BA3472FV-E2 - Rohm Semiconductor

www.rohm.com TSZ02201-0RAR0G200100-1-2

1/39 27.FEB.2012 Rev.001

TSZ22111･14･001

Datasheet

Operational Amplifiers / Comparators

High Speed with High Voltage

Operational Amplifiers

BA3472, BA3472R, BA3474, BA3474R

●General Description

General-purpose BA3472,BA3472R,BA3474,BA3474R

integrate two/four Independent Op-amps and phase

compensation capacitors on a single chip and have some

features of high-gain, and wide operating voltage range of

+3[V] to +36[V](single power supply). Especially,

characteristics are high slew rate (10[V/μs]) and high

Maximum frequency (4[MHz]).

●Features

 Operable with a single power supply

 Wide operating supply voltage

 Standard Op-Amp. Pin-assignments

 Internal phase compensation

 High open loop voltage gain

 Internal ESD protection

 Operable low input voltage around GND level

 Wide output voltage range

●Packages (Typ.) (Typ.) (Max.)

MSOP8 2.90mm x 4.00mm x 0.90mm

SSOP-B8 3.00mm x 6.40mm x 1.35mm

SSOP-B14 5.00mm x 6.40mm x 1.35mm

SOP8 5.00mm x 6.20mm x 1.71mm

SOP14 8.70mm x 6.20mm x 1.71mm

●Key Specifications

 Wide Operating Supply Voltage:

Single supply +3.0[V] to +36.0[V]

Dual supply ±1.5[V] to ±18.0[V]

 Wide Temperature Range:

BA3474F -40[°C] to +75[°C]

BA3472F BA3472FV

BA3472FVM BA3474FV -40[°C] to +85[°C]

BA3472RFVM

BA3474RFV -40[°C] to +105[°C]

 Low Input Offset Current: 6[nA] (Typ.)

 Low Input Bias Current: 100[nA] (Typ.)

 Wide Output Voltage Range:

VEE+0.3[V]-VCC-1.0[V](Typ.)

with VCC-VEE=30[V]

 High Slew Rate: 10[V/µs]

 Maximum Frequency: 4[MHz]

 Human Body Model (HBM): ±5000[V] (Typ.)

●Selection Guide

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

Hi

g

h S

p

eed

Quad

Dual 30

[

mA

]

/ 30

[

mA

]

30

[

mA

]

/ 30

[

mA

]

10

[

V/

µ

s

]

10

[

V/

µ

s

]

Output Current

Source/Sink Slew Rate

+85[°C]

Operation guaranteed

+75[°C]

+105[°C]

BA3474F

BA3472RFVM

BA3472F

BA3472FV

BA3472FVM

BA3474FV BA3474RFV

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

2/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Pin Configuration(TOP VIEW)

●Ordering Information

B A 3 4 7 x F x x - x x

Part Number

Package

F : SOP8

SOP14

FV : SSOP-B8

SSOP-B14

FVM : MSOP8

Packaging and forming specification

E2: Embossed tape and reel

(SOP8/SOP14/SSOP-B8/SSOP-B14)

TR: Embossed tape and reel

(MSOP8)

●Lineup

Topr Supply

Current

(Typ.)

Slew Rate

(Typ.) Package Orderable

Part Number

-40°C to +75°C 8.0mA

10.0V/µs

SOP14 Reel of 2500 BA3474F-E2

-40°C to +85°C 4.0mA

SOP8 Reel of 2500 BA3472F-E2

SSOP-B8 Reel of 2500 BA3472FV-E2

MSOP8 Reel of 3000 BA3472FVM-TR

8.0mA SSOP-B14 Reel of 2500 BA3474FV-E2

-40°C to +105°C 4.0mA MSOP8 Reel of 3000 BA3472RFVM-TR

8.0mA SSOP-B14 Reel of 2500 BA3474RFV-E2

SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14

B

A

3472F BA3472FV BA3472FVM

BA3472RFVM

BA3474F BA3474FV

BA3474RFV

45

36

27

18

CH1

- +

CH2

+ -

OUT1

-IN1

+IN1

VEE

OUT2

-IN2

+IN2

VCC

78

69

510

411

312

213

114

CH4

+ -

CH1

- +

OUT1

-IN1

+IN1

VCC

OUT3

+IN3

-IN3

VEE

CH2

- + + -

CH3

OUT4

-IN4

+IN4

OUT2

+IN2

-IN2

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

3/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Absolute Maximum Ratings (Ta=25[℃])

Parameter Symbol

Ratings

Unit

BA3472

BA3474

BA3472R

BA3474R

Supply Voltage VCC-VEE +36 V

Differential Input Voltage (*1) Vid 36 V

Input Common-mode

Voltage Range Vicm (VEE - 0.3) to VEE + 36 V

Operating Temperature Range Topr -40 to +85(SOP14:+75) -40 to +105 ℃

Storage Temperature Range Tstg -55 to +150 ℃

Maximum Junction Temperature Tjmax +150

℃

Note: Absolute maximum rating item indicates the condition which must not be exceeded.

Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause

deterioration of characteristics.

(*1) The voltage difference between inverting input and non-inverting input is the differential input voltage.

Then input terminal voltage is set to more than VEE.

●Electrical Characteristics

○BA3472 (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃])

Parameter Symbol

Temperature

range

Limits

Unit Condition BA3472F/FV/FVM

Min. Typ. Max.

Input Offset Voltage (*2) Vio 25℃

- 1 10

mV

Vicm=0[V],VOUT=0[V]

- 1.5 10 VCC=5[V],VEE=0[V],Vicm=0[V],

VOUT=VCC/2

Input Offset Current (*2) Iio 25℃- 6 75 nA Vicm=0[V],VOUT=0[V]

Input Bias Current (*2) Ib 25℃- 100 500 nA Vicm=0[V],VOUT=0[V]

Supply Current ICC 25℃- 4 5.5 mA RL=∞

High Level Output Voltage VOH 25℃

3.7 4 -

V

VCC=5[V],RL=2[kΩ]

13.7 14 - RL=10[kΩ]

13.5 - - RL=2[kΩ]

Low Level Output Voltage VOL 25℃

- 0.1 0.3

V

VCC=5[V],RL=2[kΩ]

- -14.7 -14.3 RL=10[kΩ]

- - -13.5 RL=2[kΩ]

Large Signal Voltage Gain AV 25℃80 100 - dB RL≧2[kΩ],VOUT=±10 [V]

Input Common-mode

Voltage Range Vicm 25℃0 - VCC-2.0 V

VCC=5[V],VEE=0[V],

VOUT=VCC/2

Common-mode Rejection Ratio CMRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Power Supply Rejection Ratio PSRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Output Source Current (*3) IOH 25℃10 30 - mA

VCC=5[V],VIN+=1[V],

VIN-=0[V],VOUT=0[V]

Only 1ch is short circuit

Output Sink Current (*3) IOL 25℃20 30 - mA

VCC=5[V],VIN+=0[V],

VIN-=1[V],VOUT=5[V],

Only 1ch is short circuit

Maximum Frequency ft 25℃- 4 - MHz -

Slew Rate SR 25℃- 10 - V/μsAv=1,Vin=-10 to +10[V],

RL=2[kΩ]

Channel Separation CS 25℃- 120 - dB -

(*2) Absolute value

(*3) Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

4/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

○BA3472R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃])

Parameter Symbol

Temperature

range

Limits

Unit Condition

BA3472RFVM

Min. Typ. Max.

Input Offset Voltage (*4) Vio 25℃

- 1 10

mV

Vicm=0[V],VOUT=0[V]

- 1.5 10 VCC=5[V],VEE=0[V],Vicm=0[V],

VOUT=VCC/2

Input Offset Current (*4) Iio 25℃- 6 75 nA Vicm=0[V],VOUT=0[V]

Input Bias Current (*4) Ib 25℃- 100 500 nA Vicm=0[V],VOUT=0[V]

Supply Current ICC 25℃- 4 5.5 mA RL=∞

High Level Output Voltage VOH 25℃

3.7 4 -

V

VCC=5[V],RL=2[kΩ]

13.7 14 - RL=10[kΩ]

13.5 - - RL=2[kΩ]

Low Level Output Voltage VOL 25℃

- 0.1 0.3

V

VCC=5[V],RL=2[kΩ]

- -14.7 -14.3 RL=10[kΩ]

- - -13.5 RL=2[kΩ]

Large Signal Voltage Gain AV 25℃80 100 - dB RL≧2[kΩ],VOUT=±10 [V]

Input Common-mode

Voltage Range Vicm 25℃0 - VCC-2.0 V

VCC=5[V],VEE=0[V],

VOUT=VCC/2

Common-mode Rejection Ratio CMRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Power Supply Rejection Ratio PSRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Output Source Current (*5) IOH 25℃10 30 - mA

VCC=5[V],VIN+=1[V],

VIN-=0[V], VOUT=0[V]

Only 1ch is short circuit

Output Sink Current (*5) IOL 25℃20 30 - mA

VCC=5[V],VIN+=0[V],

VIN-=1[V], VOUT=5[V]

Only 1ch is short circuit

Maximum Frequency ft 25℃- 4 - MHz -

Slew Rate SR 25℃- 10 - V/μsAv=1,Vin=-10 to +10[V],

RL=2[kΩ]

Channel Separation CS 25℃- 120 - dB -

(*4) Absolute value

(*5) Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

5/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

○BA3474 (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃])

Parameter Symbol

Temperature

range

Limits

Unit Condition BA3474F/FV

Min. Typ. Max.

Input Offset Voltage (*6) Vio 25℃

- 1 10

mV

Vicm=0[V],VOUT=0[V]

- 1.5 10 VCC=5[V],VEE=0[V], Vicm=0[V]

VOUT=VCC/2

Input Offset Current (*6) Iio 25℃- 6 75 nA Vicm=0[V],VOUT=0[V]

Input Bias Current (*6) Ib 25℃- 100 500 nA Vicm=0[V],VOUT=0[V]

Supply Current ICC 25℃- 8 11 mA RL=∞

High Level Output Voltage VOH 25℃

3.7 4 -

V

VCC=5[V],RL=2[kΩ]

13.7 14 - RL=10[kΩ]

13.5 - - RL=2[kΩ]

Low Level Output Voltage VOL 25℃

- 0.1 0.3

V

VCC=5[V],RL=2[kΩ]

- -14.7 -14.3 RL=10[kΩ]

- - -13.5 RL=2[kΩ]

Large Signal Voltage Gain AV 25℃80 100 - dB RL≧2[kΩ], VOUT=±10 [V]

Input Common-mode Voltage

Range Vicm 25℃0 - VCC-2.0 V

VCC=5[V],VEE=0[V],

VOUT=VCC/2

Common-mode Rejection Ratio CMRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Power Supply Rejection Ratio PSRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Output Source Current (*7) IOH 25℃10 30 - mA

VCC=5[V],VIN+=1[V],

VIN-=0[V], VOUT=0[V]

Only 1ch is short circuit

Output Sink Current (*7) IOL 25℃20 30 - mA

VCC=5[V],VIN+=0[V],

VIN-=1[V], VOUT=5[V]

Only 1ch is short circuit

Maximum Frequency ft 25℃- 4 - MHz -

Slew Rate SR 25℃- 10 - V/μsAv=1,Vin=-10 to +10[V],

RL=2[kΩ]

Channel Separation CS 25℃- 120 - dB -

(*6) Absolute value

(*7) Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

6/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

○BA3474R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃])

Parameter Symbol

Temperature

range

Limits

Unit Condition BA3474RFV

Min. Typ. Max.

Input Offset Voltage (*8) Vio

25℃

- 1 10

mV

Vicm=0[V],VOUT=0[V]

- 1.5 10 VCC=5[V],VEE=0[V],Vicm=0[V],

VOUT=VCC/2

Input Offset Current (*8) Iio 25℃- 6 75 nA Vicm=0[V],VOUT=0[V]

Input Bias Current (*8) Ib 25℃- 100 500 nA Vicm=0[V],VOUT=0[V]

Supply Current ICC 25℃- 8 11 mA RL=∞

High Level Output Voltage VOH

25℃

3.7 4 -

V

VCC=5[V],RL=2[kΩ]

13.7 14 - RL=10[kΩ]

13.5 - - RL=2[kΩ]

Low Level Output Voltage VOL

25℃

- 0.1 0.3

V

VCC=5[V],RL=2[kΩ]

- -14.7 -14.3 RL=10[kΩ]

- - -13.5 RL=2[kΩ]

Large Signal Voltage Gain AV 25℃80 100 - dB RL≧2[kΩ],VOUT=±10 [V]

Input Common-mode Voltage

Range Vicm 25℃0 - VCC-2.0 V

VCC=5[V],VEE=0[V],

VOUT=VCC/2

Common-mode Rejection Ratio CMRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Power Supply Rejection Ratio PSRR 25℃60 97 - dB Vicm=0[V],VOUT=0[V]

Output Source Current (*9) IOH 25℃10 30 - mA

VCC=5[V],VIN+=1[V],

VIN-=0[V],VOUT=0[V],

Only 1ch is short circuit

Output Sink Current (*9) IOL 25℃20 30 - mA

VCC=5[V],VIN+=0[V],

VIN-=1[V],VOUT=5[V],

Only 1ch is short circuit

Maximum Frequency ft 25℃- 4 - MHz -

Slew Rate SR 25℃- 10 - V/μsAv=1,Vin=-10 to +10[V],RL=2[kΩ]

Channel Separation CS 25℃- 120 - dB -

(*8) Absolute value

(*9) Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

7/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Description of Electrical Characteristics

Described below are descriptions of the relevant electrical terms

Please note that item names, symbols and their meanings may differ from those on another manufacturer’s documents.

1. Absolute maximum ratings

The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of

electrical characteristics or damage to the part itself as well as peripheral components.

1.1 Power supply voltage (VCC-VEE)

Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without

causing deterioration of the electrical characteristics or destruction of the internal circuitry.

1.2 Differential input voltage (Vid)

Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without

damaging the IC.

1.3 Input common-mode voltage range (Vicm)

Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing

deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the

common-mode voltage range of the maximum ratings – use within the input common-mode voltage range of the

electric characteristics instead.

1.4 Power dissipation (Pd)

Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃). For

packaged products, Pd is determined by the maximum junction temperature and the thermal resistance.

2. Electrical characteristics

2.1 Input offset voltage (Vio)

Signifies the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input

voltage difference required for setting the output voltage to 0 V.

2.2 Input offset current (Iio)

Indicates the difference of input bias current between the non-inverting and inverting terminals.

2.3 Input bias current (Ib)

Denotes the current that flows into or out of the input terminal, it is defined by the average of the input bias current at

the non-inverting terminal and the input bias current at the inverting terminal.

2.4 Circuit current (ICC)

Indicates the current of the IC itself that flows under specified conditions and during no-load steady state.

2.5 maximum output voltage (VOM)

Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into

high-level output voltage and low-level output voltage.

2.6 Large signal voltage gain (AV)

The amplifying rate (gain) of the output voltage against the voltage difference between non-inverting and inverting

terminals, it is (normally) the amplifying rate (gain) with respect to DC voltage.

AV = (output voltage fluctuation) / (input offset fluctuation)

2.7 Input common-mode voltage range (Vicm)

Indicates the input voltage range under which the IC operates normally.

2.8 Common-mode rejection ratio (CMRR)

Signifies the ratio of fluctuation of the input offset voltage when the in-phase input voltage is changed (DC fluctuation).

CMRR = (change in input common-mode voltage) / (input offset fluctuation)

2.9 Power supply rejection ratio (PSRR)

Denotes the ratio of fluctuation of the input offset voltage when supply voltage is changed (DC fluctuation).

SVR = (change in power supply voltage) / (input offset fluctuation)

2.10 Channel separation (CS)

Expresses the amount of fluctuation of the input offset voltage or output voltage with respect to the change in the

output voltage of a driven channel.

2.11 Slew rate (SR)

Indicates the time fluctuation ratio of the output voltage when an input step signal is supplied.

2.12 Maximum frequency (ft)

Indicates a frequency where the voltage gain of Op-Amp is 1.

2.13 Total harmonic distortion + Noise (THD+N)

Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage

of driven channel.

2.14 Input referred noise voltage (Vn)

Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in

series with input terminal.

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

8/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Circuit Diagram

VCC

VIN-

V

IN+

VEE

VOUT

Fig.1 Schematic diagram (one channel only)

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

9/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Typical Performan ce Curves

BA3472

Fig.2

Derating Curve

Fig.3

Supply Current - Supply Voltage

Fig.4

Supply Current - Ambient Temperature Fig.5

High level Output Voltage - Supply Voltage

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

10/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.6

High level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.7

Low level Output Voltage

- Supply Voltage

(RL=10[kΩ])

Fig.8

Low level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.9

Output Source Current - (VCC-VOUT)

(VCC/VEE=5[V]/0[V])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

11/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*)The data above is ability value of sample, it is not guaranteed

Fig.10

Output Source Current - (VOUT-VEE)

(VCC/VEE=5[V]/0[V])

Fig.11

Input Offset Voltage

- Common Model Input Voltage

(VCC/VEE=15[V]/-15[V])

Fig.12

Input Offset Voltage - Supply voltage

Fig.13

Input Offset Voltage - Ambient Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

12/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.14

Input Bias Current - Supply voltage

Fig.15

Input Bias Current - Ambient Temperature

Fig.16

Large Signal Voltage Gain

-Supply Voltage

Fig.17

Large Signal Voltage Gain

-Ambient Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

13/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.18

Common Mode Rejection Ratio

-Supply Voltage

Fig.19

Common Mode Rejection Ratio

-Ambient Temperature

Fig.20

Slew Rate L-H - Supply Voltage

(RL=10[kΩ])

Fig.21

Slew Rate L-H - Ambient Temperature

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

14/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*)The data above is ability value of sample, it is not guaranteed

Fig.22

Voltage Gain - Frequency

(VCC=7.5[V]/-7.5[V], Av=40[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.23

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.24

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ], CL=100[pF], Ta=25[℃])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

15/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

BA3474

Fig.25

Derating Curve

Fig.26

Supply Current - Supply Voltage

Fig.27

Supply Current - Ambient Temperature Fig.28

High level Output Voltage

- Supply Voltage

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

16/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.29

High level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.30

Low level Output Voltage

- Supply Voltage

(RL=10[kΩ])

Fig.31

Low level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.32

Output Source Current - (VCC-VOUT)

(VCC/VEE=5[V]/0[V])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

17/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*)The data above is ability value of sample, it is not guaranteed

Fig.33

Output Source Current - (VOUT-VEE)

(VCC/VEE=5[V]/0[V])

Fig.34

Input Offset Voltage

- Common Model Input Voltage

(VCC/VEE=15[V]/-15[V])

Fig.35

Input Offset Voltage - Supply voltage

Fig.36

Input Offset Voltage -Ambient Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

18/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.37

Input Bias Current - Supply voltage Fig.38

Input Bias Current - Ambient Temperature

Fig.39

Large Signal Voltage Gain

-Supply Voltage

Fig.40

Large Signal Voltage Gain

-Ambient Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

19/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.41

Common Mode Rejection Ratio

-Supply Voltage

Fig.42

Common Mode Rejection Ratio

-Ambient Temperature

Fig.43

Slew Rate L-H - Supply Voltage

(RL=10[kΩ])

Fig.44

Slew Rate L-H - Ambient Temperature

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

20/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*)The data above is ability value of sample, it is not guaranteed.

Fig.45

Voltage Gain - Frequency

(VCC=7.5[V]/-7.5[V], Av=40[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.46

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.47

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

21/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

BA3472R

Fig.48

Derating Curve

Fig.49

Supply Current - Supply Voltage

Fig.50

Supply Current - Ambient

Temperature

Fig.51

High level Output Voltage

- Supply Voltage

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

22/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.52

High level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.53

Low level Output Voltage

- Supply Voltage

(RL=10[kΩ])

Fig.54

Low level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.55

Output Source Current - (VCC-VOUT)

(VCC/VEE=5[V]/0[V])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

23/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*)The data above is ability value of sample, it is not guaranteed.

Fig.56

Output Source Current -

(VOUT-VEE)

(

VCC/VEE=5

[

V

]

/0

[

V

])

Fig.57

Input Offset Voltage

- Common Model Input Voltage

(VCC/VEE=15[V]/-15[V])

Fig.58

Input Offset Voltage - Supply voltage

Fig.59

Input Offset Voltage - Ambient

Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

24/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.60

Input Bias Current - Supply

voltage

Fig.61

Input Bias Current - Ambient

Temperature

Fig.62

Large Signal Voltage Gain

-Supply Voltage

Fig.63

Large Signal Voltage Gain

-Ambient Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

25/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.64

Common Mode Rejection Ratio

-Supply Voltage

Fig.65

Common Mode Rejection Ratio

-Ambient Temperature

Fig.66

Slew Rate L-H - Supply Voltage

(RL=10[kΩ])

Fig.67

Slew Rate L-H - Ambient Temperature

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

26/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*) The data above is ability value of sample, it is not guaranteed.

Fig.68

Voltage Gain - Frequency

(VCC=7.5[V]/-7.5[V], Av=40[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.69

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.70

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

27/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

BA3474R

Fig.71

Derating Curve

Fig.72

Supply Current - Supply Voltage

Fig.73

Supply Current - Ambient Temperature Fig.74

High level Output Voltage

- Supply Voltage

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

28/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.75

High level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.76

Low level Output Voltage

- Supply Voltage

(RL=10[kΩ])

Fig.77

Low level Output Voltage

- Ambient Temperature

(RL=10[kΩ])

Fig.78

Output Source Current - (VCC-VOUT)

(VCC/VEE=5[V]/0[V])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

29/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*)The data above is ability value of sample, it is not guaranteed

Fig.79

Output Source Current - (VOUT-VEE)

(VCC/VEE=5[V]/0[V])

Fig.80

Input Offset Voltage

- Common Model Input Voltage

(VCC/VEE=15[V]/-15[V])

Fig.81

Input Offset Voltage - Supply voltage

Fig.82

Input Offset Voltage -Ambient Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

30/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.83

Input Bias Current - Supply voltage

Fig.84

Input Bias Current - Ambient Temperature

Fig.85

Large Signal Voltage Gain

-Supply Voltage

Fig.86

Large Signal Voltage Gain

-Ambient Temperature

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

31/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Fig.87

Common Mode Rejection Ratio

-Supply Voltage

Fig.88

Common Mode Rejection Ratio

-Ambient Temperature

Fig.89

Slew Rate L-H - Supply Voltage

(RL=10[kΩ])

Fig.90

Slew Rate L-H - Ambient Temperature

(RL=10[kΩ])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

32/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

(*)The data above is ability value of sample, it is not guaranteed

Fig.91

Voltage Gain - Frequency

(VCC=7.5[V]/-7.5[V], Av=40[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.92

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Fig.93

Input / Output Voltage - Time

(VCC/VEE=15[V]/-15[V], Av=0[dB],

RL=2[kΩ],CL=100[pF],Ta=25[℃])

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

33/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Applic at ion Informa tion

Test circuit 1 NULL method

VCC, VEE, EK, Vicm Unit : [V]

Parameter VF S1 S2 S3 VCC VEE EK Vicm Calculation

Input Offset Voltage VF1 ON ON OFF 15 -15 0 0 1

Input Offset Current VF2 OFF OFF OFF 15 -15 0 0 2

Input Bias Current VF3 OFF ON OFF 15 -15 0 0 3

VF4 ON OFF

Large Signal Voltage Gain VF5 ON ON ON 15 -15 +10 0 4

VF6 15 -15 -10 0

Common-mode Rejection Ratio

(Input Common-mode Voltage Range)

VF7 ON ON OFF 15 -15 0 -15 5

VF8 15 -15 0 13

Power Supply Rejection Ratio VF9 ON ON OFF 2 -2 0 0 6

VF10 18 -18 0 0

－Calculation－

1. Input Offset Voltage (Vio)

2. Input Offset Current (Iio)

3. Input Bias Current (Ib)

4. Large Signal Voltage Gain (Av)

5. Common-mode Rejection Ratio (CMRR)

6. Power Supply Rejection Ratio (PSRR)

Test circuit2 switch condition

SW No. SW

1

SW

2

SW

3

SW

4

SW

5

SW

6

SW

7

SW

8

SW

9

SW

10

SW

11

SW

12

SW

13

SW

14

Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF

High Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF

Low Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF

Output Source Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON

Output Sink Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON

Slew Rate OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF OFF OFF

Gain Bandwidth Product OFF ON OFF OFF ON ON OFF OFF ON ON OFF OFF OFF OFF

Equivalent Input Noise Voltage ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF

Fig.94 Test circuit 1 (one channel only)

| VF1 |

Vio =

1 + Rf / Rs

[V]

| VF2－VF1 |

Iio =

Ri ×(1 + Rf / Rs)

[A]

| VF4－VF3 |

Ib =

2×Ri× (1 + Rf / Rs)

[A]

ΔEK×(1+Rf /Rs)

A

v = 20×Log

|VF5-VF6| [dB]

ΔVicm×(1+Rf /Rs)

CMRR = 20×Log

|VF8-VF7|

[dB]

ΔVcc×(1+Rf /Rs)

PSRR = 20×Log

|VF10-VF9|

[dB]

VCC

C2

0.1[µF]

Rf

50[kΩ]

S1

RiRs

10[kΩ]50[Ω]

10[kΩ]

50[Ω]

Ri

Rs

S2 RL

S3

1000[pF]

C3

500[kΩ]

500[kΩ]0.1[µF]

RK

EK

RK C1

+15[V]

-15[V]

NULL

VVF

DUT

VEE

Vicm

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

34/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Test circuit 3 Channel separation

VH

VL

Δ

t

ΔV

出力電圧波形時間

電圧

Output Voltage Waveform time

Voltage

Input Voltage Waveform time

VH

VL

Voltage

Fig.95 Test circuit 2 (one channel only) Fig.96 Slew rate input output wave

Fig.97 Test circuit 3

SW1 SW2 SW3

－

＋

SW10 SW11 SW12

A

VIN- VIN+ RL

VCC

VEE

SW9

～～

SW6 SW7 SW8

～

CL

SW13 SW14

A

V

VOUT

RS

SW5

SW4

V

R1

R2

VCC

VEE

R1

V

R2

R1//R2

VOUT1

=0.5[Vrms]

VIN

VCC

VEE

R1

V

R2

R1//R2

VOUT2

OTHER

CH

CS＝20 × log 100 × VOUT1

VOUT2

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

35/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Derating curves

Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated

when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that

can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.

Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal

resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum

value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead

frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called

thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this

thermal resistance. Fig.98 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient

temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:

θja = (Tj-Ta) / Pd [℃/W] ・・・・・ (Ⅰ)

Derating curve in Fig.98 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal

resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package

condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value

measured at a specified condition. Fig.99(c) ~ (f) shows a derating curve for an example of BA3472, BA3474, BA3472R,

BA3474R.

(*10) (*11) (*12) (*13) (*14) (*15) (*16) (*17) (*18) (*19) Unit

6.2 5.5 4.7 7.0 4.9 5.0 5.7 7.5 9.5 13.5 [mW/℃]

When using the unit above Ta=25[℃], subtract the value above per degree[℃].

(*10) (*11) (*12) (*13) (*14) Mounted on a glass epoxy 1 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：below 3[%]).

(*15) Mounted on a glass epoxy 2 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：15mm×15mm).

(*16) (*18) Mounted on a glass epoxy 2 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：70mm×70mm).

(*17) (*19) Mounted on a glass epoxy 4 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：70mm×70mm).

Fig. 99 Derating curve

Fig. 98 Thermal resistance and derating curve

(a) Thermal resistance (b) Derating curve

周囲温度 Ta [℃]

チップ表面温度 Tj [℃]

消費電力 P [W]

θja = ( Tj ーTa ) / Pd [℃/W]

Ambient temperature

Chip surface temperature

0 50 75 100 125 15025

P1

P2

Pd (max)

LSIの消費電力 [W]

θ' ja2

θ' ja1

Tj ' (m ax)

θja2 < θja1

周囲温度 Ta [ ℃]

θ ja2

θ ja1

Tj (m ax )

Ambient temperature

Power dissipation of LSI

Power dissipation Pd [W]

0

200

400

600

800

1000

0 25 50 75 100 125

周囲温度 [℃]

許容損失 Pd [mW]

0

200

400

600

800

1000

1200

1400

1600

1800

0 25 50 75 100 125

周囲温度 Ta [℃]

許容損失 Pd [mW]

(e)BA3472R (f)BA3474R

BA3472RFVM

590mW(*12)

BA3474RFV

105 105

870mW(*13)

625mW(*15)

713mW(*16)

937mW(*17)

1187mW(*18)

1689mW(*19)

0

200

400

600

800

1000

0 25 50 75 100 125

周囲温度 Ta [℃]

許容損失 Pd [mW]

0

200

400

600

800

1000

0 25 50 75 100 125

周囲温度 Ta [℃]

許容損失 Pd [mW]

(c)BA3472

870mW(*13)

590mW(*12)

BA3472FVM

BA3472F

BA3472FV

(d)BA3474

780mW(*10)

690mW(*11)

610mW(*14)

BA3474F

BA3474FV

85 85

POWER DISSIPATION Pd [mW]

Ambient Temperature: Ta [℃] Ambient Temperature: Ta [℃]

Ambient Temperature: Ta [℃]

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

36/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Operational Notes

1) Unused circuits

When there are unused circuits it is recommended that they are connected

as in Fig.100, setting the non-inverting input terminal to a potential within

input common-mode voltage range (Vicm).

2) Input terminal voltage

Applying GND + 36V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, irrespective of

the supply voltage. However, this does not ensure normal circuit operation.

Please note that the circuit operates normally only when the input voltage is

within the common mode input voltage range of the electric characteristics.

3) Power supply (single / dual)

The op-amp operates when the specified voltage supplied is between VCC

and VEE. Therefore, the single supply op-amp can be used as dual supply

op-amp as well.

4) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in

chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation

(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating

curves for more information.

5) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and

the power supply, or the output and GND may result in IC destruction.

6) Operation in a strong electromagnetic field

Operation in a strong electromagnetic field may cause malfunctions.

7) Radiation

This IC is not designed to withstand radiation.

8) IC handing

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical

characteristics due to piezoelectric (piezo) effects.

9) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every

process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the

power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly

process as well as during transportation and storage.

10) Output capacitor

Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,

causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation

due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance

less than 0.1µF.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

Fig.100 Unused circuit example

VCC

VEE

+

-

Please keep this

potential in Vicm

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

37/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Physical Dimensions Tape and Reel Information

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm)

SOP8

0.9±0.15

0.3MIN

4

°

+

6

°

−

4

°

0.17 +0.1

-

0.05

0.595

6

43

8

2

5

1

7

5.0±0.2

6.2±0.3

4.4±0.2

(MAX 5.35 include BURR)

1.27

0.11

0.42±0.1

1.5±0.1

S

0.1 S

(Unit : mm)

SOP14

7

14

1.27

0.11

1

8

0.3MIN

8.7±0.2

0.4±0.1

0.15±0.1

1.5±0.1

6.2±0.3

4.4±0.2

(MAX 9.05 include BURR)

0.1

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm)

SSOP-B8

0.08 M

1234

5678

0.1

0.22±0.10

0.3MIN

0.65

(0.52)

3.0±0.2

0.15±0.1

6.4±0.3

1.15±0.1 4.4±0.2

(MAX 3.35 include BURR)

S

0.1

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

38/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

Direction of feed

Reel ∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

TR

()

1pin

(Unit : mm)

MSOP8

0.08 S

S

4.0±0.2

8

3

2.8±0.1

1

6

2.9±0.1

0.475

4

57

(MAX 3.25 include BURR)

2

1PIN MARK

0.9MAX

0.75±0.05

0.65

0.08±0.05

0.22 +0.05

−0.04

0.6±0.2

0.29±0.15

0.145 +0.05

−0.03

4°

+6°

−4°

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm)

SSOP-B14

8

7

14

1

0.10

6.4 ± 0.3

4.4

±

0.2

5.0 ± 0.2

0.22 ± 0.1

1.15 ± 0.1

0.65

0.15 ± 0.1

0.3Min.

0.1

Datasheet

www.rohm.com TSZ02201-0RAR0G200100-1-2

39/39 27.FEB.2012 Rev.001

TSZ22111･15･001

BA3472, BA3472R, BA3474, BA3474R

●Marking Diagrams

Product Name Package Type Marking

BA3472

F SOP8S

3472

FV SSOP-B8

FVM MSOP8

RFVM MSOP8 3472R

BA3474

F SOP14 3474F

FV SSOP-B14 3474

RFV SSOP-B14 3474R

SOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SOP14(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SSOP-B8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SSOP-B14(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Datasheet

Notice - Rev.001

Notice

●Precaution for circuit design

1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA

equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be

used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,

nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose

malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the

ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,

sufficient fail-safe measures must be taken, including the following:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits in the case of single-circuit failure

2) The products are designed for use in a standard environment and not in any special environments. Application of the

products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of

product performance, prior to use, is recommended if used under the following conditions:

[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents

[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places

[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,

and NO2

[d] Use in places where the products are exposed to static electricity or electromagnetic waves

[e] Use in proximity to heat-producing components, plastic cords, or other flammable items

[f] Use involving sealing or coating the products with resin or other coating materials

[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering

[h] Use of the products in places subject to dew condensation

3) The products are not radiation resistant.

4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.

5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).

When used in sealed area, confirm the actual ambient temperature.

7) Confirm that operation temperature is within the specified range described in product specification.

8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect

product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

Company in advance.

Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics

of the products and external components, including transient characteristics, as well as static characteristics.

2) The application examples, their constants, and other types of information contained herein are applicable only when

the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient

consideration to external conditions must be made.

Datasheet

Notice - Rev.001

●Precaution for Electrostatic

This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper

caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.

Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from

charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the products are stored in the following places:

[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] Where the temperature or humidity exceeds those recommended by the Company

[c] Storage in direct sunshine or condensation

[d] Storage in high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is

exceeding recommended storage time period .

3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may

occur due to excessive stress applied when dropping of a carton.

4) Use products within the specified time after opening a dry bag.

●Precaution for product label

QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a

internal part number that is inconsistent with an product part number.

●Precaution for disposition

When disposing products please dispose them properly with a industry waste company.

●Precaution for Foreign exchange and Foreign trade act

Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,

please consult with ROHM in case of export.

●Prohibitions Regarding Industrial Property

1) Information and data on products, including application examples, contained in these specifications are simply for

reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other

rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:

[a] infringement of the intellectual property rights of a third party

[b] any problems incurred by the use of the products listed herein.

2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial

property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,

sell, or dispose of the products.