0
20
40
60
80
100
0 2 4 6 8 10
Heat Dissipated - Wattts
Temp Rise Above Ambient - o
C
(Mounting Surface)
0
2
4
6
8
10
0 200 400 600 800 1000
Air Velocity - LFM
Thermal Resistance - oC/ Watt
(Mounting Surface to Ambient)
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
TO-220
Board Level
Heat Sinks
P/N: 822202B00000
PRODUCT SPECIFICATIONS
• Devices: TO-220
• Size: 25.4 x 12.7 x 30.0 mm
• Material: Aluminum, 1.2 mm Thick
• Weight: 4.3 grams
• Type: Stamped
• PCB Mounting: Solderable Tabs
• Finish: Black Anodized
• Package: Bulk
• Optional Hardware: Thermal Interface
Material
FEATURES & BENEFITS
• Hole for Device Attachment
• Vertical Mounting via Solderable Tabs
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering