GE Datasheet EHHD010A0B HAMMERHEAD* Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 10A, 120W Output Features RoHS Compliant Applications Compliant to RoHS Directive 2011/65/EU and amended Directive (EU) 2015/863 (-Z versions) Compliant to REACH Directive (EC) No 1907/2006 Flat and high efficiency curve Industry standard, DOSA compliant footprint 58.4mm x 22.8mm x 8.9mm (2.30 in x 0.9 in x 0.35 in) Ultra wide input voltage range: 18-75 Vdc Tightly regulated output Remote sense Output Voltage adjust: 90% to 110% of VO,nom Constant switching frequency Positive remote On/Off logic Output overcurrent and overvoltage protection Distributed Power Architectures Over temperature protection Wireless Networks Wide operating temperature range (-40C to 85C) Enterprise Networks including Power over Ethernet (PoE) Industrial Equipment Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module ANSI/UL# 62368-1 and CAN/CSA C22.2 No. 62368-1 Recognized, DIN VDE 0868-1/A11:2017 (EN623681:2014/A11:2017) CE mark meets 2006/95/EC directive Meets the voltage and current requirements for ETSI 300-1322 and complies with and licensed for Basic insulation rating per EN60950-1 Options Negative Remote On/Off logic (preferred) Over current/Over temperature/Over voltage protections (Auto-restart) (preferred) 2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards 1/8th Brick Heat plate for 1/8th heatsinks ISO**9001 and ISO 14001 certified manufacturing facilities 1/4th Brick heat plate with unthreaded inserts Description The EHHD010A0B [HAMMERHEAD*] Series, eighth-brick, low-height power modules are isolated dc-dc converters which provide a single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75Vdc. The EHHD010A0B provides 12Vdc nominal output voltage rated for 10Adc output current. The module incorporates GE's vast heritage for reliability and quality, while also using the latest in technology, and component and process standardization to achieve highly competitive cost. The open frame module construction, available in through-hole packaging, enable designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 90% at VIN=24Vdc and VIN=48Vdc. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and over temperature protection. An optional heat plate allows for external standard, eighth-brick or quarter-brick heat sink attachment to achieve higher output current in high temperature applications. * Trademark of General Electric Company. # UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 1 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Continuous All VIN -0.3 80 Vdc Transient, operational (100 ms) All VIN,trans -0.3 100 Vdc All TA -40 85 C -18H, H TC -40 105 C Storage Temperature All Tstg -55 125 C Altitude* All 4000 m 2250 Vdc Input Voltage Operating Ambient Temperature Maximum Heat Plate Operating Temperature (see Thermal Considerations section) I/O Isolation voltage (100% factory Hi-Pot tested) All * For higher altitude applications, contact your GE Sales Representative for alternative conditions of use. Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Operating Input Voltage Maximum Input Current (VIN= VIN, min to VIN, max, VO= VO, set, IO=IO, max) Device Symbol Min Typ Max Unit All VIN 18 24/48 75 Vdc All IIN 7.3 7.8 Adc All IIN,No load 120 80 IIN,stand-by 5 Input No Load Current VIN = 24Vdc, (IO = 0, module enabled) VIN = 48V, (IO = 0, module enabled) Input Stand-by Current All (VIN = 24 to 48V, module disabled) I2t mA 11 mA 0.5 A2s Inrush Transient All Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12H source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) All 30 mAp-p Input Ripple Rejection (120Hz) All 60 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 15 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information. September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 2 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Electrical Specifications (continued) Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25C conditions. Parameter Nominal Output Voltage Set-point VIN= 24V to 48V IO=IO, max, TA=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range (*Vin > 20V) Selected by external resistor Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and NoiseOutput Ripple and Noise on nominal output Measured with 10uF Tantalum||1uF ceramic (VIN=24 to 48, IO=80% IO, max , TA=25) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) Device Symbol Min Typ Max Unit All VO, set 11.82 12 12.18 Vdc All VO -3.0 +3.0 % VO, set All VO, adj -10 +10* % VO, set 0.2 0.2 1.5 % VO, set % VO, set % VO, set All All All All 75 All All CO, max 0 Output Current All IO 0 5 IO, lim 11 All IO, s/c VIN=24V, TA=25C, IO=10A, VO = 12V All VIN=48V, TA=25C, IO=10A, VO = 12V All Switching Frequency mVrms 200 External Capacitance Output Current Limit Inception (Hiccup Mode ) (VO= 90% of VO, set) Output Short-Circuit Current (VO250mV) ( Hiccup Mode ) Efficiency mVpk-pk 5000 F 10 Adc 12 Adc 1.2 Arms 93 % 92.5 % All fsw 300 kHz All Vpk 3 % VO, set All ts 800 s Device Symbol Min Typ Max Unit Dynamic Load Response (dIo/dt=0.1A/s; VIN = 24V or 48V; TA=25C; CO>100F) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) Isolation Specifications Parameter Isolation Capacitance All Ciso 1000 pF Isolation Resistance All Riso 10 M I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 Vdc Device Symbol Min Typ Max General Specifications Parameter Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (IO=80%IO, max, TA=40C, airflow = 200 lfm, 90% confidence) Unit All FIT 125.3 109/Hour s All MTBF 7,981,756 Hours Weight (Open Frame) All 23 (0.8) g (oz.) Weight (with Heatplate) All 37 (1.3) g (oz.) September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 3 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix "1" Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off 0.15 mA Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc Logic High Voltage - (Typ = Open Collector) All Von/off 2.5 5 6.7 Vdc Logic High maximum allowable leakage current All Ion/off 20 A All Tdelay 35 msec Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (Tdelay from instant at which VIN = VIN, min until Vo=10% of VO,set) All Tdelay 35 - msec Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) All Trise 20 Turn-On Delay and Rise Times (IO=IO, max , VIN=VIN, nom, TA = 25oC) Case 1: Input power is applied for at least 1 second, and then the On/Off input is set from OFF to ON (Tdelay = on/off pin transition until VO = 10% of VO, set) Output voltage overshoot - Startup IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC All Remote Sense Range All VSENSE All VO, limit Output Overvoltage Protection1 13.6 msec 3 % VO, set 10 % VO, set 16.6 Vdc Overtemperature Protection - Hiccup Auto Restart Input Undervoltage Lockout Open frame Heat Plate All Tref 135 OC Tref 120 OC 17.5 Vdc 15.5 Vdc 2 Vdc VUVLO Turn-on Threshold Turn-off Threshold Hysteresis Input Overvoltage Lockout All VOVLO Turn-on Threshold 76 79 Vdc Turn-off Threshold 81 83 Vdc Hysteresis 1 2 Vdc 1 -OVP voltage is lower than 13.6 for Vin between 18-20V. The module requires a minimum of 100F external output capacitor to avoid exceeding the OVP maximum limits during startup into openloop fault conditions September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 4 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Characteristic Curves The following figures provide typical characteristics for the EHHD010A0B (12V, 10A) at 25 OC. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT Io(A) (2A/div) 95 Vin=36V 85 Vin=48V Vin=75V Vin=24V 80 Vin=18V 75 70 0 2 4 6 8 10 OUTPUT VOLTAGE VO (V) (200mV/div) EFFICIENCY, (%) 90 OUTPUT CURRENT, IO (A) TIME, t (200s/div) Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/S Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V. Vin=48V Vin=75V OUTPUT VOLTAGE VO (V) (5V/div) OUTPUT VOLTAGE VO (V) (100mV/div) Vin=24V On/Off VOLTAGE VOn/Off (V) (2V/div) Vin=18V TIME, t (20ms/div) TIME, t (2s/div) Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = 24V, Io = Io,max). OUTPUT VOLTAGE VO (V) (5V/div) OUTPUT VOLTAGE VO (V) (200mV/div) INPUT VOLTAGE VIN (V) (10V/div) OUTPUT CURRENT Io(A) (2A/div) Figure 2. Typical output ripple and noise (Io = Io,max). TIME, t (200s/div) Figure 3. Transient Response to 0.1A/S Dynamic Load Change from 50% to 75% to 50% of full load, Vin=24V. September 11, 2020 TIME, t (20ms/div) Figure 6. Typical Start-up Using Input Voltage (VIN = 24V, Io = Io,max). (c)2015 General Electric Company. All rights reserved. Page 5 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE LTEST Vin+ BATTERY 12H 33-100F CS 220F E.S.R.<0.1 @ 20C 100kHz Vin- Safety Considerations NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12H. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 7. Input Reflected Ripple Current Test Setup. COPPER STRIP VO (+) For safety agency approval the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards, i.e., UL ANSI/UL* 62368-1 and CAN/CSA+ C22.2 No. 62368-1 Recognized, DIN VDE 0868-1/A11:2017 (EN623681:2014/A11:2017) If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module's output to be considered as meeting the requirements for safety extra-low voltage (SELV) or ES1, all of the following must be true: RESISTIVE LOAD SCOPE V O (- ) 1uF The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 100F electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. 10uF GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 8. Output Ripple and Noise Test Setup. Rdistribution Rcontact Rcontact Vin+ RLOAD VO VIN Rdistribution Rcontact Rcontact Vin- Rdistribution Vout+ Rdistribution Vout- NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 9. Output Voltage and Efficiency Test Setup. VO. IO Efficiency = VIN. IIN x 100 % The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV or ES1 reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module's output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness. For input voltages exceeding -60 Vdc but less than or equal to -75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV or ES1 outputs. The input to these units is to be provided with a maximum 15 A fast-acting fuse in the ungrounded lead. September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 6 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output maximum rated power (Maximum rated power = Vo,set x Io,max). Feature Descriptions Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix "1", turns the module off during a logic high and on during a logic low. SENSE(+) SENSE(-) SUPPLY VI(+) VO(+) VI(-) VO(-) II CONTACT RESISTANCE Vin+ IO LOAD CONTACT AND DISTRIBUTION LOSSES Vout+ Figure 11. Circuit Configuration for remote sense . Ion/off ON/OFF TRIM Von/off Vout- Vin- Input Undervoltage Lockout At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. Figure 10. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V Von/off 0.6V. The maximum Ion/off during a logic low is 0.15mA; the switch should maintain a logic low level whilst sinking this current. During a logic high, the typical maximum Von/off generated by the module is 5V, and the maximum allowable leakage current at Von/off = 5V is 1A. Overtemperature Protection To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference points, Tref, exceed135 OC (Figure 13, typical) or 120 OC(Figure 14, typical) respectively, but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart upon cool-down to a safe temperature. If not using the remote on/off feature: Output Overvoltage Protection For positive logic, leave the ON/OFF pin open. The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the autorestart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. For negative logic, short the ON/OFF pin to VIN(-). Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: [VO(+) - VO(-)] - [SENSE(+) - SENSE(-)] 0.5 V Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the September 11, 2020 Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto-restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. Feature Descriptions (continued) If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current (c)2015 General Electric Company. All rights reserved. Page 7 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output is brought back into its specified range. The average output current during hiccup is 10% IO, max. Rtrim-up = 1163 .52 Output Voltage Programming Trimming allows the output voltage set point to be increased or decreased from the default value; this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin. VIN(+) VO(+) Rtrim-up ON/OFF LOAD VOTRIM Rtrim-down VIN(-) 5.11 12.0 (100 + 4) 511 Rtrim-up = - - 10.22 1.225 4 4 VO(-) Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the VO(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be 1.0%. The voltage between the VO(+) and VO(-) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = VO,set x IO,max). Thermal Considerations The following equation determines the required external resistor value to obtain a percentage output voltage change of % The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. 511 Rtrim- down = - 10.22 % Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. Where % = Vo , set - Vo , desired 100 Vo , set For example, to trim-down the output voltage of the module by 6% to 11.28V, Rtrim-down is calculated as follows: % = 6 511 Rtrim-down = - 10.22 6 Rtrim-down = 74.9 Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of %: The thermal data presented here is based on physical measurements taken in a wind tunnel, using automated thermo-couple instrumentation to monitor key component temperatures: FETs, diodes, control ICs, magnetic cores, ceramic capacitors, opto-isolators, and module pwb conductors, while controlling the ambient airflow rate and temperature. For a given airflow and ambient temperature, the module output power is increased, until one (or more) of the components reaches its maximum derated operating temperature, as defined in IPC-9592. This procedure is then repeated for a different airflow or ambient temperature until a family of module output derating curves is obtained. 5.11 Vo, set (100 + %) 511 Radj- up = - - 10.22 k 1.225 % % Where % = Vo , desired - Vo , set 100 Vo , set For example, to trim-up the output voltage of the module by 4% to 12.48V, Rtrim-up is calculated is as follows: % = 4 September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 8 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output each module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figures 15 - 20. Thermal Considerations (continued) Please refer to the Application Note "Thermal Characterization Process For Open-Frame Board-Mounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures. OUTPUT CURRENT, IO (A) 10 8 100LFM (0.5m/s) NC 200LFM (1.0m/s) 6 400LFM (2.0m/s) 4 600LFM (3.0m/s) 2 0 The thermal reference points, Tref1, and Tref2 used in the specifications for open frame modules are shown in Figure 13. For reliable operation these temperatures should not exceed 124 OC & 121 OC respectively 25 35 45 55 65 75 85 AMBIENT TEMEPERATURE, TA (oC) Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(-) to Vout(+); VIN =48V, VO=12V. Tref2 10 AIRFLOW Figure 13. Tref Temperature Measurement Locations for ref Temperature Measurement Location for Figure 13. TModule. Open Frame Open Frame Module The thermal reference point, Tref, used in the specifications for modules with heatplate is shown in Figure 14. For reliable operation this temperature should not exceed 98OC. OUTPUT CURRENT, IO (A) Tref 1 NC 8 100LFM (0.5m/s) 200LFM (1.0m/s) 400LFM (2.0m/s) 6 4 600LFM (3.0m/s) 2 0 25 35 45 55 65 75 85 AMBIENT TEMEPERATURE, TA (oC) Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(-) to Vout(+);VIN =48V, VO=12V. Figure 14. Tref Temperature Measurement Location for Module with Heatplate. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 9 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Thermal Considerations (continued) OUTPUT CURRENT, IO (A) 10 OUTPUT CURRENT, IO (A) 10 8 100LFM (0.5m/s) 6 400LFM (2.0m/s) NC 200LFM (1.0m/s) 4 8 NC 4 600LFM (3.0m/s) 0 20 30 40 50 60 70 80 90 AMBIENT TEMEPERATURE, TA (oC) 0 20 30 40 50 60 70 80 90 AMBIENT TEMEPERATURE, TA ( C) o Figure 17. Output Current Derating for the Module with 18H Heatplate; Airflow in the Transverse Direction from Vout(-) to Vout(+);VIN =48V, VO=12V - The module can also be used in a sealed environment with cooling via conduction from the module's top surface through a gap pad material to a cold wall, as shown in Figure 21. This capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 22. 8 NC 100LFM (0.5m/s) 6 200LFM (1.0m/s) 400LFM (2.0m/s) 4 600LFM (3.0m/s) 2 0 25 35 45 55 65 75 (oC AMBIENT TEMEPERATURE, TA Figure 20. Output Current Derating for the Module with 18 Heatplate; Airflow in the Transverse Direction from Vout(-) to Vout(+);VIN =24V, VO=12V. Heat Transfer via Conduction 10 OUTPUT CURRENT, IO (A) 400LFM (2.0m/s) 200LFM (1.0m/s) 2 600LFM (3.0m/s) 2 100LFM (0.5m/s) 6 85 ) Figure 18. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(-) to Vout(+); VIN =24V, VO=12V. Figure 21. Cold Wall Mounting 8 NC 100LFM (0.5m/s) 6 10 200LFM (1.0m/s) 400LFM (2.0m/s) 600LFM (3.0m/s) 4 2 0 25 35 45 55 65 75 85 AMBIENT TEMEPERATURE, TA (oC) Figure 19. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(-) to Vout(+);VIN =24V, VO=12V. September 11, 2020 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) 10 8 6 4 2 0 20 30 40 50 60 70 COLDPLATE TEMEPERATURE, TC 80 90 (oC) Figure 22. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; VIN =24V or 48V. (c)2015 General Electric Company. All rights reserved. Page 10 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Through-Hole Soldering Information Tin Lead Soldering Lead-Free Soldering The EHHD010A0B power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. The EHHD010A0B xx RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pbfree wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Paste-in-Hole Soldering The EHHD010A0B xx module is compatible with reflow pastein-hole soldering processes shown in Figures 24-26. Since the EHHD010A0B xxZ module is not packaged per J-STD-033 Rev.A, the module must be baked prior to the paste-in-hole reflow process. Please contact your ABB Sales Representative for further information. Pick and Place Lead Free Soldering The -Z version of the EHHD010A0B modules are lead-free (Pbfree) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. REFLOW TEMP ( C) The EHHD010A0B modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300oC. The label also carries product information such as product code, serial number and the location of manufacture. In a conventional Tin/Lead (Sn/Pb) solder process, peak reflow temperatures are limited to less than 235C. Typically, the eutectic solder melts at 183C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of reflow technologies currently used in the industry. These power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering, the solder reflow profile should be established by accurately measuring the modules connector temperatures. Figure 23. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. REFLOW TIME (S) Figure 24. Reflow Profile for Tin/Lead (Sn/Pb) process. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 11 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module MAX TEMP SOLDER ( C) 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Figure 25. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process Pb-free Reflow Profile Power systems will comply with J-STD-015 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and applicable MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 26. 300 Per J-STD-020 Rev. C Peak Temp 260C Reflow Temp (C) 250 200 * Min. Time Above 235C 15 Seconds 150 Heating Zone 1C/Second Cooling Zone *Time Above 217C 60 Seconds 100 50 0 Reflow Time (Seconds) Figure 26. Recommended linear reflow profile using Sn/Ag/Cu solder. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 12 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output EMC Considerations The circuit and plots in Figure 27 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. FLT012A0 EHHD010 FILTER Figure 27. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT012A0 data sheet (DS05-028). VIN = 48V, Io = Io,max, L Line September 11, 2020 VIN = 48V, Io = Io,max, N Line (c)2015 General Electric Company. All rights reserved. Page 13 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Mechanical Outline for Through-Hole Module Dimensions are in millimeters and Mechanical [inches]. Outline for EHHD_120W Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] *Top side label includes GE name, product designation and date code. Through-hole Module Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View* VO- VI- SENSEON/OFF TRIM SENSE+ VI+ September 11, 2020 VO+ (c)2015 General Electric Company. All rights reserved. Page 14 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Mechanical Outline forin. EHHD_120W Through-Hole Module with 1/8th Brick Heat Plate Tolerances: x.x mm 0.5 mm [x.xx 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View* VO- VI- SENSEON/OFF TRIM SENSE+ VI+ VO+ *Bottom side label includes product designation and date code. **Side View **Side label contains product designation and date code. September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 15 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Mechanical Outline for Through-Hole Module with 1/4 Brick Heat Plate (-18H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] Mechanical Outline for EHHD_120W Through-Hole Module with 1/4th Brick Heat Plate Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options VO- VI- Bottom View* SENSEON/OFF TRIM SENSE+ VI+ VO+ **Side View **Side label contains product designation and date code. September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 16 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] Pin 1 2 3 4 5 6 7 8 Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+) 58.4[2.30] 47.2[1.86] 39.0[1.54] 26.1[1.03] 17.9[.70] 5.4[.22] KEEP OUT AREAS 1 NOTES: FOR 0.030" X 0.025" RECTANGULAR PIN, USE 0.063" PLATED THROUGH HOLE DIAMETER FOR 0.062" DIA PIN, USE 0.087" PLATED THROUGH HOLE DIAMETER 22.8 [.90] 5 4 3.8[.15] 3.8 [.15] 7 6 2 11.7 [.46] 7.62 [.300] 8 50.80[2.000] 3.81 [.150] TH Recommended Pad Layout (Component View) TH Recommend Pad Layout Side (Component Side View) September 11, 2020 (c)2015 General Electric Company. All rights reserved. Page 17 GE Datasheet EHHD010A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 10A, 120W Output Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Product Codes Input Voltage EHHD010A0B 41Z EHHD010A0B 41-HZ EHHD010A0B 41-18HZ 24/48V (18-75Vdc) 24/48V (18-75Vdc) 24/48V (18-75Vdc) Output Voltage 12V 12V 12V Output Current 10A 10A 10A On/Off Logic Negative Negative Negative Connector Type Through hole Through hole Through hole Comcodes 150029653 150029831 150029833 Ratings Table 2. Device Coding Scheme and Options Characteristic Form Factor Family Designator Input Voltage Output Current Output Voltage Pin Length Action following Protective Shutdown Options On/ Off Logic Customer Specific Mechanical Features RoHS Character and Position E HH D 010A0 B Definition E = 1 / 8th Brick HH = HammerheadTM Series D = UltraWide Range, 18V-75V 010A0 = 010.0 Amps Maximum Output Current B=12V Nominal Omit = Default Pin Length shown in Mechanical Outline Figures 6 = Pin Length: 3.68 mm 0.25mm , (0.145 in. 0.010 in.) 8 = Pin Length: 2.79 mm 0.25mm , (0.110 in. 0.010 in.) 6 8 4 = Auto-restart following shutdown (Overcurrent/ Overvoltage) Must be ordered 4 Omit = Positive Logic 1 = Negative Logic 1 XY XY= Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module H = 1/ 8th Brick size heat plate, for use with heat sinks (not available H with -S option) 18H 18H = 1/ 4th Brick size heat plate with unthreaded inserts for use in coldwall applications (not available with -S option) S S = Surface Mount connections Omit = RoHS 5/ 6, Lead Based Solder Used Z Z = RoHS 6/ 6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86-21-53899666 Europe, Middle-East and Africa: +49.89.878067-280 Go.ABB/Industrial GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. September 11, 2020 (c)2016 General Electric Company. All rights reserved. Version 2_6