Datasheet Operational Amplifiers / Comparators High Speed with High Voltage Operational Amplifiers BA3472, BA3472R, BA3474, BA3474R Key Specifications Wide Operating Supply Voltage: Single supply +3.0[V] to +36.0[V] Dual supply 1.5[V] to 18.0[V] General Description General-purpose BA3472,BA3472R,BA3474,BA3474R integrate two/four Independent Op-amps and phase compensation capacitors on a single chip and have some features of high-gain, and wide operating voltage range of +3[V] to +36[V](single power supply). Especially, characteristics are high slew rate (10[V/s]) and high Maximum frequency (4[MHz]). Wide Temperature Range: BA3474F BA3472F BA3472FVM Features Operable with a single power supply Wide operating supply voltage Standard Op-Amp. Pin-assignments Internal phase compensation High open loop voltage gain Internal ESD protection Operable low input voltage around GND level Wide output voltage range BA3472FV BA3474FV BA3472RFVM BA3474RFV -40[C] to +85[C] -40[C] to +105[C] Low Input Offset Current: 6[nA] (Typ.) Low Input Bias Current: 100[nA] (Typ.) Wide Output Voltage Range: VEE+0.3[V]-VCC-1.0[V](Typ.) with VCC-VEE=30[V] High Slew Rate: 10[V/s] Maximum Frequency: 4[MHz] Human Body Model (HBM): 5000[V] (Typ.) (Typ.) (Typ.) (Max.) 2.90mm x 4.00mm x 0.90mm 3.00mm x 6.40mm x 1.35mm 5.00mm x 6.40mm x 1.35mm 5.00mm x 6.20mm x 1.71mm 8.70mm x 6.20mm x 1.71mm Packages MSOP8 SSOP-B8 SSOP-B14 SOP8 SOP14 -40[C] to +75[C] Selection Guide Operation guaranteed High Speed +75[C] Output Current Source/Sink Slew Rate Dual 30[mA]/ 30[mA] 10[V/s] Quad 30[mA]/ 30[mA] 10[V/s] Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211114001 BA3474F +85[C] +105[C] BA3472F BA3472FV BA3472FVM BA3472RFVM BA3474FV BA3474RFV This product is not designed protection against radioactive rays. 1/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Pin Configuration(TOP VIEW) OUT1 1 14 OUT4 -IN1 2 OUT1 1 -IN1 2 +IN1 3 VEE 4 8 VCC VCC 4 11 VEE BA3472FV 5 - + CH2 + CH3 OUT2 7 MSOP8 SSOP-B8 13 -IN4 12 +IN4 -IN2 6 5 +IN2 CH4 + - +IN1 3 +IN2 6 -IN2 CH2 + - SOP8 BA3472F 7 OUT2 CH1 - + CH1 - + SOP14 BA3474F BA3472FVM BA3472RFVM 10 +IN3 9 -IN3 8 OUT3 SSOP-B14 BA3474FV BA3474RFV Ordering Information B A 3 4 7 Part Number x F x x - Package F : SOP8 SOP14 FV : SSOP-B8 SSOP-B14 FVM : MSOP8 xx Packaging and forming specification E2: Embossed tape and reel (SOP8/SOP14/SSOP-B8/SSOP-B14) TR: Embossed tape and reel (MSOP8) Lineup Topr -40C to +75C -40C to +85C -40C to +105C Supply Current (Typ.) 8.0mA Slew Rate (Typ.) 4.0mA Orderable Part Number Package SOP14 Reel of 2500 BA3474F-E2 SOP8 Reel of 2500 BA3472F-E2 SSOP-B8 Reel of 2500 BA3472FV-E2 MSOP8 Reel of 3000 BA3472FVM-TR 8.0mA SSOP-B14 Reel of 2500 BA3474FV-E2 4.0mA MSOP8 Reel of 3000 BA3472RFVM-TR 8.0mA SSOP-B14 Reel of 2500 BA3474RFV-E2 10.0V/s www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Absolute Maximum Ratings (Ta=25[]) Ratings Parameter Supply Voltage Symbol BA3472 BA3474 Unit BA3472R BA3474R VCC-VEE +36 V Vid 36 V Vicm (VEE - 0.3) to VEE + 36 V Differential Input Voltage (*1) Input Common-mode Voltage Range Operating Temperature Range Topr Storage Temperature Range Maximum Junction Temperature -40 to +85(SOP14:+75) -40 to +105 Tstg -55 to +150 Tjmax +150 Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (*1) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VEE. Electrical Characteristics BA3472 (Unless otherwise specified Parameter Input Offset Voltage (*2) Symbol Vio VCC=+15[V], VEE=-15[V], Ta=25[]) Limits Temperature range BA3472F/FV/FVM Min. Typ. Max. - 1 10 25 Unit Vicm=0[V],VOUT=0[V] mV - 1.5 10 Condition VCC=5[V],VEE=0[V],Vicm=0[V], VOUT=VCC/2 Input Offset Current (*2) Iio 25 - 6 75 nA Vicm=0[V],VOUT=0[V] Input Bias Current (*2) Ib 25 - 100 500 nA Vicm=0[V],VOUT=0[V] ICC 25 - 4 5.5 mA RL= 3.7 4 - 13.7 14 - Supply Current High Level Output Voltage Low Level Output Voltage Large Signal Voltage Gain VOH VOL 25 25 13.5 - - - 0.1 0.3 - -14.7 -14.3 - - -13.5 VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] AV 25 80 100 - dB RL2[k],VOUT=10 [V] Vicm 25 0 - VCC-2.0 V VCC=5[V],VEE=0[V], VOUT=VCC/2 Common-mode Rejection Ratio CMRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Power Supply Rejection Ratio PSRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Output Source Current (*3) IOH 25 10 30 - mA Output Sink Current (*3) IOL 25 20 30 - mA ft 25 - 4 - MHz Slew Rate SR 25 - 10 - V/s Channel Separation CS 25 - 120 - dB Input Common-mode Voltage Range Maximum Frequency (*2) (*3) VCC=5[V],VIN+=1[V], VIN-=0[V],VOUT=0[V] Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V],VOUT=5[V], Only 1ch is short circuit Av=1,Vin=-10 to +10[V], RL=2[k] - Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R BA3472R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[]) Limits Parameter Input Offset Voltage (*4) Symbol Vio Temperature range BA3472RFVM Unit Min. Typ. Max. - 1 10 25 Vicm=0[V],VOUT=0[V] mV - 1.5 10 Condition VCC=5[V],VEE=0[V],Vicm=0[V], VOUT=VCC/2 Input Offset Current (*4) Iio 25 - 6 75 nA Vicm=0[V],VOUT=0[V] Input Bias Current (*4) Ib 25 - 100 500 nA Vicm=0[V],VOUT=0[V] Supply Current ICC 25 - 4 5.5 mA RL= 3.7 4 - High Level Output Voltage VOH 25 13.7 14 - 13.5 - - Low Level Output Voltage Large Signal Voltage Gain VOL 25 - 0.1 0.3 - -14.7 -14.3 - - -13.5 VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] AV 25 80 100 - dB RL2[k],VOUT=10 [V] Vicm 25 0 - VCC-2.0 V VCC=5[V],VEE=0[V], VOUT=VCC/2 Common-mode Rejection Ratio CMRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Power Supply Rejection Ratio PSRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Output Source Current (*5) IOH 25 10 30 - mA Output Sink Current (*5) IOL 25 20 30 - mA ft 25 - 4 - MHz Slew Rate SR 25 - 10 - V/s Channel Separation CS 25 - 120 - dB Input Common-mode Voltage Range Maximum Frequency (*4) (*5) VCC=5[V],VIN+=1[V], VIN-=0[V], VOUT=0[V] Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V], VOUT=5[V] Only 1ch is short circuit Av=1,Vin=-10 to +10[V], RL=2[k] - Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R BA3474 (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[]) Limits Parameter Input Offset Voltage (*6) Symbol Vio Temperature range BA3474F/FV Unit Min. Typ. Max. - 1 10 25 Vicm=0[V],VOUT=0[V] mV - 1.5 10 Condition VCC=5[V],VEE=0[V], Vicm=0[V] VOUT=VCC/2 Input Offset Current (*6) Iio 25 - 6 75 nA Vicm=0[V],VOUT=0[V] Input Bias Current (*6) Ib 25 - 100 500 nA Vicm=0[V],VOUT=0[V] Supply Current ICC 25 - 8 11 mA RL= 3.7 4 - High Level Output Voltage VOH 25 13.7 14 - 13.5 - - Low Level Output Voltage Large Signal Voltage Gain VOL 25 - 0.1 0.3 - -14.7 -14.3 - - -13.5 VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] AV 25 80 100 - dB RL2[k], VOUT=10 [V] Vicm 25 0 - VCC-2.0 V VCC=5[V],VEE=0[V], VOUT=VCC/2 Common-mode Rejection Ratio CMRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Power Supply Rejection Ratio PSRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Output Source Current (*7) IOH 25 10 30 - mA Output Sink Current (*7) IOL 25 20 30 - mA ft 25 - 4 - MHz Slew Rate SR 25 - 10 - V/s Channel Separation CS 25 - 120 - dB Input Common-mode Voltage Range Maximum Frequency (*6) (*7) VCC=5[V],VIN+=1[V], VIN-=0[V], VOUT=0[V] Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V], VOUT=5[V] Only 1ch is short circuit Av=1,Vin=-10 to +10[V], RL=2[k] - Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R BA3474R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[]) Limits Parameter Input Offset Voltage (*8) Symbol Vio Temperature range 25 BA3474RFV Unit Min. Typ. Max. - 1 10 Vicm=0[V],VOUT=0[V] mV - 1.5 10 Condition VCC=5[V],VEE=0[V],Vicm=0[V], VOUT=VCC/2 Input Offset Current (*8) Iio 25 - 6 75 nA Vicm=0[V],VOUT=0[V] Input Bias Current (*8) Ib 25 - 100 500 nA Vicm=0[V],VOUT=0[V] Supply Current ICC 25 - 8 11 mA RL= High Level Output Voltage VOH Low Level Output Voltage Large Signal Voltage Gain VOL 25 25 3.7 4 - 13.7 14 - 13.5 - - - 0.1 0.3 - -14.7 -14.3 - - -13.5 VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] VCC=5[V],RL=2[k] V RL=10[k] RL=2[k] AV 25 80 100 - dB RL2[k],VOUT=10 [V] Vicm 25 0 - VCC-2.0 V VCC=5[V],VEE=0[V], VOUT=VCC/2 Common-mode Rejection Ratio CMRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Power Supply Rejection Ratio PSRR 25 60 97 - dB Vicm=0[V],VOUT=0[V] Output Source Current (*9) IOH 25 10 30 - mA Output Sink Current (*9) IOL 25 20 30 - mA ft 25 - 4 - MHz Slew Rate SR 25 - 10 - V/s Av=1,Vin=-10 to +10[V],RL=2[k] Channel Separation CS 25 - 120 - Input Common-mode Voltage Range Maximum Frequency (*8) (*9) VCC=5[V],VIN+=1[V], VIN-=0[V],VOUT=0[V], Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V],VOUT=5[V], Only 1ch is short circuit - - dB Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms Please note that item names, symbols and their meanings may differ from those on another manufacturer's documents. 1. Absolute maximum ratings The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of electrical characteristics or damage to the part itself as well as peripheral components. 1.1 Power supply voltage (VCC-VEE) Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without causing deterioration of the electrical characteristics or destruction of the internal circuitry. 1.2 Differential input voltage (Vid) Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without damaging the IC. 1.3 Input common-mode voltage range (Vicm) Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the common-mode voltage range of the maximum ratings - use within the input common-mode voltage range of the electric characteristics instead. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by a particular mounted board at ambient temperature (25). For packaged products, Pd is determined by the maximum junction temperature and the thermal resistance. 2. Electrical characteristics 2.1 Input offset voltage (Vio) Signifies the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input voltage difference required for setting the output voltage to 0 V. 2.2 Input offset current (Iio) Indicates the difference of input bias current between the non-inverting and inverting terminals. 2.3 Input bias current (Ib) Denotes the current that flows into or out of the input terminal, it is defined by the average of the input bias current at the non-inverting terminal and the input bias current at the inverting terminal. 2.4 Circuit current (ICC) Indicates the current of the IC itself that flows under specified conditions and during no-load steady state. 2.5 maximum output voltage (VOM) Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into high-level output voltage and low-level output voltage. 2.6 Large signal voltage gain (AV) The amplifying rate (gain) of the output voltage against the voltage difference between non-inverting and inverting terminals, it is (normally) the amplifying rate (gain) with respect to DC voltage. AV = (output voltage fluctuation) / (input offset fluctuation) 2.7 Input common-mode voltage range (Vicm) Indicates the input voltage range under which the IC operates normally. 2.8 Common-mode rejection ratio (CMRR) Signifies the ratio of fluctuation of the input offset voltage when the in-phase input voltage is changed (DC fluctuation). CMRR = (change in input common-mode voltage) / (input offset fluctuation) 2.9 Power supply rejection ratio (PSRR) Denotes the ratio of fluctuation of the input offset voltage when supply voltage is changed (DC fluctuation). SVR = (change in power supply voltage) / (input offset fluctuation) 2.10 Channel separation (CS) Expresses the amount of fluctuation of the input offset voltage or output voltage with respect to the change in the output voltage of a driven channel. 2.11 Slew rate (SR) Indicates the time fluctuation ratio of the output voltage when an input step signal is supplied. 2.12 Maximum frequency (ft) Indicates a frequency where the voltage gain of Op-Amp is 1. 2.13 Total harmonic distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. 2.14 Input referred noise voltage (Vn) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Circuit Diagram VCC VIN- VOUT VIN+ VEE Fig.1 Schematic diagram (one channel only) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Typical Performance Curves BA3472 Fig.2 Derating Curve Fig.3 Supply Current - Supply Voltage Fig.4 Supply Current - Ambient Temperature www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.5 High level Output Voltage - Supply Voltage (RL=10[k]) 9/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.7 Low level Output Voltage - Supply Voltage (RL=10[k]) Fig.6 High level Output Voltage - Ambient Temperature (RL=10[k]) Fig.8 Low level Output Voltage - Ambient Temperature (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.9 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) 10/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.11 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.10 Output Source Current - (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.13 Input Offset Voltage - Ambient Temperature Fig.12 Input Offset Voltage - Supply voltage (*)The data above is ability value of sample, it is not guaranteed www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.14 Input Bias Current - Supply voltage Fig.15 Input Bias Current - Ambient Temperature Fig.16 Large Signal Voltage Gain -Supply Voltage Fig.17 Large Signal Voltage Gain -Ambient Temperature www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.18 Common Mode Rejection Ratio -Supply Voltage Fig.19 Common Mode Rejection Ratio -Ambient Temperature Fig.20 Slew Rate L-H - Supply Voltage (RL=10[k]) Fig.21 Slew Rate L-H - Ambient Temperature (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.23 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.22 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.24 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k], CL=100[pF], Ta=25[]) (*)The data above is ability value of sample, it is not guaranteed www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R BA3474 Fig.25 Derating Curve Fig.26 Supply Current - Supply Voltage Fig.27 Supply Current - Ambient Temperature www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.28 High level Output Voltage - Supply Voltage (RL=10[k]) 15/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.29 High level Output Voltage - Ambient Temperature (RL=10[k]) Fig.30 Low level Output Voltage - Supply Voltage (RL=10[k]) Fig.31 Low level Output Voltage - Ambient Temperature (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.32 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) 16/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.34 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.33 Output Source Current - (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.35 Input Offset Voltage - Supply voltage Fig.36 Input Offset Voltage -Ambient Temperature (*)The data above is ability value of sample, it is not guaranteed www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.37 Input Bias Current - Supply voltage Fig.38 Input Bias Current - Ambient Temperature Fig.39 Large Signal Voltage Gain -Supply Voltage www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.40 Large Signal Voltage Gain -Ambient Temperature 18/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.42 Common Mode Rejection Ratio -Ambient Temperature Fig.41 Common Mode Rejection Ratio -Supply Voltage Fig.43 Slew Rate L-H - Supply Voltage (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.44 Slew Rate L-H - Ambient Temperature (RL=10[k]) 19/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.45 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.46 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.47 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k],CL=100[pF],Ta=25[]) (*)The data above is ability value of sample, it is not guaranteed. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R BA3472R Fig.48 Derating Curve Fig.49 Supply Current - Supply Voltage Fig.50 Supply Current - Ambient Temperature Fig.51 High level Output Voltage - Supply Voltage (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.52 High level Output Voltage - Ambient Temperature (RL=10[k]) Fig.53 Low level Output Voltage - Supply Voltage (RL=10[k]) Fig.54 Low level Output Voltage - Ambient Temperature (RL=10[k]) Fig.55 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 22/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.56 Output Source Current (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.57 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.58 Input Offset Voltage - Supply voltage Fig.59 Input Offset Voltage - Ambient Temperature (*)The data above is ability value of sample, it is not guaranteed. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.60 Input Bias Current - Supply voltage Fig.61 Input Bias Current - Ambient Temperature Fig.62 Large Signal Voltage Gain -Supply Voltage Fig.63 Large Signal Voltage Gain -Ambient Temperature www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.65 Common Mode Rejection Ratio -Ambient Temperature Fig.64 Common Mode Rejection Ratio -Supply Voltage Fig.67 Slew Rate L-H - Ambient Temperature (RL=10[k]) Fig.66 Slew Rate L-H - Supply Voltage (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.68 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.69 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.70 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k],CL=100[pF],Ta=25[]) (*) The data above is ability value of sample, it is not guaranteed. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R BA3474R Fig.71 Derating Curve Fig.72 Supply Current - Supply Voltage Fig.73 Supply Current - Ambient Temperature www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.74 High level Output Voltage - Supply Voltage (RL=10[k]) 27/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.76 Low level Output Voltage - Supply Voltage (RL=10[k]) Fig.75 High level Output Voltage - Ambient Temperature (RL=10[k]) Fig.77 Low level Output Voltage - Ambient Temperature (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.78 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) 28/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.79 Output Source Current - (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.80 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.81 Input Offset Voltage - Supply voltage Fig.82 Input Offset Voltage -Ambient Temperature (*)The data above is ability value of sample, it is not guaranteed www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 29/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.83 Input Bias Current - Supply voltage Fig.84 Input Bias Current - Ambient Temperature Fig.85 Large Signal Voltage Gain -Supply Voltage Fig.86 Large Signal Voltage Gain -Ambient Temperature www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 30/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.88 Common Mode Rejection Ratio -Ambient Temperature Fig.87 Common Mode Rejection Ratio -Supply Voltage Fig.89 Slew Rate L-H - Supply Voltage (RL=10[k]) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Fig.90 Slew Rate L-H - Ambient Temperature (RL=10[k]) 31/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Fig.92 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.91 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[k],CL=100[pF],Ta=25[]) Fig.93 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[k],CL=100[pF],Ta=25[]) (*)The data above is ability value of sample, it is not guaranteed www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 32/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Application Information Test circuit 1 NULL method VCC, VEE, EK, Vicm Unit : [V] Parameter VF S1 S2 S3 VCC VEE EK Vicm Calculation Input Offset Voltage VF1 ON ON OFF 15 -15 0 0 1 Input Offset Current VF2 OFF OFF OFF 15 -15 0 0 2 VF3 OFF ON VF4 ON OFF OFF 15 -15 0 0 3 ON ON ON 15 -15 +10 0 15 -15 -10 0 ON ON OFF 15 -15 0 -15 15 -15 0 13 ON ON OFF Input Bias Current VF5 Large Signal Voltage Gain VF6 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF7 VF8 VF9 Power Supply Rejection Ratio VF10 2 -2 0 0 18 -18 0 0 4 5 6 Calculation 1. Input Offset Voltage (Vio) Vio = | VF1 | 1 + Rf / Rs [V] C2 0.1[F] 2. Input Offset Current (Iio) Iio = | VF2VF1 | [A] Rf 50[k] Ri x(1 + Rf / Rs) S1 3. Input Bias Current (Ib) Ib = | VF4VF3 | Rs [A] 2xRix (1 + Rf / Rs) 50[] 10[k] Av = 20xLog Rs EKx(1+Rf /Rs) [dB] |VF5-VF6| 0.1[F] +15[V] RK 500[k] DUT NULL S3 Ri S2 Vicm EK C1 RK 500[k] Ri 50[] 10[k] 4. Large Signal Voltage Gain (Av) VCC VEE C3 1000[pF] RL -15[V] V VF 5. Common-mode Rejection Ratio (CMRR) CMRR = 20xLog Vicmx(1+Rf /Rs) |VF8-VF7| [dB] Fig.94 Test circuit 1 (one channel only) 6. Power Supply Rejection Ratio (PSRR) PSRR = 20xLog Vccx(1+Rf /Rs) |VF10-VF9| [dB] Test circuit2 switch condition SW No. SW 1 SW 2 SW 3 SW 4 SW 5 SW 6 SW 7 SW 8 SW 9 SW 10 SW 11 SW 12 SW 13 SW 14 Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF High Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF Low Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF Output Source Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Output Sink Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Slew Rate OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF OFF OFF Gain Bandwidth Product OFF ON OFF OFF ON ON OFF OFF ON ON OFF OFF OFF OFF Equivalent Input Noise Voltage ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 33/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Voltage SW4 VH R2 SW5 VL VCC A Input Voltage Waveform SW1 RS SW2 SW3 Voltage SW6 R1 SW7 SW8 time VH SW9 SW10 SW11 SW12 SW13 V SW14 VEE VIN- VIN+ A RL CL V VL V VOUT t Output Voltage Waveform Fig.95 Test circuit 2 (one channel only) time Fig.96 Slew rate input output wave Test circuit 3 Channel separation VCC VCC R1//R2 R1//R2 OTHER CH VEE VEE R1 VIN R2 R1 V VOUT2 R2 V VOUT1 =0.5[Vrms] CS20 x log 100 x VOUT1 VOUT2 Fig.97 Test circuit 3 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 34/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Derating curves Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja[/W].The temperature of IC inside the package can be estimated by this thermal resistance. Fig.98 (a) shows the model of thermal resistance of the package. Thermal resistance ja, ambient temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below: ja = (Tj-Ta) / Pd [/W] () Derating curve in Fig.98 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal resistance ja. Thermal resistance ja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.99(c) ~ (f) shows a derating curve for an example of BA3472, BA3474, BA3472R, BA3474R. LSI [W] Power dissipation of LSI Pd (max) ja = ( Tj Ta ) / Pd [/W] P2 Ambient temperature ja2 < ja1 Ta [] ' ja2 P1 ja2 Tj ' (max) Tj (max) ' ja1 Chip surface temperature ja1 Tj [] Power dissipation Pd [W] 0 P [W] 25 50 75 100 125 150 Ambient temperature Ta [ ] (b) Derating curve (a) Thermal resistance Fig. 98 Thermal resistance and derating curve 1000 1000 BA3472F POWER DISSIPATION Pd [mW] Pd [mW] Pd [mW] POWER DISSIPATION Pd [mW] 870mW(*13) 800 780mW(*10) 690mW(*11) BA3472FV 590mW(*12) 600 400 BA3472FVM 200 0 0 25 50 75 85 100 BA3474FV 800 610mW(*14) 600 400 BA3474F 200 0 125 0 Ta [] Ta [] Ambient Temperature: (c)BA3472 1000 50 75 85 100 125 (d)BA3474 1800 937mW(*17) BA3472RFVM 1689mW(*19) 1600 800 POWER DISSIPATION Pd [mW] Pd [mW] POWER DISSIPATION Pd [mW] Pd [mW] 25 Ambient Temperature: Ta [] Ta [] 713mW(*16) 625mW(*15) 600 590mW(*12) 400 200 BA3474RFV 1400 1187mW(*18) 1200 1000 870mW(*13) 800 600 400 200 105 0 105 0 0 25 50 75 100 [] Ta [] Ambient Temperature: 125 0 25 50 75 100 125 Ta [] Ta [] Ambient Temperature: (e)BA3472R (f)BA3474R (*10) (*11) (*12) (*13) (*14) (*15) (*16) (*17) (*18) (*19) Unit 6.2 5.5 4.7 7.0 4.9 5.0 5.7 7.5 9.5 13.5 [mW/] When using the unit above Ta=25[], subtract the value above per degree[]. (*10) (*11) (*12) (*13) (*14) Mounted on a glass epoxy 1 layers PCB 70[mm]x70[mm]x1.6[mm] (occupied copper areabelow 3[%]). (*15) Mounted on a glass epoxy 2 layers PCB 70[mm]x70[mm]x1.6[mm] (occupied copper area15mmx15mm). (*16) (*18) Mounted on a glass epoxy 2 layers PCB 70[mm]x70[mm]x1.6[mm] (occupied copper area70mmx70mm). (*17) (*19) Mounted on a glass epoxy 4 layers PCB 70[mm]x70[mm]x1.6[mm] (occupied copper area70mmx70mm). Fig. 99 Derating curve www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 35/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Operational Notes 1) Unused circuits When there are unused circuits it is recommended that they are connected as in Fig.100, setting the non-inverting input terminal to a potential within input common-mode voltage range (Vicm). 2) Input terminal voltage Applying GND + 36V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 3) Power supply (single / dual) The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be used as dual supply op-amp as well. VCC Please keep this potential in Vicm + VEE Fig.100 Unused circuit example 4) Power dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 5) Short-circuit between pins and erroneous mounting Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power supply, or the output and GND may result in IC destruction. 6) Operation in a strong electromagnetic field Operation in a strong electromagnetic field may cause malfunctions. 7) Radiation This IC is not designed to withstand radiation. 8) IC handing Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezoelectric (piezo) effects. 9) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. 10) Output capacitor Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE, causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance less than 0.1F. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 36/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Physical Dimensions Tape and Reel Information SOP8 <Tape and Reel information> 7 6 5 6.20.3 4.40.2 0.3MIN 8 +6 4 -4 1 2 3 0.90.15 5.00.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.50.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.420.1 Reel (Unit : mm) Direction of feed Order quantity needs to be multiple of the minimum quantity. SOP14 <Tape and Reel information> 8.7 0.2 (MAX 9.05 include BURR) 8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed 0.3MIN 4.40.2 6.20.3 14 1 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 7 1.50.1 0.15 0.1 0.11 1.27 0.4 0.1 0.1 1pin Reel (Unit : mm) Direction of feed Order quantity needs to be multiple of the minimum quantity. SSOP-B8 <Tape and Reel information> 3.00.2 (MAX 3.35 include BURR) 0.3MIN 4.4 0.2 6.4 0.3 876 5 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1.15 0.1 1 23 4 0.150.1 0.1 S 0.1 0.220.10 (0.52) 0.08 M 0.65 1pin Reel (Unit : mm) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 37/39 Direction of feed Order quantity needs to be multiple of the minimum quantity. TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R SSOP-B14 <Tape and Reel information> 5.0 0.2 8 1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed 0.3Min. 4.4 0.2 6.4 0.3 14 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 7 0.10 1.15 0.1 0.15 0.1 0.1 0.65 0.22 0.1 Direction of feed 1pin Reel (Unit : mm) Order quantity needs to be multiple of the minimum quantity. MSOP8 <Tape and Reel information> 2.80.1 4.00.2 8 7 6 5 0.60.2 +6 4 -4 0.290.15 2.90.1 (MAX 3.25 include BURR) Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 1PIN MARK 1pin +0.05 0.145 -0.03 0.475 0.080.05 0.750.05 0.9MAX S +0.05 0.22 -0.04 0.08 S Direction of feed 0.65 Reel (Unit : mm) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 38/39 Order quantity needs to be multiple of the minimum quantity. TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet BA3472, BA3472R, BA3474, BA3474R Marking Diagrams SOP8(TOP VIEW) SOP14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SSOP-B8(TOP VIEW) SSOP-B14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK MSOP8(TOP VIEW) Part Number Marking Product Name LOT Number BA3472 1PIN MARK BA3474 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 39/39 F FV FVM RFVM F FV RFV Package Type SOP8S SSOP-B8 MSOP8 MSOP8 SOP14 SSOP-B14 SSOP-B14 Marking 3472 3472R 3474F 3474 3474R TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet Notice Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation 3) The products are not radiation resistant. 4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. 5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 7) Confirm that operation temperature is within the specified range described in product specification. 8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed. Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Notice - Rev.001 Datasheet Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period . 3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use products within the specified time after opening a dry bag. Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number. Precaution for disposition When disposing products please dispose them properly with a industry waste company. Precaution for Foreign exchange and Foreign trade act Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Prohibitions Regarding Industrial Property 1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. Notice - Rev.001