PAN1326C
Bluetooth Basic Data Rate and Low Energy Module
Product Specification
Rev. 1.2
Wireless Modules

PAN1326C Bluetooth Module
Product Specification Rev. 1.2 Page 2
Overview
Panasonic’s new PAN1326C is a Host Controlled
Interface (HCI) Bluetooth RF module that brings
Texas Instrument’s seventh generation Bluetooth
core integrated circuit, the CC2564C, to an
easy-to-use module format. The PAN1326C is
Bluetooth 4.2 compliant and it offers best-in-class RF
performance with about twice the range of other
Bluetooth Low Energy solutions. Panasonic’s tiny
footprint technology has produced a module of only
85.5 mm². The module is designed to accommodate
PCBs pad pitch of 1.3 mm and as few as two layers
for easy implementation and manufacturing. The
module has been designed to be 100 percent
pin-compatible with previous generations of Texas
Instrument’s based Bluetooth HCI modules.
Features
• Bluetooth-4.2-compliant up to the HCI layer
• Best-in-class Bluetooth RF performance (Tx,
Rx sensitivity, blocking)
• Dimensions: 9.0 mm x 9.5 mm x 1.8 mm
• Based upon TI’s CC2564C
• Interfaces: UART, GPIO, PCM
Characteristics
• Bluetooth 4.2
• Receiver sensitivity -93 dBm
• Output power 11.5 dBm
• Power supply 1.7 V to 4.8 V
• Power consumption Tx 40 mA
• Power consumption Rx 20 mA
• Sleep mode 135 µA
• Operating temperature range -45 ºC to +85 ºC
Block Diagram
Chip
Antenna
Texas Instruments
CC2564C
BT-HCI Chip
UART
GPIOs
Audio PCM/I2C
Reset
32 kHz input
Vcc 3.3 V
LPF
PAN1326C
Bluetooth 4.2 Module
BR/EDR/LE
Crystal
26 MHz
PAN1326C Bluetooth Module
Product Specification Rev. 1.2 Page 3
PAN1326C Bluetooth Module
Product Specification Rev. 1.2 Page 4
Table of Contents
1 About This Document ......................................................................................................................... 5
1.1 Purpose and Audience .............................................................................................................. 5
1.2 Revision History ......................................................................................................................... 5
1.3 Use of Symbols ......................................................................................................................... 5
1.4 Related Documents ................................................................................................................... 5
2 Overview .............................................................................................................................................. 6
2.1 Block Diagram ........................................................................................................................... 7
2.2 Pin Configuration ....................................................................................................................... 9
2.3 Device Power Supply............................................................................................................... 12
2.4 Clock Inputs ............................................................................................................................. 13
2.5 Bluetooth Features .................................................................................................................. 14
2.6 Interfaces ................................................................................................................................. 14
3 Detailed Description ......................................................................................................................... 20
3.1 Dimensions .............................................................................................................................. 20
3.2 Footprint .................................................................................................................................. 22
3.3 Packaging ................................................................................................................................ 24
3.4 Case Marking .......................................................................................................................... 29
4 Specification ..................................................................................................................................... 30
4.1 Default Test Conditions ........................................................................................................... 30
4.2 Absolute Maximum Ratings ..................................................................................................... 30
4.3 Recommended Operating Conditions ...................................................................................... 31
4.4 Current Consumption............................................................................................................... 32
4.5 nSHUTD Requirements ........................................................................................................... 32
4.6 External Digital Slow Clock Requirements .............................................................................. 32
4.7 Bluetooth ................................................................................................................................. 33
4.8 Reliability Tests ....................................................................................................................... 41
4.9 Recommended Soldering Profile ............................................................................................. 42
5 Cautions ............................................................................................................................................ 43
5.1 Design Notes ........................................................................................................................... 43
5.2 Installation Notes ..................................................................................................................... 43
5.3 Usage Condition Notes ............................................................................................................ 44
5.4 Storage Notes .......................................................................................................................... 44
5.5 Safety Cautions ....................................................................................................................... 44
5.6 Other Cautions ........................................................................................................................ 45
5.7 Bluetooth Declaration .............................................................................................................. 45
5.8 Life Support Policy ................................................................................................................... 46
5.9 Restricted End Use .................................................................................................................. 46
6 Appendix ........................................................................................................................................... 47
6.1 Ordering Information ................................................................................................................ 47
6.2 Contact Details ........................................................................................................................ 48
PAN1326C Bluetooth Module
1 About This Document
Product Specification Rev. 1.2 Page 5
1 About This Document
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1326C module. It is intended for hardware design,
application, and Original Equipment Manufacturer (OEM) engineers. The product is referred to
as “the PAN1326C” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
1.0
01.11.2017
1st version
1.1
01.02.2018
Added Bluetooth QDIDs.
1.2
10.08.2018
Update layout and editorial changes.
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 6.2.2 Product Information.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 6
2 Overview
Panasonic’s new PAN1326C is a Host Controlled Interface (HCI) Bluetooth RF module that
brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to
an easy-to-use module format. The PAN1326C is Bluetooth-4.2-compliant and it offers
best in class RF performance with about twice the range of other Bluetooth Low Energy
solutions. Panasonic’s tiny footprint technology has produced a module of only 85.5 mm². The
module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for
easy implementation and manufacturing. The module has been designed to be 100 percent
pin-compatible with previous generations of Texas Instruments-based Bluetooth HCI modules.
Please refer to the Panasonic website for related documents 6.2.2 Product Information.
Further information on the variants and versions 6.1 Ordering Information.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 7
2.1 Block Diagram
Texas Instruments
CC2564C
BT-HCI Chip
UART
GPIOs
Audio PCM/I2C
Reset
32 kHz input
Vcc 3.3 V
LPF
PAN1316C
Bluetooth 4.2 Module
BR/EDR/LE
Crystal
26 MHz
RF-Pad
Chip
Antenna
Texas Instruments
CC2564C
BT-HCI Chip
UART
GPIOs
Audio PCM/I2C
Reset
32 kHz input
Vcc 3.3 V
LPF
PAN1326C
Bluetooth 4.2 Module
BR/EDR/LE
Crystal
26 MHz
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 8
The Slow Clock 32.768 kHz is mandatory, otherwise the module does not start
up 2.4 Clock Inputs.
The IO are 1.8 V driven and might need external level shifter and LDO. The
MLDO_OUT PIN can not be used as reference due to RF internal connection.
The total capacity will not exceed 2.8 µF and the total inductance will not
exceed 0 nH. There are no voltage multiplying or voltage boosting circuits.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 9
2.2 Pin Configuration
Pin Assignment PAN1316C Top View
PIN Assignment PAN1326C
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Top View
9,00 mm
6,50 mm
20
23
1
24
19
18 12
7
Pad = 24 x 0.60mm x 0.60mm
Module Height 1.8 mm
17 15 13
14
11
9
8
6
53
2
21
22 10
4
16
Pad = 28 x 0.60mm x 0.60mm
Top View
9.00 0,55
1.80
9.50
0,60
20
23
1
24
19
18 12
7
A
C
B
D
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 10
Pin Functions
No
Pin Name
Pull at
Reset
Def.
Dir. 1
I/O Type 2
Description
1
GND
Connect to Ground
2
TX_DBG
PU
O
2 mA
Logger output
3
HCI_CTS
PU
I
8 mA
HCI UART clear-to-send
4
HCI_RTS
PU
O
8 mA
HCI UART request-to-send
5
HCI_RX
PU
I
8 mA
HCI UART data receive
6
HCI_TX
PU
O
8 mA
HCI UART data transmit
7
AUD_FSYNC
PD
IO
4 mA
PCM frame synchronisation (NC if not used) FailSafe3
8
SLOW_CLK_IN
I
32.768-kHz clock in Fail Safe
9
NC
IO
Not connected
10
MLDO_OUT
O
Main LDO output (1.8 V nom.)
11
CL1.5_LDO_IN
I
PA LDO input
12
GND
Connect to Ground
13
RF
IO
Bluetooth RF IO
14
GND
Connect to Ground
15
MLDO_IN
I
Main LDO input
16
nSHUTD
PD
I
Shutdown input (active low)
17
AUD_OUT
PD
O
4 mA
PCM data output. (NC if not used) Fail Safe
18
AUD_IN
PD
I
4 mA
PCM data input. (NC if not used) Fail Safe
19
AUD_CLK
PD
IO
HY, 4 mA
PCM clock. (NC if not used) Fail Safe
20
GND
Connect to Ground
21
NC
EEPROM I²C SDA (Internal)
22
VDD_IO
PI
I/O power supply 1.8 V Nom
23
NC
EEPROM I²C SCL (Internal)
24
NC
IO
Not connected
A
GND
Connect to Ground
B
GND
Connect to Ground
C
GND
Connect to Ground
D
GND
Connect to Ground
1
I=input; O=output; IO=bidirectional; P=power; PU=pulled up; PD=pulled down
2
I/O Type: Digital I/O cells. HY=input hysteresis, current=typ. output current
3
No signals are allowed on the IO pins if no VDD_IO (Pin 22) power supplied, except pin 7, 8, 17-19.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 11
For RF conducted measurements either use the PAN1323ETU or de-solder the antenna and
solder an antenna connector to the hot pin.
Pin Description
No
Pin Name
Pull at
Reset
Def.
Dir. 4
I/O Type 5
Description
5
HCI_RX
PU
I
8 mA
HCI UART data receive
6
HCI_TX
PU
O
8 mA
HCI UART data transmit
4
HCI_RTS
PU
O
8 mA
HCI UART request-to-send
3
HCI_CTS
PU
I
8 mA
HCI UART clear-to-send
7
AUD_FYSNC
PD
IO
4 mA
PCM frame synchronisation (NC if not used) Fail safe
19
AUD_CLK
PD
IO
HY, 4 mS
PCM clock (NC if not used) Fail safe
18
AUD_IN
PD
I
4 mA
PCM data input (NC if not used) Fail safe
17
AUD_OUT
PD
O
4 mA
PCM data output (NC if not used) Fail safe
2
TX_DBG
PU
O
2 mA
Logger output
OPTION: nTX_DBG - logger out (low=1)
8
SLOW_CLK_IN
I
32.768 kHz clock in Fail safe
13
RF
IO
Bluetooth RF IO (not connected with antenna)
16
nSHUTD
PD
I
Shutdown input (active low)
22
VDD_IO
PI
I/O power supply 1.8 V Nom
15
MLDO_IN
I
Main LDO input
Connect directly to battery or to a pre-regulated 1.8 V
supply
10
MLDO_OUT
O
Main LDO output (1.8 V nom.) Can not be used as 1.8 V
supply due to internal connection to the RF part
11
CL1.5_LDO_IN
I
PA LDO input
Connect directly to battery or to a pre-regulated 1.8 V
supply
1
GND
P
Connect to Ground
12
GND
P
Connect to Ground
14
GND
P
Connect to Ground
20
GND
P
Connect to Ground
23
NC
PU/PD
I
HY, 4 mA
EEPROM I²C SCL (Internal)
21
NC
PU/PD
IO
HY, 4 mA
EEPROM I²C IRQ (Internal)
4
I=input; O=output; IO=bidirectional; P=power; PU=pulled up; PD=pulled down
5
I/O Type: Digital I/O cells. HY=input hysteresis, current=typ. output current
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 12
HCI_CTS is an input signal to the CC2564C device:
• When HCI_CTS is low, then CC2564C is allowed to send data to Host
device.
• When HCI_CTS is high, then CC2564C is not allowed to send data to Host
device.
2.3 Device Power Supply
The PAN1326C Bluetooth radio solution is intended to work in devices with a limited power
budget such as cellular phones, headsets, hand-held PC’s and other battery-operated devices.
One of the main differentiators of the PAN1326C is its power management – it is ability to draw
as little current as possible.
The PAN1326C device requires two kinds of power sources:
1. Main power supply for the Bluetooth - VDD_IN=VBAT
2. Power source for the 1.8 V I/O ring - VDD_IO
The PAN1326C includes several on-chip voltage regulators for increased noise immunity. The
PAN1326C can be connected either directly to the battery or to an external 1.8 V DC to DC
converter.
Three ways to supply power
1. Full-VBAT system (Maximum RF output power, but not optimum system power):
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 13
2. Full-DC2DC system (Lower RF output power, but optimum system power):
3. Mixed DC2DC-VBAT system (Maximum RF output power and optimum system power, but
requires routing of VBAT):
2.4 Clock Inputs
The Slow Clock is always supplied from an external source. It is connected to the
SLOW_CLK_IN pin number 8 and can be a digital signal with peak to peak of 0 V - 1.8 V.
The Slow Clock's frequency accuracy must be 32.768 kHz 250 ppm for Bluetooth usage
(according to the Bluetooth specification).
The Slow Clock 32.768 kHz is mandatory to start the internal controller; otherwise the module
does not start up.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 14
2.5 Bluetooth Features
• Bluetooth 4.2 compliant up to the HCI layer
• Up to seven active devices
• Scatternet: up to three piconets simultaneously, one as master and two as slaves
• Up to two Synchronous Connection Oriented (SCO) links on the same piconet
• Support for All Voice Air-Coding - Continuously Variable Slope Delta (CVSD), A-law, µ-law,
modified Subband Coding (mSBC), and transparent (uncoded)
• Assisted mode for HFP 1.6 Wideband Speech (WBS) profile or A2DP profile to reduce host
processing and power
• Support of multiple Bluetooth profiles with enhanced QoS
• Multiple sniff instances tightly coupled to achieve minimum power consumption
• Independent buffering for Low Energy allows large numbers of multiple connections without
affecting BR or EDR performance
• Built-in coexistence and prioritization handling for BR, EDR, and Low Energy
• Capabilities of link layer topology Scatternet - can act concurrently as peripheral and central
• Network support for up to 10 devices
• Time line optimization algorithms to achieve maximum channel utilization
2.6 Interfaces
2.6.1 Host Controller Interface (HCI)
The CC2564C incorporates one UART module dedicated to the host controller interface (HCI)
transport layer. The HCI interface transports commands, events, ACL, and synchronous data
between the Bluetooth device and it is host using HCI data packets.
The UART module supports H4 (4-wires) protocol with maximum baud rate of 4 Mbps for all fast
clock frequencies.
After power up the baud rate is set for 115.2 kbps, irrespective of fast clock frequency. The baud
rate can thereafter be changed with a vendor specific command. The CC2564C responds with a
Command Complete Event (still at 115.2 kbps), after which the baud rate change takes place.
HCI hardware includes the following features:
• Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions
• Transmitter underflow detection
• CTS/RTS hardware flow control
The interface includes four signals: TXD, RXD, CTS, and RTS. Flow control between the host
and the CC2564C is byte-wise by hardware.
Flow control is obtained by the following:
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 15
When the UART RX buffer of the CC2564C passes the “flow control” threshold, it will set the
UART_RTS signal high to stop transmission from the host.
When the UART_CTS signal is set high, the CC2564C will stop it is transmission on the
interface. In case HCI_CTS is set high in the middle of transmitting a byte, the CC2564C will
finish transmitting the byte and stop the transmission.
2.6.2 Audio/Voice CODEC Interface
The codec interface is a fully-dedicated programmable serial port that provides the logic to
interface to several kinds of PCM or I2S codec’s. PAN1326C supports all voice coding schemes
required by Bluetooth specification - Log PCM (A-Law or μ-Law) and Linear (CVSD). In addition,
module also supports transparent scheme:
• Two voice channels
• Master/slave modes
• µ-Law, A-Law, Linear, Transparent coding schemes
• Long and short frames
• Different data sizes, order, and positions.
• High rate PCM interface for EDR
• Enlarged interface options to support a wider variety of codecs
• PCM bus sharing
2.6.2.1 PCM Hardware Interface
The PCM interface is one implementation of the codec interface. It contains the following four
lines:
• Clock: configurable direction (input or output)
• Frame synchronisation: configurable direction (input or output)
• Data In: Input
• Data Out: Output/3-state
The Bluetooth device can be either the master of the interface where it generates the clock and
the frame synchronisation signals, or slave where it receives these two signals. The PCM
interface is fully configured by a vendor specific command.
For slave mode, clock input frequencies of up to 16 MHz are supported. At clock rates above
12 MHz, the maximum data burst size is 32 bits. For master mode, the CC2564C can generate
any clock frequency between 64 kHz and 6 MHz.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 16
When the I2S bus is used in an application, it is recommended adding a low
pass filter (series resistor and capacitor to GND) to the bus for better noise
suppression. Connecting the host μController/DSP directly with the module’s
I2S interface is not recommended.
The suggested low pass filter component values are:
470 pF
120 Ω
2.6.2.2 Data Format
The data format is fully configurable:
• The data length can be from 8 bits to 320 bits, in 1 bit increments, when working with two
channels, or up to 640 bits when using one channel. The Data length can be set
independently for each channel.
• The data position within a frame is also configurable in with 1 clock (bit) resolution and can
be set independently (relative to the edge of the frame synchronisation signal) for each
channel.
• The Data_In and Data_Out bit order can be configured independently. For example;
Data_In can start with the MSB while Data_Out starts with LSB. Each channel is separately
configurable. The inverse bit order (that is, LSB first) is supported only for sample sizes up
to 24 bits.
• It is not necessary for the data in and data out size to be the same length.
• The Data_Out line is configured to “high-Z” output between data words. Data_Out can also
be set for permanent high-Z, irrespective of data out. This allows the CC2564C to be a bus
slave in a multi-slave PCM environment. At power up, Data Out is configured as “high-Z”.
2.6.2.3 Frame Idle Period
The codec interface has the capability for frame idle periods, where the PCM clock can “take a
break” and become “0” at the end of the PCM frame, after all data has been transferred.
The CC2564C supports frame idle periods both as master and slave of the PCM bus.
When CC2564C is the master of the interface, the frame idle period is configurable. There are
two configurable parameters:
• Clk_Idle_Start - Indicates the number of PCM clock cycles from the beginning of the frame
until the beginning of the idle period. After Clk_Idle_Start clock cycles, the clock will become
“0”.
• Clk_Idle_End - Indicates the time from the beginning of the frame till the end of the idle
period. This time is given in multiples of PCM clock periods.
The delta between Clk_Idle_Start and Clk_Idle_End is the clock idle period.
For example, for PCM clock rate=1 MHz, frame synchronisation period=10 kHz,
Clk_Idle_Start=60, Clk_Idle_End=90.
Between each two frame synchronisations there are 70 clock cycles (instead of 100). The clock
idle period starts 60 clock cycles after the beginning of the frame, and lasts 90 – 60=30 clock
cycles. This means that the idle period ends 100 – 90=10 clock cycles before the end of the
frame. The data transmission must end prior to the beginning of the idle period.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 17
2.6.2.4 Clock-Edge Operation
The codec interface of the CC2564C can work on the rising or the falling edge of the clock. It
also has the ability to sample the frame synchronisation and the data at inversed polarity.
This is the operation of a falling-edge-clock type of codec. The codec is the master of the PCM
bus. The frame synchronisation signal is updated (by the codec) on the falling clock edge and
therefore shall be sampled (by the CC2564C) on the next rising clock. The data from the codec
is sampled (by the CC2564C) on the clock falling edge.
2.6.2.5 Two-Channel PCM Bus Example
In below figure, a 2-channel PCM bus is shown where the two channels have different word
sizes and arbitrary positions in the bus frame. (FT stands for Frame Timer)
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 18
2.6.2.6 Audio Encoding
The CC2564C codec interface can use one of four audio-coding patterns:
• A-Law (8 bit)
• µ-Law (8 bit)
• Linear (8 bit or 16 bit)
2.6.2.7 Improved Algorithm For Lost Packets
The CC2564C features an improved algorithm for improving voice quality when received voice
data packets are lost. There are two options:
• Repeat the last sample – possible only for sample sizes up to 24 bits. For sample sizes
>24 bits, the last byte is repeated.
• Repeat a configurable sample of 8 bits to 24 bits (depends on the real sample size), in order
to simulate silence (or anything else) in the PCM bus. The configured sample will be written
in a specific register for each channel.
The choice between those two options is configurable separately for each channel.
2.6.2.8 Bluetooth/PCM Clock Mismatch Handling
In Bluetooth RX, the CC2564C receives RF voice packets and writes these to the codec I/F. If
the CC2564C receives data faster than the codec I/F output allows, an overflow will occur. In
this case, the Bluetooth has two possible behaviour modes: “allow overflow” and “don’t allow
overflow”.
• If overflow is allowed, the Bluetooth will continue receiving data and will overwrite any data
not yet sent to the codec.
• If overflow is not allowed, RF voice packets received when buffer is full will be discarded.
PAN1326C Bluetooth Module
2 Overview
Product Specification Rev. 1.2 Page 19
2.6.2.9 Bluetooth Inter-IC Sound (I2S)
The CC2564C can be configured as an Inter-IC Sound (I2S) serial interface to an I2S codec
device. In this mode, the CC2564C audio codec interface is configured as a bi-directional,
full-duplex interface, with two time slots per frame: Time slot 0 is used for the left channel audio
data and time slot 1 for the right channel audio data. Each time slot is configurable up to
40 serial clock cycles in length and the frame is configurable up to 80 serial clock cycles in
length.
Do not connect the microcontroller/DSP directly to the module’s PCM interface.
It is recommended to use a simple RC low pass filter to improve noise
suppression.
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 20
3 Detailed Description
3.1 Dimensions
All dimensions are in millimeters.
3.1.1 PAN1316C Module Drawing
No.
Item
Dimension
Tolerance
Remark
1
Width
6.50
0.30
2
Length
9.00
0.30
3
Height
1.80
0.20
With case
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 21
3.1.2 PAN1326C Module Drawing
No.
Item
Dimension
Tolerance
Remark
1
Width
9.50
0.30
2
Length
9.00
0.30
3
Height
1.80
0.20
With case
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 22
3.2 Footprint
The outer dimensions have a tolerance of 0.2 mm.
The layout is symmetric to center.
The inner pins (2, 4, 6, 9, 11, 14, 16, 18, 21, and 23) are shifted to the
center by 1 mm.
3.2.1 Footprint – PAN1316C Without Antenna
0.90
1.70
6,50
0.90
1.80
9,00
17 15 13
14 12
11
9
8
7
6
53
2
1
23
24
21
18
19
20
22 10
4
16
Pad = 24 x 0.60mm x 0.60mm
Top View
1.80
2.70
2.95
3.95
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 23
3.2.2 Footprint – PAN1326C With Antenna
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 24
3.3 Packaging
The product is a mass production status product and will be delivered in the package described
below.
3.3.1 Tape Dimensions
3.3.1.1 PAN1316C Without Antenna
to centreline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20 .
Measured from centreline of sprocket
hole to centreline of pocket.
(I)
(II)
(III)
(IV) Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
W
F
P1
+/- 0.10
+/- 0.10
+/- 0.30
7.50
12.00
16.00
K1 2.00 +/- 0.10
Estimated max. length : 72 meter/22B3 reel
Forming format : Flatbed - 9
2.80
+/- 0.10
+/- 0.10
9.40
Bo
Ko
6.90
Ao+/- 0.10
Y
Y
X
X
SECTION
Y-Y
SCALE 3.5
: 1
SECTION
X-X
SCALE 3.5
: 1
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 25
3.3.1.2 PAN1326C With Antenna
3.3.2 Packing in Tape
3.3.2.1 PAN1316C Without Antenna
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
Measured from centreline of sprocket holeMeasured from centreline of sprocket hole
Cumulative tolerance of 10 sprocket
Measured from centreline of sprocket
to centreline of pocket.
holes is ± 0.20 .
hole to centreline of pocket.
(I)
(II)
(III)
(IV) Other material available.
ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED.
W
F
P1
+/- 0.10
+/- 0.10
+/- 0.30
7.50
12.00
16.00
K1 2.00 +/- 0.10
2.80
+/- 0.10
+/- 0.10
9.40
Bo
Ko
9.90Ao +/- 0.10
Tooling code: Flatbed - 9
Estimated Max Length: 72m per 22B3
Y
Y
X
X
SECTION Y-
Y
SCALE 3.5 :
1
SECTION X-
X
SCALE 3.5 :
1
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315 Machine
readable
2D-Barcode
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315 Machine
readable
2D-Barcode
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 26
3.3.2.2 PAN1326C With Antenna
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
trailer (empty)
1 x circumference /hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Direction of unreeling (for customer)
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 27
3.3.3 Component Direction
3.3.4 Reel Dimension
PAN1315 01/01
ENW89809M5A
YYWWDLL
FCC ID: T7V1315 Machine
readable
2D-Barcode
Direction of
unreeling
(for customer)
Pin 1 Marking
(Top Side)
Pin 1 Marking
(Bottom Side)
Circle r = 0.5 mm
on solder resist
near Pin 1
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 28
3.3.5 Package Label
Example
(1T)
(1P)
(2P)
(9D)
(Q)
(HW/SW)
Lot code
Customer order number, if applicable
Order number
Date code
Quantity
Hardware/software version
3.3.6 Total Package
PAN1326C Bluetooth Module
3 Detailed Description
Product Specification Rev. 1.2 Page 29
3.4 Case Marking
Example
1
2
3
4
7
8
Brand name
Hardware/software version
Order number
2D Data Matrix Code
Lot code
Marking for Pin 1
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 30
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C
Humidity: 40 to 85 % RH
Supply Voltage: 3.3 V
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
All parameters are measured as follows unless stated otherwise:
VDD_IN 6=3.3 V, VDD_IO=1.8 V.
No
See7
Min.
Max.
Unit
Ratings Over Operating Free-Air Temperature Range
1
VDD_IN
-0.5
5.5
V
2
VDDIO_1.8 V
-0.5
2.145
V
3
Input voltage to RF (Pin 13)
-0.5
2.1
V
4
Operating ambient temperature range
-40
858
°C
5
Storage temperature range
-40
125
°C
6
ESD: Human Body Model (HBM). JEDEC 22-A114
500
V
6
VDD_IN is supplied to MLDO_IN (Pin 15) and CL1.5_LDO_IN (Pin 11); other options are described
in 2.3 Device Power Supply.
7
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions
beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
8
Older generation parts, which are not recommended for new designs, will support a temperature
range -20 to 70. See 6.1 Ordering Information for details.
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 31
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not
even momentarily or individually, as permanent damage to the module may
result.
Symbol
Parameter
Condition
Min.
Max.
Unit
VDD_IN
Power supply voltage 9
1.7
4.8
V
VDD_IO
IO power supply voltage
1.62
1.92
V
VIH
High-level input voltage
Default
0.65 x
VDD_IO
VDD_IO
V
VIL
Low-level input voltage
Default
0
0.35 x VDD_IO
V
Tr/Tf
IO Input rise/fall times, 10 %
to 90 % 10
1
10
ns
Maximum ripple on VDD_IN
(Sine wave) for 1.8 V
(DC2DC) mode
0 MHz to 0.1 MHz
60
mVp-
p
0.1 MHz to 0.5 MHz
50
0.5 MHz to 2.5 MHz
30
2.5 MHz to 3.0 MHz
15
> 3.0 MHz
5
Voltage dips on VDD_IN
(VBAT) (duration=577 µs to
2.31 ms, period=4.6 m)
400
mV
Maximum ambient operating
temperature 1112
-40
85
C
9
Excluding 1.98 < VDD_IN < 2.2 V range is not allowed.
10
Asynchronous mode.
11
The device can be reliably operated for seven years at Tambient of 85 °C, assuming 25 percent active mode
and 75 percent sleep mode (15 400 cumulative active power-on hours).
12
The device can be reliably operated for seven years at Tambient of 85 °C, assuming 25 percent active mode
and 75 percent sleep mode (15 400 cumulative active power-on-hours).
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 32
4.4 Current Consumption
No
Characteristics
Min.
25 °C
Typ.
25 °C
Max.
25 °C
Min.
-40 °C
Typ.
-40 °C
Max.
-40 °C
Min.
+85 °C
Typ.
+85 °C
Max.
+85 °C
Unit
2
Current
consumption in
Deep Sleep Mode
40
105
700
A
3
Total IO current
consumption for
Active Mode
1
1
1
mA
4
Current
consumption
during transmit
DH5 full
throughput
40
mA
1
Current
consumption in
Shutdown Mode
1
3
7
A
4.5 nSHUTD Requirements
Symbol
Parameter
Min.
Max.
Unit
VIH
Operation mode level 13
1.42
1.98
V
VIL
Shutdown mode level
0
0.4
V
Minimum time for nSHUT_DOWN low to reset the device
5
ms
Tr/Tf
Rise/fall times
20
µs
4.6 External Digital Slow Clock Requirements
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Input Slow Clock frequency
32 768
Hz
Input Slow Clock accuracy
(Initial + temp + aging)
Bluetooth
±250
Ppm
Tr/Tf
Input transition time Tr/Tf –
10 % to 90 %
100
Ns
Frequency input duty cycle
15
50
85
%
Phase noise
at 1 kHz
-125
dBc/Hz
Jitter
Integrated over 300 Hz to
15 000 Hz
1
Hz
VIH
Slow Clock input voltage
limits
Square wave, DC coupled
0.65 x
VDD_IO
VDD_IO
V peak
13
Internal pull down retains shut down mode when no external signal is applied to this pin.
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 33
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
VIL
Slow Clock input voltage
limits
Square wave, DC coupled
0
0.35 x
VDD_IO
V peak
Input impedance
1
M
Input capacitance
5
pF
4.7 Bluetooth
Bluetooth Receiver – In-Band Signals
Characteristics
Condition
Min.
Typ.
Max.
Unit
Operation frequency range
2 402
2 480
MHz
Channel spacing
1
MHz
Input impedance
50
Sensitivity, Dirty Tx on14
GFSK, BER=0.1 %
-91.5
-95
dBm
π/4-DQPSK, BER=0.01 %
-90.5
-94.5
8DPSK, BER=0.01 %
-81
-87.5
BER error floor at sensitivity
+10 dB, dirty TX off
π/4-DQPSK
1E–6
1E–7
8DPSK
1E–6
Maximum usable input power
GFSK, BER=0.1 %
-5
dBm
π/4-DQPSK, BER=0.1 %
-10
8DPSK, BER=0.1 %
-10
Intermodulation characteristics
Level of interferers (for n=3, 4, and 5)
-36
-30
dBm
C/I performance15
Image=–1 MHz
GFSK, cochannel
dB
EDR, cochannel
π/4-DQPSK
9.5
11
8DPSK
16.5
20
GFSK, adjacent ±1 MHz
-10
-5
EDR, adjacent ±1 MHz, (image)
π/4-DQPSK
-10
-5
8DPSK
-5
-1
GFSK, adjacent +2 MHz
-38
-35
EDR, adjacent, +2 MHz
π/4-DQPSK
-38
-35
8DPSK
-38
-30
GFSK, adjacent –2 MHz
-28
-20
EDR, adjacent –2 MHz
π/4-DQPSK
-28
-20
8DPSK
-22
-13
GFSK, adjacent ≥ |±3| MHz
-45
-43
14
Sensitivity degradation up to 3 dB may occur for minimum and typical values where the Bluetooth frequency
is a harmonic of the fast clock.
15
Numbers show ratio of desired signal to interfering signal. Smaller numbers indicate better C/I performance.
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 34
Characteristics
Condition
Min.
Typ.
Max.
Unit
EDR, adjacent ≥ |±3| MHz
π/4-DQPSK
-45
-43
8DPSK
-44
-36
RF return loss
-10
dB
RX mode LO leakage
Frf=(received RF – 0.6 MHz)
-63
-58
dBm
Bluetooth Receiver – General Blocking
Characteristics
Condition
Min.
Typ.
Unit
Blocking performance over full range,
according to Bluetooth
specification16
30 to 2 000
-6
MHz
2 000 to 2 399
-6
MHz
2 484 to 3 000
-6
MHz
3 to 12.75
-6
GHz
Bluetooth Transmitter – GFSK
Characteristics
Min.
Typ.
Max
Unit
Maximum RF output
power17
VDD_IN=VBAT
12
dBm
VDD_IN=external regulator to 1.8 V
10
Power variation over Bluetooth band
-1
1
dB
Gain control range
30
dB
Power control step
5
dB
Adjacent channel power |M–N|=2
-45
dBm
Adjacent channel power |M–N|>2
-50
dBm
16
Exceptions are taken out of the total 24 allowed in the Bluetooth specification.
17
To modify maximum output power, use an HCI VS command.
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 35
Bluetooth Transmitter – EDR
Characteristics
Min.
Typ.
Max
Unit
EDR output power18
π/4-DQPSK
VDD_IN=VBAT
5.5
dBm
VDD_IN=external regulator to 1.8 V
8DPSK
VDD_IN=VBAT
VDD_IN=external regulator to 1.8 V
EDR relative power
-2
1
dB
Power variation over Bluetooth band
-1
1
dB
Gain control range
30
dB
Power control step
5
dB
Adjacent channel power |M–N|=1
-36
dBc
Adjacent channel power |M–N|=2
-30
dBm
Adjacent channel power |M–N|>2
-42
dBm
Bluetooth Modulation – GFSK
Characteristics
Condition
Min.
Typ.
Max.
Unit
–20 dB bandwidth
GFSK
925
kHz
F1 avg
Modulation
characteristics
Δf1avg
Mod data=4 1 s, 4 0 s:
111100001111...
165
kHz
F2 max
Δf2max ≥ limit for at
least 99.9 % of all
Δf2max
Mod data=1010101...
130
kHz
Δf2avg, Δf1avg
88
%
Absolute carrier
frequency drift
DH1
-25
25
kHz
DH3 and DH5
-35
35
Drift rate
15
kHz/5
0 μs
Initial carrier frequency
tolerance
-75
75
kHz
Bluetooth low energy Transceiver, Out-Of-Band and Spurious Emissions
Characteristics
Condition
Min.
Typ.
Max.
Unit
Second harmonic
Measured at maximum output power
-14
-2
dBm
Third harmonic
-10
-6
Fourth harmonics
-19
-11
18
To modify maximum output power, use an NCI VS command.
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 36
Bluetooth low energy Receiver – In-Band Signals
Characteristics
Condition
Min.
Typ.
Max.
Unit
Operation frequency range
2 402
2 480
MHz
Channel spacing
2
MHz
Input impedance
50
Ω
Sensitivity, Dirty Tx on19
PER=30.8 %; dirty TX on
-96
dBm
Maximum usable input power
GMSK, PER=30.8 %
-5
Intermodulation characteristics
Level of interferers (for n=3, 4, 5)
-30
dBm
C/I performance20
Image=–1 MHz
GMSK, cochannel
8
dB
GMSK, adjacent ±1 MHz
-5
GMSK, adjacent ±2 MHz
-45
GMSK, adjacent -2 MHz
-22
GMSK, adjacent ≥ |±3| MHz
-47
RX mode LO leakage
Frf=(received RF – 0.6 MHz)
-63
dBm
Bluetooth low energy Receiver—General Blocking
Characteristics
Condition
Min.
Typ.
Max.
Unit
Blocking performance over full
range, according to Bluetooth
low energy specification21
30 to 2 000 MHz
–15
dBm
2 000 to 2 399 MHz
–15
2 484 to 3 000 MHz
–15
3 to 12.75 GHz
–15
Bluetooth low energy Transmitter
Characteristics
Min.
Typ.
Max.
Unit
RF output power
VDD_IN=VBAT
12
dBm
VDD_IN=External regulator to 1.8 V
10
Power variation over Bluetooth low energy band
1
dB
Adjacent channel power |M-N|=2
-45
dBm
Adjacent channel power |M-N|>2
-50
dBm
19
Sensitivity degradation up to 3 dB may occur where the Bluetooth low energy frequency is a harmonic of the
fast clock.
20
Numbers show wanted signal-to-interfering signal ratio. Smaller numbers indicate better C/I performance.
21
Exceptions are taken out of the total 10 allowed in the Bluetooth low energy specification.
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 37
Bluetooth low energy Modulation
Characteristics
Condition
Min.
Typ.
Max.
Unit
Δf1 avg
Modulation
characteristics
Δf1avg
Mod data=4 1 s, 4 0 s:
1111000011110000...
240
250
260
kHz
Δf2 max
Δf2max ≥ limit for at
least 99.9 % of all
Δf2max
Mod data=1010101...
185
210
kHz
Δf2avg, Δf1avg
0.85
0.9
Absolute carrier
frequency drift
-25
25
kHz
Drift rate
15
kHz/5
0 ms
Initial carrier
frequency
tolerance
-75
75
kHz
No
Parameter
Min.
Typ.
Max.
Unit
1
Average Power Hopping DH5
4
11,3
20
dBm
2
Average Power: Ch0
4
11,4
20
dBm
3
Peak Power: Ch0
11,6
23
dBm
4
Average Power: Ch39
4
11,3
20
dBm
5
Peak Power: Ch39
11,6
23
dBm
6
Average Power: Ch78
4
11,3
20
dBm
7
Peak Power: Ch78
11,5
23
dBm
8
Max. Frequency Tolerance: Ch0
-75
-2.6
75
kHz
9
Max. Frequency Tolerance: Ch39
-75
-2.2
75
kHz
10
Max. Frequency Tolerance: Ch78
-75
-2.1
75
kHz
11
Max. Drift: Ch0_DH1
-25
3.6
25
kHz
12
Max. Drift: Ch0_DH3
-40
3.7
40
kHz
13
Max. Drift: Ch0_DH5
-40
4.0
40
kHz
14
Max. Drift Rate: Ch0_DH1
-20
-2.6
20
kHz
15
Max. Drift Rate: Ch0_DH3
-20
-3.2
20
kHz
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 38
No
Parameter
Min.
Typ.
Max.
Unit
16
Max. Drift Rate: Ch0_DH5
-20
-3.3
20
kHz
17
Max. Drift: Ch39_DH1
-25
4.0
25
kHz
18
Max. Drift: Ch39_DH3
-40
4.3
40
kHz
19
Max. Drift: Ch39_DH5
-40
4.3
40
kHz
20
Max. Drift Rate: Ch39_DH1
-20
-3.1
20
kHz
21
Max. Drift Rate: Ch39_DH3
-20
-3.6
20
kHz
22
Max. Drift Rate: Ch39_DH5
-20
-3.7
20
kHz
23
Max. Drift: Ch78_DH1
-25
4.1
25
kHz
24
Max. Drift: Ch78_DH3
-40
4.5
40
kHz
25
Max. Drift: Ch78_DH5
-40
4.4
40
kHz
26
Max. Drift Rate: Ch78_DH1
-20
-3.4
20
kHz
27
Max. Drift Rate: Ch78_DH3
-20
-3.9
20
kHz
28
Max. Drift Rate: Ch78_DH5
-20
-4.1
20
kHz
29
Delta F1 Avg: Ch0
140
159.5
175
kHz
30
Delta F2 Max.: Ch0
99.9
100.0
%
31
Delta F2 Avg/Delta F1 Avg: Ch0
0.8
0.9
32
Delta F1 Avg: Ch39
140
159.8
175
kHz
33
Delta F2 Max.: Ch39
99.9
100.0
%
34
Delta F2 Avg/Delta F1 Avg: Ch39
0.8
0.9
35
Delta F1 Avg: Ch78
140
159.1
175
kHz
36
Delta F2 Max.: Ch78
99.9
100.0
%
37
Delta F2 Avg/Delta F1 Avg: Ch78
0.8
0.9
45
Sensitivity
-81
-93.0
46
f(H)-f(L): Ch0
918.4
1 000
kHz
47
f(H)-f(L): Ch39
918.3
1 000
kHz
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 39
No
Parameter
Min.
Typ.
Max.
Unit
48
f(H)-f(L): Ch78
918.2
1 000
kHz
49
ACPower -3: Ch3
-51.5
-40
dBm
50
ACPower -2: Ch3
-50.4
-40
dBm
51
ACPower -1: Ch3
-18.5
dBm
52
ACPower Center: Ch3
4
6,8
20
dBm
53
ACPower +1: Ch3
-19.2
dBm
54
ACPower +2: Ch3
-50.7
-40
dBm
55
ACPower +3: Ch3
-53.3
-40
dBm
56
ACPower -3: Ch39
-51.6
-40
dBm
57
ACPower -2: Ch39
-50.7
-40
dBm
58
ACPower -1: Ch39
-19.0
dBm
59
ACPower Center: Ch39
4
6,3
20
dBm
60
ACPower +1: Ch39
-19.7
dBm
61
ACPower +2: Ch39
-50.9
-40
dBm
62
ACPower +3: Ch39
-53.2
-40
dBm
63
ACPower -3: Ch75
-51.7
-40
dBm
64
ACPower -2: Ch75
-50.7
-40
dBm
65
ACPower -1: Ch75
-19.2
dBm
66
ACPower Center: Ch75
4
5,8
20
dBm
67
ACPower +1: Ch75
-20.0
dBm
68
ACPower +2: Ch75
-51.0
-40
dBm
69
ACPower +3: Ch75
-53.4
-40
dBm
70
omega i 2-DH5: Ch0
-75
-4.7
75
kHz
71
omega o + omega i 2-DH5: Ch0
-75
-6.0
75
kHz
72
omega o 2-DH5: Ch0
-10
-1.5
10
kHz
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 40
No
Parameter
Min.
Typ.
Max.
Unit
73
DEVM RMS 2-DH5: Ch0
0.0
0.2
%
74
DEVM Peak 2-DH5: Ch0
0.1
0.35
%
75
DEVM 99 % 2-DH5: Ch0
99
100.0
%
76
omega i 3-DH5: Ch0
-75
-3.7
75
kHz
77
omega o + omega i 3-DH5: Ch0
-75
-5.8
75
kHz
78
omega o 3-DH5: Ch0
-10
-2.6
10
kHz
79
DEVM RMS 3-DH5: Ch0
0.0
0.13
%
80
DEVM Peak 3-DH5: Ch0
0.1
0.25
%
81
DEVM 99 % 3-DH5: Ch0
99
100.0
%
82
omega i 2-DH5: Ch39
-75
-4.8
75
kHz
83
omega o + omega i 2-DH5: Ch39
-75
-6.1
75
kHz
84
omega o 2-DH5: Ch39
-10
-1.4
10
kHz
85
DEVM RMS 2-DH5: Ch39
0.0
0.2
%
86
DEVM Peak 2-DH5: Ch39
0.1
0.35
%
87
DEVM 99 % 2-DH5: Ch39
99
100.0
%
88
omega i 3-DH5: Ch39
-75
-3.8
75
kHz
89
omega o + omega i 3-DH5: Ch39
-75
-5.9
75
kHz
90
omega o 3-DH5: Ch39
-10
-2.6
10
kHz
91
DEVM RMS 3-DH5: Ch39
0.0
0.13
%
92
DEVM Peak 3-DH5: Ch39
0.1
0.25
%
93
DEVM 99% 3-DH5: Ch39
99
100.0
%
94
omega i 2-DH5: Ch78
-75
-4.9
75
kHz
95
omega o + omega i 2-DH5: Ch78
-75
-6.2
75
kHz
96
omega o 2-DH5: Ch78
-10
-1.4
10
kHz
97
DEVM RMS 2-DH5: Ch78
0.0
0.2
%
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 41
No
Parameter
Min.
Typ.
Max.
Unit
98
DEVM Peak 2-DH5: Ch78
0.1
0.35
%
99
DEVM 99 % 2-DH5: Ch78
99
100.0
%
100
omega i 3-DH5: Ch78
-75
-3.8
75
kHz
101
omega o + omega i 3-DH5: Ch78
-75
-6.0
75
kHz
102
omega o 3-DH5: Ch78
-10
-2.7
10
kHz
103
DEVM RMS 3-DH5: Ch78
0.0
0.13
%
104
DEVM Peak 3-DH5: Ch78
0.1
0.25
%
105
DEVM 99 % 3-DH5: Ch78
99
100.0
%
4.8 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature
and humidity for one hour.
No.
Item
Limit
Condition
1
Vibration test
Electrical parameter should be in
specification
• Freq.: 10~50 Hz; Amplitude: 1.5 mm;
20 min./cycle, 1 hrs. each of XYZ axis
• Freq.: 30~100 Hz, 6 G; 20min./cycle, 1 hrs.
each of XYZ axis
2
Shock test
See above
Dropped onto hard wood from a height of
50 cm for 3 times
3
Heat cycle test
See above
-40 °C for 30 min. and +85 °C for 30 min.;
each temperature 300 cycles
4
Moisture test
See above
+60 °C, 90 % RH, 300 h
5
Low temperature test
See above
-40 °C, 300 h
6
High temperature test
See above
+85 °C, 300 h
PAN1326C Bluetooth Module
4 Specification
Product Specification Rev. 1.2 Page 42
4.9 Recommended Soldering Profile
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight
More than 75 percent of the soldering area shall be coated by solder
The soldering profiles should be adhered to in order to prevent
electrical or mechanical damage
Soldering profile assumes lead-free soldering
PAN1326C Bluetooth Module
5 Cautions
Product Specification Rev. 1.2 Page 43
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the product’s functions and damage to the product.
5.1 Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
3. This product should not be mechanically stressed when installed.
4. Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
5. Avoid assembly and use of the target equipment in conditions where the product’s
temperature may exceed the maximum tolerance.
6. The supply voltage should not be exceedingly high or reversed. It should not carry noise
and/or spikes.
7. Keep this product away from other high frequency circuits.
8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in 4.9
Recommended Soldering Profile. Set up the temperature at the soldering portion of this
product according to this reflow profile.
2. Carefully position the products so that their heat will not burn into printed circuit boards
or affect the other components that are susceptible to heat.
3. Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
5. This product should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the unit.
PAN1326C Bluetooth Module
5 Cautions
Product Specification Rev. 1.2 Page 44
5.3 Usage Condition Notes
1. Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, check and evaluate their operation befor assembly on the final products.
2. Do not use dropped products.
3. Do not touch, damage or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
product.
5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on
PCB.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4 Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
– Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
– Storage in direct sunlight,
– Storage in an environment where the temperature may be outside the range of 5 °C to
35 °C, or where the humidity may be outside the 45 to 85 percent range,
– Storage of the products for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after six
months of storage.
3. Keep this product away from water, poisonous gas, and corrosive gas.
4. This product should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (maximum 10).
5.5 Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
PAN1326C Bluetooth Module
5 Cautions
Product Specification Rev. 1.2 Page 45
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6 Other Cautions
1. Do not use the products for other purposes than those listed.
2. Be sure to provide an appropriate fail-safe function on your product to prevent any
additional damage that may be caused by the abnormal function or the failure of the
product.
3. This product has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These products are not intended for uses other than under the special conditions shown
below. Before using these products under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
– In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash,
– In direct sunlight, outdoors, or in a dusty environment,
– In an environment where condensation occurs,
– In an environment with a high concentration of harmful gas (for example salty air, HCl,
Cl2, SO2, H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
Please refer to the Panasonic website for for further information
6.2.2 Product Information.
5.7 Bluetooth Declaration
PAN1326C QDID: 39329
https://launchstudio.bluetooth.com/ListingDetails/5045
TI Host-Stack: QDID: 69887
https://launchstudio.bluetooth.com/ListingDetails/23810
TI Profile Stack: QDID: 69886
https://launchstudio.bluetooth.com/ListingDetails/23811
PAN1326C Bluetooth Module
5 Cautions
Product Specification Rev. 1.2 Page 46
5.8 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect it is safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
5.9 Restricted End Use
This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted
activity that supports the development, production, handling usage, maintenance, storage,
inventory or proliferation of any weapons or military use.
Transfer, export, re-export, usage or reselling of this product to any destination, end user or any
end use prohibited by the European Union, United States or any other applicable law is strictly
prohibited.
PAN1326C Bluetooth Module
6 Appendix
Product Specification Rev. 1.2 Page 47
6 Appendix
6.1 Ordering Information
Variants and Versions
Order Number
Brand Name
Description
MOQ
22
ENW89823C4KF
PAN1316C
Bluetooth Basic Data Rate and Low Energy Module w/o
antenna
1 500
ENW89823A4KF23
PAN1326C
Bluetooth Basic Data Rate and Low Energy Module w/
antenna
1 500
22
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.
23
Samples are available on customer demand.
PAN1326C Bluetooth Module
6 Appendix
Product Specification Rev. 1.2 Page 48
6.2 Contact Details
6.2.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic “Sales & Support”
website to find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
6.2.2 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules