Board Level Heat Sinks P/N: 831502B00000 FEATURES & BENEFITS * No Hardware Device Attachment * Constant Spring Force Tension * RoHS Compliant CUSTOMIZED HEATSINKS * Specialized Tabs, Plating * Specialized Body Configurations * Contact Applications Engineering 0 200 400 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 0 0 1 2 3 Heat Dissapated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 Thermal Resistance - 0C/Watt (Mounting Surface to Ambient) * Package: Bulk Air Velocity - LFM Temp Rise Above Ambient - 0C (Mounting Surface) * Devices: TO-220 & TO-262 * Size: 19.0 x 12.8 x 12.7 mm * Material: Aluminum, 1.2 mm Thick * Weight: 1.8 grams * Type: Stamped * IC Mounting: Integrated Spring * PCB Mounting: Device Leads * Finish: Black Anodized TO-220, TO-262 PRODUCT SPECIFICATIONS