Specification Number : BP-ABZ-C
1/16
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Murata (China) Investment Co., Ltd.
Sub-G Module Data Sheet
Sample Part Number:
CMWX1ZZABZ-TEMP
CMWX1ZZABZ-TEMP-1
MP Part Number:
CMWX1ZZABZ-078
CMWX1ZZABZ-091
Specification Number : BP-ABZ-C
2/16
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Murata (China) Investment Co., Ltd.
Revision History
Revision
Code
Date
Description
Comments
A
Dec 1, 2016
Initial Draft
B
Jan 19, 2017
Revise template
C
Oct 16, 2018
Updated the RF performance, Electrical Characteristics
and power up sequence.
Added weight info.
Updated P/N
Revised label info
Specification Number : BP-ABZ-C
3/16
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TABLE OF CONTENTS
1. Features ······················································································································· 4
2. Part Number ················································································································· 4
3. Block Diagram ··············································································································· 4
4. Label Information ·········································································································· 5
5. Absolute Maximum Ratings ····························································································· 5
6. Operating Condition ······································································································· 5
7. Electrical Characteristics ································································································ 6
7.1. FSK/OOK Transceiver Specification ············································································ 6
7.2. LoRa Transceiver Specification ··················································································· 6
7.3. SIGFOX Transceiver Specification ·············································································· 7
7.4. Low power mode current ···························································································· 7
8. Power Sequences ············································································································ 8
9. Reference circuit ············································································································ 9
10. Tape and Reel packing ·································································································· 11
11. Notice ························································································································ 14
CAUTION
················································································································ 16
Specification Number : BP-ABZ-C
4/16
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Murata (China) Investment Co., Ltd.
1. Features
Interfaces : I2C, UART, USB, SPI
Main ICs : STM32L, SX1276
Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±2 ppm)
and 32.768KHz clock (frequency error=±20 ppm)
Supported Frequencies : 868 MHz, 915 MHz
Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max)
Weight : 0.48g (Typ)
Package : Metal Shield can
RoHS : This module is compliant with the RoHS directive
2. Part Number
Ordering Part Number
MCU
Description
CMWX1ZZABZ-TEMP
STM32L082
Engineering sample
CMWX1ZZABZ-EVK
STM32L082
Evaluation board
CMWX1ZZABZ-078
STM32L082
MP P/N
CMWX1ZZABZ-TEMP-1
STM32L072
Engineering sample
CMWX1ZZABZ-EVK-1
STM32L072
Evaluation board
CMWX1ZZABZ-091
STM32L072
MP P/N
3. Block Diagram
Specification Number : BP-ABZ-C
5/16
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4. Label Information
5. Absolute Maximum Ratings
Table 3 Maximum ratings
Parameters
Min
Typ
Max
Unit
Storage Temperature
-40
25
+90
degC
Input RF Level
-
-
10
dBm
Supply Voltage
VDD_USB
-0.3
-
3.9
V
VDD_MCU, VDD_RF, VDD_TCXO
-0.3
-
3.9
V
VREF+
-0.3
-
VDD_MCU+0.4
V
6. Operating Condition
Table 4 Operating specification
Parameters
Min
Typ
Max
Unit
Operating Temperature
-40
25
+85
degC
Supply Voltage
VDD_USB (USB peripheral used) (1)
3.0
-
3.6
V
VDD_USB(USB peripheral not used) (1)
VDD_MCU_min
VDD_MCU
VDD_MCU_max
V
VDD_MCU,VDD_RF,VDD_TCXO
2.2(3)
-
3.6
V
VREF+(2)
1.8
-
VDD_MCU
V
(1) VDD_USB must respect the following conditions:
- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.
- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than
VDD_MCU.
- In operating mode, VDD_USB could be lower or higher than VDD_MCU.
- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os.
(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is
on the STM32L082*** datasheet and user guider.
(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V.
1 pin mark
Product name
FCC ID number
IC ID number
Inspection number
KCC logo
Murata Logo
TELEC logo
Specification Number : BP-ABZ-C
6/16
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7. Electrical Characteristics
7.1. FSK/OOK Transceiver Specification
Conditions:
Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation
without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx
and Tx path matching, unless otherwise specified.
FSK/OOK Receiver Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
RFS_F_HF
LnaBoost is turned on
FDA = 5 kHz, BR = 4.8 kb/s
-117.5
dBm
IDDR (*)
Supply current in Receive
mode
LnaBoost Off, band 1
22
mA
LnaBoost On, band 1
23
mA
FSK/OOK Transmitter Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
RF_OP
RF output power in 50 ohms
on RFO pin ( High efficiency
PA)
Programmable with
steps
Max
14
dBm
Min
-5
dBm
RF_OPH
RF output power in 50 ohms
on PA_BOOST pin( Regulated
PA)
Programmable with
1dB steps
Max
18.5
dBm
Min
2
dBm
ΔRF_
OPH_V
RF output power stability on
PA_BOOST pin versus voltage
supply.
VDD = 2.2 V to 3.6 V
+/-1
dB
ΔRF_T
RF output power stability
versus temperature on
PA_BOOST pin.
From T = -40 °C to +85 °C
+/-1.5
dB
IDDT (*)
Supply current in Transmit
mode with impedance
matching
RFOP = +20 dBm, on
PA_BOOST
128
mA
RFOP = +17 dBm, on
PA_BOOST
106
mA
RFOP = +14 dBm, on
RFO_HF pin
47
mA
RFOP = + 7 dBm, on
RFO_HF pin
34
mA
(*) IDDR and IDDT are total current consumption including MCU in active.
7.2. LoRa Transceiver Specification
Conditions:
The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following
conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error
Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes.
With matched impedances
LoRa Receiver Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
IDDR_L (*)
Supply current in receiver
LoRa mode, LnaBoost off
Band 1, BW = 125 kHz
21.5
mA
Band 1, BW = 250 kHz
22.2
mA
Band 1, BW = 500 kHz
23.6
mA
RFS_L125_HF
RF sensitivity, Long-Range
Mode, highest LNA gain,
LnaBoost for Band1, using
split Rx/Tx path
125 kHz bandwidth
SF = 6
-117.5
dBm
SF = 7
-122.5
dBm
SF = 8
-125.5
dBm
SF = 9
-128.5
dBm
SF = 10
-131.0
dBm
SF = 11
-133.5
dBm
SF = 12
-135.5
dBm
RFS_L250_HF
RF sensitivity, Long-Range
Mode, highest LNA gain,
LnaBoost for Band1, using
split Rx/Tx path
SF = 6
-114.0
dBm
SF = 7
-119.0
dBm
SF = 8
-122.0
dBm
SF = 9
-125.0
dBm
Specification Number : BP-ABZ-C
7/16
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Murata (China) Investment Co., Ltd.
250 kHz bandwidth
SF = 10
-127.5
dBm
SF = 11
-130.0
dBm
SF = 12
-133.0
dBm
LoRa Transmitter Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
IDDT_L (*)
Supply current in transmitter
mode
RFOP setting = 14 dBm
47
mA
RFOP setting = 10 dBm
36
mA
IDDT_H_L (*)
Supply current in transmitter
mode
Using PA_BOOST pin
RFOP setting = 20 dBm
128
mA
(*) IDDR_L, IDDT_L and IDDT_H_L are total current consumption including MCU in active.
7.3. SIGFOX Transceiver Specification
Conditions:
The table below gives the electrical specifications for the transceiver operating with SIGFOX modulation. Following
conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C. With matched
impedances.
Notes: To operate as SIGFOX mode, the following configuration is required.
- TCXO_OUT (Pin 47) must be connected to PH0-OSC_IN (Pin46).
- PA12 (Pin 1) must be connected to TXCO_VCC (Pin48).
- SX1276_DIO4 (Pin10) must be connected to PA5 (Pin21).
SIGFOX Receiver Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
RFS_F_HF
AT$SB=x,1, AT$SF=x,1,
AT$SR PER<0.1
-122
dBm
IDDR_S
Supply current in Receive
mode
AT$TM=3,10
23
mA
SIGFOX Transmitter Specification
Symbol
Description
Conditions
Min.
Typ
Max
Unit
RF_OP_S
RF output power in 50 ohms
on RF pin
Programmable with
steps
AT$SF
Max
18.5
dBm
Min
4.5
dBm
IDDT_S
Supply current in Transmit
mode with impedance
matching
Output power setting 20 dBm
AT$SF
128
mA
Output power setting 14 dBm
AT$SF
44
mA
7.4. Low power mode current
Conditions:
Power supply: 3.3V, Temp: Room, TCXO_VDD (pin 48 of the module) is connected to PA12 (Pin1 of the module)
Mode
Description
Min.
Typ
Max
Unit
Mode0
STM32L0 in Stop mode with RTC (Real Time Clock) (*1) (*3)
SX1276 in Sleep mode
1.65
uA
Mode1
STM32L0 in Standby mode with RTC (Real Time Clock) (*2)
SX1276 in Sleep mode
1.40
uA
(*1) The Stop mode achieves the lowest power consumption while retaining the RAM and register contents and real
time clock. All clocks in the VCORE domain are stopped, the PLL, MSI RC, HSE crystal and HSI RC oscillators are
disabled. The LSE or LSI is still running. The voltage regulator is in the low-power mode.
Some peripherals featuring wakeup capability can enable the HSI RC during Stop mode to detect their wakeup
condition. The device can be woken up from Stop mode by any of the EXTI line, in 3.5us, the processor can serve
the interrupt or resume the code. The EXTI line source can be any GPIO. It can be the PVD output, the comparator 1
event or comparator 2 event (if internal reference voltage is on), it can be the RTC alarm/tamper/timestamp/wakeup
events, the USB/USART/I2C/LPUART/LPTIMER wakeup events.
(*2) The Standby mode is used to achieve the lowest power consumption and real time clock. The internal voltage
regulator is switched off so that the entire VCORE domain is powered off. The PLL, MSI RC, HSE crystal and HSI
RC oscillators are also switched off. The LSE or LSI is still running. After entering Standby mode, the RAM and
register contents are lost except for registers in the Standby circuitry (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32
KHz oscillator, RCC_CSR register). The device exits Standby mode in 60 μs when an external reset (NRST pin), an
Specification Number : BP-ABZ-C
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Murata (China) Investment Co., Ltd.
IWDG reset, a rising edge on one of the three WKUP pins, RTC alarm (Alarm A or Alarm B), RTC tamper event, RTC
timestamp event or RTC Wakeup event occurs.
(*3) STM SigFox Firmware is always in stop mode by default, it wakes up automatically when receiving one
character. Else it wakes up automatically when an interrupt is to be processed and returns in stop mode when
finished.
8. Power Sequences
8.1 Power Up Sequence
Specification Number : BP-ABZ-C
9 / 16
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Murata (China) Investment Co., Ltd.
9. Reference circuit
In case of using the module as LoRa
U1
CMWX1ZZABZ-078/091
PA12/USB_DP
1
PA11/USB_DM
2
GND
3
VDD_USB
4
VDD_MCU
5
VDD_RF
6
GND
7
DBG_SX1276_DIO2
8
DBG_SX1276_DIO3
9
SX1276_DIO4
10
DBG_SX1276_DIO5
11
DBG_SX1276_DIO1
12
DBG_SX1276_DIO0
13
PB15/SPI2_MOSI
14
PB14/SPI2_MISO
15
PB13/SPI2_SCK
16
PB12/SPI2_NSS
17
PA10/USART1_RX
18
PA9/USART1_TX
19
PA8/MCO
20
PA5/ADC5/DAC2
21
PA4/ADC4/DAC1
22
PA3/ADC3/USART2_RX/LPUART1_RX
23
PA2/ADC2/USART2_TX/LPUART1_TX
24
GND 25
ANT 26
GND 27
DBG_CRF1 28
DBG_CRF3 29
DBG_CRF2 30
STSAFE_nRST 31
VREF+ 32
PA0/WKUP1 33
MCU_nRST 34
PB8/I2C1_SCL 35
PB9/I2C1_SDA 36
PB2/LPTIM1_OUT 37
PB7/LPTIM1_IN2 38
PB6/LPTIM1_ETR 39
PA13/SWDIO/LPUART1_RX 41
PA14/SWCLK/LPUART1_TX 42
BOOT0 43
GND 44
PB5/LPTIM1_IN1 40
PH1-OSC_OUT 45
PH0-OSC_IN 46
TCXO_OUT 47
VDD_TCXO 48
GND 49
GND 50
GND 51
GND 52
GND 53
GND
54
GND
55
GND
56
GND
57
C3
10uF C5
0.1uF
Module reset do not need
external pull up resistor.
Because there is an about
45K permanent pull up
resistor inside of module.
J1
1
1
2
2
3
3
4
4
5
5
6
6
Notes for VREF+:
1. VREF+ can be grounded or floating
when DAC and ADC function are not active.
2. VREF+ should be connected to VDD
if module is battery powered and need to
monitor the battery voltage
VDD_TCXO
C7
1uF
module reset
VDD
Button1
1 2
C6 0.1uF
J2 2
3
4
1
5
SMA connector
C4
1uF
SWCLK
For VDD_TCXO connection
Option1:Connect VDD_TCXO to VDD
Option2:Connect VDD_TCXO to PA12 so
that MCU can control TCXO on/off
VDD
C8 C9
SWD connector
SWDIO
C1
10uF C2
0.1uF
VDD_USB
USART2_TX
USART2_RX
L1
VDD
USART1_TX
USART1_RX
R1
10K
Optional
The VDD_USB is the power supply for
PA11 and PA12.
VREF+
Specification Number : BP-ABZ-C 10/ 16
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Murata (China) Investment Co., Ltd.
In case of using the module as SigFox modem with STM SigFox firmware
U1
CMWX1ZZABZ-099
PA12/USB_DP
1
PA11/USB_DM
2
GND
3
VDD_USB
4
VDD_MCU
5
VDD_RF
6
GND
7
DBG_SX1276_DIO2
8
DBG_SX1276_DIO3
9
SX1276_DIO4
10
DBG_SX1276_DIO5
11
DBG_SX1276_DIO1
12
DBG_SX1276_DIO0
13
PB15/SPI2_MOSI
14
PB14/SPI2_MISO
15
PB13/SPI2_SCK
16
PB12/SPI2_NSS
17
PA10/USART1_RX
18
PA9/USART1_TX
19
PA8/MCO
20
PA5/ADC5/DAC2
21
PA4/ADC4/DAC1
22
PA3/ADC3/USART2_RX/LPUART1_RX
23
PA2/ADC2/USART2_TX/LPUART1_TX
24
GND 25
ANT 26
GND 27
DBG_CRF1 28
DBG_CRF3 29
DBG_CRF2 30
STSAFE_nRST 31
VREF+ 32
PA0/WKUP1 33
MCU_nRST 34
PB8/I2C1_SCL 35
PB9/I2C1_SDA 36
PB2/LPTIM1_OUT 37
PB7/LPTIM1_IN2 38
PB6/LPTIM1_ETR 39
PA13/SWDIO/LPUART1_RX 41
PA14/SWCLK/LPUART1_TX 42
BOOT0 43
GND 44
PB5/LPTIM1_IN1 40
PH1-OSC_OUT 45
PH0-OSC_IN 46
TCXO_OUT 47
VDD_TCXO 48
GND 49
GND 50
GND 51
GND 52
GND 53
GND
54
GND
55
GND
56
GND
57
C3
10uF C5
0.1uF
Module reset do not need
external pull up resistor.
Because there is an about
45K permanent pull up
resistor inside of module.
J1
1
1
2
2
3
3
4
4
5
5
6
6
VDD_TCXO
C6
1uF
module reset
VDD
Button1
1 2
C1 0.1uF
J2 2
3
4
1
5
SMA connector
C4
1uF
SWCLK
VDD
C8 C9
SWD connector
SWDIO
Host Interface USART_TX
Host Interface USART_RX
L1
VDD
R1
10K
The VDD_USB is must.
Because it is the power
supply for PA11 and PA12.
VREF+
Specification Number : BP-ABZ-C
11/ 16
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
10. Tape and Reel packing
10.1 Dimension of Tape (Plastic tape)
(unit : mm)
10.2 Dimensions of Reel
2.0±0.1
1.75±0.10
0.30±0.05
24.0±0.1
11.5±0.1
13±0.1
1.5+0.1/-0.0
24.0±0.3
feeding direction
4.0±0.1 *1
12.1±0.1
1.5+0.1/-0
2±0.15
W1
W2
R80
R135
R5
5
22
φ
10
120
°
φ330±2
φ 80±1
φ13±0.2
Label
Reel inside width W1: 25.5±1.0
Reel outside width W2: 29.5±1.0
Unit: mm
Specification Number : BP-ABZ-C
12/ 16
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10.3 Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62μm in thickness
[4] Base tape : As specified in (1)
10.4 Leader and Tail tape
40 to 200mm
(No components)
Components
No components
Feeding direction
Leader tape
(Cover tape alone)
150mm min.
250mm min.
Tail tape
Feeding Hole
Chip
Feeding Direction
[2]
[3]
[4]
[3] [1]
Specification Number : BP-ABZ-C
13/ 16
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Murata (China) Investment Co., Ltd.
- The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
- The cover tape and base tape are not adhered at no components area for 250mm min.
- Tear off strength against pulling of cover tape : 5N min.
- Packaging unit : 1000 pcs/ reel
- Material
Base tape : Plastic
Reel : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
- Peeling of force: 1.3N max. in the direction of peeling as shown below.
- Packaging (Humidity proof Packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
165 to 180 °
0.7 N max.
Base tape
Cover tape
1.3 N max.
　 湿度
イ ン ジケ－タ
乾燥剤
表示ラ べル
防湿梱包袋
表示ラ ベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag
Specification Number : BP-ABZ-C
14/ 16
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Murata (China) Investment Co., Ltd.
11. Notice
11.1 Storage Conditions
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35 °C and humidity from 20 ~ 70 %RH.
(Packing materials, in particular, may be deformed at the temperature over 40 °C)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be
used within 168 hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125 +5/-0 °C, 24 hours, 1 time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
11.2 Handling Conditions
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solderability.
11.3 Standard PCB Design (Land Pattern and Dimensions)
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
11.4 Notice for Chip Placer :
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
11.5 Soldering Conditions：
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning other soldering conditions.
Specification Number : BP-ABZ-C
15/ 16
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
Reflow Soldering Standard Conditions (Example)
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
11.6 Cleaning :
Since this Product is Moisture Sensitive, any cleaning is not permitted.
11.7 Operational Environment Conditions :
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
11.8 Input Power Capacity :
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
Within 120 s
Pre-heating
time(s)
220 °C
Within 60 s
Cooling down
Slowly
180 °C
150 °C
240 ~ 250 °C
Within 3 s
Specification Number : BP-ABZ-C
16/ 16
< Specification may be changed by Murata without notice >
Murata (China) Investment Co., Ltd.
CAUTION
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is
mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose,
under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the
environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not
be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this
specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING
WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR
AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as
may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such
applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS,
AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE
OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and reproducing our product. Our product cannot be used
for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other
intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding
third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such
information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or
other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and
the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our
suppliers.
Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for
consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the
defect was caused by components in Products supplied to Murata from a third party).
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and
accept the validity of the contents herein.
When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet.
Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status.
We reject any liability or product warranty for engineering samples.
In particular we disclaim liability for damages caused by
・the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you,
・deviation or lapse in function of engineering sample,
・improper use of engineering samples.
We disclaims any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.