0.9
0.65
0.7
0.25
1.65
0.5
2.605
0.63
11.65
12.65
15.6
16.1
16.6
17.1
17.6
18.1
18.6
19.1
19.6
17.6
18.1
18.6
19.1
19.6
20.1
20.6
21.1
21.6
21
52437-2171
10.011.1515.1
17.1
K
VIEW K
(金具部投影図)
(DETAIL OF FITTING NAIL)
金具
FITTING NAIL
5
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:47
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/03/02
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
MUMEDA
2004/12/20
APPR:
NUKITA
2004/12/24
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52437
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5 FPC CONN.ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52437-019
PSD
001
F
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 1 OF 2
注記NOTES
1.使用材料
MATERIAL
ハウジング：46ナイロン、ガラス充填、UL94V-0、白
HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE
アクチュエータ：ポリフェニレンサルフィド（PPS）、ガラス充填、
UL94V-0、茶色
ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,
UL94V-0,BROWN
ターミナル：リン青銅、ニッケル下地金めっき（t=0.2）
TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING
金具：リン青銅、ニッケル下地錫めっき（t=0.2）
FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING
2.エンボステープ梱包時は、アクチュエータがロックした状態になります。
IN THE PACKAGE,ACTUATOR OF PART
NO.52437-**29 SHOULD BE LOCKED.
ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、
基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。
MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM
DATUM-H.
UPPER DIRECTON:0.1MAXIMUM
LOWER DIRECTION:0.15 MAXIMUM
偶数極に適用
APPLY FOR EVEN CIRCUIT.
ﾊﾟﾀｰﾝ剥離止め金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
R0.3は、FPCの導体部にかからないこと
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
7.ソルダーテールの平坦度は、0.1MAXIMUMとする。
SOLDER TAIL COPLANARITY IS 0.1 MAXIMUM.
8.ELV 及び RoHS 適合品
ELV AND RoHS COMPLIANT
極数
CKT.
(A)BCD
12.5
10.5
11.0
11.5
14.5 52437-3071
52437-2971
52437-2871
52437-2771
52437-2671
52437-2571
52437-2471
52437-2371
52437-2271
EMBOSSED PACKAGE
ORDER No. オーダー番号
22
24
15.65
30
12.15
23
25
12.0
13.15
13.65
26
27
13.0
14.15
14.65 13.5
28
29
14.0
15.15
CONNECTOR SERIES NO. : 52437-**29
3
4
5
6
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:47
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/03/02
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
MUMEDA
2004/12/20
APPR:
NUKITA
2004/12/24
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52437
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5 FPC CONN.ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52437-019
PSD
001
F
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE SHEET 1 GENERAL MARKET 2 OF 2
4
±
0.5
6
±
0.5
0.5(N-1)
0.5(N-1)
±
0.05
0.45MAX.
0.5
±
0.05
6
±
0.5
0.5
±
0.05
0.5
±
0.1
1.85MIN.
0.3
±
0.03
0.5(N+1)
±
0.07
0.5
±
0.08
0.5(N-1)
±
0.05
0.5(N+1)
±
0.07
0.35+0.04
-0.03
4
±
0.5
(0.605)
(0.3)
0.5
±
0.1
0.5
±
0.08
コネクタ位置
(FROM PATTERN EDGE)
適合金めっきFPC推奨寸法
L
(PITCH)
M
CONNECTOR
POSITION
仕上がり厚さ：0.3
±
0.05
補強板
(STIFFENER BOARD)
パターンおよび
半田禁止エリア
DETAIL L
APPLICABLE FFC OF GOLD
PLATING RECOMMENDED DIMENSION
補強板
(STIFFENER BOARD)
SOLDERING AREA
OF FITTING NAIL
金具パターンエリア
6
(公差非累積)
(PITCH)
適合金めっきFFC推奨寸法
(NON-ACCUMULATIVE)
THICKNESS: 0.3+0.05/-0.05
PATTERN
APPLICABLE FPC OF GOLD
PLATING RECOMMENDED DIMENSION
THICKNESS: 0.3+0.05/-0.05
VIEW M
(PITCH)
KEEPING OUT AREA OF
PATTERN AND SOLDERING
±
0.05
仕上がり厚さ：0.3
±
0.05
(DETAIL OF FITTING NAIL
ON PATTERN)
2.2
(ピッチ)
BOARD
0.55MAX.
3.65
0.8
(0.2)
R0.3
1.25
(0.3)
R0.3
3.05
1.1
(0.3)
1.25
3.65
0.5
±
0.05
(0.3)
導体部： 銅箔(35μmか50μm)
COPPER FOIL (35μm or 50μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
0.3
±
0.05
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
補強板：ポリエステル系
REINFORCE BOARD: PET
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
仕上がり厚さ
THICKNESS
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
熱硬化接着剤
THERMOSETTING ADHESIVE
導体部： 銅箔(35μm)
COPPER FOIL (35μm)
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
仕上がり厚さ
THICKNESS
補強板：ポリイミド
REINFORCE BOARD: POLYMIDE
0.3
±
0.05
FPC構成推奨仕様
STRUCTURE OF FPC
FFC構成推奨仕様
STRUCTURE OF FFC
FPCについて
打ち抜き方向は導体側から補強板を推奨いたします。
補強フィルム材質はポリイミドを推奨いたします。
接着剤は熱効果接着剤を推奨致します。
ABOUT FPC :
RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER BOARD SIDE.
RECOMMENDED MATERIAL :
STIFFNER FILM : POLYIMIDE
BONDING AGENT : THERMOSETTING BONDING AGENT
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
