DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC8172TB O UT SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER DESCRIPTION The PC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is as same circuit current as conventional PC8106TB, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications. FEATURES * Recommended operating frequency : fRFout = 0.8 to 2.5 GHz * Higher IP3 : CG = 9.5 dB TYP., OIP3 = +7.5 dBm TYP. @ fRFout = 0.9 GHz : 6-pin super minimold package * Supply voltage : VCC = 2.7 to 3.3 V E- * High-density surface mounting APPLICATIONS * PCS1900M PH AS * 2.4 GHz band transmitter/receiver system (wireless LAN etc.) ORDERING INFORMATION Part Number PC8172TB-E3 Remark Package Marking 6-pin super minimold C3A Supplying Form * Embossed tape 8 mm wide. * Pin 1, 2, 3 face the tape perforation side. * Qty 3 kpcs/reel. To order evaluation samples, please contact your nearby sales office. (Part number for sample order: PC8172TB-A) Caution Electro-static sensitive devices Document No. P14729EJ2V0DS00 (2nd edition) Date Published September 2000 N CP(K) The mark shows major revised points. PC8172TB PIN CONNECTIONS 2 1 Pin Name 1 IFinput 4 4 3 2 GND 5 5 2 3 LOinput 4 PS 6 6 5 VCC 6 RFoutput O UT 3 Pin No. (Bottom View) C3A (Top View) 1 SERIES PRODUCTS (TA = +25C, VCC = VRFout = 3.0 V, ZS = ZL = 50 ) CG (dB) ICC (mA) fRFout (GHz) PC8172TB 9 0.8 to 2.5 9.5 PC8106TB 9 0.4 to 2.0 9 PC8109TB 5 0.4 to.2.0 6 PC8163TB 16.5 0.8 to 2.0 9 @RF 0.9 GHz Note @RF 1.9 GHz @RF 2.4 GHz 8.5 8.0 7 - 4 - 5.5 - E- Part Number PO(sat) (dBm) Part Number @RF 0.9 GHz +0.5 PC8106TB -2 PC8109TB -5.5 PC8163TB +0.5 OIP3 (dBm) @RF 1.9 GHz @RF 2.4 GHz 0 -0.5 -4 @RF 0.9 GHz Note @RF 1.9 GHz @RF 2.4 GHz +7.5 +6.0 +4.0 - +5.5 +2.0 - -7.5 - +1.5 -1.0 - -2 - +9.5 +6.0 - PH AS PC8172TB Note Note fRFout = 0.83 GHz @ PC8163TB Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. To know the associated product, please refer to each latest data sheet. BLOCK DIAGRAM (FOR THE PC8172TB) (Top View) LOinput PS GND VCC IFinput 2 Data Sheet P14729EJ2V0DS00 RFoutput PC8172TB SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM) Wireless Transceiver Low Noise Tr. DEMOD. VCO SW I Q O UT RX /N PLL PLL I 0 TX PA E- Phase shifter PC8172TB 90 Q PH AS To know the associated products, please refer to each latest data sheet. Data Sheet P14729EJ2V0DS00 3 PC8172TB CONTENTS 5 2. ABSOLUTE MAXIMUM RATINGS .................................................................................................. 6 O UT 1. PIN EXPLANATION .......................................................................................................................... 3. RECOMMENDED OPERATING CONDITIONS............................................................................... 6 4. ELECTRICAL CHARACTERISTICS ................................................................................................ 6 5. OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY...................................... 7 6. TEST 6.1 6.2 6.3 CIRCUIT .................................................................................................................................. 8 TEST CIRCUIT 1 (fRFout = 900 MHz).................................................................................... 8 TEST CIRCUIT 2 (fRFout = 1.9 GHz)..................................................................................... 9 TEST CIRCUIT 3 (fRFout = 2.4 GHz)..................................................................................... 10 7. TYPICAL CHARACTERISTICS........................................................................................................ 12 E- 8. PACKAGE DIMENSIONS ................................................................................................................. 24 9. NOTE ON CORRECT USE ............................................................................................................. 25 PH AS 10. RECOMMENDED SOLDERING CONDITIONS............................................................................... 25 4 Data Sheet P14729EJ2V0DS00 PC8172TB 1. PIN EXPLANATION 2 IFinput GND Applied Voltage (V) Pin Voltage (V)Note - 1.4 GND - LOinput 5 VCC 2.7 to 3.3 6 RFoutput Same bias as VCC through external inductor 2.3 4 PS VCC/GND Equivalent Circuit This pin is IF input to double balanced mixer (DBM). The input is designed as high impedance. The circuit contributes to suppress spurious signal. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. For above reason, double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track Length should be kept as short as possible to minimize ground impedance. 5 6 3 1 Local input pin. Recommendable input level is -10 to 0 dBm. - Supply voltage pin. - This pin is RF output from DBM. This pin is designed as open collector. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. PH AS 3 - Function and Explanation O UT 1 Pin Name E- Pin No. - Power save control pin. Bias controls operation as follows. Pin bias 2 VCC 5 Control 4 VCC Operation GND Power Save GND 2 Note Each pin voltage is measured with VCC = VPS = VRFout = 3.0 V. Data Sheet P14729EJ2V0DS00 5 PC8172TB 2. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Rating Unit VCC TA = +25C 3.6 V PS pin Input Voltage VPS TA = +25C 3.6 V Power Dissipation of Package PD Mounted on double-side copperclad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C) 270 mW Operating Ambient Temperature TA Storage Temperature Tstg Input Power Pin O UT Supply Voltage -40 to +85 C -55 to +150 C +10 dBm 3. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Supply Voltage VCC Operating Ambient Temperature TA RF Output Frequency IF Input Frequency MIN. TYP. MAX. Unit The same voltage should be applied to pin 5 and 6 2.7 3.0 3.3 V -40 +25 +85 C PLOin ZS = 50 (without matching) -10 -5 0 dBm fRFout With external matching circuit 0.8 - 2.5 GHz 50 - 400 MHz E- Local Input Level Test Conditions fIFin 4. ELECTRICAL CHARACTERISTICS PH AS (TA = +25C, VCC = VRFout = 3.0 V, fIFin = 240 MHz, PLOin = -5 dBm, and VPS 2.7 V unless otherwise specified) Parameter Symbol Circuit Current Test Conditions Note TYP. MAX. Unit ICC No Signal 5.5 9.0 13 mA Circuit Current In Power Save Mode ICC(PS) VPS = 0 V - - 2 A Conversion Gain CG1 fRFout = 0.9 GHz, PIFin = -30 dBm 6.5 9.5 12.5 dB CG2 fRFout = 1.9 GHz, PIFin = -30 dBm 5.5 8.5 11.5 dB CG3 fRFout = 2.4 GHz, PIFin = -30 dBm 5 8.0 11.0 dB Saturated RF Output Power PO(sat)1 fRFout = 0.9 GHz, PIFin = 0 dBm -2.5 +0.5 - dBm PO(sat)2 fRFout = 1.9 GHz, PIFin = 0 dBm -3.5 0 - dBm PO(sat)3 fRFout = 2.4 GHz, PIFin = 0 dBm -4 -0.5 - dBm Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz 6 MIN. Data Sheet P14729EJ2V0DS00 PC8172TB 5. OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25C, VCC = VRFout = 3.0 V, PLOin = -5 dBm, and VPS 2.7 V unless otherwise specified) Output Third-Order Distortion Intercept Point Input Third-Order Distortion Intercept Point SSB Noise Figure Power Save Response Time Test Conditions Symbol OIP31 Note fRFout = 0.9 GHz OIP32 fRFout = 1.9 GHz OIP33 fRFout = 2.4 GHz IIP31 fRFout = 0.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz Data Unit +7.5 dBm +6.0 dBm O UT Parameter fIFin1 = 240 MHz fIFin2 = 241 MHz +4.0 dBm -2.0 dBm -2.5 dBm IIP32 fRFout = 1.9 GHz IIP33 fRFout = 2.4 GHz -4.0 dBm SSB*NF1 fRFout = 0.9 GHz, fIFin = 240 MHz 9.5 dB SSB*NF2 fRFout = 1.9 GHz, fIFin = 240 MHz 10.4 dB SSB*NF3 fRFout = 2.4 GHz, fIFin = 240 MHz 10.6 dB Rise time TPS(rise) VPS: GND VCC 1 s Fall time TPS(fall) VPS: VCC GND 1.5 s Note fRFout < fLOin @ fRFout = 0.9 GHz PH AS E- fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz Data Sheet P14729EJ2V0DS00 7 PC8172TB 6. TEST CIRCUIT 6.1 TEST CIRCUIT 1 (fRFout = 900 MHz) Strip Line Spectrum Analyzer C3 C8 L O UT 6 50 Signal Generator 100 pF 100 pF 1 pF RFoutput IFinput 1 50 C1 10 nH 5 GND VCC 2 Signal Generator 100 pF 1 000 pF VCC C5 4 C7 C4 C6 PS LOinput 3 50 C2 1 000 pF 1 F 68 pF 1 F VCC GND IFinput PS bias C4 C2 PH AS LOinput E- EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD PS C5 C7 C6 L Voltage Supply C 8 C3 C1 RFoutput PC8172TB COMPONENT LIST Form Chip capacitor Chip inductor Symbol Value (1) 35 x 42 x 0.4 mm polyimide board, double-sided copper clad C1, C2, C3 100 pF (2) Ground pattern on rear of the board C4 1 000 pF C5, C6 1 F C7 68 pF C8 1 pF L 10 nH (3) Solder plated patterns (4) : Through holes Note Note 10 nH: LL1608-FH10N (TOKO Co., Ltd.) 8 Data Sheet P14729EJ2V0DS00 PC8172TB 6.2 TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer 2.75 pF C8 6 L RFoutput IFinput 1 50 C1 470 nH GND O UT 50 Signal Generator 100 pF 100 pF C3 5 VCC 2 Signal Generator 100 pF 1 000 pF 4 PS LOinput 3 50 C2 VCC C5 C7 C6 C4 1 000 pF 1 F 30 pF 1 F EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD C4 C2 GND L PH AS IFinput PS bias E- LOinput VCC PS C5 C7 C6 Voltage Supply C3 C1 C8 RFoutput PC8172TB COMPONENT LIST Form Chip capacitor Symbol Value (1) 35 x 42 x 0.4 mm polyimide board, double-sided copper clad C1, C2, C3 100 pF (2) Ground pattern on rear of the board C4 1 000 pF C5, C6 1 F C7 30 pF C8 Chip inductor L (3) Solder plated patterns (4) : Through holes 2.75 pF Note 470 nH Note 470 nH: LL2012-FR47 (TOKO Co., Ltd.) Data Sheet P14729EJ2V0DS00 9 PC8172TB 6.3 TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line 50 1.75 pF Signal Generator 100 pF 100 pF C3 RFoutput IFinput 6 L C8 1 50 C1 470 nH O UT Spectrum Analyzer 5 GND VCC 2 Signal Generator 100 pF 1 000 pF 4 PS LOinput 3 50 C2 VCC C5 C7 C6 C4 1 000 pF 1 F 10 pF 1 F EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD C4 C2 L PH AS GND E- LOinput IFinput VCC PS bias PS C5 C7 C6 Voltage Supply C1 C8 C3 RFoutput PC8172TB COMPONENT LIST Form Chip capacitor Chip inductor Symbol Value (1) 35 x 42 x 0.4 mm polyimide board, double-sided copper clad C1, C2, C3 100 pF (2) Ground pattern on rear of the board C4 1 000 pF C5, C6 1 F C7 10 pF C8 1.75 pF L (3) Solder plated patterns (4) : Through holes Note 470 nH Note 470 nH: LL2012-FR47 (TOKO Co., Ltd.) 10 Data Sheet P14729EJ2V0DS00 PC8172TB Caution The test circuits and board pattern on data sheet are for performance evaluation use only (They are not recommended circuits). In the case of actual design-in, matching circuit should be de- PH AS E- O UT termined using S-parameter of desired frequency in accordance to actual mounting pattern. Data Sheet P14729EJ2V0DS00 11 PC8172TB 7. TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C, VCC = VRFout) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 12 12 10 10 TA = +85C 8 6 TA = +25C 4 TA = -40C 2 0 1 2 3 4 Supply Voltage VCC (V) 6 4 no signal VCC = VPS 0 -40 -20 8 6 PH AS 4 2 VCC = 3.0 V 0 0 1 2 3 4 PS Pin Input Voltage VPS (V) PS PIN CONTROL RESPONSE TIME REF LVL = 0 dBm ATT = 10 dB 10 dB/DIV (Vertical axis) CENTER = 0.9 GHz SPAN = 0 Hz RBW = 3 MHz VBW = 3 MHz SWP = 50 sec 5 sec/DIV (Horizontal axis) 12 0 E- 10 VCC = 3.0 V VCC = 2.7 V 20 40 60 Operating Ambient Temperature TA (C) CIRCUIT CURRENT vs. PS PIN INPUT VOLTAGE 12 Circuit Current ICC (mA) 8 2 no signal VCC = VPS 0 O UT Circuit Current ICC (mA) Circuit Current ICC (mA) VCC = 3.3 V Data Sheet P14729EJ2V0DS00 80 PC8172TB S-PARAMETERS FOR EACH PORT (VCC = VPS = VRFout = 3.0 V) (The parameters are monitored at DUT pins) LO port RF port (without matching) Z S22 REF 1.0 Units 200.0 mUnits/ 1 71.5 -240.34 hp MARKER 1 1.15 GHz O UT Z S11 REF 1.0 Units 200.0 mUnits/ 1 21.625 -91.148 hp MARKER 1 900.0 MHz MARKER 2 1.65 GHz MARKER 2 1.9 GHz MARKER 3 2.15 GHz MARKER 3 2.5 GHz 1 1 3 3 2 IF port 0.400000000 GHz 2.500000000 GHz PH AS Z S11 REF 1.0 Units 200.0 mUnits/ 1 332.63 -601.34 hp START STOP E- START 0.400000000 GHz STOP 2.500000000 GHz 2 MARKER 1 240.0 MHz 1 START STOP 0.100000000 GHz 1.000000000 GHz Data Sheet P14729EJ2V0DS00 13 PC8172TB S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3.0 V) -ON EVALUATION BOARD- - (S22 data are monitored at RF connector on board) 1.9 GHz (matched in test circuit 2) S22 Z REF 1.0 Units 200.0 mUnits/ 1 55.615 2.2849 hp C MARKER 1 900.0 MHz D S22 Z REF 1.0 Units 200.0 mUnits/ 1 38.584 -2.2656 hp C MARKER 1 1.9 GHz D 1 O UT 900 MHz (matched in test circuit 1) 1 START STOP log MAG. S22 REF 0.0 dB 10.0 dB/ 1 -18.196 dB hp PH AS log MAG. S22 REF 0.0 dB 10.0 dB/ 1 -24.754 dB hp C 1.400000000 GHz 2.400000000 GHz E- START 0.400000000 GHz STOP 1.400000000 GHz C MARKER 1 900.0 MHz D MARKER 1 1.9 GHz D 1 1 1 START STOP 14 0.400000000 GHz 1.400000000 GHz Data Sheet P14729EJ2V0DS00 START STOP 1.400000000 GHz 2.400000000 GHz PC8172TB S-PARAMETERS FOR MATCHED RF OUTPUT (VCC = VPS = VRFout = 3.0 V) -ON EVALUATION BOARD- - (S22 data are monitored at RF connector on board) 2.4 GHz (matched in test circuit 3) O UT S22 Z REF 1.0 Units 200.0 mUnits/ 1 47.975 -7.1113 hp C MARKER 1 2.4 GHz D 1 E- START 1.900000000 GHz STOP 2.900000000 GHz PH AS log MAG. S22 REF 0.0 dB 10.0 dB/ 1 -22.326 dB hp C MARKER 1 2.4 GHz D 1 1 START 1.900000000 GHz STOP 2.900000000 GHz Data Sheet P14729EJ2V0DS00 15 PC8172TB CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 15 5 VCC = 3.3 V VCC = 2.7 V 0 -5 fRFout = 900 MHz fLOin = 1 140 MHz PIFin = -30 dBm VCC = VPS -10 -15 -30 -25 -20 -15 -10 -5 0 5 10 Local Input Level PLOin (dBm) VCC = 3.0 V -5 CONVERSION GAIN vs. LOCAL INPUT LEVEL -10 -15 fRFout = 900 MHz fLOin = 1 140 MHz PLOin = -5 dBm VCC = VPS -20 -25 -30 -25 -20 -15 -10 -5 0 5 10 RF OUTPUT LEVEL vs. IF INPUT LEVEL 5 10 TA = -40C TA = +85C 0 TA = +25C -5 fRFout = 900 MHz fLOin = 1 140 MHz PIFin = -30 dBm VCC = VPS = 3.0 V PH AS -10 -25 -20 -15 -10 0 -5 TA = -40C E- 5 -15 -30 -5 0 5 10 TA = +85C -10 -15 fRFout = 900 MHz fLOin = 1 140 MHz PLOin = -5 dBm VCC = VPS = 3.0 V TA = +25C -20 -25 -30 Local Input Level PLOin (dBm) 16 VCC = 2.7 V IF Input Level PIFin (dBm) 15 Conversion Gain CG (dB) 0 O UT VCC = 3.0 V 5 RF Output Level PRFout (dBm) 10 RF Output Level PRFout (dBm) Conversion Gain CG (dB) VCC = 3.3 V Data Sheet P14729EJ2V0DS00 -25 -20 -15 -10 -5 0 IF Input Level PIFin (dBm) 5 10 PC8172TB CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 15 5 VCC = 3.3 V 10 VCC = 3.0 V 5 VCC = 2.7 V -5 -10 -15 -30 -25 -20 -15 -10 0 VCC = 3.0 V -5 fRFout = 1.9 GHz fLOin = 1 660 MHz PIFin = -30 dBm VCC = VPS -5 0 5 10 Local Input Level PLOin (dBm) -10 -15 fRFout = 1.9 GHz fLOin = 1 660 MHz PLOin = -5 dBm VCC = VPS -20 -25 -30 -25 -20 -15 -10 -5 0 5 10 IF Input Level PIFin (dBm) CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 TA = +25C -5 TA = +85C fRFout = 1.9 GHz fLOin = 1 660 MHz PIFin = -30 dBm VCC = VPS = 3.0 V PH AS -10 -15 -30 -25 -20 -15 0 -5 TA = -40C E- TA = -40C 5 RF Output Level PRFout (dBm) 5 15 Conversion Gain CG (dB) VCC = 2.7 V O UT 0 RF Output Level PRFout (dBm) Conversion Gain CG (dB) VCC = 3.3 V -10 -5 0 5 10 -10 TA = +25C -15 TA = +85C -20 -25 -30 Local Input Level PLOin (dBm) Data Sheet P14729EJ2V0DS00 -25 -20 -15 -10 fRFout = 1.9 GHz fLOin = 1 660 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -5 0 5 10 IF Input Level PIFin (dBm) 17 PC8172TB CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 15 5 VCC = 3.0 V 5 VCC = 2.7 V 0 -5 fRFout = 2.4 GHz fLOin = 2 160 MHz PIFin = -30 dBm VCC = VPS -10 -15 -30 -25 -20 -15 -10 -5 0 5 10 Local Input Level PLOin (dBm) CONVERSION GAIN vs. LOCAL INPUT LEVEL VCC = 2.7 V -10 -15 fRFout = 2.4 GHz fLOin = 2 160 MHz PLOin = -5 dBm VCC = VPS -20 -25 -20 -15 -10 -5 0 5 10 RF OUTPUT LEVEL vs. IF INPUT LEVEL 5 10 0 TA = +25C -5 TA = +85C -10 -25 -20 -15 -10 0 -5 TA = -40C E- TA = -40C -15 -30 fRFout = 2.4 GHz fLOin = 2 160 MHz PIFin = -30 dBm VCC = VPS = 3.0 V -5 0 5 10 -10 TA = +25C -15 TA = +85C -20 -25 -30 Local Input Level PLOin (dBm) 18 VCC = 3.0 V -5 -25 -30 PH AS Conversion Gain CG (dB) 0 IF Input Level PIFin (dBm) 15 5 VCC = 3.3 V O UT RF Output Level PRFout (dBm) 10 RF Output Level PRFout (dBm) Conversion Gain CG (dB) VCC = 3.3 V Data Sheet P14729EJ2V0DS00 -25 -20 -15 -10 fRFout = 2.4 GHz fLOin = 2 160 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -5 0 IF Input Level PIFin (dBm) 5 10 0 -10 -20 -30 -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -10 -20 -30 TA = -40C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -15 -30 TA = +25C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 0 -10 -20 -30 TA = +25C VCC = VPS = 3.3 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = -5 dBm -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 -5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 0 -10 -20 -30 -40 0 5 TA = +25C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = -5 dBm -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 IF Input Level PIFin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 -40 -10 10 IF Input Level PIFin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) -20 E- -20 0 IF Input Level PIFin (dBm) PH AS 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IF Input Level PIFin (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 O UT TA = +25C VCC = VPS = 2.7 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = -5 dBm -40 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) PC8172TB IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -20 -30 TA = +85C VCC = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 140 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 -25 -20 -15 -10 -5 0 5 IF Input Level PIFin (dBm) 19 -10 -20 -30 TA = +25C VCC = VPS = 2.7 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -10 -20 -30 TA = -40C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -30 TA = +25C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -20 -30 TA = +25C VCC = VPS = 3.3 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) -15 -10 -5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -25 IF Input Level PIFin (dBm) -20 -15 TA = +25C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = -5 dBm -10 -5 0 5 IF Input Level PIFin (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -20 -30 TA = +85C VCC = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1 660 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 IF Input Level PIFin (dBm) 20 -20 E- -20 0 IF Input Level PIFin (dBm) PH AS 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IF Input Level PIFin (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 O UT 0 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) PC8172TB Data Sheet P14729EJ2V0DS00 -25 -20 -15 -10 -5 IF Input Level PIFin (dBm) 0 5 0 -10 -20 -30 -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -10 -20 -30 TA = -40C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -15 -30 TA = +25C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 0 -10 -20 -30 TA = +25C VCC = VPS = 3.3 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = -5 dBm -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 -5 0 5 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 0 -10 -20 -30 -40 0 5 TA = +25C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = -5 dBm -50 -60 -70 -80 -30 -25 -20 -15 -10 -5 0 5 IF Input Level PIFin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 -40 -10 10 IF Input Level PIFin (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) -20 E- -20 0 IF Input Level PIFin (dBm) PH AS 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IF Input Level PIFin (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 O UT TA = +25C VCC = VPS = 2.7 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = -5 dBm -40 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) RF Output Level of Each Tone PRFout (dBm) PC8172TB IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 -10 -20 -30 TA = +85C VCC = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2 160 MHz PLOin = -5 dBm -40 -50 -60 -70 -80 -30 IF Input Level PIFin (dBm) Data Sheet P14729EJ2V0DS00 -25 -20 -15 -10 -5 0 5 IF Input Level PIFin (dBm) 21 PC8172TB LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY 0 -10 -20 -30 fRFout = 900 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -40 -50 0 0.5 1 1.5 2 2.5 3 Local Input Frequency fLOin (GHz) Local Leakage at RF Pin LOrf (dBm) 0.5 1 1.5 2 2.5 3 -10 E- -10 -20 -30 fRFout = 900 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -40 PH AS Local Leakage at RF Pin LOrf (dBm) 0 0 0 0.5 1 1.5 2 2.5 3 -30 fRFout = 1.9 GHz PLOin = -5 dBm VCC = VPS = 3.0 V -40 -50 0 0.5 1 1.5 2 2.5 Local Input Frequency fLOin (GHz) Local Input Frequency fLOin (GHz) IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY -70 -80 fRFout = 900 MHz fLOin = 1 140 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -90 100 200 300 400 500 IF Leakage at RF Pin IFrf (dBm) -60 0 -20 3 0 fRFout = 1.9 GHz fLOin = 1 660 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 -20 -30 -40 -50 IF Input Frequency fIFin (MHz) 22 fRFout = 1.9 GHz PLOin = -5 dBm VCC = VPS = 3.0 V -40 -50 -50 IF Leakage at RF Pin IFrf (dBm) -30 LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 -100 -20 Local Input Frequency fLOin (GHz) LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY -50 -10 O UT Local Leakage at IF Pin LOif (dBm) Local Leakage at IF Pin LOif (dBm) 0 0 100 200 300 400 IF Input Frequency fIFin (MHz) Data Sheet P14729EJ2V0DS00 500 PC8172TB LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 -10 -30 fRFout = 2.4 GHz PLOin = -5 dBm VCC = VPS = 3.0 V -40 0 0.5 1 1.5 2 2.5 Local Input Frequency fLOin (GHz) IF LEAKAGE AT RF PIN vs. IF INPUT FREQUENCY fRFout = 2.4 GHz fLOin = 2 160 MHz PLOin = -5 dBm VCC = VPS = 3.0 V -10 -20 -30 3 -30 fRFout = 2.4 GHz PLOin = -5 dBm VCC = VPS = 3.0 V -40 -50 0 0.5 1 1.5 2 2.5 3 Local Input Frequency fLOin (GHz) PH AS -40 -20 E- 0 -10 O UT -20 -50 IF Leakage at RF Pin IFrf (dBm) Local Leakage at RF Pin LOrf (dBm) Local Leakage at IF Pin LOif (dBm) 0 -50 0 100 200 300 400 500 IF Input Frequency fIFin (MHz) Remark The graphs indicate nominal characteristics. Data Sheet P14729EJ2V0DS00 23 PC8172TB 8. PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 O UT 0.2+0.1 -0.05 0.65 0.65 1.3 2.00.2 1.250.1 PH AS 0.15+0.1 -0.05 E- 0 to 0.1 0.7 0.90.1 0.1 MIN. 24 Data Sheet P14729EJ2V0DS00 PC8172TB 9. NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. (4) Connect a matching circuit to the RF output pin. O UT (5) The DC cut capacitor must be each attached to the input and output pins. 10. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. Soldering Method Soldering Conditions Recommended Condition Symbol Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None IR35-00-3 VPS Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None VP15-00-3 Wave Soldering Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None WS60-00-1 Partial Heating Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None - E- Infrared Reflow PH AS Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P14729EJ2V0DS00 25 NOTICE 3. 4. 5. 6. 7. PH AS 8. O UT 2. 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