Rev. 0.7 4/11 Copyright © 2011 by Silicon Laboratories Si2493/57/34/15/04-EVB
Si2493/57/34/15/04
Global ISOmodem-EVB
Evaluation Board Rev 5.0 for the Si2493/57/34/15/04
ISOmodem with UART and SPI Interfaces
Description
The global Si2493/57/34/15/04-EVB evaluation board
Rev 5.0 provides the system designer an easy way of
evaluating the Si2493/57/34/15/04 ISOmodem®. The
Si2493/57/34/15/04-EVB consists of a motherboard
with a power supply, an RS-232 and USB interface,
other ease-of-use features, and a complete removable
modem module on a daughter card. (A functional block
diagram of the Si2493/57/34/15/04-EVB is shown
below.) The Si2493/57/34/15/04 ISOmodem is a
complete controller-based modem chipset with an
integrated and programmable direct access
arrangement (DAA) that meets global telephone line
requireme nts. Available as a combinatio n of one 16-pin
small line-side device and one 24-pin or 16-pin system-
side device, the Si2493/57/34/15/04 ISOmodem
eliminates the need for a separate DSP data pump,
modem controller, memories, codec, isolation
transformer, relays, opto-isolators, and a 2- to 4-wire
hybrid. The Si2493/57/34/15/04 is ideal for embedded
modem applications due to its small board area,
controller-based architecture, low power consumption,
and global compliance. The Si2493/57/34/15/04-EVB
provides an RJ-11 jack (for interfacing the Si2493/57/
34/15/04-EVB to the phone line), and USB and RS232
serial ports for interfacing to a PC or data terminal. This
allows the ISOmodem to operate as a serial modem for
straightforw ard evaluation of the Si2493/57 /34/15/04. To
evaluate the Si2493/57/34/15/04 ISOmodem in an
embedded system, the daughter card can be used
independently of or with the motherboard.
A direct access header (J103) is available on the
motherboard to bypass the RS-232 transceivers and
connect the Si2493/57/34/15/04 ISOmodem directly to
a target system.
An on-board rectifier, filter, and voltage regulator allow
the power input to be 7.5–13 V ac or dc (either polarity)
supplied through a screw terminal (J8) or a standard
2 mm power jack (J9). Alternatively, power can be
supplied through the USB inter face (whether the USB or
RS232 interface is used). The evaluation board can
drive an external speaker for call monitoring or the
speaker mounted directly on the board . Please note that
the PCM interface, parallel interface, and EEPROM are
available on the 24-pin FT only. See "1.7.EVB Part
Numbers" on page 8 for ISOmodem EVB options.
Features
The Si2493/57/34/15/04-EVB includes the following:
Dual RJ-11 connection to phone line
RS-232 and USB interface to PC
Speaker for call monitorin g
Direct access to Si2493/57/34/15/04 for embedded
application evaluation
Easy power connec tion to co mm o n 7. 5 V–13.5 V
power supplies or USB port.
9 V ac adaptor
Simple installation and operation
EEPROM (24-pin FT only)
RS232 lines st atus display on LEDs.
Functional Block Diagram
Si2493/57/34/15/04
Push Button
Reset
RESET XTALIXTALO
Si3018* Interface
Circuit RJ-11
Phone
line
Audio
Amplifier
AOUT
Audio
Out
Direct
Access HDR Daughter Board Bou ndary
Power-On
Reset
Rectifier
Filter
RS-232
Transceivers
UART DB9
Interface
Selection
Jumpers
Voltage
Regulator 3.3 V
5 V
7.5-13.5 V dc or
peak ac Adaptor
USB
Connector U SB I/F
*Si3010 for Si2404
Si2493/57/34/15/04
2 Rev. 0.7
1. Si2493/57/34/15/04-EVB Setup and
Evaluation
This section explains how to set up the Si2493/57/34/
15/04-EVB for evaluation as an RS-232 or USB
interface modem. Jumper settings, power connection,
PC/terminal connections, and terminal program
configuration settings are given. The initial modem
setup after power is applied as well as a basic tutorial
on modem operation are provided. Si2493/57/34/15/04-
EVB configurations for evaluating additional features
are discussed separately. See the Si2493/57/34/15 or
Si2404 data sheets and “AN93: Si2493/57/34/15/04/04
Modem Designer’s Guide” for complete details.
1.1. Si2493/57/34/15/04-EVB Quick S tart—
RS-232 Interface
1. Set jumpers according to Figure 1, but change J6 to the
arrangement shown in Figure 3 if an FS ISOmodem
package is used.
2. Connect:
DB-9 to PC COM 1 (with a pass-through cable).
RJ-11 to phone line or CO simulator.
9 V ac adaptor (or USB cable).
3. Bring up:
T urn on power to modem.
Autobaud automatically adjusts modem DTE speed and
protocol.
4. Type “AT” followed by a carriage return.
Should echo “AT” and then an “OK”.
1.2. Si2493/57/34/15/04-EVB Quick S tart—
USB Interface
1. Set jumpers according to Figure 3, but change J6 to the
arrangement shown in Figure 3 if an FS ISOmodem
package is used.
2. Connect:
USB cable to PC
RJ-11 to phone line or CO simulator
3. Download USB driver for your operating system from the
CD supplied with the evaluation board.
4. Install driver.
5. Bring up.
Reset the modem.
Autobaud automatically adjusts modem DTE speed and
protocol.
6. Type “AT” followed by a carriage return.
Should echo “AT” and then an “OK”.
1.3. Motherboard and Daughter Card
Configuration
The EVB consist of a motherboard that takes a plug in
daughter card. The motherboar d can be con figured in a
variety of ways that are explained below and are
managed via jumpers. The daug hter card contains both
the modem system side and the isolated line interface
(DAA).
The daughter card comes preconfigured and functional
although the user may decide to change some
operating options such as the type of crystal used with
the modem chip or the type of control signals used, i.e.
UART vs parallel. These features must be managed by
changing strapping resistors soldered down to the
daughter card and by changing parts associated with
the crystal. These possible changes are explained
below.
1.3.1. Motherboard Configuration
Check all the jumper setting on the S2493/57/34/15/04-
EVB before applying power. The standard factory
setting for the modem in a 24-pin FT package are
shown in the figure below. This setup configures the
modem for RS232 serial operation with autobaud
enabled. Any standard terminal program configured to
communicate through a PC com port can be used to
communicate with the EVB.
Figure 1 shows the default motherboard setup for the
FT package daughter card as well as the functions of
connectors and jumpers.
Si2493/57/34/15/04
Rev. 0.7 3
RS232 com
port link to
Host
USB,
virtual com
port link to
Host (J11)
Insert JP33 & JP34
jumpers to enable
EEPROM
Insert jumper in
JP34 to run at a
fixed 19.2 kBaud
rate.
Remove JP12
Jumper to shut
down audio
power amp U27
Call progress
Speaker, and its
jumper JP14.
RS232 vs USB
select jumper,
JP23, with
RS232 select
shown.
(Remove to
disable both
modes).
AC/DC Pwr
Inputs: J8
or J9.
Speaker
Output,
JP11
RJ11
Tel. Line
connectors.
Tip and ring
signals available
at these test
points.
Modem daughter cards
mate with J101 & JP2.
(Daughter card versions
prior to rev. 2.0 will not fit
this motherboard.)
Tests points (+3.3V
and Isense) that allow
modem current o tbe
measured via the 1.0
Ohm shunt: R59.
System Connector.
Allows all modem
signals to be
probed or routed
elsewhere.
LEDs and test
points showing
status of all
control lines as
well as TX/RX
J6: Jumpers for control
line configuration.
Shown set up for a 24
pin modem on DC.
EEPROM
(U5)
Reset
Pushbutton
Audio Power
amp (U27)
Figure 1. Default Motherboard Setup
Si2493/57/34/15/04
4 Rev. 0.7
1.3.1.1. RS232 vs USB vs User Provided IO
Selection
To change to USB operation simply move the RS232
selection jumper on JP23 to the USB position as
marked on the PCB and shown in Figure 1. When the
USB vs UART settings are changed the appropriate
indicator LED will light up on the EVB.
If neither jumper is in place then neither serial port will
be activated and the user must provide I/O signals via
the pins on J103. This IO can be in ASYNCH SERIAL,
SPI SERIAL and Parallel Bus mode.
1.3.1.2. Autobaud Control
Autobaud is enabled with no jumper at the JP34
position. When a jumper is in place, autobaud is
disabled and the user must setup the host to run 19k2
baud in order to use th e mo d em .
1.3.1.3. EEPROM Control
To enable the EEPROM (U5) both jumpers JP34 and
JP35 must be in place and the modem reset.
JP35 physically connects the EEPROM chips select
line to the modem and allows the EEPROM to function
when addressed by the modem, while JP34 connects a
strapping option to the correct modem pin which is
sensed during reset and instructs the modem firmware
to use the EEPROM.
1.3.1.4. Call Progress Configuration
The modem call establishment can be heard by
enabling the call progress feature via software (see
AN93) and Hardware. The hardware components
include installing JP12 which enabled the audio power
amplifier and installing JP14 to connect the on board
speaker to the power amplifier output. If an offboard
speaker is to be used then JP14 can be removed and
the alternate speaker can be connected to pins 1 and 4
of JP11. Note the this audio output is 8 and
differential so that neither output pin should be
grounded.
1.3.1.5. Control Line Configuration
Various modem control lines can be rearranged
depending on the user preferences and the specific
modem chips used. This is done using JP6. The basic
two JP6 configurations are shown in the following
figures.
Figure 2. Default J6 Setup for 24-Pin Modem
Chips
Figure 3. Default J6 Setup for 16-Pin Modem
Chips
The specific details of what the jumpers connect are
shown in Table 1, which is also found printed on the
underside of the EVB.
J6
1
4
7
10
13
3
6
9
12
15
J6
1
4
7
10
13
3
6
9
12
15
Table 1. Routing of Control Signals with Jumper Position on J6
RS232
Signal Si24xx 24-Pin Si24xx 16-Pin Si2401
Left Right Left Right Left Right
DCD DCD SDI/EESD DCD NC DCD NC
RI RI FSYNCH NC RI NC RI
DTR ESC RI ESC NC ESC NC
RTS RTS SDO/
EECLK NC RTS NC GPIO1
DSR INT AOUT/INT NC INT NC AOUT/INT
Si2493/57/34/15/04
Rev. 0.7 5
1.3.2. Daughter Card Configuration
The daughter card comes configured with either a 24-
pin FT or 16-pin FS system side part and either 32 kHz
or 4.9152 MHz operation, and UART operation. The
daughter card can also be setup to operate with a third
clock frequency, an on board 27 MHz oscillator. To
change between these options requires component
changes on the daughter card.
The daughter card can also operate in three possible
interface modes: p arallel bus mode, in SPI mode as well
as the default UART mode.
There are six small (0402) strapping resistors (R101 to
R106) that are on the daughter card and are configured
differently depending on the combination of chip
package, clock frequency chosen, and interface mode.
See Figures 5 and 6 for details.
The card and its options are shown in Figure 4, which
shows the Modem Daughter card Rev 2.0 top and
bottom views with the critical parts that may be changed
to select another command mode (i.e. SPI) or an
alternate crystal frequency, such as 4.9152 MHz.
Si2493/57/34/15/04
6 Rev. 0.7
Figure 4. Modem Daughter Card Rev 2.0 Top and Bottom Views
Figure 5. R101–R106 Setup for Clock and Mode Configuration on the DC with the 16-Pin FS
Package
These option strapping resistors select
modem command mode UART, SPI or
Parallel and crystal clock frequency.
Three possible crystals or ext oscillator.
Crystal loading caps (C40 & C41)
specific to the crystal type used.
TOP VIEW
BOTTOM VIEW
Si2493/57/34/15/04
Rev. 0.7 7
Figure 6. R106 Setup for Clock and Mode Configuration on DC with 24-Pin FT Package
1.3.2.1. 32 kHz Setup
For 32 kHz, populate Y1 with the 32 kHZ crystal shown
in the BOM and use 18 pF capacitors for the C40/C41
values. Also remove Y3 and Y1b if present and strap
R101 to R106 as shown in Figure 5.
The modem should then work as expected; no changes
are needed on the motherboard
1.3.2.2. 4.9152 MHz
For 4.9152 MHz, populate Y1b with the 4.9152 MHz
crystal shown in the BOM and use 33 pF capacitors for
the C40 and C41 values. Also remove Y3 and Y1 if
present and strap R101 to R106 as shown in Figures 5
or 6 above.The modem should then work as expected;
no changes are needed on the motherboard
1.3.2.3. 27 MHz
For 27 MHz, populate Y3 with the small surface mount
oscillator shown in the BOM and remove Y3 and Y1b if
present. Also remove any capacitors at the C40 and
C41 positions.
Strap R101 to R106 as shown in Figures 5 or 6 above.
The modem should then work as expected; no changes
are needed on the motherboard
1.3.2.4. SPI Mode Setup
To change to SPI mode setup it is necessary to
configure the R101 straps as shown in Figure 5 or
Figure 6, according to the package and clock used.
Then setup the daughter card with neither UART nor
USB operation selected, i.e. with no jumper on JP23.
The SPI signals can then be obtained on J103, the
system connector and connected to the host. Signal
usage is described in Table 2.
1.3.3. Parallel Bus Mode Setup
To change to parallel bus mode setup it is nec essary to
configure the R101 straps as shown in Figure 5 or
Figure 6, according to the package and clock used.
Then setup the daughter card with neither UART nor
USB operation selected, i.e. with no jumper on JP23.
The SPI signals can then be obtained on J103, the
system connector and connected to the host. See the
data sheet and schematic for signal and pin usage.
1.4. Power Requirements
The Si2493/57/34/15/04-EVB has an on-board diode
bridge, filter capacitor, and voltage regulator (U10 and
U18). Power can be supplied from any source capable
of providing 7.5 V–13 V dc or 7.5 V–13 V peak ac and
at least 100 mA. (Additional current may be req uired if a
speaker is connected for monitoring call progress
tones.) Power may be applied to the Si2493/57/34/15/
04-EVB through the screw terminals (J8), the 2 mm
power jack (J9), or the USB cable (even if the modem is
configured for RS-232 operation). The onboard full-
wave rectifier and filter ensure the correct polarity is
applied to the Si2493/57/34/15/04-EVB. Daughter card
current can be measured by connecting a DVM across
R59, a 1 resistor using the supplied test points on
Table 2. Signal Usage
SPI Function JP23 Pin Number Legacy Pin
Function
SPI_CSb 5 RTSb
SPI_MISO 7 RXD
SPI_MOSI 9 TXD
SPI_SCLK 11 CTSb
Si2493/57/34/15/04
8 Rev. 0.7
either side.
1.5. Terminal and Line Connections
The Si2493/57/34/15/04 can be tested as a standard
serial data modem by connecting the Si2493/57/34/15/
04-EVB to a personal computer or other data terminal
equipment (DTE), ph one line , and p ower. Connect a PC
serial port to the DB9 connector on the Si2493/57/34/
15/04-EVB with a pass-through cable. The RS-232
transceivers on the EVB can communicate with the DTE
at rates up to 1 Mbps. Any standard terminal program,
such as HyperTerminal or ProComm, running on a PC
communicates with the Si2493/57/34/15/04-EVB. The
standard factory jumper configuration has autobaud
enabled. Autobaud detects the DTE speed, data length,
parity, and number of stop bits.
If JP33 is installed, autobaud is disabled. Configure the
terminal emulation program to 19200 bps, eight data
bits, no parity, one stop bit, and hardware (CTS)
handshaking. Conn ect the RJ-11 jack on the Si24 93 /5 7 /
34/15/04-EVB to an analog phone line or telephone line
simulator, such as a Teltone TLS 5.
1.6. Making Connections
With the terminal program properly configured and
running, apply power to the Si2493/57/34/15/04-EVB.
Type “AT<cr>”, and the modem should return “OK”
indicating the modem is working in the command mode
and communicating with the terminal. If the “OK”
response is not received, try resetting the modem by
pressing the manual reset switch (S1); then, again type
“AT<cr>.” Next, type “ATI6<cr>.” The modem should
respond with “2493”, “2457”, “2434”, “2415”, or “2404”
indicating the terminal is communicating with an Si2493,
Si2457, Si2434, Si2415, or Si2404.
Type “ATS0=2<cr>” to configure the modem to answer
on the second ring.
To take the modem off-hook, type “ATH1<cr>.” The
modem should go to the off-hook state, draw loop
current, and respond with an “OK.” Next, type
“ATH<cr>” or “ATH0<cr>”, and the modem should hang
up (go on-hook) and stop drawing loop current.
To make a modem connection, type “ATDT(called
modem phone number)<cr>.” Once the connection is
establishe d, a “CONNECT” message appear s indicating
the two modems are in the data mode and
communicating. Typing on one terminal should appear
on the other terminal. To return to the command mode
without interrupting the connection between the two
modems, type “+++.” Approximately two seconds later,
“OK” appears. The modem is now in command mode
and accepts “AT” commands.Type “ATH” (or “ATH0”) to
terminate the data connection, or type “ATO” to return to
the data mode. After the ATO command, the modem
resumes the data connection and no longer accepts AT
commands.
1.7. EVB Part Numbers
The ISOmodem evaluation boards are offered in
multiple speeds and packaging options. The first four
numbers indicate the system-side device. The next two
letters indicate the system-side p ackage ( FS–Lead-free,
16-pin SOIC; FT–Lead-free, 24-pin TSSOP). The final
two numbers indicate the line-side de vice. See Figure 7.
Figure 7. EVB Part Number Example
2. Si2493/57/34/15/04-EVB
Functional Description
The Si2493/57/34/15/04-EVB is a multipurpose
evaluation system. The modem daughter card
illustrates the small size and few components required
to implement an entire controller-based modem with
global compatibility. The daughter card can be used
independently of, or in conjunction with, the
motherboard. The motherboard adds features that
enhance the ease of evaluating the many capabilities of
the Si2493/57/34/15/04 ISOmodem®.
2.1. Motherboard
The motherboard provides a convenient interface to the
Si2493/57/34/15/04 DC (daughter card). The versatile
power supply allows for a wide range of ac and dc
voltages to power the board . RS-23 2 transce ive rs and a
DB9 connector allow the Si2493/57/34/15/04-EVB to be
easily connected to a PC or other terminal device.
Jumper options allow direct access to the LVCMOS/TTL
level serial inputs to the Si2493/57/34/15/04, bypassing
the RS-232 transceivers or USB interface. This is
particularly useful for directly connecting the Si2493/57/
34/15/04 to embedded systems.
The Si24xxURT-EVB motherboard connects to the
daughter card through two connectors, JP101 and JP2.
JP101 is an 8x2 header providing connection to all
Si2493/57/34/15/04 digital signals and regulated 3.3 V
power for the Si2493/57/34/15/04. The Si2493/57/34/
15/04 digital signals appearing at JP101 (daughter card
interface) are LVCMOS and TTL compatible. JP2 is a
4x1 socket providing connection between the daughter
Si2457-D-FS18-EVB
LS Part Number (Si30xx)
SS Package
SS Part Number
SS R evision
Si2493/57/34/15/04
Rev. 0.7 9
card and the RJ-11 phone jack.
2.1.1. Voltage Regulator/Power Supply
The input volt age to either J8 or J9 must be between 7.5
and 13.5 V dc or 7.5 and 13.5 VPEAK ac. The
motherboard includes a diode bridge (D12) to guard
against a polarity reversal of the dc voltage or to rectify
an ac voltage. The power source must be capable of
continuously supplying at least 100 mA. C44 serves as
a filter cap for an ac input. The voltage regulator, U10,
provides 5 V for the motherboard and the input for
voltage regulator U3, which outputs 3.3 V for use on the
motherboard and to power the daugh ter card. Si24xxDC
power consumption can be measured by placing a
meter across R59. Power is supplied to U2 through D5
from the USB.
2.1.2. Reset Circuitry
The Si2493/57/34/15/04 requires a reset pulse to
remain low for at least 5.0 ms after the power supply
has stabilized during the powerup sequence or for at
least 5.0 ms during a power-on reset. Most production
Si2493/57/34/15/04 modem chipset applications require
that RESET be controlled by th e host processor. Certa in
Si2493/57/34/15/04 operation modes, including
powerdown, require a hardware reset to recover.
The Si2493/57/34/15/04-EVB contains two reset
options, an automatic power-on reset device, U18
(DS1818) (default), and a manual reset switch (S1) to
permit resetting the chip without removing power. A
reset, regardless of the mechanism, causes all modem
settings to revert to factory default values.
2.1.3. Automa ti c Re se t (DS1 8 18)
The DS1818 is a small, low-cost device that monitors
the voltage on VD and an external reset pushbutton. If
VD drops below 3.0 V, the DS1818 provides a 220 ms
active-low reset pulse. On powerup, the DS1818 also
outputs an active low reset pulse for 220 ms after VD
reaches 90% of the nominal 3.3 V value. The DS1818
outputs a 220 ms reset pulse any time the power supply
voltage exceeds the 3.3 V ±10% window.
2.1.4. Manual Reset
The manual reset switch (S1) performs a power-on
reset. This resets the Si2493/57/34/15/04 to factory
defaults without turning off power . Pressing S1 activates
the reset monitor in the DS1818 a nd produces a 220 ms
active low reset pulse.
2.1.5. EEPROM Enable (FT Only)
Connecting JP34 and JP35 enables the optional
EEPROM, U5. See “AN93: Si2457/Si2434/Si2415/
Si2404 Modem Designer’s Guide” for programming
details.
2.1.6. Interface Selection
The serial interface of the Si2493/57/34/15/04-EVB can
be connected to a computer, terminal, embedded
system, or an y other data terminal equipmen t (DTE ) via
a standard RS-232 interface, USB interface, or through
a direct TTL serial interface.
The Si2493/57/34/15/04 can be tested as a standard
data modem by connecting the Si2493/57/34/15/04-
EVB to a personal computer or other DTE power supply
and a phone line. A PC can communicate with the
Si2493/57/34/15/04-EVB using a standard terminal
program, such as HyperTerm or ProComm.
Jumper settings determine how the Si2493/57/34/15/
04-EVB is connected to the DTE.
2.1.7. RS-232 Interface
This operation mode uses the standard factory jumper
settings illustrated in Figure 1 on page 3. The Maxim
MAX3237 transceiver interfaces directly with the TTL
levels available at the serial interface of the Si2493/57/
34/15/04 and, using internal charge pumps, makes
these signals compatible with the RS-232 st andard. The
RS-232 transceiver on the Si2493/57/34/15/04-EVB can
communicate at rates between 300 bps and 1 Mbps.
This simplifies the connection to PCs and other data
terminal equipment (DTE). The signals available on the
Si2493/57/34/15/04-EVB serial interface (DB9
connector) are listed in Table 3.
2.1.8. USB Interface
The USB cable connects to J10 on the motherboard
and provides both data and power. Installing a jumper
on JP23 enables the USB interface and disables the
RS-232 interface. The USB interface is provided by
U12. A USB driver for this chip is available for most PC
and MAC operating systems on the CD.
Si2493/57/34/15/04
10 Rev. 0.7
2.1.9. Direct Access Interface
While the motherboard supplies power through J8, J9,
or USB, power-on reset, and an RJ–11 jack for the
modem, the direct access interface (J103) is used to
connect the motherboar d to an e mbedded system. J103
provides access to all Si2493/57/34/15/04 signals
available on the daughter card.
It is necessar y t o r em o ve th e jum p er o n J P 23 to d isa ble
both the RS-232 and USB interface and prevent signal
contention.
2.1.10. PCM Interface (24-Pin FT Only)
The Si2493/57/34/15/04 PCM interface can be
demonstrated using the voice mother board, not with this
EVB.
2.1.11. AOUT Call Progress Audio Output
Call progress audio output is provide d by the Si249 3/57/
34/15/04 on the AOUT pin as a PWM signal. This sign al
allows the user to monitor call progress signals, such as
dial tone, DTMF dialing, ring, busy signals, and modem
negotiation. Control of this signal is provided by AT
commands and register settings described in the
introduction. The AOUT signal is connected to an on
board amplifier, for a high-quality output. AOUT can
also be connected to a summin g amplifier or m ultiplexer
in an embedded application as part of an integrated
audio system.
2.1.11.1. AOUT Audio Processing
The AOUT signal discussed in this section leaves the
Si2493/57/34/15/04 is processed (demodulated) by a
high pass filter: (R133,134,135, and C24, C25, 26,
C27). It is critically important to not put a dc load on the
AOUT pin since the pin also acts as a modem feature
control on reset and is internally weakly pulled up. Any
unintentional dc load on AOUT prevents proper
operation of the modem. See “AN93: Si3457/34/15/04
Modem Designer’s Guide” for more details on the
features controlled by pin strapping.
Since this PWM signal swings rail to rail and is simply
filtered by a low pass filter to acquire the audio. It is
important to keep the power supply to the modem free
of noise in the audio spectrum.
2.1.11.2. The Audio Output Amplifier (LM4819)
The Power amplifier on the EVB is powered by a current
limited 4.2 V supply. The current limit is implemented in
the EVB because it is intended for HW/SW
development and is no t needed for a production design.
This amplifier can drive an 8 speaker with 200 mW of
Call progress audio (i.e., ISOmodem's call progress
dialing and negotiation tones).
The power amplifier itself is a low cost, rugged H bridge
type device. There are several pin compatible designs
from multiple vendors that can provide alternate price/
power tradeoffs for this amplifier. This power amp can
be shut down by removing jumper JP12. The signal at
JP12 can also be tied to a control signal to allow the
host to shut down the amplifier. The customer can
change the values of R172 and R173 when integrating
the EVB to his system, but should keep the RC formed
by C37 and R173 at a 50 Hz or higher corner to avoid a
power-on thump.
2.1.11.3. The Call Progress Speaker
The Call progress speaker, Regal RE-2308-NL is
connected to the amplifier via a jumper, JP14. If another
speaker is to be connected then it is necessary to
remove JP14 and conn ect the external speaker to JP11,
Pins 1 and 4. It is important to remember that the
speaker signal is differential. Both the output pins are
driven outputs and must not be grounded.
Table 3. DB9 Pin Connections
J1 Name J1 Symbol J1 Pin Si2493/57/34/15/
04 Pin Si2493/57/34/15/
04 Name
Carrier Detect CD 1*See note DCD/EESD
Received Data RXD 2 9 RXD
Transmit Data TXD 3 10 TXD
Data Terminal Ready DTR 4* See note ESC/RI
Signal Ground SG 5 6 GND
Data Set Ready DSR 6* See note INT/AOUT
Ready to Send RTS 7* See note RTS/RXCLK
Clear to Send CTS 8 11 CTS
Ring Indicator RD 9*17 RI
*Note: JP6 jumper option.
Si2493/57/34/15/04
Rev. 0.7 11
2.2. Modem Daughter Card Operation
The Si2493/57/34/15/04URT-EVB daughter card is a
complete modem solution perfectly suited for use in an
embedded system. The daughtercard contains both the
modem system-side chip and the isolated line interface
(DAA).
The daughter card requires a 3.3 V supply capable of
providing at least 35 mA and communicates with the
system via LVCMOS/TTL-compatible digital signals on
JP1. The RJ-11 jack (TIP and RING) is connected via
JP2. Be sure to provide the pr oper power-on reset p ulse
to the daughter card if it is used in the stand-alone
mode.
2.2.1. Reset Requirements
The Si2493/57/34/15/04 ISOmodem® daughter card
must be properly reset at powerup. The reset pin (pin 8)
of the Si2493/57/34/15 /04 (JP103, J101 pin 13) must be
held low for at least 5.0 ms after power is applied and
stabilized to ensure the device is properly reset.
2.2.2. Crystal Requirements
Clock accuracy and stability are important in modem
applications. To ensure reliable communication between
modems, the clock must remain within ±100 ppm of the
design value over the life of the modem. The crystal
selected for use in a modem application must have a
frequency tolerance of less than ±100 ppm for the
combination of initial frequency tolerance, drift over the
normal operating temperature range, and five year
aging. Other considerations, such as production
variations in PC board capacitance and the tolerance of
loading capacitors, must also be taken into account.
2.2.3. Protection
The Si2493/57/34/15/04-EVB meets or exceeds all FCC
and international PTT requirements and
recommendations for high-voltage surge and isolation
testing without any modification. The protection/isolation
circuitry includes C1, C2, C8, C9, FB1, FB2, and RV1.
The PCB layout is also a key “component” in the
protection circuitry. The Si2493/57/34/15/04-EVB
provides isolation to 3 kV. Contact Silicon Laboratories
for information about designing to higher levels of
isolation.
Si2493/57/34/15/04
12 Rev. 0.7
3. Design
The following sections contain the schem atics, bill of materials, and layout for the Si2493/57/34/15/04 including the
daughter card and motherboard.
These components are for
internal Silabs use only.
:LUHVFRPPRQWR
SLQSDUWV
No
R103 R106R101
No
No
No
No No
No Yes
NoNo
No Yes
PKG_16.11 & PKG_24.15
PKG_16.3 & PKG_24.4
PKG_16.15 & PKG_24.23
PKG_16.7 & PKG_24.11
PKG_24.16
R102
No
No
Yes
Yes
Yes
No Yes X
XNo
No
Yes
SPI 32 kHz
SPI 27 MHz
SPI 4.9252 MHz
Pin11 Pin3 Pin15Pin7
Pin15 Pin23Pin11
R104 R106R101 R102
No Yes
X
X
No
Yes
No
Yes
No
Yes
Pin16
16 pin sys side strapping table
UART 4.9152 MHz
UART 27 MHz
UART 32 kHz Parallel
PKG_24.17
R105
Pin17
X
X
X
X
Parallel
27 Mhz
4.9152 MHz
SPI
SPI
SPI
No Yes
No Yes
No
No
Yes 27 Mhz
Yes X 4.9152 MHz
32.768 kHzNo No
No No UARTNo Yes 32.768 kHzX
No No UARTNo No No
No No UARTNo No Yes
4.9152 MHz
27 Mhz
24 pin system side strapping table
<<%<DUHDOWHUQDWHIRRWSULQWVDQGIUHTXHQFLHV
7KH9DOXHVRI&&YDU\6HH7KH%20
2QO\RQH6\VWHPVLGHSDUWLV
VROGHUHGDWWLPH8RU8
CTSb AOUT_INTb INTb RIb DCDb
CTSb AOUT_INTb FSYNCH(RI) DCDb
SDO_EECLK_RTSb
DCDb
ESC
AOUT_INTb
RXD
RESETb
XTALI
XTALO
RXD
RTSb
RESETb
DCDb
FSYNCH
RTSb
INTb
ESC
RIb
SDI_EESD
AOUT_INTb
CLKOUT_EECSb_AO
CLKOUT_EECSb_AO
TXD
CTSb
TXD
CTSb
FSYNCH
SDO_EECLK_RTSb
SDO_EECLK_RTSb
SDI_EESD
RIb
AOUT_INTb
FSYNCH
INTb
ESC
DCDb
RIb
SDI_EESD
VDA
XTALO
XTALI
XTALO
AOUT_INTb
CTSb
DCDb
FSYNCH
INTb
RIb
VDA
VDB
RXD
TXD
CTSb
XTALI
RESETb
C1A
C2A
C1A
C2A
VDD
VDD
VDD
VDD
R101 10KR101 10K
C41 33pFC41 33pF
R121 NIR121 NI
R18 1.2KR18 1.2K
R111 200R111 200
R120 NIR120 NI
FB5FB5
C51
0.22uF
C51
0.22uF
R104 10KR104 10K
R102 10KR102 10K
C56
0.1uF
C56
0.1uF
R103 10KR103 10K
C52
0.1uF
C52
0.1uF
R105 10KR105 10K
R112 200R112 200
U13
Si24xx-16 pin
U13
Si24xx-16 pin
CLKIN/XTALI 1
XTALO 2
RIb
3
VDD3.3 4
RXD_SPI_MISO
5
TXD_SPI_MOSI
6
CTSb_SPI_SCLK
7
RESET
8C2A 9
C1A 10
INTb
11
GND
12
VA
13
ESC
14 DCDb
15
RTSb_SPI_CSb
16
J1
SOCKET 8x2
J1
SOCKET 8x2
1
122
3
344
5
566
7
788
9
910 10
11
11
13
13
15
15
12 12
14 14
16 16
C53
0.22uF
C53
0.22uF
C40 33pFC40 33pF
C55
0.1uF
C55
0.1uF
C54
1uF
C54
1uF
Y3
27 MHz
Y3
27 MHz
GND
2
VCC 4
OUT 3
NC
1
C50
0.1uF
C50
0.1uF
R106 10KR106 10K
R110 200R110 200
Y1B
32.768KHz
Y1B
32.768KHz
U12
Si2493
U12
Si2493
CLKIN/XTALI 1
XTALO 2
CLKOUT/EECSb/A0
3
FSYNCH/D6
4
VD3.3 5
GND
6
VDA
7
RTSb/SPI_CSb/D7
8
VDB
19
GND
20 VD 3.3 21
C2A 13
C1A 14
ESC/D3
22 DCDb/D4
23 SDO/EECLK/D5
24
CTS/SPI_SCLK/CSb
11
RXD/SPI_MISO/RDb
9
TXD/SPI_MOSI/WRb
10
RESET
12
RIb/D1
17
SDI/EESD/D2
18
AOUT/INTb
15
INTb/D0
16
Y1
4.9152MHz
Y1
4.9152MHz
Figure 8. i2493/57/34/15/04 Schematic
Si2493/57/34/15/04
Rev. 0.7 13
Bias
Ring Detect/CID/Voltage monitoring
DC Term
Add 0.020 to 0.030 sq.
inches of Cu at all
transistor collectors
Place C3 near D1
No GND or I_GND
copper planes in DAA
section.
TIP
RING
Keep 5 mm creepage
rules between this DAA
section and all else.
C1A
C2A
I_GND
I_GND
I_GND
I_GND
R12
56.2
R12
56.2 C10
0.01uF
C10
0.01uF
Q5
MMBTA06LT1
Q5
MMBTA06LT1
Q3
MMBTA42LT1
Q3
MMBTA42LT1
C4X1uF
25VX8R
C4X1uF
25VX8R
RV1
P3100SB
RV1
P3100SB
Q1
MMBTA42LT1
Q1
MMBTA42LT1
FB1
600 Ohm
FB1
600 Ohm
R2
150
R2
150
R4
2.49K
R4
2.49K
C5
0.1uF
C0603
C5
0.1uF
C0603
C6
0.1uF
C0603
C6
0.1uF
C0603
C2 33pFC2 33pF
C8
680pF
C8
680pF
-+
D1
HD04
-+
D1
HD04
Q2
MMBTA92LT1
Q2
MMBTA92LT1
C9
680pF
C9
680pF
R6
100K
R6
100K
FB2
600 Ohm
FB2
600 Ohm
R11
73.2
R11
73.2
C1 33pFC1 33pF
R13
56.2
R13
56.2
C7 2.7nFC7 2.7nF
+
C41uF
+
C41uF
R15
0
R15
0
Z1
43V
Z1
43V
R7 20MR7 20M
J2
TSM-104-01-T-SV
4X1 Header
J2
TSM-104-01-T-SV
4X1 Header
Q4
MMBTA06LT1
Q4
MMBTA06LT1
R8 20MR8 20M
R3
3.65K
R3
3.65K
C3
0.01uF
C3
0.01uF
R9
1M
R9
1M
R5
100K
R5
100K
R1
1.07K
R1
1.07K
R16
0
R16
0
U2
Si3018
U2
Si3018
QE 1
DCT 2
RX 3
IB
4
C1B
5
C2B
6
VREG
7
RNG1 8
DCT2 16
IGND
15
DCT3 14
QB 13
QE2 12
SC
11
VREG2
10 RNG2 9
R10
536
R10
536
Figure 9. Si3018/10 DAA Schematic
Si2493/57/34/15/04
14 Rev. 0.7
4. Bill of Materials: Si24xx Daughter Card
Table 4. Si24xx Daughter Card Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
1 2 C1, C2 33 pF Y2 250 V ±10% Y2 C1808 SCC1808X330K502T Holy Stone
2 1 C3 0.01 µF 250 V ±10% X7R C0805 GRM21BR72E103KW03L Murata
3 1 C4 1 µF 50 V ±20% Alum_Elec C3.3X3.3MM EEE1HS010SR Panasonic
4 2 C5, C6 0.1 µF 16 V ±20% X7R C0603 C0603X7R160-104M Venkel
5 1 C7 2.7 nF 50 V ±20% X7R C0603 C0603X7R500-272M Venkel
6 2 C8, C9 680 pF Y2 250 V ±10% Y2 C1808 SCC1808X681K502T H oly Stone
7 1 C10 0.01 µF 16 V ±20% X7R C0603 C0603X7R160-103M Venkel
8 2 C40,
C41 18 pF 50 V ±5% COG C0603 C0603COG500-180J Venkel
9 3 C50,
C52,
C56
0.1 µF 10 V ±20% X7R C0603 C0603X7R100-104M Venkel
10 2 C51,
C53 0.22 µF 6.3 V ±10% X5R C0603 C0603X7R6R3-224K Venkel
11 1 C54 1 µF 25 V ±10% X5R C0603 C0603X5R250-105K Venkel
12 1 D1 HD04 0.8 A 400 V BRIDGE MiniDIP4 HD04-T Diodes Inc.
13 3 FB1,
FB2,
FB5
600 200 mA SMT L0603 BLM18AG601SN1 Murata
14 1 J1 SOCKET 8x2 SOCKET SOCKETX8-100-SMT SSW-108-22-G-D-VS Samtec
15 1 J2 4X1 Header_0 CONN1X4-100-SMT TSM-104-01-T-SV Berg
16 2 Q1 Q3 MMBTA42LT1 200 mA 300 V NPN SOT23-BEC MMBTA42LT1 On Semi
17 1 Q2 MMBTA92LT1 100 mA 300 V PNP SOT23-BEC MMBTA92LT1 On Semi
18 2 Q4 Q5 MMBTA06LT1 500 mA 80 V NPN SOT23-BEC MMBTA06LT1 On Semi
19 1 RV1 P3100SB 275 V Sidactor DO-214AA-NP P3100SBL Littelfuse
20 1 R1 1.07 k1/2 W ±1% ThickFilm R2010 CR2010-2W-1071F Venkel
21 1 R2 150 1/16 W ±5% ThickFilm R0603 CR0603-16W-151J Venkel
22 1 R3 3.65 k1/2 W ±1% ThickFilm R2010 CR2010-2W-3651F Venkel
23 1 R4 2.49 k1/2 W ±1% ThickFilm R2010 CR2010-2W-2491F Venkel
24 2 R5, R6 100 k1/16 W ±5% ThickFilm R0603 CR0603-16W-104J Venkel
25 2 R7, R8 20 M1/8 W ±5% ThickFilm R0805 CR0805-8W-206J Venkel
26 1 R9 1 M1/16 W ±1% ThickFilm R0603 CR0603-16W-1004F Venkel
27 1 R10 536 1/4 W ±1% ThickFilm R1206 CR1206-4W-5360F Venkel
28 1 R11 73.2 1/2 W ±1% ThickFilm R2010 CR2010-2W-73R2F Venkel
29 2 R12,
R13 56.2 1/16 W ±1% ThickFilm R0603 CR0603-16W-56R2F Venkel
30 2 R15,
R16 01 A ThickFilm R0603 CR0603-16W-000 Venkel
31 2 R120,
R121 01 A ThickFilm R0603 CR0603-16W-000 Venkel
32 1 R18 1.2 k1/10 W ±5% ThickFilm R0603 CR0603-10W-121J Venkel
33 4 R101,
R102,
R103,
R104,
R106
10 k1/10 W ±5% ThickFilm R0603 CR0603-10W-103J Venkel
Si2493/57/34/15/04
Rev. 0.7 15
34 1 R105 1 k1/10 W ±5% ThickFilm R0603 CR0603-10W-102J Venkel
35 3 R110,
R111,
R112
200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel
36 1 U2 Si3018 300 V LineSide SO16N6.0P1.27 Si3018-F-GS SiLabs
37 1 U12 Si24xx ISOMODEM TSSOP24N6.4P0.65 Si2493-E-FT SiLabs
38 1 U13 Si24xx-16 pin 16pin SOIC 2493 Silicon
Laboratories
39 1 Y1B
(Y1, Y3) 32.768 kHz XTAL-3X8-LD ECS–.327–12.5–8X ECS
International
40 1 Z1 43 V 500 mW 43 V Zener SOD-123 BZT52C43-7-F Diodes Inc.
Table 4. Si24xx Daughter Card Bill of Materials (Continued)
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2493/57/34/15/04
16 Rev. 0.7
Figure 10. Motherboard Modem Interface Schematic
Si2493/57/34/15/04
Rev. 0.7 17
"Do not gound
speaker+ or
Speaker -
AOUT_INTb
+4.7V
+4.7V
JP14
En. Lcl. Speaker
JP14
En. Lcl. Speaker
1 2
R31 10KR31 10K
U27
LM4819
U27
LM4819
SHUTDOWN
1
BYPASS
2
IN+
3
IN-
4
VO2 8
GND
7VDD 6
VO1 5
R33
1K
R33
1K
R172 20.0KR172 20.0K
JP12
Pwr Amp En. JP12
Pwr Amp En.
1 2
C37 1uFC37 1uF
C27
0.1uF
C27
0.1uF C23 1uF
C23 1uF
R35
1K
R35
1K
C24
0.1uF
C24
0.1uF
R175 0R175 0
LS1
SPEAKER
LS1
SPEAKER
C26
0.1uF
C26
0.1uF
C25
0.1uF
C25
0.1uF
C21
1uF
C21
1uF
JP11
DIFF SPKR OUT
JP11
DIFF SPKR OUT
R174
20.0K
R174
20.0K
R34
1K
R34
1K
C97 1nFC97 1nF
R173 20.0KR173 20.0K
Figure 11. Audio Amplifier Schematic
Si2493/57/34/15/04
18 Rev. 0.7
RESETb
+3.3V
VCC_USB
+4.7V
J8
7-12V AC/DC PWR
J8
7-12V AC/DC PWR
1
2
R103 1.6R103 1.6
R105 1.6R105 1.6
D49
MMBD3004S-7-F
D49
MMBD3004S-7-F
D11
STPS140Z
SOD-123D11
STPS140Z
SOD-123
D50 RED
+3.3V PWR
D50 RED
+3.3V PWR
D13 STPS140ZD13 STPS140Z
U18
DS1818
U18
DS1818
VCC
2
GND
3RST 1
U3
LT1963A-3.3 V
SOT223
U3
LT1963A-3.3 V
SOT223
GND
IN OUT
GND
C51
0.01uF
25V
C51
0.01uF
25V
C66
10uF
C66
10uF
C48
0.1uF
50V
C48
0.1uF
50V
FB7
600 Ohm
FB7
600 Ohm C96
0.1uF
C96
0.1uF
FB6
600 Ohm
FB6
600 Ohm
-+
D12
Bridge Rectifier
-+
D12
Bridge Rectifier
C43
1uF
C43
1uF R57
0.05
R57
0.05
C42
0.01uF
25V
C42
0.01uF
25V
R161 681R161 681
C49
10uF
C49
10uF
+
C44
470uF
+
C44
470uF
U10
TO263-3N
LM2937ES-5.0
U10
TO263-3N
LM2937ES-5.0
GND
IN OUT
GND
S1
RESET
S1
RESET
R102
1.33K
R102
1.33K
J9
7-12V AC/DC PWR
J9
7-12V AC/DC PWR
3
2
1
Figure 12. Power Supply Schematic
Si2493/57/34/15/04
Rev. 0.7 19
RS-232, Female,
Front View
USB
Keep Very Close
RXD_232
CTS_232
RD_232
TXD_232
DTR_232
DSR_232
RTS_232
CD_232
RXD_T
CTS_T
DSR_T
CD_T
RI_T
TXD_T
RTS_T
DTR_T
RI_U
CD_U
DSR_U
TXD_U
RXD_U
CTS_U
RTS_U
DTR_U
+3.3V
+3.3V
VCC_USB
DN5 15VDN5 15V
C58
0.1uF
C58
0.1uF
R112
10K
R112
10K
DN4 15VDN4 15V
DN1 15VDN1 15V
FB8
600 Ohm
BLM18AG601SN1
FB8
600 Ohm
BLM18AG601SN1
R110 10KR110 10K
U11
MAX3237
U11
MAX3237
C2+ 1
C2- 3
C1+ 28
C1- 25
V+
27
V-
4
T1IN 24
T2IN 23
T3IN 22
T4IN 19
T5IN 17
R1OUTB 16
R1OUT 21
R2OUT 20
R3OUT 18
EN 13
GND
2
T1OUT
5
T2OUT
6
T3OUT
7
T4OUT
10
T5OUT
12
VCC 26
R1IN
8
R2IN
9
R3IN
11
MBAUD
15
SHDN
14
C62
0.1uF
C62
0.1uF
DN8 15VDN8 15V
C53
0.1uF
C53
0.1uF
DN3 15VDN3 15V
C52
560pF
C52
560pF
R109 10KR109 10K
J10
DB9
J10
DB9
CD(O)
1
RXD(O)
2
TXD(I)
3
DTR(I)
4
SG
5
DSR(O) 6
RTS(I) 7
CTS(O) 8
RD(O) 9
MH
10
MH
11
D14D14
C63
0.1uF
C63
0.1uF
DN7 15VDN7 15V
DN2 15VDN2 15V
R111 10KR111 10K
U12
CP2102
U12
CP2102
REGIN
7
VDD 6
GND
3
VBUS
8
D-
5
D+
4
CTS 23
RTS 24
RXD 25
TXD 26
DSR 27
DTR 28
DCD 1
RI 2
SUSPEND 11
SUSPEND 12
RST 9
GND
EPAD
D15D15
C57 0.1uFC57 0.1uF
C61
0.1uF
C61
0.1uF
J11
USB Type B
J11
USB Type B
+V 1
D- 2
D+ 3
GND 4
SH
5SH
6
C59
0.1uF
C59
0.1uF
C56 0.1uFC56 0.1uF
DN6 15VDN6 15V
FB9
600 Ohm
BLM18AG601SN1
FB9
600 Ohm
BLM18AG601SN1
R108
0
NOPOP
R108
0
NOPOP
C54
1uF
C54
1uF
C60
0.01uF
C60
0.01uF
C55
1uF
C55
1uF
Figure 13. RS-232 Interface and USB Interface Schematic
Si2493/57/34/15/04
20 Rev. 0.7
5. Bill of Materials: Si24xx Motherboard
Table 5. Si24xx Motherboard Bill of Materials
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
1 8 C21, C23,
C37, C43,
C54, C55,
C69, C74
1 µF 10 V ±10% X7R C0603 C0603X7R100-105K Venkel
2 17 C24, C25,
C26, C27,
C53, C56,
C57, C58,
C59, C61,
C62, C63,
C71, C72,
C75, C96,
C98
0.1 µF 10 V ±20% X7R C0402 C0402X7R100-104M Venkel
3 3 C42, C51,
C60 0.01 µF 25 V ±10% X7R C0402 C0402X7R250-103K Venkel
4 1 C44 470 µF 25 V ±20% Alum_Ele
cC10.3X10.3MM EMVE250ADA471MJA0G United
Chemicon
5 1 C48 0.1 µF 50 V ±10% X7R C0603 C0603X7R500-104K Venkel
6 2 C49, C66 10 µF 16 V ±10% X5R C0805 C0805X5R160-106K Venkel
7 3 C52, C70,
C73 560 pF 16 V ±10% X7R C0603 C0603X7R160-561K Venkel
8 1 C97 1 nF 100 V ±10% X7R C0603 C0603X7R101-102K Venkel
9 8 DN1, DN2,
DN3, DN4,
DN5, DN6,
DN7, DN8
15 V 225 mW 15 V Zener,
Dual SOT23-AAK MMBZ15VDLT1G On Semi
10 2 D11, D13 STPS140Z 1.0 A 40 V Scho ttky SOD-123 STPS140Z ST MICRO
11 1 D12 Bridge
Rectifier 0.8 A 100 V BRIDGE MiniDIP4 HD01-T Diodes Inc.
12 3 D14, D15,
D49 MMBD300
4S-7-F 225 mA 300 V DUAL SOT23-AKC MMBD3004S-7-F Diodes Inc.
13 11 D41, D42,
D43, D44,
D45, D46,
D47, D48,
D50, D52,
D53
RED 25 mA 1.9 V SMT,
Chip LED LED-HSMX-
C170 HSMC-C170 Avago
Technologies
14 1 D54 BAV23A 400 mA 200 V DUAL SOT23-KKA BAV23A Diodes Inc.
15 5 FB6, FB7,
FB8, FB9,
FB11
600 Ohm 200 mA SMT L0603 BLM18AG601SN1 MuRata
16 4 HW1, HW2,
HW3, HW4 spacer 2397 SPC
Technology
17 4 HW5, HW6,
HW7, HW8 screw NSS-4-4-01 Richco
Plastic Co
Si2493/57/34/15/04
Rev. 0.7 21
18 1 JP11 HEADER
4X1 Header CONN-1X4 TSW-104-07-T-S Samtec
19 2 JP12, JP14 JUMPER Header CONN-1X2 TSW-102-07-T-S Samtec
20 1 JP23 HEADER
1x3 Header CONN-1X3 TSW-103-07-T-S Samtec
21 3 JP33, JP34,
JP35 JUMPER Unshroud
ed CONN-1X2 68000-402 Berg
22 1 J5 RJ-11 RJ-11 RJ11-DUAL-
MTJG MTJG-2-64-2-2-1 ADAM TECH
23 1 J6 HEADER
5x3 Header TSW-105-07-S-T Samtec
24 1 J8 CONN
TRBLK 2 TERM
BLK CONN-1X2-TB 1729018 PHOENIX
CONTACT
25 1 J9 Power
Jack 1 A BARREL CONN-3-PWR ADC-002-1 Adam Tech
26 1 J10 DB9 D-SUB CONN-9-DBF D09S33E4GX00LF FCI
27 1 J11 USB Type
BUSB CONN-USB-B 292304-1 Tyco
28 1 J101 HEADER
8x2 Header CONN2X8 16/80 pins of 9-146252-0-
08 Tyco/AMP
29 1 J102 Socket 1x4 Header SSW-104-01-T-S Samtec
30 1 J103 8X2
Shrouded
Header
Shrouded CONN2X8-4W 5103309-3 Tyco
31 1 LS1 SPEAKER 0.5 W
Max RE-2308-NL RE-2308-NL Regal
32 7 R31, R40,
R41, R42,
R43, R52,
R109, R110,
R111, R112
10 k1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel
33 3 R33, R34,
R35 1k1/16 W ±1% ThickFilm R0603 CR0603-16W-1001F Venkel
34 1 R48 100 k1/10 W ±1% ThickFilm R0603 CR0603-10W-1003F Venkel
35 1 R57 0.05 1/4 W ±5% ThickFilm R0805 LCR0805-R050J Venkel
36 1 R59 1 1/10 W ±1% ThickFilm R0603 CR0603-10W-1R00F Venkel
37 1 R101 200 1/10 W ±5% ThickFilm R0603 CR0603-10W-2000J Venkel
38 1 R102 1.33 k1/10 W ±1% ThickFilm R0603 CR0603-10W-1331F Venkel
39 2 R103, R105 1.6 1/4 W ±5% ThickFilm R1206 CR1206-8W-1R6J Venkel
40 11 R155, R156,
R157, R158,
R159, R160,
R161, R162,
R163, R169,
R170
681 1/10 W ±1% ThickFilm R0603 CR0603-10W-6810F Venkel
Table 5. Si24xx Motherboard Bill of Materials (Continued)
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2493/57/34/15/04
22 Rev. 0.7
41 3 R172, R173,
R174 20.0 k1/16 W ±1% ThickFilm R0603 CR0603-16W-2002F Venkel
42 1 R175 0 2 A ThickFilm R1206 CR1206-4W-000 Venkel
43 1 S1 SW PUSH-
BUTTON 50 mA 12 Vdc Tactile SW4N6.5X4.5-
PB 101-0161-EV Mountain
Switch
44 10 TP5, TP6,
TP16, TP17,
TP19, TP20,
TP21, TP22,
TP23, TP24
BLUE Loop TESTPOINT 151-205-RC Kobiconn
45 4 TP7, TP8,
TP9, TP25 Turret Turret TP[12594] 2551-2-00-44-00-00-07-0 Mill-Max
46 1 TP11 RED Loop TESTPOINT 151-207-RC Kobiconn
47 1 U3 LT1963A-
3.3 V 1.5 A
max LDO SOT223 LT1963AEST-3.3#PBF Linear Tech-
nologies
48 1 U5 EEPROM
32K Serial TSSOP8N6.4P0.
65 25LC320A-I/ST Microchip
Technology
49 1 U10 5 0.5 A
max LDO TO263-3N LM2937ES-5.0 National
Semiconduc-
tors
50 1 U11 MAX3237 5.5 V RS232 TSSOP MAX3237EIPWR TI
51 1 U12 CP2102 MCU QFN28N5X5P0.
5CP2102-GM SiLabs
52 2 U13, U14 IDT74C B T
LV3257 TSSOP-16 IDT74CBTLV3257 IDT
53 1 U18 DS1818 3.3 V 10% SOT-23 DS1818-10 Dallas Semi-
conductor
54 1 U26 74LCX541 Buffer TSSOP20N6.4P
0.65 74LCX541MTC Fairchild
55 1 U27 LM4819 350 mW SO8N6.0P1.27 LM4819M National
Semiconduc-
tor
Unpopulated Components
56 1 J7 2MM, RT
ANG SHROUD
ED CONN1X5-S5B-
PH-SM4-TB S5B-PH-SM4-TB JST
11 R39 10k1/10 W ±1% ThickFilm R0603 CR0603-10W-1002F Venkel
1 1 R108 0 1 A ThickFilm R0603 CR0603-16W-000 Venkel
Table 5. Si24xx Motherboard Bill of Materials (Continued)
Item Qty Ref Value Rating Voltage Tol Type PCB Footprint Mfr Part Number Mfr
Si2493/57/34/15/04
Rev. 0.7 23
Figure 14. Daughter Card Primary Side Silkscreen
Si2493/57/34/15/04
24 Rev. 0.7
Figure 15. Daughter Card Secondary Side Silkscreen
Si2493/57/34/15/04
Rev. 0.7 25
Figure 16. Daughter Card Primary Side Layout
Si2493/57/34/15/04
26 Rev. 0.7
Figure 17. Daughter Card Secondary Side Layout
Si2493/57/34/15/04
Rev. 0.7 27
Figure 18. Motherboard Primary Side Silkscreen
Si2493/57/34/15/04
28 Rev. 0.7
Figure 19. Motherboard Silkscreen (Secondary Side)
Si2493/57/34/15/04
Rev. 0.7 29
Figure 20. Motherboard Primary Side Layout
Si2493/57/34/15/04
30 Rev. 0.7
Figure 21. Motherboard Secondary Side Layout
Si2493/57/34/15/04
Rev. 0.7 31
Figure 22. Motherboard Ground Plane Layout
Si2493/57/34/15/04
32 Rev. 0.7
Figure 23. Motherboard Power Plane Layout
Si2493/57/34/15/04
Rev. 0.7 33
6. Complete Design Package on CD
(See Sales Representative for
Details)
Silicon Laboratories can provide a complete design
package of the Si2493/57/34/15/04-EVB including the
following:
OrCad Schematics
Gerber Files
BOM
Documentation
Contact your local sales representative or Silicon
Laboratories headquarters sales for ordering
information.
Si2493/57/34/15/04
34 Rev. 0.7
DOCUMENT CHANGE LIST
Revision 0.2 to Revision 0.3
Updated Figure 15, “Daughter Card Secondary Side
Silkscreen,” on page 24.
Updated Figure 16, “Daughter Card Primary Side
Layout,” on page 25.
Updated Figure 17, “Daughter Card Secondary Side
Layout,” on page 26.
Updated “Bill of Materials: Si24xx Daughter Card” .
Revision 0.3 to Revision 0.4
Changed from Rev.1.0 to Rev.1.1 Daughter Card.
Revision 0.4 to Revision 0.5
Changed from Rev.3.1 to Rev.3.2 Motherboard.
Revision 0.5 to Revision 0.6
Changed from Rev.1.1 to Rev.1.2 Daughter Card.
Added FS (SOIC) Package Option.
Revision 0.6 to Revision 0.7
Changed R1.2 to 2.0 daughtercard.
Changed R32 to 5.0 motherboard.
Changed power amplifier chip and speakers.
Removed connector to SSI BUS.
Changed regulator and power on reset circuit.
Changed various jumper locations.
Si2493/57/34/15/04
Rev. 0.7 35
NOTES:
Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific
written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected
to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
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thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®,
USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of
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