PAN1326C Bluetooth Basic Data Rate and Low Energy Module Product Specification Rev. 1.2 Wireless Modules PAN1326C Bluetooth Module Overview Panasonic's new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that brings Texas Instrument's seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy-to-use module format. The PAN1326C is Bluetooth 4.2 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic's tiny footprint technology has produced a module of only 85.5mm. The module is designed to accommodate PCBs pad pitch of 1.3mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instrument's based Bluetooth HCI modules. Features * Bluetooth-4.2-compliant up to the HCI layer * Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking) * * * Dimensions: 9.0 mm x 9.5 mm x 1.8 mm Based upon TI's CC2564C Interfaces: UART, GPIO, PCM Characteristics * Bluetooth 4.2 * Receiver sensitivity -93dBm * Output power 11.5dBm * Power supply 1.7V to 4.8V * Power consumption Tx 40mA * Power consumption Rx 20mA * Sleep mode 135A * Operating temperature range -45C to +85C Block Diagram PAN1326C Bluetooth 4.2 Module BR/EDR/LE Vcc 3.3 V UART Crystal 26 MHz GPIOs Chip Antenna Audio PCM/I2C Texas Instruments CC2564C BT-HCI Chip Reset 32 kHz input LPF Product Specification Rev. 1.2 Page 2 PAN1326C Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of it is contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. (c) Panasonic Industrial Devices Europe GmbH 2017. This Product Specification is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status "Engineering Samples". This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 1.2 Page 3 PAN1326C Bluetooth Module Table of Contents 1 2 3 4 5 6 About This Document......................................................................................................................... 5 1.1 Purpose and Audience .............................................................................................................. 5 1.2 Revision History ......................................................................................................................... 5 1.3 Use of Symbols ......................................................................................................................... 5 1.4 Related Documents ................................................................................................................... 5 Overview .............................................................................................................................................. 6 2.1 Block Diagram ........................................................................................................................... 7 2.2 Pin Configuration ....................................................................................................................... 9 2.3 Device Power Supply............................................................................................................... 12 2.4 Clock Inputs ............................................................................................................................. 13 2.5 Bluetooth Features .................................................................................................................. 14 2.6 Interfaces ................................................................................................................................. 14 Detailed Description ......................................................................................................................... 20 3.1 Dimensions .............................................................................................................................. 20 3.2 Footprint .................................................................................................................................. 22 3.3 Packaging ................................................................................................................................ 24 3.4 Case Marking .......................................................................................................................... 29 Specification ..................................................................................................................................... 30 4.1 Default Test Conditions ........................................................................................................... 30 4.2 Absolute Maximum Ratings ..................................................................................................... 30 4.3 Recommended Operating Conditions ...................................................................................... 31 4.4 Current Consumption............................................................................................................... 32 4.5 nSHUTD Requirements ........................................................................................................... 32 4.6 External Digital Slow Clock Requirements .............................................................................. 32 4.7 Bluetooth ................................................................................................................................. 33 4.8 Reliability Tests ....................................................................................................................... 41 4.9 Recommended Soldering Profile ............................................................................................. 42 Cautions ............................................................................................................................................ 43 5.1 Design Notes ........................................................................................................................... 43 5.2 Installation Notes ..................................................................................................................... 43 5.3 Usage Condition Notes ............................................................................................................ 44 5.4 Storage Notes .......................................................................................................................... 44 5.5 Safety Cautions ....................................................................................................................... 44 5.6 Other Cautions ........................................................................................................................ 45 5.7 Bluetooth Declaration .............................................................................................................. 45 5.8 Life Support Policy ................................................................................................................... 46 5.9 Restricted End Use .................................................................................................................. 46 Appendix ........................................................................................................................................... 47 6.1 Ordering Information ................................................................................................................ 47 6.2 Contact Details ........................................................................................................................ 48 Product Specification Rev. 1.2 Page 4 PAN1326C Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1326C module. It is intended for hardware design, application, and Original Equipment Manufacturer (OEM) engineers. The product is referred to as "the PAN1326C" or "the module" within this document. 1.2 1.3 Revision History Revision Date Modifications/Remarks 1.0 01.11.2017 1st version 1.1 01.02.2018 Added Bluetooth QDIDs. 1.2 10.08.2018 Update layout and editorial changes. Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product's functionality at risk. [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document 1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents 6.2.2 Product Information. Product Specification Rev. 1.2 Page 5 PAN1326C Bluetooth Module 2 Overview 2 Overview Panasonic's new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that brings Texas Instrument's seventh generation Bluetooth core integrated circuit, the CC2564, to an easy-to-use module format. The PAN1326C is Bluetooth-4.2-compliant and it offers best in class RF performance with about twice the range of other Bluetooth Low Energy solutions. Panasonic's tiny footprint technology has produced a module of only 85.5mm. The module is designed to accommodate PCBs pad pitch of 1.3mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instruments-based Bluetooth HCI modules. Please refer to the Panasonic website for related documents 6.2.2 Product Information. Further information on the variants and versions 6.1 Ordering Information. Product Specification Rev. 1.2 Page 6 PAN1326C Bluetooth Module 2 Overview 2.1 Block Diagram PAN1316C Bluetooth 4.2 Module BR/EDR/LE Vcc 3.3 V UART Crystal 26 MHz GPIOs Audio PCM/I2C Texas Instruments CC2564C BT-HCI Chip Reset 32 kHz input LPF RF-Pad PAN1326C Bluetooth 4.2 Module BR/EDR/LE Vcc 3.3 V UART Crystal 26 MHz GPIOs Chip Antenna Audio PCM/I2C Texas Instruments CC2564C BT-HCI Chip Reset 32 kHz input LPF Product Specification Rev. 1.2 Page 7 PAN1326C Bluetooth Module 2 Overview The Slow Clock 32.768kHz is mandatory, otherwise the module does not start up 2.4 Clock Inputs. The IO are 1.8V driven and might need external level shifter and LDO. The MLDO_OUT PIN can not be used as reference due to RF internal connection. The total capacity will not exceed 2.8F and the total inductance will not exceed 0nH. There are no voltage multiplying or voltage boosting circuits. Product Specification Rev. 1.2 Page 8 PAN1326C Bluetooth Module 2 Overview 2.2 Pin Configuration Pin Assignment PAN1316C Top View 9,00 mm 19 6,50 mm 20 17 18 15 16 13 12 14 21 Pad = 24 x 0.60mm x 0.60mm 11 Module Height 1.8 mm 22 Top View 23 2 24 10 1 9 4 3 6 5 8 7 PIN Assignment PAN1326C 0,55 C D A B 19 20 17 18 15 16 13 9.50 1.80 9.00 12 14 21 Pad = 28 x 0.60mm x 0.60mm 11 Top View 10 23 2 24 1 Product Specification Rev. 1.2 9 4 3 6 5 8 0,60 22 7 Page 9 PAN1326C Bluetooth Module 2 Overview Pin Functions No Pin Name Pull at Reset Def. I/O Type 1 Dir. 1 GND 2 Description Connect to Ground 2 TX_DBG PU O 2mA Logger output 3 HCI_CTS PU I 8mA HCI UART clear-to-send 4 HCI_RTS PU O 8mA HCI UART request-to-send 5 HCI_RX PU I 8mA HCI UART data receive 6 HCI_TX PU O 8mA HCI UART data transmit 7 AUD_FSYNC PD IO 4mA PCM frame synchronisation (NC if not used) FailSafe3 Fail Safe 8 SLOW_CLK_IN I 32.768-kHz clock in 9 NC IO Not connected 10 MLDO_OUT O Main LDO output (1.8V nom.) 11 CL1.5_LDO_IN I PA LDO input 12 GND Connect to Ground 13 RF IO Bluetooth RF IO 14 GND Connect to Ground 15 MLDO_IN I Main LDO input Shutdown input (active low) 16 nSHUTD PD I 17 AUD_OUT PD O 4mA PCM data output. (NC if not used) Fail Safe 18 AUD_IN PD I 4mA PCM data input. (NC if not used) Fail Safe 19 AUD_CLK PD IO HY, 4mA PCM clock. (NC if not used) Fail Safe 20 GND Connect to Ground 21 NC EEPROM IC SDA (Internal) 22 VDD_IO PI 23 NC 24 NC I/O power supply 1.8V Nom EEPROM IC SCL (Internal) IO Not connected A GND Connect to Ground B GND Connect to Ground C GND Connect to Ground D GND Connect to Ground 1 I=input; O=output; IO=bidirectional; P=power; PU=pulled up; PD=pulled down 2 I/O Type: Digital I/O cells. HY=input hysteresis, current=typ. output current 3 No signals are allowed on the IO pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17-19. Product Specification Rev. 1.2 Page 10 PAN1326C Bluetooth Module 2 Overview For RF conducted measurements either use the PAN1323ETU or de-solder the antenna and solder an antenna connector to the hot pin. Pin Description No Pin Name 5 Pull at Reset Def. I/O Type 4 Dir. 5 HCI_RX PU I 8mA HCI UART data receive 6 HCI_TX PU O 8mA HCI UART data transmit 4 HCI_RTS PU O 8mA HCI UART request-to-send 3 HCI_CTS PU I 8mA HCI UART clear-to-send 7 AUD_FYSNC PD IO 4mA PCM frame synchronisation (NC if not used) Fail safe 19 AUD_CLK PD IO HY, 4mS PCM clock (NC if not used) Fail safe 18 AUD_IN PD I 4mA PCM data input (NC if not used) Fail safe 17 AUD_OUT PD O 4mA PCM data output (NC if not used) Fail safe PU O 2mA 2 TX_DBG Description Logger output OPTION: nTX_DBG - logger out (low=1) I 32.768kHz clock in IO Bluetooth RF IO (not connected with antenna) I Shutdown input (active low) 22 VDD_IO PI I/O power supply 1.8V Nom 15 MLDO_IN I Main LDO input Connect directly to battery or to a pre-regulated 1.8V supply 10 MLDO_OUT O Main LDO output (1.8V nom.) Can not be used as 1.8V supply due to internal connection to the RF part 11 CL1.5_LDO_IN I Connect directly to battery or to a pre-regulated 1.8V supply 1 GND P Connect to Ground 12 GND P Connect to Ground 14 GND P Connect to Ground 20 GND P Connect to Ground 8 SLOW_CLK_IN 13 RF 16 nSHUTD PD Fail safe PA LDO input 23 NC PU/PD I HY, 4mA EEPROM IC SCL (Internal) 21 NC PU/PD IO HY, 4mA EEPROM IC IRQ (Internal) 4 I=input; O=output; IO=bidirectional; P=power; PU=pulled up; PD=pulled down 5 I/O Type: Digital I/O cells. HY=input hysteresis, current=typ. output current Product Specification Rev. 1.2 Page 11 PAN1326C Bluetooth Module 2 Overview HCI_CTS is an input signal to the CC2564C device: 2.3 * When HCI_CTS is low, then CC2564C is allowed to send data to Host device. * When HCI_CTS is high, then CC2564C is not allowed to send data to Host device. Device Power Supply The PAN1326C Bluetooth radio solution is intended to work in devices with a limited power budget such as cellular phones, headsets, hand-held PC's and other battery-operated devices. One of the main differentiators of the PAN1326C is its power management - it is ability to draw as little current as possible. The PAN1326C device requires two kinds of power sources: 1. Main power supply for the Bluetooth - VDD_IN=VBAT 2. Power source for the 1.8V I/O ring - VDD_IO The PAN1326C includes several on-chip voltage regulators for increased noise immunity. The PAN1326C can be connected either directly to the battery or to an external 1.8V DC to DC converter. Three ways to supply power 1. Full-VBAT system (Maximum RF output power, but not optimum system power): Product Specification Rev. 1.2 Page 12 PAN1326C Bluetooth Module 2 Overview 2. Full-DC2DC system (Lower RF output power, but optimum system power): 3. Mixed DC2DC-VBAT system (Maximum RF output power and optimum system power, but requires routing of VBAT): 2.4 Clock Inputs The Slow Clock is always supplied from an external source. It is connected to the SLOW_CLK_IN pin number 8 and can be a digital signal with peak to peak of 0V - 1.8V. The Slow Clock's frequency accuracy must be 32.768kHz 250ppm for Bluetooth usage (according to the Bluetooth specification). The Slow Clock 32.768kHz is mandatory to start the internal controller; otherwise the module does not start up. Product Specification Rev. 1.2 Page 13 PAN1326C Bluetooth Module 2 Overview 2.5 2.6 2.6.1 Bluetooth Features * * * * * Bluetooth 4.2 compliant up to the HCI layer * Assisted mode for HFP 1.6 Wideband Speech (WBS) profile or A2DP profile to reduce host processing and power * * * Support of multiple Bluetooth profiles with enhanced QoS * * * * Built-in coexistence and prioritization handling for BR, EDR, and Low Energy Up to seven active devices Scatternet: up to three piconets simultaneously, one as master and two as slaves Up to two Synchronous Connection Oriented (SCO) links on the same piconet Support for All Voice Air-Coding - Continuously Variable Slope Delta (CVSD), A-law, -law, modified Subband Coding (mSBC), and transparent (uncoded) Multiple sniff instances tightly coupled to achieve minimum power consumption Independent buffering for Low Energy allows large numbers of multiple connections without affecting BR or EDR performance Capabilities of link layer topology Scatternet - can act concurrently as peripheral and central Network support for up to 10 devices Time line optimization algorithms to achieve maximum channel utilization Interfaces Host Controller Interface (HCI) The CC2564C incorporates one UART module dedicated to the host controller interface (HCI) transport layer. The HCI interface transports commands, events, ACL, and synchronous data between the Bluetooth device and it is host using HCI data packets. The UART module supports H4 (4-wires) protocol with maximum baud rate of 4Mbps for all fast clock frequencies. After power up the baud rate is set for 115.2kbps, irrespective of fast clock frequency. The baud rate can thereafter be changed with a vendor specific command. The CC2564C responds with a Command Complete Event (still at 115.2kbps), after which the baud rate change takes place. HCI hardware includes the following features: * * * Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions Transmitter underflow detection CTS/RTS hardware flow control The interface includes four signals: TXD, RXD, CTS, and RTS. Flow control between the host and the CC2564C is byte-wise by hardware. Flow control is obtained by the following: Product Specification Rev. 1.2 Page 14 PAN1326C Bluetooth Module 2 Overview When the UART RX buffer of the CC2564C passes the "flow control" threshold, it will set the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the CC2564C will stop it is transmission on the interface. In case HCI_CTS is set high in the middle of transmitting a byte, the CC2564C will finish transmitting the byte and stop the transmission. 2.6.2 Audio/Voice CODEC Interface The codec interface is a fully-dedicated programmable serial port that provides the logic to interface to several kinds of PCM or I2S codec's. PAN1326C supports all voice coding schemes required by Bluetooth specification - Log PCM (A-Law or -Law) and Linear (CVSD). In addition, module also supports transparent scheme: * * * * * * * * 2.6.2.1 Two voice channels Master/slave modes -Law, A-Law, Linear, Transparent coding schemes Long and short frames Different data sizes, order, and positions. High rate PCM interface for EDR Enlarged interface options to support a wider variety of codecs PCM bus sharing PCM Hardware Interface The PCM interface is one implementation of the codec interface. It contains the following four lines: * * * * Clock: configurable direction (input or output) Frame synchronisation: configurable direction (input or output) Data In: Input Data Out: Output/3-state The Bluetooth device can be either the master of the interface where it generates the clock and the frame synchronisation signals, or slave where it receives these two signals. The PCM interface is fully configured by a vendor specific command. For slave mode, clock input frequencies of up to 16MHz are supported. At clock rates above 12MHz, the maximum data burst size is 32bits. For master mode, the CC2564C can generate any clock frequency between 64kHz and 6MHz. Product Specification Rev. 1.2 Page 15 PAN1326C Bluetooth Module 2 Overview When the I2S bus is used in an application, it is recommended adding a low pass filter (series resistor and capacitor to GND) to the bus for better noise suppression. Connecting the host Controller/DSP directly with the module's I2S interface is not recommended. The suggested low pass filter component values are: 470pF 120 2.6.2.2 Data Format The data format is fully configurable: 2.6.2.3 * The data length can be from 8bits to 320bits, in 1bit increments, when working with two channels, or up to 640bits when using one channel. The Data length can be set independently for each channel. * The data position within a frame is also configurable in with 1 clock (bit) resolution and can be set independently (relative to the edge of the frame synchronisation signal) for each channel. * The Data_In and Data_Out bit order can be configured independently. For example; Data_In can start with the MSB while Data_Out starts with LSB. Each channel is separately configurable. The inverse bit order (that is, LSB first) is supported only for sample sizes up to 24bits. * * It is not necessary for the data in and data out size to be the same length. The Data_Out line is configured to "high-Z" output between data words. Data_Out can also be set for permanent high-Z, irrespective of data out. This allows the CC2564C to be a bus slave in a multi-slave PCM environment. At power up, Data Out is configured as "high-Z". Frame Idle Period The codec interface has the capability for frame idle periods, where the PCM clock can "take a break" and become "0" at the end of the PCM frame, after all data has been transferred. The CC2564C supports frame idle periods both as master and slave of the PCM bus. When CC2564C is the master of the interface, the frame idle period is configurable. There are two configurable parameters: * Clk_Idle_Start - Indicates the number of PCM clock cycles from the beginning of the frame until the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock will become "0". * Clk_Idle_End - Indicates the time from the beginning of the frame till the end of the idle period. This time is given in multiples of PCM clock periods. The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period. For example, for PCM clock rate=1MHz, frame synchronisation period=10kHz, Clk_Idle_Start=60, Clk_Idle_End=90. Between each two frame synchronisations there are 70 clock cycles (instead of 100). The clock idle period starts 60 clock cycles after the beginning of the frame, and lasts 90 - 60=30 clock cycles. This means that the idle period ends 100 - 90=10 clock cycles before the end of the frame. The data transmission must end prior to the beginning of the idle period. Product Specification Rev. 1.2 Page 16 PAN1326C Bluetooth Module 2 Overview 2.6.2.4 Clock-Edge Operation The codec interface of the CC2564C can work on the rising or the falling edge of the clock. It also has the ability to sample the frame synchronisation and the data at inversed polarity. This is the operation of a falling-edge-clock type of codec. The codec is the master of the PCM bus. The frame synchronisation signal is updated (by the codec) on the falling clock edge and therefore shall be sampled (by the CC2564C) on the next rising clock. The data from the codec is sampled (by the CC2564C) on the clock falling edge. 2.6.2.5 Two-Channel PCM Bus Example In below figure, a 2-channel PCM bus is shown where the two channels have different word sizes and arbitrary positions in the bus frame. (FT stands for Frame Timer) Product Specification Rev. 1.2 Page 17 PAN1326C Bluetooth Module 2 Overview 2.6.2.6 Audio Encoding The CC2564C codec interface can use one of four audio-coding patterns: * * * 2.6.2.7 A-Law (8bit) -Law (8bit) Linear (8bit or 16bit) Improved Algorithm For Lost Packets The CC2564C features an improved algorithm for improving voice quality when received voice data packets are lost. There are two options: * Repeat the last sample - possible only for sample sizes up to 24 bits. For sample sizes >24 bits, the last byte is repeated. * Repeat a configurable sample of 8bits to 24bits (depends on the real sample size), in order to simulate silence (or anything else) in the PCM bus. The configured sample will be written in a specific register for each channel. The choice between those two options is configurable separately for each channel. 2.6.2.8 Bluetooth/PCM Clock Mismatch Handling In Bluetooth RX, the CC2564C receives RF voice packets and writes these to the codec I/F. If the CC2564C receives data faster than the codec I/F output allows, an overflow will occur. In this case, the Bluetooth has two possible behaviour modes: "allow overflow" and "don't allow overflow". * If overflow is allowed, the Bluetooth will continue receiving data and will overwrite any data not yet sent to the codec. * If overflow is not allowed, RF voice packets received when buffer is full will be discarded. Product Specification Rev. 1.2 Page 18 PAN1326C Bluetooth Module 2 Overview 2.6.2.9 Bluetooth Inter-IC Sound (I2S) The CC2564C can be configured as an Inter-IC Sound (I2S) serial interface to an I2S codec device. In this mode, the CC2564C audio codec interface is configured as a bi-directional, full-duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio data and time slot 1 for the right channel audio data. Each time slot is configurable up to 40 serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in length. Do not connect the microcontroller/DSP directly to the module's PCM interface. It is recommended to use a simple RC low pass filter to improve noise suppression. Product Specification Rev. 1.2 Page 19 PAN1326C Bluetooth Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. 3.1.1 PAN1316C Module Drawing No. Item Dimension Tolerance Remark 1 Width 6.50 0.30 2 Length 9.00 0.30 3 Height 1.80 0.20 With case Product Specification Rev. 1.2 Page 20 PAN1326C Bluetooth Module 3 Detailed Description 3.1.2 PAN1326C Module Drawing No. Item Dimension Tolerance Remark 1 Width 9.50 0.30 2 Length 9.00 0.30 3 Height 1.80 0.20 With case Product Specification Rev. 1.2 Page 21 PAN1326C Bluetooth Module 3 Detailed Description 3.2 Footprint 3.2.1 The outer dimensions have a tolerance of 0.2mm. The layout is symmetric to center. The inner pins (2, 4, 6, 9, 11, 14, 16, 18, 21, and 23) are shifted to the center by 1mm. Footprint - PAN1316C Without Antenna 3.95 2.95 1.80 0.90 20 17 18 15 16 13 12 14 6,50 21 Pad = 24 x 0.60mm x 0.60mm 11 Top View 22 10 23 9 2 24 1 0.90 1.70 1.80 2.70 19 4 3 6 5 8 7 9,00 Product Specification Rev. 1.2 Page 22 PAN1326C Bluetooth Module 3 Detailed Description 3.2.2 Footprint - PAN1326C With Antenna Product Specification Rev. 1.2 Page 23 PAN1326C Bluetooth Module 3 Detailed Description 3.3 Packaging The product is a mass production status product and will be delivered in the package described below. 3.3.1 3.3.1.1 Tape Dimensions PAN1316C Without Antenna Y X X Y SECTION SCALE 3.5 Y-Y :1 SECTION SCALE 3.5 X-X :1 o A o B Ko K1 F P1 W 6.90 9.40 2.80 2.00 7.50 12.00 16.00 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.30 Product Specification Rev. 1.2 (I) (II) (III) Forming format : Flatbed - 9 Estimated max. length : 72 meter/22B3 reel (IV) to centreline of pocket. Cumulative tolerance of 10 sprocket holes is 0.20 . Measured from centreline of sprocket hole to centreline of pocket. Other material available. ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED. Page 24 PAN1326C Bluetooth Module 3 Detailed Description 3.3.1.2 PAN1326C With Antenna Y X X Y SECTION YSCALE 3.5 : Y 1 SECTION XSCALE 3.5 : X 1 Ao Bo Ko K1 F P1 W 3.3.2 3.3.2.1 9.90 9.40 2.80 2.00 7.50 12.00 16.00 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.10 +/- 0.30 (I) (II) (III) (IV) Tooling code: Flatbed - 9 Estimated Max Length: 72m per 22B3 Measured from centreline of sprocket hole to centreline of pocket. Cumulative tolerance of 10 sprocket holes is 0.20 . Measured from centreline of sprocket hole to centreline of pocket. Other material available. ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED. Packing in Tape PAN1316C Without Antenna trailer (empty) 1 x circumference / hub (min 160mm) Machine readable 2D-Barcode PAN1315 01/01 ENW89809M5A YYWWDLL FCC ID: T7V1315 PAN1315 01/01 ENW89809M5A YYWWDLL FCC ID: T7V1315 Machine readable 2D-Barcode Direction of unreeling (for customer) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.2 Page 25 PAN1326C Bluetooth Module 3 Detailed Description 3.3.2.2 PAN1326C With Antenna Direction of unreeling (for customer) trailer (empty) 1 x circumference /hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.2 Page 26 PAN1326C Bluetooth Module 3 Detailed Description 3.3.3 Component Direction 3.3.4 PAN1315 01/01 ENW89809M5A YYWWDLL FCC ID: T7V1315 Direction of unreeling (for customer) Machine readable 2D-Barcode Pin 1 Marking (Top Side) Pin 1 Marking (Bottom Side) Circle r = 0.5 mm on solder resist near Pin 1 Reel Dimension Product Specification Rev. 1.2 Page 27 PAN1326C Bluetooth Module 3 Detailed Description 3.3.5 Package Label Example 3.3.6 (1T) Lot code (1P) Customer order number, if applicable (2P) Order number (9D) Date code (Q) Quantity (HW/SW) Hardware/software version Total Package Product Specification Rev. 1.2 Page 28 PAN1326C Bluetooth Module 3 Detailed Description 3.4 Case Marking Example 1 Brand name 2 Hardware/software version 3 Order number 4 2D Data Matrix Code 7 Lot code 8 Marking for Pin 1 Product Specification Rev. 1.2 Page 29 PAN1326C Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: 4.2 25 10C 40 to 85% RH 3.3V Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. All parameters are measured as follows unless stated otherwise: 6 VDD_IN =3.3V, VDD_IO=1.8V. No 7 See Min. Max. Unit Ratings Over Operating Free-Air Temperature Range 1 VDD_IN -0.5 5.5 V 2 VDDIO_1.8V -0.5 2.145 V 3 Input voltage to RF (Pin 13) -0.5 2.1 V 4 Operating ambient temperature range -40 85 8 C 5 Storage temperature range -40 125 C 500 V 6 ESD: Human Body Model (HBM). JEDEC 22-A114 6 7 8 VDD_IN is supplied to MLDO_IN (Pin 15) and CL1.5_LDO_IN (Pin 11); other options are described in 2.3 Device Power Supply. Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Older generation parts, which are not recommended for new designs, will support a temperature range -20 to 70. See 6.1 Ordering Information for details. Product Specification Rev. 1.2 Page 30 PAN1326C Bluetooth Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition VDD_IN Power supply voltage VDD_IO IO power supply voltage 9 Min. Max. Unit 1.7 4.8 V 1.62 1.92 V High-level input voltage Default 0.65 x VDD_IO VDD_IO V VIL Low-level input voltage Default 0 0.35 x VDD_IO V Tr/Tf IO Input rise/fall times, 10% 10 to 90% 1 10 ns VIH Maximum ripple on VDD_IN (Sine wave) for 1.8V (DC2DC) mode 0MHz to 0.1MHz 0.1MHz to 0.5MHz 60 mVpp 50 0.5MHz to 2.5MHz 30 2.5MHz to 3.0MHz 15 > 3.0MHz 5 Voltage dips on VDD_IN (VBAT) (duration=577s to 400 mV 85 C 2.31ms, period=4.6m) Maximum ambient operating 1112 temperature 9 -40 Excluding 1.98 < VDD_IN < 2.2V range is not allowed. 10 Asynchronous mode. 11 The device can be reliably operated for seven years at Tambient of 85C, assuming 25 percent active mode and 75 percent sleep mode (15 400 cumulative active power-on hours). 12 The device can be reliably operated for seven years at Tambient of 85C, assuming 25 percent active mode and 75 percent sleep mode (15 400 cumulative active power-on-hours). Product Specification Rev. 1.2 Page 31 PAN1326C Bluetooth Module 4 Specification 4.4 Current Consumption No Characteristics Min. Typ. Max. Min. 25C 25C 25C -40C 2 Current consumption in Deep Sleep Mode 40 Min. -40C -40C +85C +85C +85C 1 4 Current consumption during transmit DH5 full throughput 40 1 Current consumption in Shutdown Mode 1 Typ. Max. Unit 700 A 1 mA 1 mA 3 7 A nSHUTD Requirements Symbol Parameter VIH Operation mode level VIL Tr/Tf 4.6 Max. 105 3 Total IO current consumption for Active Mode 4.5 Typ. Min. 13 Max. Unit 1.42 1.98 V Shutdown mode level 0 0.4 V Minimum time for nSHUT_DOWN low to reset the device 5 ms Rise/fall times 20 s External Digital Slow Clock Requirements Symbol Parameter Condition Min. Typ. Input Slow Clock frequency Input Slow Clock accuracy (Initial + temp + aging) Max. 32 768 Bluetooth Input transition time Tr/Tf - 10% to 90% Tr/Tf Frequency input duty cycle VIH 13 Unit 15 Phase noise at 1kHz Jitter Integrated over 300Hz to 15 000Hz Slow Clock input voltage limits Square wave, DC coupled 50 Hz 250 Ppm 100 Ns 85 -125 1 0.65 x VDD_IO % dBc/Hz Hz V peak VDD_IO Internal pull down retains shut down mode when no external signal is applied to this pin. Product Specification Rev. 1.2 Page 32 PAN1326C Bluetooth Module 4 Specification Symbol Parameter Condition VIL Slow Clock input voltage limits Square wave, DC coupled Min. Typ. Max. 0 0.35 x V peak VDD_IO Input impedance 1 M Input capacitance 4.7 Unit 5 pF Bluetooth Bluetooth Receiver - In-Band Signals Characteristics Condition Min. Operation frequency range Typ. 2 402 Max. Unit 2 480 MHz Channel spacing 1 MHz Input impedance 50 dBm Sensitivity, Dirty Tx on14 GFSK, BER=0.1% -91.5 -95 /4-DQPSK, BER=0.01% -90.5 -94.5 -81 -87.5 1E-7 8DPSK, BER=0.01% BER error floor at sensitivity +10dB, dirty TX off /4-DQPSK 1E-6 8DPSK 1E-6 Maximum usable input power GFSK, BER=0.1% Intermodulation characteristics 15 C/I performance Image=-1MHz dBm -5 /4-DQPSK, BER=0.1% -10 8DPSK, BER=0.1% -10 Level of interferers (for n=3, 4, and 5) -36 -30 dBm GFSK, cochannel dB /4-DQPSK 9.5 11 16.5 20 -10 -5 -10 -5 -5 -1 -38 -35 /4-DQPSK -38 -35 8DPSK -38 -30 -28 -20 /4-DQPSK -28 -20 8DPSK -22 -13 -45 -43 EDR, cochannel 8DPSK GFSK, adjacent 1MHz EDR, adjacent 1MHz, (image) /4-DQPSK 8DPSK GFSK, adjacent +2MHz EDR, adjacent, +2MHz GFSK, adjacent -2MHz EDR, adjacent -2MHz GFSK, adjacent |3|MHz 14 Sensitivity degradation up to 3dB may occur for minimum and typical values where the Bluetooth frequency is a harmonic of the fast clock. 15 Numbers show ratio of desired signal to interfering signal. Smaller numbers indicate better C/I performance. Product Specification Rev. 1.2 Page 33 PAN1326C Bluetooth Module 4 Specification Characteristics Condition EDR, adjacent |3|MHz Min. Typ. /4-DQPSK -45 -43 8DPSK -44 -36 RF return loss RX mode LO leakage Max. Unit -10 Frf=(received RF - 0.6MHz) -63 dB -58 dBm Bluetooth Receiver - General Blocking Characteristics Condition Blocking performance over full range, according to Bluetooth 30 to 2 000 -6 MHz 2 000 to 2 399 -6 MHz 2 484 to 3 000 -6 MHz 3 to 12.75 -6 GHz specification16 Min. Typ. Unit Bluetooth Transmitter - GFSK Characteristics Maximum RF output power 17 Min. Typ. VDD_IN=VBAT 12 VDD_IN=external regulator to 1.8V 10 Power variation over Bluetooth band -1 Max Unit dBm 1 dB Gain control range 30 dB Power control step 5 dB Adjacent channel power |M-N|=2 -45 dBm Adjacent channel power |M-N|>2 -50 dBm 16 Exceptions are taken out of the total 24 allowed in the Bluetooth specification. 17 To modify maximum output power, use an HCI VS command. Product Specification Rev. 1.2 Page 34 PAN1326C Bluetooth Module 4 Specification Bluetooth Transmitter - EDR Characteristics EDR output power Min. 18 /4-DQPSK Typ. VDD_IN=VBAT Max Unit 5.5 dBm VDD_IN=external regulator to 1.8V 8DPSK VDD_IN=VBAT VDD_IN=external regulator to 1.8V EDR relative power -2 1 dB Power variation over Bluetooth band -1 1 dB Gain control range 30 dB Power control step 5 dB Adjacent channel power |M-N|=1 -36 dBc Adjacent channel power |M-N|=2 -30 dBm Adjacent channel power |M-N|>2 -42 dBm Bluetooth Modulation - GFSK Characteristics F1 avg Condition Min. -20dB bandwidth GFSK Modulation characteristics f1avg Mod data=4 1s, 4 0s: 111100001111... f2max limit for at Mod data=1010101... F2 max Typ. Max. Unit kHz 925 kHz 165 kHz least 99.9% of all 130 f2max f2avg, f1avg Absolute carrier frequency drift 88 % DH1 -25 25 DH3 and DH5 -35 35 Drift rate 15 Initial carrier frequency tolerance -75 75 kHz kHz/5 0 s kHz Bluetooth low energy Transceiver, Out-Of-Band and Spurious Emissions Characteristics Condition Second harmonic Third harmonic Measured at maximum output power Fourth harmonics 18 Min. Typ. Max. Unit -14 -2 -10 -6 -19 -11 dBm To modify maximum output power, use an NCI VS command. Product Specification Rev. 1.2 Page 35 PAN1326C Bluetooth Module 4 Specification Bluetooth low energy Receiver - In-Band Signals Characteristics Condition Operation frequency range Min. Typ. 2 402 Input impedance Sensitivity, Dirty Tx on PER=30.8%; dirty TX on Maximum usable input power GMSK, PER=30.8% Intermodulation characteristics Level of interferers (for n=3, 4, 5) 20 MHz 2 MHz 50 -96 dBm -30 dBm -5 C/I performance GMSK, cochannel Image=-1MHz GMSK, adjacent 1MHz -5 GMSK, adjacent 2MHz -45 GMSK, adjacent -2MHz -22 GMSK, adjacent |3|MHz -47 Frf=(received RF - 0.6MHz) -63 RX mode LO leakage Unit 2 480 Channel spacing 19 Max. 8 dB dBm Bluetooth low energy Receiver--General Blocking Characteristics Condition Blocking performance over full 30 to 2 000MHz -15 range, according to Bluetooth 2 000 to 2 399MHz -15 2 484 to 3 000MHz -15 3 to 12.75GHz -15 low energy specification21 Min. Typ. Max. Unit dBm Bluetooth low energy Transmitter Characteristics RF output power Min. Typ. VDD_IN=VBAT 12 VDD_IN=External regulator to 1.8V 10 Power variation over Bluetooth low energy band Max. Unit dBm 1 dB Adjacent channel power |M-N|=2 -45 dBm Adjacent channel power |M-N|>2 -50 dBm 19 Sensitivity degradation up to 3dB may occur where the Bluetooth low energy frequency is a harmonic of the fast clock. 20 Numbers show wanted signal-to-interfering signal ratio. Smaller numbers indicate better C/I performance. 21 Exceptions are taken out of the total 10 allowed in the Bluetooth low energy specification. Product Specification Rev. 1.2 Page 36 PAN1326C Bluetooth Module 4 Specification Bluetooth low energy Modulation Characteristics Condition f1 avg f1avg Modulation characteristics f2 max Min. Mod data=4 1s, 4 0s: Typ. 240 250 185 210 0.85 0.9 Max. Unit 260 kHz 1111000011110000... f2max limit for at Mod data=1010101... kHz least 99.9% of all f2max f2avg, f1avg Absolute carrier -25 25 kHz frequency drift Drift rate Initial carrier 15 kHz/5 0 ms -75 75 kHz frequency tolerance No Parameter Min. Typ. Max. Unit 1 Average Power Hopping DH5 4 11,3 20 dBm 2 Average Power: Ch0 4 11,4 20 dBm 11,6 23 dBm 11,3 20 dBm 11,6 23 dBm 11,3 20 dBm 11,5 23 dBm 3 Peak Power: Ch0 4 Average Power: Ch39 4 5 Peak Power: Ch39 6 Average Power: Ch78 4 7 Peak Power: Ch78 8 Max. Frequency Tolerance: Ch0 -75 -2.6 75 kHz 9 Max. Frequency Tolerance: Ch39 -75 -2.2 75 kHz 10 Max. Frequency Tolerance: Ch78 -75 -2.1 75 kHz 11 Max. Drift: Ch0_DH1 -25 3.6 25 kHz 12 Max. Drift: Ch0_DH3 -40 3.7 40 kHz 13 Max. Drift: Ch0_DH5 -40 4.0 40 kHz 14 Max. Drift Rate: Ch0_DH1 -20 -2.6 20 kHz 15 Max. Drift Rate: Ch0_DH3 -20 -3.2 20 kHz Product Specification Rev. 1.2 Page 37 PAN1326C Bluetooth Module 4 Specification No Parameter Min. Typ. Max. Unit 16 Max. Drift Rate: Ch0_DH5 -20 -3.3 20 kHz 17 Max. Drift: Ch39_DH1 -25 4.0 25 kHz 18 Max. Drift: Ch39_DH3 -40 4.3 40 kHz 19 Max. Drift: Ch39_DH5 -40 4.3 40 kHz 20 Max. Drift Rate: Ch39_DH1 -20 -3.1 20 kHz 21 Max. Drift Rate: Ch39_DH3 -20 -3.6 20 kHz 22 Max. Drift Rate: Ch39_DH5 -20 -3.7 20 kHz 23 Max. Drift: Ch78_DH1 -25 4.1 25 kHz 24 Max. Drift: Ch78_DH3 -40 4.5 40 kHz 25 Max. Drift: Ch78_DH5 -40 4.4 40 kHz 26 Max. Drift Rate: Ch78_DH1 -20 -3.4 20 kHz 27 Max. Drift Rate: Ch78_DH3 -20 -3.9 20 kHz 28 Max. Drift Rate: Ch78_DH5 -20 -4.1 20 kHz 29 Delta F1 Avg: Ch0 140 159.5 175 kHz 30 Delta F2 Max.: Ch0 99.9 100.0 31 Delta F2 Avg/Delta F1 Avg: Ch0 0.8 0.9 32 Delta F1 Avg: Ch39 140 159.8 33 Delta F2 Max.: Ch39 99.9 100.0 34 Delta F2 Avg/Delta F1 Avg: Ch39 0.8 0.9 35 Delta F1 Avg: Ch78 140 159.1 36 Delta F2 Max.: Ch78 99.9 100.0 37 Delta F2 Avg/Delta F1 Avg: Ch78 0.8 0.9 45 Sensitivity -81 -93.0 % 175 kHz % 175 kHz % 46 f(H)-f(L): Ch0 918.4 1 000 kHz 47 f(H)-f(L): Ch39 918.3 1 000 kHz Product Specification Rev. 1.2 Page 38 PAN1326C Bluetooth Module 4 Specification No Parameter Typ. Max. Unit 48 f(H)-f(L): Ch78 918.2 1 000 kHz 49 ACPower -3: Ch3 -51.5 -40 dBm 50 ACPower -2: Ch3 -50.4 -40 dBm 51 ACPower -1: Ch3 -18.5 52 ACPower Center: Ch3 Min. 4 6,8 dBm 20 dBm 53 ACPower +1: Ch3 -19.2 54 ACPower +2: Ch3 -50.7 -40 dBm 55 ACPower +3: Ch3 -53.3 -40 dBm 56 ACPower -3: Ch39 -51.6 -40 dBm 57 ACPower -2: Ch39 -50.7 -40 dBm 58 ACPower -1: Ch39 -19.0 59 ACPower Center: Ch39 4 6,3 dBm dBm 20 dBm 60 ACPower +1: Ch39 -19.7 61 ACPower +2: Ch39 -50.9 -40 dBm 62 ACPower +3: Ch39 -53.2 -40 dBm 63 ACPower -3: Ch75 -51.7 -40 dBm 64 ACPower -2: Ch75 -50.7 -40 dBm 65 ACPower -1: Ch75 -19.2 66 ACPower Center: Ch75 4 5,8 dBm dBm 20 dBm 67 ACPower +1: Ch75 -20.0 dBm 68 ACPower +2: Ch75 -51.0 -40 dBm 69 ACPower +3: Ch75 -53.4 -40 dBm 70 omega i 2-DH5: Ch0 -75 -4.7 75 kHz 71 omega o + omega i 2-DH5: Ch0 -75 -6.0 75 kHz 72 omega o 2-DH5: Ch0 -10 -1.5 10 kHz Product Specification Rev. 1.2 Page 39 PAN1326C Bluetooth Module 4 Specification No Parameter Min. Typ. Max. Unit 73 DEVM RMS 2-DH5: Ch0 0.0 0.2 % 74 DEVM Peak 2-DH5: Ch0 0.1 0.35 % 75 DEVM 99% 2-DH5: Ch0 99 100.0 76 omega i 3-DH5: Ch0 -75 -3.7 75 kHz 77 omega o + omega i 3-DH5: Ch0 -75 -5.8 75 kHz 78 omega o 3-DH5: Ch0 -10 -2.6 10 kHz 79 DEVM RMS 3-DH5: Ch0 0.0 0.13 % 80 DEVM Peak 3-DH5: Ch0 0.1 0.25 % 81 DEVM 99% 3-DH5: Ch0 % 99 100.0 82 omega i 2-DH5: Ch39 -75 -4.8 75 kHz 83 omega o + omega i 2-DH5: Ch39 -75 -6.1 75 kHz 84 omega o 2-DH5: Ch39 -10 -1.4 10 kHz 85 DEVM RMS 2-DH5: Ch39 0.0 0.2 % 86 DEVM Peak 2-DH5: Ch39 0.1 0.35 % 87 DEVM 99% 2-DH5: Ch39 % 99 100.0 88 omega i 3-DH5: Ch39 -75 -3.8 75 kHz 89 omega o + omega i 3-DH5: Ch39 -75 -5.9 75 kHz 90 omega o 3-DH5: Ch39 -10 -2.6 10 kHz 91 DEVM RMS 3-DH5: Ch39 0.0 0.13 % 92 DEVM Peak 3-DH5: Ch39 0.1 0.25 % 93 DEVM 99% 3-DH5: Ch39 % 99 100.0 94 omega i 2-DH5: Ch78 -75 -4.9 75 kHz 95 omega o + omega i 2-DH5: Ch78 -75 -6.2 75 kHz 96 omega o 2-DH5: Ch78 -10 -1.4 10 kHz 0.0 0.2 % 97 DEVM RMS 2-DH5: Ch78 Product Specification Rev. 1.2 % Page 40 PAN1326C Bluetooth Module 4 Specification No Parameter Min. 98 DEVM Peak 2-DH5: Ch78 0.1 99 DEVM 99% 2-DH5: Ch78 Max. Unit 0.35 % 99 100.0 100 omega i 3-DH5: Ch78 -75 -3.8 75 kHz 101 omega o + omega i 3-DH5: Ch78 -75 -6.0 75 kHz 102 omega o 3-DH5: Ch78 -10 -2.7 10 kHz 103 DEVM RMS 3-DH5: Ch78 0.0 0.13 % 104 DEVM Peak 3-DH5: Ch78 0.1 0.25 % 105 DEVM 99% 3-DH5: Ch78 4.8 Typ. 99 % 100.0 % Reliability Tests The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item 1 Vibration test Limit Electrical parameter should be in specification Condition * * Freq.: 10~50Hz; Amplitude: 1.5mm; 20min./cycle, 1hrs. each of XYZ axis Freq.: 30~100Hz, 6G; 20min./cycle, 1hrs. each of XYZ axis 2 Shock test See above Dropped onto hard wood from a height of 50cm for 3 times 3 Heat cycle test See above -40C for 30min. and +85C for 30min.; each temperature 300 cycles 4 Moisture test See above +60C, 90% RH, 300h 5 Low temperature test See above -40C, 300h 6 High temperature test See above +85C, 300h Product Specification Rev. 1.2 Page 41 PAN1326C Bluetooth Module 4 Specification 4.9 Recommended Soldering Profile Reflow permissible cycle: 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead-free soldering Product Specification Rev. 1.2 Page 42 PAN1326C Bluetooth Module 5 Cautions 5 Cautions Failure to follow the guidelines set forth in this document may result in degrading of the product's functions and damage to the product. 5.1 Design Notes 1. Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 F directly at the module). 3. This product should not be mechanically stressed when installed. 4. Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 5. Avoid assembly and use of the target equipment in conditions where the product's temperature may exceed the maximum tolerance. 6. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. 7. Keep this product away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board. 5.2 Installation Notes 1. Reflow soldering is possible twice based on the conditions set forth in 4.9 Recommended Soldering Profile. Set up the temperature at the soldering portion of this product according to this reflow profile. 2. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 3. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. 5. This product should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. Product Specification Rev. 1.2 Page 43 PAN1326C Bluetooth Module 5 Cautions 5.3 Usage Condition Notes 1. Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. 2. Do not use dropped products. 3. Do not touch, damage or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this product. 5. Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 5.4 Storage Notes 1. The module should not be stressed mechanically during storage. 2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: - Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, - Storage in direct sunlight, - Storage in an environment where the temperature may be outside the range of 5C to 35C, or where the humidity may be outside the 45 to 85 percent range, - Storage of the products for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after six months of storage. 3. Keep this product away from water, poisonous gas, and corrosive gas. 4. This product should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (maximum 10). 5.5 Safety Cautions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum: Product Specification Rev. 1.2 Page 44 PAN1326C Bluetooth Module 5 Cautions 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 5.6 Other Cautions 1. Do not use the products for other purposes than those listed. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the product. 3. This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These products are not intended for uses other than under the special conditions shown below. Before using these products under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: - In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, - In direct sunlight, outdoors, or in a dusty environment, - In an environment where condensation occurs, - In an environment with a high concentration of harmful gas (for example salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. Please refer to the Panasonic website for for further information 6.2.2 Product Information. 5.7 Bluetooth Declaration PAN1326C QDID: 39329 https://launchstudio.bluetooth.com/ListingDetails/5045 TI Host-Stack: QDID: 69887 https://launchstudio.bluetooth.com/ListingDetails/23810 TI Profile Stack: QDID: 69886 https://launchstudio.bluetooth.com/ListingDetails/23811 Product Specification Rev. 1.2 Page 45 PAN1326C Bluetooth Module 5 Cautions 5.8 Life Support Policy This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect it is safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. 5.9 Restricted End Use This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end user or any end use prohibited by the European Union, United States or any other applicable law is strictly prohibited. Product Specification Rev. 1.2 Page 46 PAN1326C Bluetooth Module 6 Appendix 6 Appendix 6.1 Ordering Information Variants and Versions Order Number Brand Name Description MOQ 22 ENW89823C4KF 23 ENW89823A4KF 22 23 PAN1316C Bluetooth Basic Data Rate and Low Energy Module w/o antenna 1 500 PAN1326C Bluetooth Basic Data Rate and Low Energy Module w/ antenna 1 500 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. Samples are available on customer demand. Product Specification Rev. 1.2 Page 47 PAN1326C Bluetooth Module 6 Appendix 6.2 6.2.1 Contact Details Contact Us Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic "Sales & Support" website to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 6.2.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Product Specification Rev. 1.2 Page 48