Qualification Test Report MINI USB CONNECTOR SERIES 1. 501-57070 19-Aug-2005 Rev B INTRODUCTION 1.1. Purpose Testing was performed on the MINI USB CONNECTOR SERIES connector to determine its conformance to the requirements of Product Specification 108-57062 Rev B. 1.2. Scope This report covers the electrical, mechanical, and environmental performance of MINI USB CONNECTOR SERIES manufactured by the Global Personal Computer Division. 1.3. Conclusion MINI USB CONNECTOR SERIES connector meets the electrical, mechanical, and environmental performance requirements of Product Specification 108-57062 Rev B. 1.4. Product Description MINI USB CONNECTOR SERIES connector is designed for printed circuit board applications. The contacts are copper alloy, gold plated on the contact interface and Tin-plating on the soldertail, Nickel underplated all over. The housing material is glass filled insulating polymer, UL94V-0.The shell material is Copper Alloy. Nickel plated over Cu underplated all over. 1.5. Test Samples The test samples were randomly selected from normal current production lots, and the following part numbers were used for test: Test Group Quantity Description A, B, C, D, E 5 ea. MINI USB CONNECTOR SERIES DR Oblic Hu DATE 25-Aug-05 APVD Wei-Jer Ke DATE 25-Aug-05 P-05-000108 TYCO Holdings (Bermuda) VII LTD. Taiwan Branch 3F, No. 45, Dongsing Road, Taipei,11070, Taiwan. ROC. TEL : 886-2-8768-2788 . This specification is a controlled document. 1 of 3 LOC DW 501-57070 1.6. Qualification Test Sequence Test or Examination Examination of product Low Level Contact Resistance Insulation Resistance Dielectric Withstanding Voltage Contact Capacitance Contact Current Rating Random Vibration Physical Shock Durability Connector Mating Force Connector Unmating Force Thermal Shock Humidity Temperature Life Solderability Resistance to Soldering Heat Test Group (a) A B C D Test Sequence (b) 1,11 1,5 1,7 1,4 3,8 2,4 3 4 2 2 6 7 5 2,10 4,9 5 6 3 3 E 1,3 2 Figure 1. NOTE: (a) The numbers indicate sequence in which tests were performed. Rev B 2 of 3 501-57070 2. TEST RESULT GP A B C TEST Max. DATA Min. Mean Contact Mating force 3.57Kgf Max. 2.51 2.24 2.41 0.27 Low Level Contact Resistance 50 MMax 17.38 12.64 14.72 4.74 Contact Unmating force 0.71Kgf Min 2.35 1.74 1.96 0.61 Durability 5000 Cycles OK OK OK OK Random Vibration 5.35 G's OK OK OK OK Physical Shock 30G's, 11mSec OK OK OK OK Low Level Contact Resistance 50mMax. 17.46 11.38 15.10 6.08 Contact Unmating force 0.31Kgf Min 1.44 0.93 1.21 0.51 Contact Mating force 3.57Kgf Max. 1.84 1.45 1.58 0.39 Appearance No physical damage OK OK OK -- Low Level Contact Resistance 50mMax. 16.81 12.45 14.25 4.36 Temperature Life 85 for 250hours OK OK OK OK Low Level Contact Resistance 50mMax. 16.43 13.87 14.74 1.79 Appearance No physical damage OK OK OK -- Contact Capacitance 2pF Max OK OK OK OK Insulation Resistance 100 MMin OK OK OK OK Dielectric Withstanding Voltage 1000V AC OK OK OK OK Thermal Shock -55 to +85 5 Cycle OK OK OK OK Humidity 40, 90-95%RH 168h. OK OK OK OK Appearance No physical damage OK OK OK -- Contact Current Rating 1.0A at 250Vac Min. OK OK OK OK 95% solder coverage. OK OK OK OK No physical damage OK OK OK -- Resistance to Reflow Soldering Heat 260+0/-5, 20~40sec. OK OK OK OK Appearance OK OK OK -- D Solderability Appearance E SPEC. No physical damage Figure 2. Rev B 3 of 3