ACCOUNT PRODUCTS SOLUTIONS SUPPORT ABOUT ALL Package : HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat leaded package 176 terminals 0.5 mm pitch 24 mm x 24 mm x 1.4 mm body 32 Bit,DUAL CORE,3M FLASH,384 RAM Operating Characteristics CART Search... SPC5746CSK1AMKU6 Buy Options ENGLISH Environmental Information Quality Information Shipping Information Buy Options SP5746CSK1AMKU6RActiveREEL-Reel 13" Q2/T3 in Drypack Distributor Min. Package Quantity: 500 Lead Time: 16 weeks 935347119528 SPC5746CSK1AMKU6ActiveTRAY-Tray, Bakeable, Multiple in Drypack Min. Package Quantity: 40 Lead Time: 16 weeks 935347119557 Sample Buy Direct Distributor Availability? Availability? Operating Characteristics Parameter Value Description 32 Bit,DUAL CORE,3M FLASH,384 RAM Environmental Information Material Declaration PbFree EU RoHS Halogen Free RHF Indicator 2nd Level Interconnect REACH SVHC Weight (mg) SP5746CSK1AMKU6R (935347119528) Yes Yes Certificate Of Analysis (CoA) Yes D e3 REACH SVHC 1868.5 SPC5746CSK1AMKU6 (935347119557) Yes Yes Certificate Of Analysis (CoA) Yes D e3 REACH SVHC 1868.5 Quality Information Material Declaration Safe Assure Functional Safety Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C) Maximum Time at Peak Temperatures (s) Lead Free Soldering Lead Free Soldering Lead Free Soldering SP5746CSK1AMKU6R (935347119528) ISO 26262 3 260 40 SPC5746CSK1AMKU6 (935347119557) ISO 26262 3 260 40 Shipping Information Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US) SP5746CSK1AMKU6R (935347119528) 854231 5A992 SPC5746CSK1AMKU6 (935347119557) 854231 5A992 ABOUT NXP RESOURCES Investors Mobile Apps Press, News, Blogs Contact Us Careers Privacy | Terms of Use | Terms of Sale | Feedback FOLLOW US News 12 Dec 2017 NXP and Alibaba Cloud Announce Strategic Partnership for Edge Computing and IoT Security Read More (c)2006-2017 NXP Semiconductors. All rights reserved.