2015-12-08 1
2015-1 2-08
Silicon NPN Phototransistor in SMT TOPLED®-Package
Version 1.4
SFH 320
Ordering Information
Features:
•Spectral range of sensitivity: (typ) 450 ... 1150 nm
•Package: TOPLED
•Special: High linearity
•P-LCC-2 package
•Available in groups
•Suitable for all soldering methods
•The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
•Miniature photointerrupters
•Industrial electronics
•For control and drive circuits
Type: Photocurrent Ordering Code
IPCE [µA]
λ = 950 nm, Ee = 0.1 mW/cm2,
VCE = 5 V
SFH 320 16 ... 80 Q65110A2471
SFH 320-3 25 ... 50 Q65110A2469
SFH 320-3/4 25 ... 80 Q65110A1781
SFH 320-4 40 ... 80 Q65110A2510
Note: Only one bin within one packing unit (variation less than 2:1)
2015-12-08 2
Version 1.4 SFH 320
Maximum Ratings (TA = 25 °C)
Characteristics (TA = 25 °C)
Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 100 °C
Collector-emitter voltage VCE 35 V
Collector current IC15 mA
Collector surge current
(τ < 10 µs)
ICS 75 mA
Total Power dissipation Ptot 165 mW
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD 2000 V
Thermal resistance for mounting on pcb RthJA 450 K/W
Parameter Symbol Values Unit
Wavelength of max. sensitivity (typ) λS max 980 nm
Spectral range of sensitivity (typ) λ10% (typ) 450
... 1150
nm
Radiant sensitive area
(ø 220µm)
(typ) A 0.038 mm2
Dimensions of chip area (typ) L x W (typ) 0.45 x
0.45
mm x
mm
Half angle (typ) ϕ ± 60 °
Capacitance
(VCE = 0 V, f = 1 MHz, E = 0)
(typ) CCE 5 pF
Dark current
(VCE = 20 V, E = 0)
(typ (max)) ICE0 1 (≤ 50) nA
Version 1.4 SFH 320
2015-12-08 3
Grouping (TA = 25 °C, λ = 950 nm)
Group Min Photocurrent Max Photocurrent Typ Photocurrent Rise and fall time
Ee = 0.1 mW/cm2,
VCE = 5 V
Ee = 0.1 mW/cm2,
VCE = 5 V
EV = 1000 lx, Std.
Light A, VCE = 5 V
IC = 1 mA, VCC = 5
V, RL = 1 kΩ
IPCE, min [µA] IPCE, max [µA] IPCE [µA] tr, tf [µs]
-2 16 32 420 6
-3 25 50 650 7
-4 40 80 1000 8
Group Collector-emitter saturation voltage
IC = IPCEmin x 0.3, Ee = 0.1 mW/cm2
VCEsat [mV]
-2 150
-3 150
-4 150
Note.: IPCEmin is the min. photocurrent of the specified group.
Relative Spectral Sensitivity 1) page 13
Srel = f(λ)
Photocurrent 1) page 13
IPCE = f(Ee),
V
CE = 5 V
0
OHF00207
400
S
rel
λ
nm
%
500 600 700 800 900 1100
10
20
30
40
50
60
70
80
100
E
OHF01924
e
PCE
Ι
10 -1
10 -3 10 -2 10 0
10 0
10 1
10 2
10 3
2
mW/cm
2
3
4
µA
2015-12-08 4
Version 1.4 SFH 320
Photocurrent 1) page 13
IPCE = f(VCE), Ee = Parameter
Photocurrent 1) page 13
IPCE / IPCE(25°C) = f(TA), VCE = 5 V
Dark Current 1) page 13
ICEO = f(VCE), E = 0
Dark Current 1) page 13
ICEO = f(TA), E = 0
V
OHF01529
CE
PCE
Ι
0
0
10
10 -2
10 -1
mA
V
5 10 15 20 25 30 35
mW
cm2
0.1
0.25 2
cm
mW
0.5 2
cm
mW
12
cm
mW
T
OHF01524
A
0
-25
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 25 50 75 100
Ι
PCE
PCE
Ι
25
C
V
OHF01527
CE
CEO
Ι
-3
10
10 -2
10 -1
10 0
10 1
0 5 10 15 20 25 30 35V
nA
T
OHF01530
A
CEO
Ι
-1
10
10 0
10 1
10 2
10 3
-25
nA
0 25 50 75 100
˚C
Version 1.4 SFH 320
2015-12-08 5
Collector-Emitter Capacitance 1) page 13
CCE = f(VCE), f = 1 MHz, E = 0
Power Consumption
Ptot = f(TA), RthJA = 450 K / W
Directional Characteristics 1) page 13
Srel = f(ϕ)
V
OHF01528
CE
-2
10
CE
C
10 -1 10 010 110 2
0V
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
5.0
pF
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
0
2015-12-08 6
Version 1.4 SFH 320
Package Outline
Dimensions in mm (inch).
Package
TOPLED
Approximate Weight:
35 mg
GPLY6030
0.7 (0.028)
0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)
0.18 (0.007)
0.5 (0.020)
1.1 (0.043)
3.3 (0.130)
3.7 (0.146)
0.4 (0.016)
0.6 (0.024)
2.6 (0.102)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
Collector marking
3.0 (0.118)
3.4 (0.134)
(2.4) (0.095)
0.1 (0.004) (typ.)
4˚±1
Version 1.4 SFH 320
2015-12-08 7
Recommended Solder Pad
Dimensions in mm.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
2015-12-08 8
Version 1.4 SFH 320
Taping
Dimensions in mm (inch).
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time
25 °C to TP
Time within 5 °C of the specified peak
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
OHAY2271
3.6 (0.142)
8 (0.315)
3.5 (0.138)
1.75 (0.069)
4 (0.157)1.5 (0.059)
2.9 (0.114) 4 (0.157)
2 (0.079) Cathode/Collector Marking
Version 1.4 SFH 320
2015-12-08 9
Tape dimensions [mm]
Tape dim ensions in m m
Reel dimensions [mm]
Reel dim ensions in m m
Reel dim ensions in m m
Tape and Reel
8 mm tape with 2000 pcs. on ∅ 180 mm reel, 8000 pcs. on ∅ 330 mm reel
WP0P1P2D0E F
8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05
or
4 ± 0.1
2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05
A W Nmin W1W2max
180 8 60 8.4 + 2 14.4
A W Nmin W1W2max
330 8 60 8.4 + 2 14.4
D0
2
P
P
0
1
P
W
F E
Direction of unreeling
N
W1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
2015-12-08 10
Version 1.4 SFH 320
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
OHA04563
(G) GROUP:
1234567890(1T) LOT NO: (9D) D/C: 1234
(X) PROD NO: 123456789
(6P) BATCH NO: 1234567890
LX XXXX
RoHS Compliant
BIN1: XX-XX-X-XXX-X
ML
XTemp ST
XXX °C X
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
9999(Q)QTY:
Semiconductors
OSRAM Opto
XX-XX-X-X
EXAMPLE
X_X123_1234.1234 XX_X123_1234.1234 X
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
Pack: RXX
XXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-X
EXAMPLE
Pack: RXXPack: RXX
DEMY DEMY
EXAMPLE
1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
12341234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
12341234
EXAMPLE
Pack: RXXPack: RXX
DEMY
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
12345678901234567890
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
SemiconductorsSemiconductors
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
EXAMPLE
SemiconductorsSemiconductors
OSRAM OptoOSRAM Opto
EXAMPLE
EXAMPLE
1234567890
X_X123_1234.1234 X
Pack: RXX
DEMY
X_X123_1234.1234 X
(9D) D/C:
1234
(9D) D/C:
1234567890
(6P) BATCH NO:
1234567890
OSRAM Opto
XXX
X_X123_1234.1234 X
XX-XX-X-X
Pack: RXX
DEMY
Semiconductors
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10% bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Version 1.4 SFH 320
2015-12-08 11
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
200 ± 5
352 ± 5
195 ± 5
352 ± 5
30 ± 5
33 ± 5
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
2015-12-08 12
Version 1.4 SFH 320
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
Version 1.4 SFH 320
2015-12-08 13
Glossary
1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2015-12-08 14
Version 1.4 SFH 320
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.