REVISIONS LTR DESCRIPTION DATE (yr-mo-pa) | APPROVED REV SHEET REV SHEET REV STATUS REV OF SHEETS sHeer fi |2 7314 5/6 [7 [8 | 9 10711 | 1213 p14 PMIC WA PREPARED BY A, DEFENSE ELECTRONICS SUPPLY CENTER & DAYTON, OHIO 45444 STANDARDIZED MILITARY MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X DRAWING 8 BIT, ONE TIME PROGRAMMABLE PROM, Z MONOLITHIC SILICON THIS DRAWING IS AVAILABLE rf y ae SIZE CAGE FOR USE BY ALL DEPARTMENTS CODE AND AGENCIES OF THE 26 APRIL 1989 A 67268 5962-88734 DEPARTMENT OF DEFENSE REVISION LEVEL AMSC NIA SHEET 1 OF 14 DESC FORM 193 4 U.S, GOVERNMENT PRINTING OFFICE: 1987 748-129/60911 5962-1054 DISTRIBUTION STATEMENT A. Approved for public release; distribution is untimited.1. SCOPE 1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". 1.2 Part number. The complete part number shall be as shown in the following example: 5962-88734 01 J X | TT TT 1 | | | | | | i | | i I Drawing number Device type Case outTine Lead finish per (1.2.1) (1.2.2) MIL-M-38510 1.2.1 Device types. The device types shall identify the circuit function as follows: Device type Generic number Circuit function Access time 01 See 6.4 2K x 8-bit PROM 55 ns 02 See 6.4 2K x 8-bit PROM 45 ns 03 See 6.4 2K x 8-bit PROM 35 ns 04 See 6.4 2K x 8-bit PROM 25 ns 1.2.2 Case outlines. The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline J D-3 (24-lead, 1.290" x 0.610" x 0.225"), dual-in-line package K F-6 (24-lead, 0.640" x 0.420" x 0.090"), flat package L D-9 (24-lead, 1.280" x 0.310" x 0.200"), dual-in-line package 3 C-4 (28-terminal, 0.460" x 0.460" x 0.100"), square leadless chip carrier package 1.3 Absolute maximum ratings. Supply voltage (Vcc) - - - - ------+--+---- *4.5 V de to +5.5 V de Storage temperature range - ------+------- -65 C to +150 C Voltages on any pin with respect to ground - - - - - -0.6 V de to +7.0 V de Vpp with respect to ground ------------- -0.6 V dc to +13.0 V dc Power dissipation (Py) ------+--+-+-+------ 550 mW 1/ Lead temperature (soldering, 10 seconds) - - - - - - +300C ~ Thermal resistance, junction-to-case (Ojc) - - - - - See MIL-M-38510, appendix C 1.4 Recommended operating conditions. Case operating temperature range (Tc) - - - - - - - -55C to +125C 1/ Must withstand the added Pp due to short-circuit test; e.g., Igs. STANDARDIZED size MILITARY DRAWING A _ DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET 2 DAYTON, OHIO 45444 DESC FORM 193A SEP 87 * U. 8. GOVERNMENT PRINTING OFFICE: 1988--549-9042. APPLICABLE DOCUMENTS ] 2.1 Government specification and standard. Unless otherwise specified, the following specification and standard, of the Issue listed in that {ssue of the Department of Defense Index of } Specifications. and Standards specified in the solicitation, form a part of this drawing to the | extent specified herein. SPECIFICATION MILITARY MIL-M-38510 - Microcircuits, General Specification for. STANDARD MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. (Copies of the specification and standard required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of IL-STD-883, Provistons for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as spectfted tm MIL-W-38510 and herein. 3.2.1 Terminal connections, The terminal connections shall be as specified on figure 1, 3.2.2 Truth tables. The truth tables shall be as specified on figure 2. 3.2.2.1 Unprogrammed or erased devices. The truth table for unprogrammed devices for contracts involving no altered Ttem drawing shall be specified on figure 2 as applicable. When required in group A, B, or C (see 4.3), the devices shall be programmed by the manufacturer prior to test in a checkerboard pattern or equivalent with (a minimum of 50 percent of the total number of gates programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of gates programmed. 3.2.2.2 Programmed devices. The truth tables for programmed devices shall be as specified by an attached altere mM drawing. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. STANDARDIZED SIZE MILITARY DRAWING A 5962-88734 DEFENSE ELECTRONICS SUPPLY CENTER REVIGION LEVEL SHEET DAYTON, OHIO 45444 3 DESC FORM 193A SEP 87 % U. &. GOVERNMENT PRINTING OFFICE: 19985S49-904 ' | i } ' ; !TABLE I. Electrical performance characteristics. | | I ] I | Test [Symbol | , conditions | |Group A [Devicel Limits | Unit | I -55C < Te +125 C |subgroups| type | | 4.5 V de < Voc < 5.5 V de i | ! Min | Max | | | unless otherwise specified | I | | I | l 1 | | | 1 Input low voltage iWin Weg = 4.5 V and 5.5 $1, 2, 31 Atl 1-0.51}0.81 | | | | Li | I | | | | | | | ] I ] T T i I Input high voltage IH Vcc = 4.5 V and 5.5 V ! 1, 2, 3 ! All | 2.0 Nec V +0.5 | | | I | 1 Vil | | | | | i | T I I I I | I Output Tow voltage 2/ Vo. lIg_ = 16 mA, Vec = 4.5 11,2,3]al | 10.45 | V | IVy_ = 0.8 V, Vry = 2.0 | I | i | { | | | | | { 2/ F 4m, V, 4.5 1, 2, 3 All 2.4 V Output high voltage Vou H=- > Yeo = 4. > 2; . 4 9 ~ | 9 Iver = 0.8 V, Vy = 2.0 V | | | | | | | | | | | | if I | l | | | Output short-circuit IIgs IVec = 5.5 V f1, 2, 3 1] all | | 200 | mM current 1/ | \Voyr = GND | | | | | I | | | | | | T T [ ] I | T Input load current 3/ Mu WIN = 5.5 V and GND | 1, 2, 3 ! All ! +10 uA | T | | Output leakage Lo Vout = 5.5 V and GND ! 1, 2,3 ! All ! ! #10 ! nA I T | ] I I T Operating active IIlec (TS, = Vin Ver = 5.5 V | 1, 2,3 1Aall [ | 120 | mA current 4/ | 109 to 07 = O mA | | | | | | ICSo = CS3 = Vry | | | | | | | f = 1/tacc | | | | | ! | | | | | | T 1 | ] T | Input capacitance {IN ININ = 0 V, see 4.3.1c ! 4 Al 6 | pF i ] I | | T l ] Output capacitance !Cout {Your = 0 V, see 4.3.1c ! 4 All | [| 12] pF | | q I | ol | 1 55 ns Address to output delay Itacc [0S; = Vir 19, 10, 117 027 . 45 1 fs 5/ | [CS2 = CS3 = Vay | Tos TT 357 ns_ | l | Tos TT 28 TT ais See footnotes at end of table. STANDARDIZED a MILITARY DRAWING 5962-88734 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 4 DESC FORM 193A SEP 87 U. S. GOVERNMENT PRINTING OFFICE: 1988549-904TABLE 1. Electrical performance characteristics - Continued. Test Symbo} Conditions -55C < Te < +125 C I I ] |Group A |Devicel |subgroups| type I T Limits | Unit T I | | ! | = oT | ] | T | | | Address to output hold [toy |CS, = Voy }9, 10, 11) Al] | Oo | | ns 1/ 5/ | lesz = C53 = Vip | | | | to system and/or tester noise. See figures 3 and 4. May not be tested, but shall be guaranteed to the limits specified in table I. These are absolute voltages with respect to device ground pin and include all over shoots due Do not attempt to test these values without suitable equipment. Output shall be loaded in accordance with figure 4. Worst case of output control signal lines US;, CS, or CS3. The addresses, (Ag-Ajg pins), are toggling between Vy, and Vyy. STANDARDIZED SIZE MILITARY DRAWING A 5962-88734 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 5 DESC FORM 193A SEP 87 %& U. 8, GOVERNMENT PRINTING OFFICE: 1988-549-904T T [Device ! 01 through 04 ! |types I | I l [Case lJ, K, LIL 3 | loutlines | | | | [+ {Terminal {Terminal symbol! number I | | i { ] [ | 1 [Ay }nc | 1 2 JAG | A7 | | 3 JAs | Ag | ) 4 |Ag | As | on) |A3 | Ag | 1 6 [Ag | A3 i | 7 |Ay f Ap | is eta Pe 11 0 0 | 12 |eho Io, | ! 13 103 ! 05 ! ! 14 104 GND | 16 (96 03 20 (CS1/Vpp|07 | Fr 21 jA10 { NC | ! 24 WWec \S1/pP | 25 -- Ao Or | p 7 Mee FIGURE 1. Terminal connections. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-88734 REVISION LEVEL SHEET 6 DESC FORM 193A SEP 87 FT U.S. GOVERNMENT PRINTING OFFICE: 1987548-096Truth table A DAYTON, OHIO 45444 I I TJ i CS1/VPP s2'es3i1/0 Pins| | | | [Programs VPP c Cc [Pata in f i] I |Read IVIL |VIMIVIH |Data out | | T i a { Deselect |VIH X | X |High - 2| T Deselect xX VIL[ X [High - Z Deselect X ivi High - Z FIGURE 2. Truth tables. STANDARDIZED A 5962-88734 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DESC FORM 193A SEP 87 U.S. GOVERNMENT PRINTING OFFICE: 1987549-096Truth table B Intelligent program 1/ Vite lV HP VPP Data in TT | Pin functions T I ] ] T T | |Read or output disable Ics3 Ics2 CS, |Outputs | Tl ! Mode! Other IPGH IVEY Vpp [Outputs TO { | ! Read 1/ Vin Vin Win [Data out ! T I | |! Output disable 1/, 2/ 1X |X Wry tHigh - Z T | Output disable 1/, 2/ X Wy | X [High - Z T | Output disable 1/, 2/ Vit | X X [High - Z r ! Program 1/ VitplVinp!Vpp [Data in r | Program verify 1/ WWrnP|ViLp|pp {Data out | T | | | | l ! Program inhibit 1/ | THP Vinp!Vpp High - Z ! T [ I | | | | | 1 NOTES: 1. During programming and verification, all unspecified pins to be at Viip. 2, X = Don't care but not to exceed Vcc plus 5%. 3. Vpp = 13.5 V #0.5 V; Vy_p = 0.4 V maximum; Vyyp = 3.0 V minimum. DAYTON, OHIO 45444 FIGURE 2. Truth tables - Continued. STANDARDIZED Size sos-aayn MILITARY DRAWING A " DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET 8 DESC FORM 193A SEP 87 tr U.S. GOVERNMENT PRINTING OFFICE: 1987549-096ADDRESSES aay VALIO aay = taco CoH 1 2.4 Vv Xe 4V CSea CS3 0.8 Vv k 0./8 V Jf e4 V 2.4 VS OUTPUTS VALID XA Laas v.45 FIGURE 3. AC read timing diagram. he Ene - High impedance test systems only. 98.2 2.01 V DUT 30 pF (INCLUDING SCOPE AND JIG CAPACITANCE) tor is tested with C; = 5 pF. 1 FIGURE 4, Output load. STANDARDIZED SIZE 5962-88734 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 DESC FORM 193A SEP 87 YY U.S. GOVERNMENT PRINTING OFFICE: 1987 -549-0963.4 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the part number listed in 1.2 herein. In addition, the manufacturer's part number may also be marked as listed in 6.4 herein. 3.5 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the manutacturer or the user to result in a wide variety of PROM configurations, two processing options. are provided for selection in the contract, using an altered item drawing. 3.5.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1. It Ts recommended that users perform subgroups 7 and 9 after programming to verify specific program configuration. 3.5.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in 6.4. The certificate of compliance submitted to DESC-ECS prior to listing as an approved source of supply shall state that the manufacturer's product meets the requirements of MIL-STD-883 (see 3.1 herein) and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DESC-ECS shall be required in accordance with MIL-STD-883 (see 3.1 herein). 3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4, QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section of AYL-MCSESTO to the extent specified in MIL-STD-883 (see 3.1 herein). 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883 . (1) Test condition D or E using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) Ta = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 fncTuding groups A, B, C, and D inspections. The following additional criteria shall apply. STANDARDIZED SIZE MILITARY DRAWING A 5962-88734 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 10 DESC FORM 193A E p 87 U. 8. GOVERNMENT PRINTING OFFICE: 1968540-904_~ 4.3.1 Group A_ inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (Czy and Coyt measurements) shall be measured only for the initial test and after process or design changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested. d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups 9, 10 and 11. (1) A sample shall be selected to satisfy programmability requirements prior to performing subgroup 9. Twelve devices shall be submitted to programming (see 3.2.2.1). If more than two devices fail to program, the lot shall be rejected. At the manufacturers option, the sample may be increased to 24 total devices with no more than 4 total device failures allowable. (2) Ten devices from the programuablity sample shal] be submitted to the requirements of group A, subgroups 9, 10 and 11. If more than two devices fail, the lot shall be rejected. At the manufacturers option, the sample may be increased to 20 total devices with no more than 4 total device failures allowable. e. Subgroups 7 and 8 shall verify the truth table as specified on figure 2. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition D or E using the circuit submitted with the certificate of compliance (see 3.6 herein). (2) Ta = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by methoa 1005 of MIL-STD-883. 4.4 Programming procedures. The programming procedures shal] be as specified by the device manufacturer. 4.5 Electrostatic discharge sensitvity (ESDS). Electrostatic discharge sensitivity (ESDS) testing shall be performed Tn accordance with MIL-STD-883, method 3015 and MIL-M-38510 for intial testing and after any design or process changes which may affect input or output protection circuitry. The option to categorize devices as ESD sensitive without performing the test is not allowed. Only those device types that pass ESDS testing at 1000 volts or greater shall be considered as conforming to the requirements of this drawing. STANDARDIZED MILITARY DRAWING 5962-68734 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 rm PP Ae ' 93A tz U. . GOVERNMENT PRINTING OFFICE: 1968549-904 SEP 87TABLE II. Electrical test requirements. 1/ electrical parameters (method 5005) | T Subgroups ] | MIL-STD-883 test requirements ! (per method | | 5005, table 1) 2 as | Interim electrical parameters | --- | {method 5004) | T I | Final electrical test parameters { 1*,2,3,7*,8 { | (method 5004) for unprogrammed | | | devices | | T | I | Final electrical test parameters [ 1*,2,3,7*,8,9 | | (method 5004) for programmed devices | | T | Ty | Group A test requirements 11,2,3,4**,7, | | (method 5005) { 8,9,10,11 | | I I | Groups C and D end-point | 2,3,7,8 | | | * PDA applies to subgroups 1 and 7. ** See 4.3.1c. Any subgroups at the same temperature may be combined when using a multifunction tester. | ~ 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-M-38510. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for O&M application. When a military specification exists and the product covered by this drawing has been qualified for listing on QPL-38510, the device specified herein will be inactivated and will not be used for new design. The QPL-38510 product shall be the preferred item for all applications. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Comments. Comments on this drawing should be directed to DESC-ECS, Dayton, Ohio 45444, or telephone 513-296-5375. STANDARDIZED SIZE MILITARY DRAWING A 5962-88734 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 Yd DESC FORM 193A U.S. 2OVi - 1968$49- SEP 87 ERNMENT PRINTING OFFICE: 1968$49-9046.4 Approved sources of supply. sources ary be added as th F ey become available. and a certificate of compliance (see 3.6 herein) Approved sources of supply are listed herein. The vendor listed herein has agreed to this drawing has been submitted to DESC-ECS. Additional T T Vendor | Vendor | | Military drawing | CAGE | similar part | | part number | number | number 1/ | 3 | ! 5962-8873401UX | 66579 WS57C191B-55YMB ! | T I ] I | 5962-8873401KX ! 66579 | WS57C291B-55HMB ! I | T i l ! 5962-8873401LX 66579 | WS57C291B-55KMB ! | T 1 T | | 5962-88734013X | 66579 | WS57C291B-55ZMB_ | | | i | I I I I | 5962-88734020X | 66579 | WS57C1918-45YMB | | | 65786 | CY7C292A-45DMB | i | | | | 5962-8873402KX | 66579 | WS57C291B-45HMB [ | | 65786 | CY7C291A-45KMB | T I l ] | 5962-8873402LX | 66579 | WS57C291B-45KMB | | | 65786 | CY7C291A-45DMB | | | I ] | 5962-88734023X | 66579 | WS57C291B-45ZMB | | 65786 CY7C291A-45LMB | T ] | 5962-8873403KX 65786 CY7C291A-35KMB | | | 5962-8873403LX 65786 | CY7C291A-35DMB ! i | | T ] ] ] 5962-88734033X 65786 CY7C291A-35LMB | T I I 5962-8873403UX ! 65786 CY7C292A-35DMB T I I ] | 5962-8873404KX | 65786 | CY7C291A-25KMB | | en | | 5962-8873404LX | 65786 | CY7C291A-25DMB | | | | | See footnote at end of table. STANDARDIZED sae MILITARY DRAWING 5962-88734 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 13 DESC FORM 193A SEP 87 % U. S. GOVERNMENT PRINTING OFFICE: 1968--549-904| ! Vendor | Vendor | j Military drawing | CAGE | similar part | | part number ! number |! number 1/ ! | T { | | | 5962-88734043X 65786 CY7C291A-25LMB | | T I | I | 5962-8873404JX 65786 ! CY7C292A-25DMB | | 1/ Caution. Do not use this number for item acquisition. ~ Yems aquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE Vendor name Truth table number and address 66579 Waferscale Integration, Incorporated A 47280 Kato Road Fremont, CA 94538 65786 Cypress Semiconductor Corporation B 3901 North First Street San Jose, CA 95134 STANDARDIZED A MILITARY DRAWING 5962-88734 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 14 DESC FORM 193A SEP 87 012548 % U. 8. GOVERNMENT PRINTING OFFICE: 1988549-904 ae