LM4889MAX/NOPB - NATIONAL SEMICONDUCTOR

LM4889

LM4889 1 Watt Audio Power Amplifier

Literature Number: SNAS157G

November 2006

LM4889

1 Watt Audio Power Amplifier

General Description

The LM4889 is an audio power amplifier primarily designed

for demanding applications in mobile phones and other

portable communication device applications. It is capable of

delivering 1 watt of continuous average power to an 8Ω BTL

load with less than 2% distortion (THD+N) from a 5VDC power

supply.

Boomer audio power amplifiers were designed specifically to

provide high quality output power with a minimal amount of

external components. The LM4889 does not require output

coupling capacitors or bootstrap capacitors, and therefore is

ideally suited for mobile phone and other low voltage appli-

cations where minimal power consumption is a primary re-

quirement.

The LM4889 features a low-power consumption shutdown

mode, which is achieved by driving the shutdown pin with a

logic low. Additionally, the LM4889 features an internal ther-

mal shutdown protection mechanism.

The LM4889 contains advanced pop & click circuitry to elim-

inate noise which would otherwise occur during turn-on and

turn-off transitions.

The LM4889 is unity-gain stable and can be configured by

external gain-setting resistors.

Key Specifications

■Improved PSRR at 217Hz, 5 - 3.3V 75dB

■ Power Output at 5.0V & 2% THD 1.0W(typ.)

■ Power Output at 3.3V & 1% THD 400mW(typ.)

■ Shutdown Current at 3.3 & 2.6V 0.01µA(typ.)

Features

■Available in space-saving MSOP, SOIC, LLP, and micro

SMD packages

■Ultra low current shutdown mode (3.3 to 2.6V - 0.01µA)

■Can drive capacitive loads up to 500 pF

■Improved pop & click circuitry eliminates noises during

turn-on and turn-off transitions

■2.2 - 5.5V operation

■No output coupling capacitors, snubber networks or

bootstrap capacitors required

■Unity-gain stable

■External gain configuration capability

Applications

■Mobile Phones

■PDAs

■Portable electronic devices

Typical Application

20035801

FIGURE 1. Typical Audio Amplifier Application Circuit

Boomer® is a registered trademark of National Semiconductor Corporation.

LM4889 1 Watt Audio Power Amplifier

Connection Diagrams

Small Outline (SO) Package

20035835

Top View

Order Number LM4889MA

See NS Package Number M08A

SO Marking

20035872

Top View

XY - Date Code

TT - Die Traceability

Bottom 2 lines - Part Number

Mini Small Outline (MSOP) Package

20035836

Top View

Order Number LM4889MM

See NS Package Number MUA08A

MSOP Marking

20035871

Top View

G - Boomer Family

A2 - LM4889MM

8 Bump micro SMD

20035887

Top View

Order Number LM4889ITL, LM4889ITLX

See NS Package Number TLA08AAA

8 Bump micro SMD Marking

20035879

Top View

X - Date Code

T - Die Traceability

G - Boomer Family

A3 - LM4889ITL

LLP Package

20035830

Top View

Order Number LM4889LD

See NS Package Number LDA10B

10 Pin LLP Marking

20035831

Top View

Z - Assembly Plant Date Code (M for Malacca)

XY - 2 Digit Date Code

TT - Die Traceability

L4889 - LM4889LD

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LM4889

Absolute Maximum Ratings (Note 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage 6.0V

Storage Temperature −65°C to +150°C

Input Voltage −0.3V to VDD +0.3V

Power Dissipation (Note 3) Internally Limited

ESD Susceptibility (Note 4) 2000V

ESD Susceptibility (Note 5) 200V

Junction Temperature 150°C

Thermal Resistance

θJC (SOP) 35°C/W

θJA (SOP) 150°C/W

θJA (8 Bump micro SMD) (Note 10) 210°C/W

θJC (MSOP) 56°C/W

θJA (MSOP) 190°C/W

θJA (LLP) 220°C/W

Soldering Information

See AN-1112 "microSMD Wafers Level Chip Scale

Package".

Operating Ratings

Temperature Range

TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ 85°C

Supply Voltage 2.2V ≤ VDD ≤ 5.5V

Electrical Characteristics VDD = 5V

Symbol Parameter Conditions

LM4889 Units

(Limits)

Typical Limit

(Note 6) (Notes 7, 9)

IDD Quiescent Power Supply Current VIN = 0V, Io = 0A, no Load 4 8 mA (max)

VIN = 0V, Io = 0A, with BTL Load 5 8 mA (max)

ISD Shutdown Current Vshutdown = GND (Note 8) 0.1 2 µA (max)

VSDIH Shutdown Voltage Input High 1.2 V (min)

VSDIL Shutdown Voltage Input Low 0.4 V (max)

PoOutput Power THD = 2% (max); f = 1 kHz 1 W

THD+N Total Harmonic Distortion+Noise Po = 0.4 Wrms; f = 1kHz 0.1 %

PSRR Power Supply Rejection Ratio

Vripple = 200mV sine p-p

fripple = 217Hz

fripple = 1kHz

Vripple = 200mV sine p-p

Input Floating 75 68 dB

Electrical Characteristics VDD = 3.3V

Symbol Parameter Conditions

LM4889 Units

(Limits)

Typical Limit

(Note 6) (Notes 7, 9)

IDD Quiescent Power Supply Current VIN = 0V, Io = 0A, no Load 3.5 7 mA (max)

VIN = 0V, Io = 0A, with BTL Load 4.5 7 mA (max)

ISD Shutdown Current Vshutdown = GND (Note 8) 0.01 2 µA (max)

VSDIH Shutdown Voltage Input High 1.2 V (min)

VSDIL Shutdown Voltage Input Low 0.4 V (max)

PoOutput Power THD = 1% (max); f = 1kHz 0.4 W

THD+N Total Harmonic Distortion+Noise Po = 0.25Wrms; f = 1kHz 0.1 %

PSRR Power Supply Rejection Ratio

Vripple = 200mV sine p-p

fripple = 217Hz

fripple =1kHz

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LM4889

Electrical Characteristics VDD = 2.6V

Symbol Parameter Conditions

LM4889 Units

(Limits)

Typical Limit

(Note 6) (Notes 7, 9)

IDD Quiescent Power Supply Current VIN = 0V, Io = 0A, no Load 2.6 6 mA (max)

VIN = 0V, Io = 0A, with BTL Load 3.0 6 mA (max)

ISD Shutdown Current Vshutdown = GND (Note 8) 0.01 2 µA (max)

Output Power ( 8Ω )

Output Power ( 4Ω )

THD = 1% (max); f = 1 kHz

0.2

0.22

THD+N Total Harmonic Distortion+Noise Po = 0.1Wrms; f = 1kHz 0.08 %

PSRR Power Supply Rejection Ratio

Vripple = 200mV sine p-p

fripple = 217Hz

fripple = 1kHz

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions

which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters

where no limit is given, however, the typical value is a good indication of device performance.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum

allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4889, see power derating

currents for additional information.

Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor.

Note 5: Machine Model, 220 pF–240 pF discharged through all pins.

Note 6: Typicals are measured at 25°C and represent the parametric norm.

Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).

Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA.

Note 9: Datasheet min/max specification limits are guaranteed by design, test or statistical analysis.

Note 10: All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4889ITL demo board (views featured

in the Application Information section) has two inner layers, one for VDD and one for GND. The planes each measure 600mils x 600mils (15.24mm x 15.24mm)

and aid in spreading heat due to power dissipation within the IC.

External Components Description

(Figure 1)

Components Functional Description

1. RiInverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high

pass filter with Ci at fC= 1/(2π RiCi).

2. CiInput coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a highpass filter

with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components, for an explanation of

how to determine the value of Ci.

3. RfFeedback resistance which sets the closed-loop gain in conjunction with Ri. AVD = 2*(Rf/Ri).

4. CSSupply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for

information concerning proper placement and selection of the supply bypass capacitor.

5. CBBypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External

Components, for information concerning proper placement and selection of CB.

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LM4889

Typical Performance Characteristics

THD+N vs Frequency

at VDD = 5V, 8Ω RL, and PWR = 250mW

20035837

THD+N vs Frequency

at VDD = 3.3V, 8Ω RL, and PWR = 150mW

20035838

THD+N vs Frequency

at VDD = 2.6V, 8Ω RL, and PWR = 100mW

20035839

THD+N vs Frequency

at VDD = 2.6V, 4Ω RL, and PWR = 100mW

20035840

THD+N vs Power Out

at VDD = 5V, 8Ω RL, 1kHz

20035875

THD+N vs Power Out

at VDD = 3.3V, 8Ω RL, 1kHz

20035842

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LM4889

THD+N vs Power Out

at VDD = 2.6V, 8Ω RL, 1kHz

20035843

THD+N vs Power Out

at VDD = 2.6V, 4Ω RL, 1kHz

20035844

Power Supply Rejection Ratio (PSRR) at VDD = 5V

20035845

Input terminated with 10Ω R

Power Supply Rejection Ratio (PSRR) at VDD = 5V

20035873

Input Floating

Power Supply Rejection Ratio (PSRR) at VDD = 2.6V

20035847

Input terminated with 10Ω R

Power Supply Rejection Ratio (PSRR) at VDD = 3.3V

20035846

Input terminated with 10Ω R

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LM4889

Power Dissipation vs

Output Power

VDD = 3.3V

20035849

Power Dissipation vs

Output Power

VDD = 5V

20035848

Output Power vs

Load Resistance

20035874

Power Dissipation vs

Output Power

VDD = 2.6V

20035850

Supply Current vs

Shutdown Voltage

20035853

Clipping (Dropout) Voltage vs

Supply Voltage

20035852

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LM4889

Open Loop Frequency Response

20035855

Frequency Response vs

Input Capacitor Size

20035854

Noise Floor

20035856

Power Derating Curves

(PDMAX = 670mW)

20035832

Power Derating Curves - 8 bump µSMD

(PDMAX = 670mW)

20035833

Power Derating Curves - 10 Pin LD pkg

(PDMAX = 670mW)

20035834

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LM4889

Application Information

BRIDGE CONFIGURATION EXPLANATION

As shown in Figure 1, the LM4889 has two operational am-

plifiers internally, allowing for a few different amplifier config-

urations. The first amplifier's gain is externally configurable,

while the second amplifier is internally fixed in a unity-gain,

inverting configuration. The closed-loop gain of the first am-

plifier is set by selecting the ratio of Rf to Ri while the second

amplifier's gain is fixed by the two internal 20kΩ resistors.

Figure 1 shows that the output of amplifier one serves as the

input to amplifier two which results in both amplifiers produc-

ing signals identical in magnitude, but out of phase by 180°.

Consequently, the differential gain for the IC is

AVD= 2 *(Rf/Ri)

By driving the load differentially through outputs Vo1 and Vo2,

an amplifier configuration commonly referred to as “bridged

mode” is established. Bridged mode operation is different

from the classical single-ended amplifier configuration where

one side of the load is connected to ground.

A bridge amplifier design has an advantage over the single-

ended configuration, as it provides differential drive to the

load, thus doubling output swing for a specified supply volt-

age. Four times the output power is possible as compared to

a single-ended amplifier under the same conditions. This in-

crease in attainable output power assumes that the amplifier

is not current limited or clipped. In order to choose an

amplifier's closed-loop gain without causing excessive clip-

ping, please refer to the Audio Power Amplifier Design

section.

A bridge configuration, such as the one used in LM4889, also

creates a second advantage over single-ended amplifiers.

Since the differential outputs, Vo1 and Vo2, are biased at half-

supply, no net DC voltage exists across the load. This elimi-

nates the need for an output coupling capacitor which is

required in a single supply, single-ended amplifier configura-

tion. Without an output coupling capacitor, the half-supply

bias across the load would result in both increased internal IC

power dissipation and also possible loudspeaker damage.

POWER DISSIPATION

Power dissipation is a major concern when designing a suc-

cessful amplifier, whether the amplifier is bridged or single-

ended. A direct consequence of the increased power

delivered to the load by a bridge amplifier is an increase in

internal power dissipation. Since the LM4889 has two opera-

tional amplifiers in one package, the maximum internal power

dissipation is 4 times that of a single-ended amplifier. The

maximum power dissipation for a given application can be

derived from the power dissipation graphs or from Equation

PDMAX = 4*(VDD)2/(2π2RL) (1)

It is critical that the maximum junction temperature TJMAX of

150°C is not exceeded. TJMAX can be determined from the

power derating curves by using PDMAX and the PC board foil

area. By adding additional copper foil, the thermal resistance

of the application can be reduced from a free air value of 150°

C/W, resulting in higher PDMAX. Additional copper foil can be

added to any of the leads connected to the LM4889. It is es-

pecially effective when connected to VDD, GND, and the output

pins. Refer to the application information on the LM4889 ref-

erence design board for an example of good heat sinking. If

TJMAX still exceeds 150°C, then additional changes must be

made. These changes can include reduced supply voltage,

higher load impedance, or reduced ambient temperature. In-

ternal power dissipation is a function of output power. Refer

to the Typical Performance Characteristics curves for

power dissipation information for different output powers and

output loading.

POWER SUPPLY BYPASSING

As with any amplifier, proper supply bypassing is critical for

low noise performance and high power supply rejection. The

capacitor location on both the bypass and power supply pins

should be as close to the device as possible. Typical appli-

cations employ a 5V regulator with 10 µF tantalum or elec-

trolytic capacitor and a ceramic bypass capacitor which aid in

supply stability. This does not eliminate the need for bypass-

ing the supply nodes of the LM4889. The selection of a bypass

capacitor, especially CB, is dependent upon PSRR require-

ments, click and pop performance (as explained in the sec-

tion, Proper Selection of External Components), system

cost, and size constraints.

SHUTDOWN FUNCTION

In order to reduce power consumption while not in use, the

LM4889 contains a shutdown pin to externally turn off the

amplifier's bias circuitry. This shutdown feature turns the am-

plifier off when a logic low is placed on the shutdown pin. By

switching the shutdown pin to ground, the LM4889 supply

current draw will be minimized in idle mode. While the device

will be disabled with shutdown pin voltages less than

0.5VDC, the idle current may be greater than the typical value

of 0.1µA. (Idle current is measured with the shutdown pin

grounded).

In many applications, a microcontroller or microprocessor

output is used to control the shutdown circuitry to provide a

quick, smooth transition into shutdown. Another solution is to

use a single-pole, single-throw switch in conjunction with an

external pull-up resistor. When the switch is closed, the shut-

down pin is connected to ground and disables the amplifier.

If the switch is open, then the external pull-up resistor will en-

able the LM4889. This scheme guarantees that the shutdown

pin will not float thus preventing unwanted state changes.

PROPER SELECTION OF EXTERNAL COMPONENTS

Proper selection of external components in applications using

integrated power amplifiers is critical to optimize device and

system performance. While the LM4889 is tolerant of external

component combinations, consideration to component values

must be used to maximize overall system quality.

The LM4889 is unity-gain stable which gives the designer

maximum system flexibility. The LM4889 should be used in

low gain configurations to minimize THD+N values, and max-

imize the signal to noise ratio. Low gain configurations require

large input signals to obtain a given output power. Input sig-

nals equal to or greater than 1 Vrms are available from

sources such as audio codecs. Please refer to the section,

Audio Power Amplifier Design, for a more complete expla-

nation of proper gain selection.

Besides gain, one of the major considerations is the closed-

loop bandwidth of the amplifier. To a large extent, the band-

width is dictated by the choice of external components shown

in Figure 1. The input coupling capacitor, Ci, forms a first order

high pass filter which limits low frequency response. This val-

ue should be chosen based on needed frequency response

for a few reasons.

SELECTION OF INPUT CAPACITOR SIZE

Large input capacitors are both expensive and space hungry

for portable designs. Clearly, a certain sized capacitor is

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LM4889

needed to couple in low frequencies without severe attenua-

tion. But in many cases the speakers used in portable sys-

tems, whether internal or external, have little ability to

reproduce signals below 100 Hz to 150 Hz. Thus, using a

large input capacitor may not increase actual system perfor-

mance.

In addition to system cost and size, click and pop performance

is effected by the size of the input coupling capacitor, Ci. A

larger input coupling capacitor requires more charge to reach

its quiescent DC voltage (nominally 1/2 VDD). This charge

comes from the output via the feedback and is apt to create

pops upon device enable. Thus, by minimizing the capacitor

size based on necessary low frequency response, turn-on

pops can be minimized.

Besides minimizing the input capacitor size, careful consid-

eration should be paid to the bypass capacitor value. Bypass

capacitor, CB, is the most critical component to minimize turn-

on pops since it determines how fast the LM4889 turns on.

The slower the LM4889's outputs ramp to their quiescent DC

voltage (nominally 1/2 VDD), the smaller the turn-on pop.

Choosing CB equal to 1.0 µF along with a small value of Ci (in

the range of 0.1 µF to 0.39 µF), should produce a virtually

clickless and popless shutdown function. While the device will

function properly, (no oscillations or motorboating), with CB

equal to 0.1 µF, the device will be much more susceptible to

turn-on clicks and pops. Thus, a value of CB equal to 1.0 µF

is recommended in all but the most cost sensitive designs.

AUDIO POWER AMPLIFIER DESIGN

A 1W/8Ω Audio Amplifier

Given:

Power Output 1 Wrms

Load Impedance 8Ω

Input Level 1 Vrms

Input Impedance 20 kΩ

Bandwidth 100 Hz–20 kHz ± 0.25 dB

A designer must first determine the minimum supply rail to

obtain the specified output power. By extrapolating from the

Output Power vs Supply Voltage graphs in the Typical Per-

formance Characteristics section, the supply rail can be

easily found. A second way to determine the minimum supply

rail is to calculate the required Vopeak using Equation 2 and

add the output voltage. Using this method, the minimum sup-

ply voltage would be (Vopeak + (VODTOP + VODBOT)), where

VODBOT and VODTOP are extrapolated from the Dropout Voltage

vs Supply Voltage curve in the Typical Performance Char-

acteristics section.

(2)

5V is a standard voltage in most applications, it is chosen for

the supply rail. Extra supply voltage creates headroom that

allows the LM4889 to reproduce peaks in excess of 1W with-

out producing audible distortion. At this time, the designer

must make sure that the power supply choice along with the

output impedance does not violate the conditions explained

in the Power Dissipation section.

Once the power dissipation equations have been addressed,

the required differential gain can be determined from Equa-

tion 3.

(3)

Rf/Ri = AVD/2

From Equation 3, the minimum AVD is 2.83; use AVD = 3.

Since the desired input impedance was 20 kΩ, and with a

AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results in an

allocation of Ri = 20 kΩ and Rf = 30 kΩ. The final design step

is to address the bandwidth requirements which must be stat-

ed as a pair of −3 dB frequency points. Five times away from

a −3 dB point is 0.17 dB down from passband response which

is better than the required ±0.25 dB specified.

fL = 100 Hz/5 = 20 Hz

fH = 20 kHz * 5 = 100 kHz

As stated in the External Components section, Ri in con-

junction with Ci create a highpass filter.

Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF

The high frequency pole is determined by the product of the

desired frequency pole, fH, and the differential gain, AVD. With

a AVD = 3 and fH = 100 kHz, the resulting GBWP = 300kHz

which is much smaller than the LM4889 GBWP of 2.5MHz.

This calculation shows that if a designer has a need to design

an amplifier with a higher differential gain, the LM4889 can

still be used without running into bandwidth limitations.

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LM4889

20035824

FIGURE 2. Higher Gain Audio Amplifier

The LM4889 is unity-gain stable and requires no external

components besides gain-setting resistors, an input coupling

capacitor, and proper supply bypassing in the typical appli-

cation. However, if a closed-loop differential gain of greater

than 10 is required, a feedback capacitor (C4) may be needed

as shown in Figure 2 to bandwidth limit the amplifier. This

feedback capacitor creates a low pass filter that eliminates

possible high frequency oscillations. Care should be taken

when calculating the -3dB frequency in that an incorrect com-

bination of R3 and C4 will cause rolloff before 20kHz. A typical

combination of feedback resistor and capacitor that will not

produce audio band high frequency rolloff is R3 = 20kΩ and

C4 = 25pf. These components result in a -3dB point of ap-

proximately 320kHz.

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LM4889

20035829

FIGURE 3. Differential Amplifier Configuration for LM4889

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LM4889

20035880

FIGURE 4. Reference Design Board and Layout - micro SMD

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LM4889

LM4889 micro SMD DEMO BOARD ARTWORK

Composite View

20035886

Silk Screen

20035881

Top Layer

20035882

Bottom Layer

20035883

Inner Layer Ground

20035885

Inner Layer VDD

20035884

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LM4889

REFERENCE DESIGN BOARD AND PCB LAYOUT

GUIDELINES - MSOP & SO BOARDS

20035868

FIGURE 5. Reference Design Board

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LM4889

LM4889 SO DEMO BOARD ARTWORK

Silk Screen

20035876

Top Layer

20035863

Bottom Layer

20035864

LM4889 MSOP DEMO BOARD ARTWORK

Silk Screen

20035877

Top Layer

20035866

Bottom Layer

20035867

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LM4889

Physical Dimensions inches (millimeters) unless otherwise noted

8-Bump micro SMD

Order Number LM4889ITL, LM4889ITLX

NS Package Number TLA08AAA

X1 = 1.514±0.03 X2 = 1.514±0.03 X3 = 0.600±0.075

MSOP

Order Number LM4889MM

NS Package Number MUA08A

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LM4889

LLP

Order Number LM4889LD

NS Package Number LDA10B

Order Number LM4889MA

NS Package Number M08A

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LM4889

Notes

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LM4889

Notes

LM4889 1 Watt Audio Power Amplifier

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