 of up to ±12 kV, and against electrical fast transients (EFT) according to IEC61000-4-4 of up to ±4
kV.
The SN65HVD7x full-duplex family provides internal biasing of the receiver input thresholds in combination with
large input-threshold hysteresis. At a positive input threshold of VIT+ = –20 mV and an input hysteresis of Vhys =
40 mV, the receiver output remains logic high under a bus-idle or bus-short condition even in the presence of
120 mVPP differential noise without the need for external failsafe biasing resistors.
Device operation is specified over a wide temperature range from –40°C to 125°C.
9.4 Device Functional Modes
For the SN65HVD70, SN65HVD73, and SN65HVD76, when the driver enable pin, DE, is logic high, the
differential outputs Y and Z follow the logic states at data input D. A logic high at D causes Y to turn high and Z
to turn low. In this case the differential output voltage defined as VOD = V(Y) – V(Z) is positive. When D is low, the
output states reverse, Z turns high, Y becomes low, and VOD is negative.
When DE is low, both outputs turn high-impedance. In this condition the logic state at D is irrelevant. The DE pin
has an internal pulldown resistor to ground, thus when left open the driver is disabled (high-impedance) by
default. The D pin has an internal pullup resistor to VCC, thus, when left open while the driver is enabled, output Y
turns high and Z turns low.
Table 1. Driver Function Table SN65HVD70, SN65HVD73, SN65HVD76
INPUT ENABLE OUTPUTS FUNCTION
D DE Y Z
H H H L Actively drives the bus high
L H L H Actively drives the bus low
X L Z Z Driver disabled
X OPEN Z Z Driver disabled by default
OPEN H H L Actively drives the bus high by default
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,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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When the receiver enable pin, RE, is logic low, the receiver is enabled. When the differential input voltage
defined as VID = V(A) – V(B) is positive and higher than the positive input threshold, VIT+, the receiver output, R,
turns high. When VID is negative and less than the negative and lower than the negative input threshold, VIT–, the
receiver output, R, turns low. If VID is between VIT+ and VIT– the output is indeterminate.
When RE is logic high or left open, the receiver output is high-impedance and the magnitude and polarity of VID
are irrelevant. Internal biasing of the receiver inputs causes the output to go failsafe-high when the transceiver is
disconnected from the bus (open-circuit), the bus lines are shorted (short-circuit), or the bus is not actively driven
(idle bus).
Table 2. Receiver Function Table SN65HVD70, SN65HVD73, SN65HVD76
DIFFERENTIAL INPUT ENABLE OUTPUT FUNCTION
VID = V(A) – V(B) RE R
VIT+ < VID L H Receives valid bus High
VIT– < VID < VIT+ L ? Indeterminate bus state
VID < VIT– L L Receives valid bus Low
X H Z Receiver disabled
X OPEN Z Receiver disabled by default
Open-circuit bus L H Fail-safe high output
Short-circuit bus L H Fail-safe high output
Idle (terminated) bus L H Fail-safe high output
For the SN65HVD71, HVD74, and HVD77, the driver and receiver are fully enabled, thus the differential outputs
Y and Z follow the logic states at data input D at all times. A logic high at D causes Y to turn high and Z to turn
low. In this case the differential output voltage defined as VOD = V(Y) – V(Z) is positive. When D is low, the output
states reverse, Z turns high, Y becomes low, and VOD is negative. The D pin has an internal pullup resistor to
VCC, thus, when left open while the driver is enabled, output Y turns high and Z turns low.
Table 3. Driver Function Table SN65HVD71, SN65HVD74, SN65HVD77
INPUT OUTPUTS FUNCTION
D Y Z
H H L Actively drives the bus High
L L H Actively drives the bus Low
OPEN H L Actively drives the bus High by default
When the differential input voltage defined as VID = V(A) – V(B) is positive and higher than the positive input
threshold, VIT+, the receiver output, R, turns high. When VID is negative and less than the negative input
threshold, VIT–, the receiver output, R, turns low. If VID is between VIT+ and VIT– the output is indeterminate.
Internal biasing of the receiver inputs causes the output to go failsafe-high when the transceiver is disconnected
from the bus (open-circuit), the bus lines are shorted (short-circuit), or the bus is not actively driven (idle bus).
Table 4. Receiver Function Table SN65HVD71, SN65HVD74, SN65HVD77
DIFFERENTIAL INPUT OUTPUT FUNCTION
VID = V(A) – V(B) R
VIT+ < VID H Receives valid bus High
VIT– < VID < VIT+ ? Indeterminate bus state
VID < VIT– L Receives valid bus Low
Open-circuit bus H Fail-safe high output
Short-circuit bus H Fail-safe high output
Idle (terminated) bus H Fail-safe high output
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VCC
16 V
Y
Z
R2
R1
16 V
A
VCC
B
R3
R
R2
R3
R1
VCC
9 V
R
VCC
9 V
DE 1.5 k
1 M
VCC
9 V
D, RE 1.5 k
1 M
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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9.4.1 Equivalent Circuits
Figure 25. D and RE Inputs Figure 26. DE Input
Figure 27. R Output Figure 28. Receiver Inputs
Figure 29. Driver Outputs
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R
D
R
D
DE
RE
Y
Z
B
A
GND
VCC
VCC
R
D
R
DY
Z
B
A
RE
DE
GND
VCC
R
DR
DE
RE
D
Y
ZR
D
R
RE
DE
D
A
B
B
AZ
Y
RD
RRE DE D
Z YBA
Master Slave
Slave
R(T)
R(T)
R(T)
R(T)
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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SLLSEI9E –MAY 2014–REVISED OCTOBER 2014
10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The SN65HVD7x family consists of full-duplex RS-485 transceivers commonly used for asynchronous data
transmissions. Full-duplex implementation requires two signal pairs (four wires), and allows each node to
transmit data on one pair while simultaneously receiving data on the other pair.
To eliminate line reflections, each cable end is terminated with a termination resistor, R(T), whose value matches
the characteristic impedance, Z0, of the cable. This method, known as parallel termination, allows for higher data
rates over longer cable length.
Figure 30. Typical RS-485 Network With SN65HVD7x Full-Duplex Transceivers
10.2 Typical Application
A full-duplex RS-485 network consists of multiple transceivers connecting in parallel to two bus cables. On one
signal pair, a master driver transmits data to multiple slave receivers. The master driver and slave receivers may
remain fully enabled at all times. On the other signal pair, multiple slave drivers transmit data to the master
receiver. To avoid bus contention, the slave drivers must be intermittently enabled and disabled such that only
one driver is enabled at any time, as in half-duplex communication. The master receiver may remain fully
enabled at all times.
Because the driver may not be disabled, only one driver should be connected to the bus when using the
SN65HVD71, SN65HVD74, or SN65HVD77 device.
Master Enable Control Slave Enable Control
Figure 31. Full-Duplex Transceiver Configurations
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10000
1000
100
10
Cable Length (ft)
100 1k 10k 100k 1M 10M 100M
Data Rate (bps)
Conservative
Characteristics
5%, 10%, and 20% Jitter
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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Typical Application (continued)
10.2.1 Design Parameters
RS-485 is a robust electrical standard suitable for long-distance networking that may be used in a wide range of
applications with varying requirements, such as distance, data rate, and number of nodes.
10.2.1.1 Data Rate and Bus Length
There is an inverse relationship between data rate and cable length, which means the higher the data rate, the
short the cable length; and conversely, the lower the data rate, the longer the cable length. While most RS-485
systems use data rates between 10 kbps and 100 kbps, some applications require data rates up to 250 kbps at
distances of 4000 ft and longer. Longer distances are possible by allowing for small signal jitter of up to 5 or
10%.
Figure 32. Cable Length vs Data Rate Characteristic
10.2.1.2 Stub Length
When connecting a node to the bus, the distance between the transceiver inputs and the cable trunk, known as
the stub, should be as short as possible. Stubs present a non-terminated piece of bus line which can introduce
reflections as the length of the stub increases. As a general guideline, the electrical length, or round-trip delay, of
a stub should be less than one-tenth of the rise time of the driver, thus giving a maximum physical stub length as
shown in Equation 1.
L(STUB) ≤0.1 × tr×v×c
where
• tris the 10/90 rise time of the driver
•vis the signal velocity of the cable or trace as a factor of c
•cis the speed of light (3 × 108m/s) (1)
Per Equation 1,Table 5 lists the maximum cable-stub lengths for the minimum-driver output rise-times of the
SN65HVD7x full-duplex family of transceivers for a signal velocity of 78%.
Table 5. Maximum Stub Length
DEVICE MINIMUM DRIVER OUTPUT MAXIMUM STUB LENGTH
RISE TIME (ns) (m) (ft)
SN65HVD70 100 2.34 7.7
SN65HVD71 100 2.34 7.7
SN65HVD73 4 0.1 0.3
SN65HVD74 4 0.1 0.3
SN65HVD76 2 0.05 0.15
SN65HVD77 2 0.05 0.15
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VID (mV)
R
±20 0
V min
hys
60
40 mV
Vnmax = 120 mVpp
±60
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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10.2.1.3 Bus Loading
The RS-485 standard specifies that a compliant driver must be able to driver 32 unit loads (UL), where 1 unit
load represents a load impedance of approximately 12 kΩ. Because the SN65HVD7x family consists of 1/8 UL
transceivers, connecting up to 256 receivers to the bus is possible.
10.2.1.4 Receiver Failsafe
The differential receivers of the SN65HVD7x family are failsafe to invalid bus states caused by the following:
• Open bus conditions, such as a disconnected connector
• Shorted bus conditions, such as cable damage shorting the twisted-pair together
• Idle bus conditions that occur when no driver on the bus is actively driving
In any of these cases, the differential receiver will output a failsafe logic high state so that the output of the
receiver is not indeterminate.
Receiver failsafe is accomplished by offsetting the receiver thresholds such that the input indeterminate range
does not include zero volts differential. In order to comply with the RS-422 and RS-485 standards, the receiver
output must output a high when the differential input VID is more positive than 200 mV, and must output a Low
when VID is more negative than –200 mV. The receiver parameters which determine the failsafe performance are
VIT+, VIT–, and Vhys (the separation between VIT+ and VIT–). As shown in the Electrical Characteristics table,
differential signals more negative than –200 mV will always cause a low receiver output, and differential signals
more positive than 200 mV will always cause a high receiver output.
When the differential input signal is close to zero, it is still above the VIT+ threshold, and the receiver output will
be High. Only when the differential input is more than Vhys below VIT+ will the receiver output transition to a Low
state. Therefore, the noise immunity of the receiver inputs during a bus fault conditions includes the receiver
hysteresis value, Vhys, as well as the value of VIT+.
Figure 33. SN65HVD7x Noise Immunity Under Bus Fault Conditions
10.2.1.5 Transient Protection
The bus pins of the SN65HVD7x full-duplex transceiver family include on-chip ESD protection against ±30-kV
HBM and ±12-kV IEC 61000-4-2 contact discharge. The International Electrotechnical Commission (IEC) ESD
test is far more severe than the HBM ESD test. The 50% higher charge capacitance, C(S), and 78% lower
discharge resistance, R(D), of the IEC model produce significantly higher discharge currents than the HBM model.
As stated in the IEC 61000-4-2 standard, contact discharge is the preferred transient protection test method.
Although IEC air-gap testing is less repeatable than contact testing, air discharge protection levels are inferred
from contact discharge test results.
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Pulse Power (kW)
22
20
18
16
14
12
10
8
6
4
2
0
Time (µs)
0 5 10 15 20 25 30 35 40
0.5-kV Surge
10-kV ESD
4-kV EFT
Pulse Power (MW)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Time (µs)
0 5 10 15 20 25 30 35 40
0.5-kV Surge
6-kV Surge
3.0
2.8
2.6
2.4
R(C) R(D)
C(S)
High-Voltage
Pulse
Generator
Device
Under
Test
Current (A)
40
35
30
25
20
15
10
5
0
Time (ns)
0 50 100 150 200 250 300
10-kV IEC
10-kV HBM
330 Ω
(1.5 kΩ)
150 pF
(100 pF)
50 M
(1 M)
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
SLLSEI9E –MAY 2014–REVISED OCTOBER 2014
www.ti.com
Figure 34. HBM and IEC ESD Models and Currents in Comparison (HBM Values in Parenthesis)
The on-chip implementation of IEC ESD protection significantly increases the robustness of equipment. Common
discharge events occur because of human contact with connectors and cables. Designers may choose to
implement protection against longer duration transients, typically referred to as surge transients.
EFTs are generally caused by relay-contact bounce or the interruption of inductive loads. Surge transients often
result from lightning strikes (direct strike or an indirect strike which induce voltages and currents), or the
switching of power systems, including load changes and short circuit switching. These transients are often
encountered in industrial environments, such as factory automation and power-grid systems.
Figure 35 compares the pulse-power of the EFT and surge transients with the power caused by an IEC ESD
transient. The left hand diagram shows the relative pulse-power for a 0.5kV surge transient and 4-kV EFT
transient, both of which dwarf the 10-kV ESD transient visible in the lower-left corner. 500-V surge transients are
representative of events that may occur in factory environments in industrial and process automations.
The right hand diagram shows the pulse-power of a 6-kV surge transient, relative to the same 0.5-kV surge
transient. 6-kV surge transients are most likely to occur in power generation and power-grid systems.
Figure 35. Power Comparison of ESD, EFT, and Surge Transients
In the case of surge transients, high-energy content is characterized by long pulse duration and slow decaying
pulse power. The electrical energy of a transient that is dumped into the internal protection cells of a transceiver
is converted into thermal energy, which heats and destroys the protection cells, thus destroying the transceiver.
Figure 36 shows the large differences in transient energies for single ESD, EFT, surge transients, and an EFT
pulse train that is commonly applied during compliance testing.
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3.3 V
VCC
GND
D
DE
R
RE
Y
Z
RxD
TxD
DIR
MCU/
UART
10 k
10 k
TVS
R2
R1
SN65HVD7x
100 nF
TVS
R2
R1
DIR
B
A
10 k
100
0.1
0.01
10
1
10-3
10-4
10-5
10-6
Pulse Energy (J)
0.5 1 2 4 6 8 10
Peak Pulse Voltage (kV)
1000
ESD
EFT
Surge
15
EFT Pulse Train
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
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SLLSEI9E –MAY 2014–REVISED OCTOBER 2014
Figure 36. Comparison of Transient Energies
10.2.2 Detailed Design Procedure
In order to protect bus nodes against high-energy transients, the implementation of external transient protection
devices is therefore necessary. Figure 37 shows a protection circuit against 16-kV ESD, 4-kV EFT, and 1-kV
surge transients.
Figure 37. Transient Protection Against ESD, EFT, and Surge transients
Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Links: SN65HVD70 SN65HVD71 SN65HVD73 SN65HVD74 SN65HVD76 SN65HVD77
D
VOD
R
D
VOD
R
D
VOD
R
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
SLLSEI9E –MAY 2014–REVISED OCTOBER 2014
www.ti.com
Table 6. Bill of Materials
DEVICE FUNCTION ORDER NUMBER MANUFACTURER
XCVR 3.3-V, full-duplex RS-485 SN65HVD7xD TI
transceiver
R1 10-Ω, pulse-proof thick-film CRCW0603010RJNEAHP Vishay
resistor
R2
TVS Bidirectional 400-W CDSOT23-SM712 Bourns
transient suppressor
10.2.3 Application Curves
RL= 60 ΩRL= 60 Ω
Figure 38. SN65HVD70 and SN65HVD71, 500 kbps Figure 39. SN65HVD73 and SN65HVD74, 20 Mbps
RL= 60 Ω
Figure 40. SN65HVD76 and SN65HVD77, 50 Mbps
24 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: SN65HVD70 SN65HVD71 SN65HVD73 SN65HVD74 SN65HVD76 SN65HVD77
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
www.ti.com
SLLSEI9E –MAY 2014–REVISED OCTOBER 2014
11 Power Supply Recommendations
To ensure reliable operation at all data rates and supply voltages, each supply should be buffered with a 100-nF
ceramic capacitor located as close to the supply pins as possible. The TPS76333 is a linear voltage regulator
suitable for the 3.3-V supply.
12 Layout
12.1 Layout Guidelines
On-chip IEC-ESD protection is good for laboratory and portable equipment but never sufficient for EFT and surge
transients occurring in industrial environments. Therefore robust and reliable bus node design requires the use of
external transient protection devices.
Because ESD and EFT transients have a wide frequency bandwidth from approximately 3-MHz to 3-GHz, high-
frequency layout techniques must be applied during PCB design.
For successful PCB design, begin with the design of the protection circuit (see Figure 41).
1. Place the protection circuitry close to the bus connector to prevent noise transients from penetrating your
board.
2. Use VCC and ground planes to provide low-inductance. Note that high-frequency currents follow the path of
least inductance and not the path of least impedance.
3. Design the protection components into the direction of the signal path. Do not force the transient currents to
divert from the signal path to reach the protection device.
4. Apply 100-nF to 220-nF bypass capacitors as close as possible to the VCC-pins of transceiver, UART,
controller ICs on the board (see Figure 41).
5. Use at least two vias for VCC and ground connections of bypass capacitors and protection devices to
minimize effective via-inductance (see Figure 41).
6. Use 1-kΩto 10-kΩpullup and pulldown resistors for enable lines to limit noise currents in theses lines during
transient events (see Figure 41).
7. Insert pulse-proof resistors into the A and B bus lines if the TVS clamping voltage is higher than the specified
maximum voltage of the transceiver bus pins. These resistors limit the residual clamping current into the
transceiver and prevent it from latching up (see Figure 41).
8. While pure TVS protection is sufficient for surge transients up to 1 kV, higher transients require metal-oxide
varistors (MOVs) which reduce the transients to a few hundred volts of clamping voltage, and transient
blocking units (TBUs) that limit transient current to less than 1 mA.
Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 25
Product Folder Links: SN65HVD70 SN65HVD71 SN65HVD73 SN65HVD74 SN65HVD76 SN65HVD77
GND
GNDGND
GND
MCU
VCC or GND
R
R
R
R
TVS
TVS
SN65HVD7x
JMP
JMP
R
R
R
R
VCC or GND C
5
5
5
6
6
7
7
7
7
1
1
4
GND
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
SLLSEI9E –MAY 2014–REVISED OCTOBER 2014
www.ti.com
12.2 Layout Example
Figure 41. SN65HVD7x Layout Example
26 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: SN65HVD70 SN65HVD71 SN65HVD73 SN65HVD74 SN65HVD76 SN65HVD77
SN65HVD70
,
SN65HVD71
,
SN65HVD73
,
SN65HVD74
,
SN65HVD76
,
SN65HVD77
www.ti.com
SLLSEI9E –MAY 2014–REVISED OCTOBER 2014
13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
SN65HVD70 Click here Click here Click here Click here Click here
SN65HVD71 Click here Click here Click here Click here Click here
SN65HVD73 Click here Click here Click here Click here Click here
SN65HVD74 Click here Click here Click here Click here Click here
SN65HVD76 Click here Click here Click here Click here Click here
SN65HVD77 Click here Click here Click here Click here Click here
13.3 Trademarks
All trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 27
Product Folder Links: SN65HVD70 SN65HVD71 SN65HVD73 SN65HVD74 SN65HVD76 SN65HVD77
PACKAGE OPTION ADDENDUM
www.ti.com 13-Oct-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN65HVD70D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HVD70
SN65HVD70DGS ACTIVE VSSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 VD70
SN65HVD70DGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD70
SN65HVD70DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HVD70
SN65HVD71D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD71
SN65HVD71DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD71
SN65HVD71DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD71
SN65HVD71DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD71
SN65HVD73D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD73
SN65HVD73DGS ACTIVE VSSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD73
SN65HVD73DGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD73
SN65HVD73DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD73
SN65HVD74D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD74
SN65HVD74DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD74
SN65HVD74DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD74
SN65HVD74DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD74
SN65HVD76D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HVD76
PACKAGE OPTION ADDENDUM
www.ti.com 13-Oct-2014
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN65HVD76DGS ACTIVE VSSOP DGS 10 80 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD76
SN65HVD76DGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 VD76
SN65HVD76DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HVD76
SN65HVD77D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD77
SN65HVD77DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD77
SN65HVD77DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VD77
SN65HVD77DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HVD77
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 13-Oct-2014
Addendum-Page 3
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN65HVD70DGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65HVD70DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN65HVD71DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65HVD71DR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
SN65HVD73DGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65HVD74DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65HVD74DR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
SN65HVD76DGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65HVD76DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN65HVD77DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65HVD77DR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Oct-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65HVD70DGSR VSSOP DGS 10 2500 364.0 364.0 27.0
SN65HVD70DR SOIC D 14 2500 333.2 345.9 28.6
SN65HVD71DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
SN65HVD71DR SOIC D 8 2500 533.4 186.0 36.0
SN65HVD73DGSR VSSOP DGS 10 2500 364.0 364.0 27.0
SN65HVD74DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
SN65HVD74DR SOIC D 8 2500 340.5 338.1 20.6
SN65HVD76DGSR VSSOP DGS 10 2500 366.0 364.0 50.0
SN65HVD76DR SOIC D 14 2500 333.2 345.9 28.6
SN65HVD77DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
SN65HVD77DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Oct-2016
Pack Materials-Page 2
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