KLI-2113 IMAGE SENSOR LINEAR CCD IMAGE SENSOR AUGUST 20, 2013 DEVICE PERFORMANCE SPECIFICATION REVISION 3.0 PS-0050 KLI-2113 Image Sensor TABLE OF CONTENTS Summary Specification ......................................................................................................................................................................................... 4 Description .................................................................................................................................................................................................... 4 Features ......................................................................................................................................................................................................... 4 Applications .................................................................................................................................................................................................. 4 Ordering Information ............................................................................................................................................................................................ 5 Device Description ................................................................................................................................................................................................. 6 Exposure Control ..................................................................................................................................................................................... 6 Pixel Summing .......................................................................................................................................................................................... 6 Image Acquisition ........................................................................................................................................................................................ 7 Charge Transport ......................................................................................................................................................................................... 7 Physical Description .................................................................................................................................................................................... 8 Pin Description and Device Orientation ............................................................................................................................................ 8 Imaging Performance ............................................................................................................................................................................................ 9 Typical Operational Conditions................................................................................................................................................................ 9 Specifications................................................................................................................................................................................................ 9 Typical Performance Curves ............................................................................................................................................................................ 10 Defect Definitions ................................................................................................................................................................................................ 11 Operationing Conditions ........................................................................................................................................................................ 11 Specifications............................................................................................................................................................................................. 11 Operation .................................................................................................................................................................................................................. 12 Absolute Maximum Ratings ................................................................................................................................................................... 12 DC Bias Operating Conditions ............................................................................................................................................................... 13 AC Operating Conditions ........................................................................................................................................................................ 14 Clock Levels ........................................................................................................................................................................................... 14 AC Timing Levels................................................................................................................................................................................... 14 Timing ......................................................................................................................................................................................................................... 15 Storage and Handling .......................................................................................................................................................................................... 17 Storage Conditions................................................................................................................................................................................... 17 ESD ............................................................................................................................................................................................................... 17 Cover Glass Care and Cleanliness ......................................................................................................................................................... 17 Environmental Exposure ........................................................................................................................................................................ 17 Soldering Recommendations ................................................................................................................................................................ 17 Mechanical Information ..................................................................................................................................................................................... 18 Completed Assembly ............................................................................................................................................................................... 18 Quality Assurance and Reliability .................................................................................................................................................................. 23 Quality and Reliability ............................................................................................................................................................................. 23 Replacement .............................................................................................................................................................................................. 23 Liability of the Supplier ........................................................................................................................................................................... 23 Liability of the Customer ........................................................................................................................................................................ 23 Test Data Retention ................................................................................................................................................................................. 23 Mechanical.................................................................................................................................................................................................. 23 Life Support Applications Policy .................................................................................................................................................................... 23 Revision Changes................................................................................................................................................................................................... 24 MTD/PS-0229 ............................................................................................................................................................................................. 24 PS-0050 ....................................................................................................................................................................................................... 24 www.truesenseimaging.com Revision 3.0 PS-0050 Pg 2 KLI-2113 Image Sensor TABLE OF FIGURES Figure 1: Single Channel Schematic ........................................................................................................................................................... 6 Figure 2: Output Waveforms .....................................................................................................................................................................10 Figure 3: Typical Responsivity....................................................................................................................................................................10 Figure 4: Illustration of Defect Classifications ......................................................................................................................................11 Figure 5: ESD Protection Circuit ................................................................................................................................................................12 Figure 6: Typical Output Bias/Buffer Circuit ..........................................................................................................................................13 Figure 7: Normal ModeTiming ...................................................................................................................................................................15 Figure 8: Binning ModeTiming...................................................................................................................................................................16 Figure 9: Completed Assembly Drawing (1 of 4) ..................................................................................................................................19 Figure 10: Completed Assembly Drawing (2 of 4) ................................................................................................................................20 Figure 11: Completed Assembly Drawing (3 of 4) ................................................................................................................................21 Figure 12: Completed Assembly Drawing (4 of 4) ................................................................................................................................22 www.truesenseimaging.com Revision 3.0 PS-0050 Pg 3 KLI-2113 Image Sensor Summary Specification KLI-2113 Image Sensor DESCRIPTION The KLI-2113 Image Sensor is a high dynamic range, multispectral, linear CCD image sensor ideally suited for demanding color scanner applications. The imager consists of three parallel 2098-element photodiode arrays--one for each primary color. The KLI-2113 sensor offers high sensitivity, a high data rate, low noise, and negligible lag. Independent exposure control for each channel allows color balancing at the front end. CMOS-compatible 5 V clocks, and single 12 V DC supply are all that are required to drive the KLI-2113 sensor, simplifying the design of interface electronics. FEATURES High Resolution Parameter Typical Value Architecture 3 Channel, RGB Tri-linear CCD Pixels Count 2098 x 3 Pixel Size 14 m (H) x 14 m (V) Pixel Pitch 14 m Inter-Array Spacing 112 mm (8 lines effective) Imager Size 29.37 mm (H) x 0.24 mm (V) Saturation Signal 170,000 electrons Dynamic Range 76 dB Responsivity (Wavelength = 460, 540, 650 nm) 25, 32, 50 V/J/cm 2 Output Sensitivity 11.5 V/electron Dark Current 0.02 pA/pixel Dark Current Doubling Rate 9 C Wide Dynamic Range High Sensitivity Charge Transfer Efficiency 0.99999/Transfer High Operating Speed Photoresponse Non-uniformity 5% Peak-Peak Lag (First Field) 0.6% High Charge Transfer Efficiency Maximum Data Rate 20 MHz/Channel No Image Lag Package CERDIP (Sidebrazed, CuW) Electronic Exposure Control Pixel Summing Capability Up to 2.0V peak-peak Output 5.0V Clock Inputs Two-Phase Register Clocking On-chip Dark Reference Cover Glass AR coated, 2 sides Parameters above are specified at T = 25C and 2 MHz clock rates unless otherwise noted. APPLICATIONS Digitization Machine Vision Mapping/Aerial Photography www.truesenseimaging.com Revision 3.0 PS-0050 Pg 4 KLI-2113 Image Sensor Ordering Information Catalog Number Product Name Description KLI- 2113-AAA-ER-AA Monochrome, No Microlens, CERDIP Package (leadframe), Taped Clear Cover Glass with AR coating (2 sides), Standard Grade 4H0605 KLI- 2113-AAA-ER-AE Monochrome, No Microlens, CERDIP Package (leadframe), Taped Clear Cover Glass with AR coating (2 sides), Engineering Sample 4H0601 KLI- 2113-AAB-ED-AA Monochrome, No Microlens, CERDIP Package (leadframe), Clear Cover Glass with AR coating (both sides), Standard Grade 4H0604 KLI- 2113-AAB-ED-AE Monochrome, No Microlens, CERDIP Package (leadframe), Clear Cover Glass with AR coating (both sides), Engineering Sample 4H0600 KLI- 2113-DAA-ED-AA Color (RGB), No Microlens, CERDIP Package (leadframe), Clear Cover Glass with AR coating (both sides), Standard Grade 4H0603 KLI- 2113-DAA-ED-AE Color (RGB), No Microlens, CERDIP Package (leadframe), Clear Cover Glass with AR coating (both sides), Engineering Sample 4H0096 KEK-4H0096-KLI-2113-12-5 Evaluation Board (Complete Kit) 4H0602 Marking Code KLI-2113-AAA (Serial Number) KLI-2113-AAB (Serial Number) KLI-2113-DAA (Serial Number) N/A See Application Note Product Naming Convention for a full description of the naming convention used for Truesense Imaging image sensors.For reference documentation, including information on evaluation kits, please visit our web site at www.truesenseimaging.com. Please address all inquiries and purchase orders to: Truesense Imaging, Inc. 1964 Lake Avenue Rochester, New York 14615 Phone: (585) 784-5500 E-mail: info@truesenseimaging.com Truesense Imaging reserves the right to change any information contained herein without notice. All information furnished by Truesense Imaging is believed to be accurate. www.truesenseimaging.com Revision 3.0 PS-0050 Pg 5 KLI-2113 Image Sensor Device Description Figure 1: Single Channel Schematic Exposure Control Exposure control is implemented by selectively clocking the LOG gates during portions of the scanning line time. By applying a large enough positive bias to the LOG gate, the channel potential is increased to a level beyond the 'pinning level' of the photodiode. (The 'pinning' level is the maximum channel potential that the photodiode can achieve and is fixed by the doping levels of the structure.) With TG1 in an 'off' state and LOG strongly biased, all of the photocurrent will be drawn off to the LS drain. Referring to Figure 6, one notes that the exposure can be controlled by pulsing the LOG gate to a 'high' level while TG1 is turning 'off' and then returning the LOG gate to a 'low' bias level sometime during the line scan. The effective exposure (texp) is the net time between the falling edge of the LOG gate and the falling edge of the TG1 gate (end of the line). Separate LOG connections for each channel are provided, enabling onchip light source and image spectral color balancing. As a cautionary note, the switching transients of the LOG gates during line readout may inject an artifact at the sensor output. Rising edge artifacts can be avoided by switching LOG during the photodiode-to-CCD transfer period, preferably, during the TG1 falling edge. Depending on clocking speeds, the falling edge of the LOG should be synchronous with the 1/2 shift register readout clocks. For very fast applications, the falling edge of the LOG gate may be limited by on-chip RC delays across the array. In this case, artifacts may extend across one or more pixels. Correlated double sampling (CDS) processing of the output waveform can remove the first order magnitude of such artifacts. In high dynamic range applications, it may be advisable to limit the LOG fall times to minimize the current transients in the device substrate and limit the magnitude of the artifact to an acceptable level. Pixel Summing The effective resolution of this sensor can be varied by enabling the pixel summing feature. A separate pin is provided for the last shift register gate labeled 2s. This gate, when clocked appropriately, stores the summation of signal from adjacent pixels. This combined charge packet is then transferred onto the sense node. As an example, the sensor can be operated in 2-pixel summing mode (1049 pixels), by supplying a 2s clock which is a 75% duty cycle signal at 1/2 the frequency of the 2 signal, and modifying the R clock as depicted in Figure 8. Applications that require full resolution mode (2098 pixels), must tie the 2s pin to the 2 pin. Refer to Figure 7and Figure 8 for additional details. www.truesenseimaging.com Revision 3.0 PS-0050 Pg 6 KLI-2113 Image Sensor IMAGE ACQUISITION During the integration period, an image is obtained by gathering electrons generated by photons incident upon the photodiodes. The charge collected in the photodiode array is a linear function of the local exposure. The charge is stored in the photodiode itself and is isolated from the CCD shift registers during the integration period by the transfer gates TG1 and TG2, which are held at barrier potentials. At the end of the integration period, the CCD register clocking is stopped with the 1 and 2 gates being held in a 'high' and 'low' state respectively. Next, the TG gates are turned 'on' causing the charge to drain from the photo-diode into the TG1 storage region. As TG1 is turned back 'off', charge is transferred through TG2 and into the 1 storage region. The TG2 gate is then turned 'off', isolating the shift registers from the accumulation region once again. Complementary clocking of the 1 and 2 phases now resumes for readout of the current line of data while the next line of data is integrated. CHARGE TRANSPORT Readout of the signal charge is accomplished by two-phase, complementary clocking of the Phase 1 and Phase 2 gates (1 and 2) in the horizontal (output) shift register. The register architecture has been designed for high speed clocking with minimal transport and output signal degradation, while still maintaining low (4.75V p-pmin) clock swings for reduced power dissipation, lower clock noise and simpler driver design. The data in all registers is clocked simultaneously toward the output structures. The signal is then transferred to the output structures in a parallel format at the falling edge of the 2s clock. Resettable floating diffusions are used for the charge to voltage conversion while source followers provide buffering to external connections. The potential change on the floating diffusion is dependent on the amount of signal charge and is given by VFD = Q/CFD, where VFD is the change in potential on the floating diffusion, Q is the amount of charge, and CFD is the capacitance of the floating diffusion node. Prior to each pixel output, the floating diffusion is returned to the RD level by the reset clock, R. www.truesenseimaging.com Revision 3.0 PS-0050 Pg 7 KLI-2113 Image Sensor PHYSICAL DESCRIPTION Pin Description and Device Orientation Pin Name Description Pin Name Description 1 VIDR Red Output Video 28 VIDG Green Output Video 2 SUB Substrate 27 SUB Substrate 3 RD Reset Drain 26 VDD Amplifier Supply 4 R Reset Clock 25 VIDB Blue Output Video 5 LOGR Red Overflow Gate 24 SUB Substrate 6 LOGG Green Overflow Gate 23 N/C No Connection 7 SUB Substrate 22 LOGB Blue Overflow Gate 8 N/C No Connection 21 N/C No Connection 9 LS Light Shield/Exposure Drain 20 N/C No Connection 10 IG Input Gate/LOG Test Pin 19 ID Input Diode Test Pin 11 TG2 Outer Transfer Gate 18 TG1 Inner Transfer Gate 12 N/C No Connection 17 N/C No Connection 13 2s Phase2 Shift Register Summing Gate Clock 16 N/C No Connection 14 2 Phase2 Shift Register Clock 15 1 Phase1 Shift Register Clock www.truesenseimaging.com Revision 3.0 PS-0050 Pg 8 KLI-2113 Image Sensor Imaging Performance TYPICAL OPERATIONAL CONDITIONS Specifications given under nominal operating conditions @ 25 C ambient, fCLK =2 MHz and nominal external VIDn load resistors unless otherwise specified. SPECIFICATIONS Description Units Notes Verification Plan Vsat 2.0 Vp-p 1, 7 die8 Vo/Ne 11.5 V/e- 7 design9 Saturation Signal Charge Ne,sat 170k electrons Responsivity (@ 650nm) (@ 540nm) (@ 460nm) R 50 32 25 V/J/cm2 2, 7 design9 Output Buffer Bandwidth f-3dB 75 MHz @ CLOAD = 10 pF design9 Dynamic Range DR 76 dB 3 design9 Dark Current Idark 0.02 pA/pixel 4 die8 Charge Transfer Efficiency CTE .99999 - 5 design9 L 0.6 1 % 1st Field design9 7 9 Volts 7 design9 10 % p-p 6 die8 per phase design9 Saturation Output Voltage Output Sensitivity Lag DC Output Offset Symbol Vodc Min. 6 Nom. Max. Photoresponse Uniformity PRNU 5 Register Clock Capacitance C 500 pF Transfer Gate Capacitance CTG 400 pF Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. design9 design9 Defined as the maximum output level achievable before linearity or PRNU performance is degraded. With color filter. Values specified at filter peaks. 50% bandwidth = 30 nm. This device utilizes 2-phase clocking for cancellation of driver displacement currents. Symmetry between 1 and 2 phases must be maintained to minimize clock noise. Dark current doubles approximately every +9 C. 4256 Measured per transfer. For total line h < (.99999) =0.96 Low frequency response across array with color filter array. Decreasing external VIDn load resistors to improve signal bandwidth will decrease these parameters. A parameter that is measured on every sensor during production testing. A parameter that is quantified during the design verification activity. www.truesenseimaging.com Revision 3.0 PS-0050 Pg 9 KLI-2113 Image Sensor Typical Performance Curves (2 MHz Operation, Emitter Follower Buffered, 3/4 Vsat, Dark to Bright Transition) VIDR Output (1V/DIV) 2 Clock (2V/DIV) Time (200 ns/DIV) Figure 2: Output Waveforms KLI-2113 Spectral Response Improved Color Filter - Type II 60 Responsivity (V/mJ/cm2) 50 40 30 20 10 0 350 400 450 500 550 600 650 700 750 800 850 Wavelength (nm) Figure 3: Typical Responsivity www.truesenseimaging.com Revision 3.0 PS-0050 Pg 10 KLI-2113 Image Sensor Defect Definitions OPERATIONING CONDITIONS Test conditions: T=25 C, fCLK=2MHz, tint=1.066msec. SPECIFICATIONS Field Defect Type Threshold Units Notes Number Dark Bright 8.0 mV 1, 2 0 Bright Bright/Dark 10 % 1, 3 0 Bright Exposure Control 4.0 mV 1, 4, 5 16 Notes: 1. 2. 3. 4. 5. Defective pixels will be separated by at least one non-defective pixel within and across channels. Pixels whose response is greater than the average response by the specified threshold. See Figure 4 below. Pixels whose response is greater or less than the average response by the specified threshold. SeeFigure 4below. Pixels whose response deviates from the average pixel response by the specified threshold when operating in exposure control mode. See Figure 4 below. Defect coordinates are available upon request. Average Pixel Note 3: Bright Field Bright Pixel Note 4: Bright Field Exposure Control Bright Defect Note 3: Bright Field Dark Pixel Average Pixel Signal Out Signal Out Note 2: Dark Field Bright pixel Exposure Note 5: Bright Field Exposure Control Dark Defect Exposure Figure 4: Illustration of Defect Classifications www.truesenseimaging.com Revision 3.0 PS-0050 Pg 11 KLI-2113 Image Sensor Operation ABSOLUTE MAXIMUM RATINGS Description Symbol Minimum Maximum Units Notes Gate Pin Voltages VGATE -0.5 +16 V 1, 2 Pin to Pin Voltage VPIN-PIN 16 V 1, 3 Diode Pin Voltages VDIODE -0.5 +16 V 1,4 Output Bias Current IDD -10 mA 5 Output Load Capacitance CVID,LOAD 15 pF CCD Clocking Frequency fC 20 MHz Notes: 1. 2. 3. 4. 5. 6. 6 Referenced to substrate voltage. Includes pins: 1, 2, 2s, TG1, TG2, R, IG, and LOGn. Voltage difference (either polarity) between any two pins. Includes pins: VIDn, RD, VDD, LS and ID. Care must be taken not to short output pins to ground during operation as this may cause serious damage to the output structures. Charge transfer efficiency will degrade at frequencies higher than the nominal (2MHz) clocking frequency. VIDn load resistor values may need to be decreased as well to achieve required output bandwidths. To Device Function I/O Pin Vt - 20 V SUB Figure 5: ESD Protection Circuit CAUTION: To allow for maximum performance, this device contains limited i/o protection and may be sensitive to electrostatic induced damage. Devices should be installed in accordance with strict ESD handling procedures! www.truesenseimaging.com Revision 3.0 PS-0050 Pg 12 KLI-2113 Image Sensor DC BIAS OPERATING CONDITIONS Description Substrate Symbol Minimum Nominal VSUB Maximum 0 Units Reset Drain Bias VRD +11.5 +12.0 +12.5 V Output Buffer Supply VDD +11.5 +12.0 +12.5 V Light Shield/Drain Bias VLS +11.5 +12.0 +12.5 V Output Bias Current/Ch. IDDn -4.0 -6.0 -8.0 mA Test Pin-Input Gate/LOG VIG +12.0 V Test Pin-Input Diode VID +12.0 V Notes: 1. Notes V 1 A current sink must be supplied for each output. Load capacitance should be minimized so as not to limit bandwidth.See Figure 6.Choose values optimized for specific operating frequency, but R2 should not be less than 75. VDD 2N2369 or Similar* 0.1mF To Device Output Pin: VIDn (Minimize Path Length) Buffered Output R2=120 * R1=600 * Figure 6: Typical Output Bias/Buffer Circuit www.truesenseimaging.com Revision 3.0 PS-0050 Pg 13 KLI-2113 Image Sensor AC OPERATING CONDITIONS Clock Levels Description Symbol Minimum Nominal Maximum Units CCD Readout Clocks High V1H, V2H, V2sH +4.75 +5.0 +5.25 V CCD Readout Clocks Low V1L, V2L, V2sL -0.1 0 +0.1 V Transfer Clocks High VTG1H, VTG2H +4.75 +5.0 +5.25 V Transfer Clocks Low VTG1L, VTG2L -0.1 0 +0.1 V VRH +4.75 +5.0 +5.25 V Reset Clock High Reset Clock Low Notes VRL -0.1 0 +0.1 V Exposure Clocks High VLOG1H, VLOG2H +4.75 +5.0 +5.25 V 1 Exposure Clocks Low VLOG1L, VLOG2L -0.1 0 +0.1 V 1 Maximum Units Notes Notes: 1. Tie pin to 0 V for applications where exposure control is not used. AC Timing Levels Description Symbol Minimum Nominal CCD Element Duration 1e-(= 1/fCLK ) 50 500 ns Line/Integration Period 1L (= tint ) 0.108 1.066 ms PD-CCD Transfer Period tpd 1.0 s Transfer Gate 1 Clear ttg1 500 ns Transfer Gate 2 Clear ttg2 500 ns LOGGate Duration tLOG1 1 s LOGGate Clear tLOG2 1 s Reset Pulse Duration trst 9 ns Clamp to 2 Delay tcd 5 ns Sample to Reset Edge Delay tsd 5 ns 1 CCD Clock Rise Time tr ns Typical Notes: 1. 30 1 Recommended delays for correlated double sampling of output. www.truesenseimaging.com Revision 3.0 PS-0050 Pg 14 KLI-2113 Image Sensor Timing Figure 7: Normal ModeTiming www.truesenseimaging.com Revision 3.0 PS-0050 Pg 15 KLI-2113 Image Sensor Figure 8: Binning ModeTiming www.truesenseimaging.com Revision 3.0 PS-0050 Pg 16 KLI-2113 Image Sensor 3. Improper cleaning of the cover glass may damage these devices. Refer to Application Note Image Sensor Handling Best Practices. Storage and Handling STORAGE CONDITIONS Description Symbol Minimum Maximum Units Notes Storage Temperature TST 0 70 C 1 Operating Temperature TOP -25 +80 C 2 Notes: 1. 2. Noise performance will degrade with increasing temperatures. Long term storage at these temperatures will accelerate color filter degradation. ESD 1. This device contains limited protection against Electrostatic Discharge (ESD). ESD events may cause irreparable damage to a CCD image sensor either immediately or well after the ESD event occurred. Failure to protect the sensor from electrostatic discharge may affect device performance and reliability. 2. Devices should be handled in accordance with strict ESD procedures for Class 0 (<250V per JESD22 Human Body Model test), or Class A (<200V JESD22 Machine Model test) devices. Devices are shipped in static-safe containers and should only be handled at static-safe workstations. 3. See Application Note Image Sensor Handling Best Practices for proper handling and grounding procedures. This application note also contains workplace recommendations to minimize electrostatic discharge. 4. Store devices in containers made of electroconductive materials. COVER GLASS CARE AND CLEANLINESS 1. The cover glass is highly susceptible to particles and other contamination. Perform all assembly operations in a clean environment. 2. Touching the cover glass must be avoided. www.truesenseimaging.com ENVIRONMENTAL EXPOSURE 1. Extremely bright light can potentially harm CCD image sensors. Do not expose to strong sunlight for long periods of time, as the color filters and/or microlenses may become discolored. In addition, long time exposures to a static high contrast scene should be avoided. Localized changes in response may occur from color filter/microlens aging. For Interline devices, refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible lighting Conditions. 2. Exposure to temperatures exceeding maximum specified levels should be avoided for storage and operation, as device performance and reliability may be affected. 3. Avoid sudden temperature changes. 4. Exposure to excessive humidity may affect device characteristics and may alter device performance and reliability, and therefore should be avoided. 5. Avoid storage of the product in the presence of dust or corrosive agents or gases, as deterioration of lead solderability may occur. It is advised that the solderability of the device leads be assessed after an extended period of storage, over one year. SOLDERING RECOMMENDATIONS 1. The soldering iron tip temperature is not to exceed 370 C. Higher temperatures may alter device performance and reliability. 2. Flow soldering method is not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. Recommended method is by partial heating using a grounded 30W soldering iron. Heat each pin for less than 2 seconds duration. Revision 3.0 PS-0050 Pg 17 KLI-2113 Image Sensor Mechanical Information COMPLETED ASSEMBLY www.truesenseimaging.com Revision 3.0 PS-0050 Pg 18 KLI-2113 Image Sensor Figure 9: Completed Assembly Drawing (1 of 4) www.truesenseimaging.com Revision 3.0 PS-0050 Pg 19 KLI-2113 Image Sensor Figure 10: Completed Assembly Drawing (2 of 4) www.truesenseimaging.com Revision 3.0 PS-0050 Pg 20 KLI-2113 Image Sensor Figure 11: Completed Assembly Drawing (3 of 4) www.truesenseimaging.com Revision 3.0 PS-0050 Pg 21 KLI-2113 Image Sensor Figure 12: Completed Assembly Drawing (4 of 4) www.truesenseimaging.com Revision 3.0 PS-0050 Pg 22 KLI-2113 Image Sensor Quality Assurance and Reliability QUALITY AND RELIABILITY All image sensors conform to the specifications stated in this document.This is accomplished through a combination of statistical process control and visual inspection and electrical testing at key points of the manufacturing process, using industry standard methods. Information concerning the quality assurance and reliability testing procedures and results are available from Truesense Imaging upon request.For further information refer to Application Note Quality and Reliability. REPLACEMENT All devices are warranted against failure in accordance with the Terms of Sale.Devices that fail due to mechanical and electrical damage caused by the customer will not be replaced. LIABILITY OF THE SUPPLIER A reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the customer. Product liability is limited to the cost of the defective item, as defined in the Terms of Sale. LIABILITY OF THE CUSTOMER Damage from mishandling (scratches or breakage), electrostatic discharge (ESD), or other electrical misuse of the device beyond the stated operating or storage limits, which occurred after receipt of the sensor by the customer, shall be the responsibility of the customer. TEST DATA RETENTION Image sensors shall have an identifying number traceable to a test data file. Test data shall be kept for a period of 2 years after date of delivery. MECHANICAL The device assembly drawing is provided as a reference. Truesense Imaging reserves the right to change any information contained herein without notice.All information furnished by Truesense Imaging is believed to be accurate. Life Support Applications Policy Truesense Imaging image sensors are not authorized for and should not be used within Life Support Systems without the specific written consent of Truesense Imaging, Inc. www.truesenseimaging.com Revision 3.0 PS-0050 Pg 23 KLI-2113 Image Sensor Revision Changes MTD/PS-0229 Revision Number Description of Changes 4 New Color Filter materials implemented. 5 Updated format. Added Serial Numbers to Package Drawings 5.1 Corrected responsivity in Table on p.4 PS-0050 Revision Number Description of Changes 1.0 Initial release with new document number, updated branding and document template Updated Storage and Handling and Quality Assurance and Reliability sections 2.0 Updated assembly drawing 3.0 Updated assembly drawing www.truesenseimaging.com (c)Truesense Imaging Inc., 2013. TRUESENSE is a registered trademark of Truesense Imaging, Inc. Revision 3.0 PS-0050 Pg 24