MM01951 - MULTICORE / LOCTITE

Technical Data Sheet

C511™

October-2009

PRODUCT DESCRIPTION

C511™ provides the following product characteristics:

Technology Cored solder wire

Activity High

Product Benefits • No clean

• Clear residue

• Good wetting

• Fast soldering

• Heat stable

• Mild odor

• Pb-free and SnPb alloys available

IPC/J-STD-004

Classification

ROM1

Application Soldering - Cored wire

Surface Finishes Copper, Brass and Nickel

C511™ cored solder wire has been specially formulated to

complement no clean wave and reflow soldering processes.

TYPICAL PROPERTIES

Solder Wire - Cored Typical Properties

Alloys - Tin/lead • SN63

• SN60

• SN62

Alloys - Lead Free • 96SC (SAC387)

• 97SC (SAC305)

• 99C (SnCu)

• 95A (SnSb)

• 96S (SnAg)

Acid Value 164 to 176 mg KOH/g

Halide content 1.1%

Flux Content (%) 2.7

ALLOYS:

The alloys used in C511™ cored solder wires conform to the

purity requirements of the common national and international

standards.

FLUX:

C511™ solid flux is based on modified rosin and carefully

selected activators. In practice they exhibit a mild rosin odor

and leave a small quantity of clear residue.

DIRECTIONS FOR USE

Soldering with C511™ does not require any special methods

or deviation from standard hand soldering practices.

Soldering Iron:

● Good results can be obtained using a range of tip

temperatures. However, the optimum tip temperature and

heat capacity required for a hand-soldering process is a

function of both soldering iron design and the nature of

the task.

● Care should be exercised to avoid unnecessarily high tip

temperatures for extensive periods of time.

● A high tip temperature may increase any tendency to flux

spitting and it may produce some residue darkening.

● The tip of the soldering iron should be properly tinned.

Severely contaminated soldering iron tips should be

cleaned with Multicore® Tip Tinner/Cleaner.

● Wipe the tip on a clean, damp sponge before re-tinning

with C511™ wire.

Soldering Process:

1. Apply the soldering iron tip to the work surface. The iron

tip should contact both the base material and the lead at

the same time to heat both surfaces properly. It should

take no more than a fraction of a second to heat both

surfaces adequately.

2. Apply C511™ flux cored wire to a part of the joint surface

away from the soldering iron and allow to form a joint

fillet. This will be virtually instantaneous. Do not apply

excessive solder to the joint as this will not improve joint

integrity and it will leave excess flux residues on the

surface.

3. Remove solder from the work piece and then remove the

iron tip.

4. The total process will be very rapid, depending upon

thermal mass, tip temperature, tip configuration and the

solderability of the surfaces to be joined.

5. The resin and flux systems are designed to leave

relatively low residues and to minimize residual activity.

This is achieved by ensuring some decomposition and

volatilization takes place during the soldering process

Cleaning:

C511™ flux cored solder wire has been formulated to leave

amber flux residues and resist spitting and fuming. In most

industrial and consumer electronics applications, cleaning will

not be required. The product may, therefore, be used to

complement a no-clean wave soldering or reflow process or to

allow repairs to cleaned boards without the need for a second

cleaning process. In high-reliability applications, the residues

should be removed.

Should cleaning be required, this is best achieved using

SC-01™ cleaner.

TDS C511™, October-2009

RELIABILITY PROPERTIES

J-STD-004 Solder spread mm² 340

Corrosion Test Pass

SIR (without cleaning) IPC-SF-818 Class 3 Pass

Bellcore

TR-NWT-000078

Pass

Electromigration (without cleaning) Bellcore

TR-NWT-000078

Pass

Classification EN29454-1 1.1.2

IPC-SF-818 MR3CN

PACKAGING

C511™ is available in various diameters, flux percentages, and

reel sizes.

DATA RANGES

The data contained herein may be reported as a typical value

and/or a range. Values are based on actual test data and are

verified on a periodic basis.

GENERAL INFORMATION

For safe handling information on this product, consult the

Material Safety Data Sheet (MSDS).

Not for Product Specifications

The technical information contained herein is intended for

reference only. Please contact Henkel Corporation Technical

Service for assistance and recommendations on specifications

for this product.

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

µm / 25.4 = mil

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

Note

The data contained herein are furnished for information only

and are believed to be reliable. We cannot assume

responsibility for the results obtained by others over whose

methods we have no control. It is the user's responsibility to

determine suitability for the user's purpose of any production

methods mentioned herein and to adopt such precautions as

may be advisable for the protection of property and of persons

against any hazards that may be involved in the handling and

use thereof. In light of the foregoing, Henkel Corporation

specifically disclaims all warranties expressed or implied,

including warranties of merchantability or fitness for a

particular purpose, arising from sale or use of Henkel

Corporation’s products. Henkel Corporation specifically

disclaims any liability for consequential or incidental

damages of any kind, including lost profits. The discussion

herein of various processes or compositions is not to be

interpreted as representation that they are free from

domination of patents owned by others or as a license under

any Henkel Corporation patents that may cover such

processes or compositions. We recommend that each

prospective user test his proposed application before repetitive

use, using this data as a guide. This product may be covered

by one or more United States or foreign patents or patent

applications.

Trademark usage

Except as otherwise noted, all trademarks in this document

are trademarks of Henkel Corporation in the U.S. and

elsewhere. ® denotes a trademark registered in the U.S.

Patent and Trademark Office.

Reference 0.0

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+1 949 789 2500 +44.1442.278.000 +86.21.2891.8000

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