TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 ULTRALOW-NOISE, HIGH PSRR, FAST RF 200mA LOW-DROPOUT LINEAR REGULATORS IN NanoStarTM WAFER CHIP SCALE AND SOT23 FEATURES DESCRIPTION 1 * 200mA RF Low-Dropout Regulator With Enable * Available in Fixed Voltage Versions from 1.8V to 4.75V and Adjustable (1.22V to 5.5V) * High PSRR (70dB at 10kHz) * Ultralow-Noise (32VRMS, TPS79328) * Fast Start-Up Time (50s) * Stable With a 2.2F Ceramic Capacitor * Excellent Load/Line Transient Response * Very Low Dropout Voltage (112mV at 200mA, TPS79330) * 5- and 6-Pin SOT23 (DBV) and NanoStar Wafer Chip Scale (YEQ, YZQ) Packages The TPS793xx family of low-dropout (LDO) low-power linear voltage regulators features high power-supply rejection ratio (PSRR), ultralow-noise, fast start-up, and excellent line and load transient responses in NanoStar wafer chip scale and SOT23 packages. NanoStar packaging gives an ultrasmall footprint as well as an ultralow profile and package weight, making it ideal for portable applications such as handsets and PDAs. Each device in the family is stable, with a small 2.2F ceramic capacitor on the output. The TPS793xx family uses an advanced, proprietary BiCMOS fabrication process to yield extremely low dropout voltages (for example, 112mV at 200mA, TPS79330). Each device achieves fast start-up times (approximately 50s with a 0.001F bypass capacitor) while consuming very low quiescent current (170A typical). Moreover, when the device is placed in standby mode, the supply current is reduced to less than 1A. The TPS79328 exhibits approximately 32VRMS of output voltage noise at 2.8V output with a 0.1F bypass capacitor. Applications with analog components that are noise-sensitive, such as portable RF electronics, benefit from the high PSRR and low-noise features as well as the fast response time. 234 APPLICATIONS * * * * * RF: VCOs, Receivers, ADCs Audio Cellular and Cordless Telephones Bluetooth(R), Wireless LAN Handheld Organizers, PDAs DBV PACKAGE (TOP VIEW) GND 2 EN 3 5 OUT 4 NR Fixed Option DBV PACKAGE (TOP VIEW) IN 1 6 OUT GND 2 5 FB EN 3 4 NR Adjustable Option YEQ, YZQ PACKAGE (TOP VIEW) IN C3 A3 EN C1 B2 A1 OUT TPS79328 TPS79328 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY RIPPLE REJECTION vs FREQUENCY 0.30 100 VIN = 3.8 V COUT = 2.2 F CNR = 0.1 F 0.25 90 IOUT = 200 mA 80 Ripple Rejection (dB) 1 Output Spectral Noise Density (V/Hz) IN 0.20 0.15 IOUT = 1 mA 0.10 IOUT = 200 mA 70 60 50 40 IOUT = 10 mA 30 20 0.05 VIN = 3.8 V COUT = 10 F CNR = 0.01 F 10 0 0 100 NR 1k 10 k Frequency (Hz) 100 k 10 100 1k 10 k 100 k 1M 10 M Frequency (Hz) GND Figure 1. 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar is a trademark of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2001-2007, Texas Instruments Incorporated TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) VOUT (2) PRODUCT TPS793xxyyyz (1) (2) XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable). YYY is package designator. Z is package quantity. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Output voltages from 1.2V to 4.8V in 50mV increments are available; minimum order quantities may apply. Contact factory for details and availability. ABSOLUTE MAXIMUM RATINGS Over operating temperature range (unless otherwise noted) (1) UNIT VIN range -0.3V to 6V VEN range -0.3V to 6V VOUT range -0.3V to 6V Peak output current Internally limited ESD rating, HBM 2kV ESD rating, CDM 500V Continuous total power dissipation See Dissipation Ratings Table Junction temperature range, DBV package -40C to +150C Junction temperature range, YEQ package -40C to +125C Storage temperature range, Tstg -65C to +150C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS TABLE TA = +70C POWER RATING TA = +85C POWER RATING BOARD PACKAGE RJC RJA Low-K (1) DBV 65C/W 255C/W 3.9mW/C 390mW 215mW 155mW High-K (2) DBV 65C/W 180C/W 5.6mW/C 560mW 310mW 225mW (1) YEQ 27C/W 255C/W 3.9mW/C 390mW 215mW 155mW High-K (2) YEQ 27C/W 190C/W 5.3mW/C 530mW 296mW 216mW Low-K (1) (2) 2 TA +25C POWER RATING DERATING FACTOR ABOVE TA = +25C The JEDEC low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2 ounce copper traces on top of the board. The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1 ounce internal power and ground planes and 2 ounce copper traces on top and bottom of the board. Submit Documentation Feedback Copyright (c) 2001-2007, Texas Instruments Incorporated TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 ELECTRICAL CHARACTERISTICS Over recommended operating temperature range TJ = -40C to +125C, VEN = VIN, VIN = VOUT(nom) + 1V (1), IOUT = 1mA, COUT = 10F, CNR = 0.01F (unless otherwise noted). Typical values are at +25C. PARAMETER TEST CONDITIONS VIN Input voltage (1) IOUT Continuous output current VFB Internal reference (TPS79301) V 0 200 mA 1.225 VFB 1.250 V 5.5 - VDO V 2.8V < VIN < 5.5V 1.764 1.8 1.836 V TPS79325 0A < IOUT < 200mA, 3.5V < VIN < 5.5V 2.45 2.5 2.55 V TPS79328 0A < IOUT < 200mA, 3.8V < VIN < 5.5V 2.744 2.8 2.856 V TPS793285 0A < IOUT < 200mA, 3.85V < VIN < 5.5V 2.793 2.85 2.907 V TPS79330 0A < IOUT < 200mA, 4V < VIN < 5.5V 2.94 3 3.06 V TPS79333 0A IOUT < 200mA, 4.3V < VIN < 5.5V 3.234 3.3 3.366 V TPS793475 0A < IOUT < 200mA, 5.25V < VIN < 5.5V 4.655 4.75 4.845 V 0.05 0.12 %/V Load regulation (VOUT%/IOUT) 0A < IOUT < 200mA, TJ = +25C 5 mV TPS79328 IOUT = 200mA 120 200 TPS793285 IOUT = 200mA 120 200 TPS79330 IOUT = 200mA 112 200 TPS79333 IOUT = 200mA 102 180 TPS793475 IOUT = 200mA 77 125 Output current limit VOUT = 0V GND pin current 0A < IOUT < 200mA Shutdown current (3) VEN = 0V, 2.7V < VIN < 5.5V FB pin current VFB = 1.8V TPS79328 Output noise voltage (TPS79328) Time, start-up (TPS79328) UNIT 5.5 0A < IOUT < 200mA, VOUT + 1V < VIN 5.5V Power-supply ripple rejection MAX TPS79318 Line regulation (VOUT%/VIN) (1) Dropout voltage (2) (VIN = VOUT(nom) - 0.1V) TYP 2.7 1.201 Output voltage range (TPS79301) Output voltage MIN 285 600 mA 170 220 A 0.07 1 A 1 A f = 100Hz, TJ = +25C, IOUT = 10mA 70 f = 100Hz, TJ = +25C, IOUT = 200mA 68 f = 10kHz, TJ = +25C, IOUT = 200mA 70 f = 100kHz, TJ = +25C, IOUT = 200mA 43 CNR = 0.001F 55 CNR = 0.0047F 36 CNR = 0.01F 33 CNR = 0.1F 32 CNR = 0.001F 50 BW = 200Hz to 100kHz, IOUT = 200mA RL = 14, COUT = 1F CNR = 0.0047F dB VRMS s 70 CNR = 0.01F mV 100 High level enable input voltage 2.7V < VIN < 5.5V 1.7 VIN Low level enable input voltage 2.7V < VIN < 5.5V 0 0.7 V EN pin current VEN = 0V -1 1 A UVLO threshold VCC rising 2.25 UVLO hysteresis (1) (2) (3) 2.65 100 V V mV Minimum VIN is 2.7V or VOUT + VDO, whichever is greater. Dropout is not measured for the TPS79318 and TPS79325 since minimum VIN = 2.7V. For adjustable versions, this parameter applies only after VIN is applied; then VEN transitions high to low. Copyright (c) 2001-2007, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 FUNCTIONAL BLOCK DIAGRAMS ADJUSTABLE VERSION IN OUT UVLO 2.45V 59 k Current Sense ILIM GND R1 SHUTDOWN _ + FB EN R2 UVLO Thermal Shutdown Bandgap Reference 1.22V IN External to the Device QuickStart 250 k Vref NR FIXED VERSION IN OUT UVLO 2.45V Current Sense GND SHUTDOWN ILIM _ R1 + EN UVLO R2 Thermal Shutdown R2 = 40 k QuickStart Bandgap Reference 1.22V IN 250 k Vref NR Table 1. Terminal Functions TERMINAL NAME 4 SOT23 ADJ SOT23 FIXED WCSP FIXED DESCRIPTION NR 4 4 B2 Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This improves power-supply rejection and reduces output noise. EN 3 3 A3 Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown mode. EN can be connected to IN if not used. FB 5 N/A N/A This terminal is the feedback input voltage for the adjustable device. GND 2 2 A1 Regulator ground IN 1 1 C3 Input to the device. OUT 6 5 C1 Output of the regulator. Submit Documentation Feedback Copyright (c) 2001-2007, Texas Instruments Incorporated TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (SOT23 PACKAGE) TPS79328 OUTPUT VOLTAGE vs OUTPUT CURRENT TPS79328 OUTPUT VOLTAGE vs JUNCTION TEMPERATURE 2.805 250 2.805 VIN = 3.8 V COUT = 10 F TJ = 25C 2.804 2.803 VIN = 3.8 V COUT = 10 F 2.800 VOUT (V) 2.800 2.799 IGND (A) 2.795 2.801 2.790 IOUT = 200 mA 2.785 2.798 100 50 2.780 VIN = 3.8 V COUT = 10 F 2.796 2.795 0 50 100 150 2.775 200 -40 -25 -10 5 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 IOUT (mA) 20 35 50 65 80 95 110 125 TJ (C) TJ (C) Figure 2. Figure 3. Figure 4. TPS79328 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY TPS79328 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY TPS79328 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY 0.30 1.6 VIN = 3.8 V COUT = 2.2 F CNR = 0.1 F 0.25 0.20 0.15 IOUT = 1 mA 0.10 IOUT = 200 mA 0.05 100 1k 10 k Frequency (Hz) VIN = 3.8 V COUT = 10 F CNR = 0.1 F 0.25 0.20 IOUT = 1 mA 0.15 0.10 IOUT = 200 mA 0.05 0 100 0 100 k Output Spectral Noise Density (V/Hz) 0.30 Output Spectral Noise Density (V/Hz) 1k 10 k VIN = 3.8 V IOUT = 200 mA COUT = 10 F 1.4 1.2 CNR = 0.001 F 1.0 CNR = 0.0047 F 0.8 CNR = 0.01 F 0.6 CNR = 0.1 F 0.4 0.2 0 100 100 k 1k 10 k Frequency (Hz) Frequency (Hz) Figure 5. Figure 6. Figure 7. ROOT MEAN SQUARE OUTPUT NOISE vs CNR OUTPUT IMPEDANCE vs FREQUENCY TPS79328 DROPOUT VOLTAGE vs JUNCTION TEMPERATURE 2.5 60 VOUT = 2.8 V IOUT = 200 mA COUT = 10 F 50 2.0 160 VIN = 2.7 V COUT = 10 F 140 40 120 ZO () 1.5 30 IOUT = 1 mA 1.0 20 IOUT = 100 mA IOUT = 200 mA 100 80 60 0.5 10 100 k 180 VIN = 3.8 V COUT = 10 F TJ = 25 C VDO (mV) Output Spectral Noise Density (V/Hz) IOUT = 200 mA 150 2.797 RMS, Output Noise (VRMS) IOUT = 1 mA 200 IOUT = 1 mA 2.802 VOUT (V) TPS79328 GROUND CURRENT vs JUNCTION TEMPERATURE 40 20 IOUT = 10 mA BW = 100 Hz to 100 kHz 0 0.001 0.01 CNR (F) 0.1 Figure 8. Copyright (c) 2001-2007, Texas Instruments Incorporated 0 10 100 1k 10 k 100 k Frequency (Hz) Figure 9. 1M 10 M 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 TJ (C) Figure 10. Submit Documentation Feedback 5 TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued) TPS79328 RIPPLE REJECTION vs FREQUENCY TPS79328 RIPPLE REJECTION vs FREQUENCY 100 90 90 IOUT = 200 mA Ripple Rejection (dB) 70 60 50 40 IOUT = 10 mA 30 20 VIN = 3.8 V COUT = 10 F CNR = 0.01 F 10 0 10 100 1k 10 k 100 k 1M 80 IOUT = 200 mA 70 60 50 IOUT = 10 mA 40 30 60 50 IOUT = 10 mA 40 30 20 10 0 10 100 1k 10 k 100 k 1M 10 M 10 1k 10 k 100 k 1M 10 M Frequency (Hz) Figure 13. TPS79328 OUTPUT VOLTAGE, ENABLE VOLTAGE vs TIME (START-UP) TPS79328 LINE TRANSIENT RESPONSE TPS79328 LOAD TRANSIENT RESPONSE VIN = 3.8 V VOUT = 2.8 V IOUT = 200 mA COUT = 2.2 F TJ = 25C 0 CNR = 0.001 F VOUT (mV) Figure 12. 2 4.8 3.8 IOUT = 200 mA COUT = 2.2 F CNR = 0.01 F 0 0 200 60 80 100 120 140 160 180 200 0 10 20 30 40 50 60 70 80 1mA 100 0 20 40 di 0.02A + s dt 300 -20 CNR = 0.01 F 0 -20 -40 dv 0.4 V + s dt IOUT (mA) CNR = 0.0047 F 1 VIN (mV) 2 VIN = 3.8 V COUT = 10 F 20 20 3 0 100 Frequency (Hz) Figure 11. 4 VEN (V) IOUT = 200 mA 70 10 Frequency (Hz) VOUT (V) 80 20 0 10 M VIN = 3.8 V COUT = 2.2 F CNR = 0.1 F 90 VOUT (mV) Ripple Rejection (dB) 80 100 VIN = 3.8 V COUT = 2.2 F CNR = 0.01 F Ripple Rejection (dB) 100 TPS79328 RIPPLE REJECTION vs FREQUENCY 90 100 0 50 100 150 200 250 300 350 400 450 500 Time (s) Time (s) Time (s) Figure 14. Figure 15. Figure 16. POWER-UP / POWER-DOWN DROPOUT VOLTAGE vs OUTPUT CURRENT TPS79301 DROPOUT VOLTAGE vs INPUT VOLTAGE 200 250 VOUT = 3 V RL = 15 TJ = 125C 200 150 VIN VDO (mV) VDO (mV) 500 mV/div TJ = 125C 150 TJ = 25C 100 TJ = 25C 100 VOUT 50 TJ = -55C 50 TJ = -40C IOUT = 200 mA 0 1s/div 0 0 20 40 60 80 100 120 140 160 180 200 IOUT (mA) Figure 17. 6 Submit Documentation Feedback Figure 18. 2.5 3.0 3.5 4.0 4.5 5.0 VIN (V) Figure 19. Copyright (c) 2001-2007, Texas Instruments Incorporated TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued) TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT 100 COUT = 2.2 F VIN = 5.5 V, VOUT 1.5 V TJ = -40C to 125C ESR, Equivalent Series Resistance () ESR, Equivalent Series Resistance () 100 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT 10 Region of Instability 1 0.1 Region of Stability 0.01 COUT = 10 F VIN = 5.5 V TJ = -40C to 125C 10 Region of Instability 1 0.1 Region of Stability 0.01 0 0.02 0.04 0.06 IOUT (A) Figure 20. Copyright (c) 2001-2007, Texas Instruments Incorporated 0.08 0.20 0 0.02 0.04 0.06 0.08 0.20 IOUT (A) Figure 21. Submit Documentation Feedback 7 TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 APPLICATION INFORMATION The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170A typically), and enable-input to reduce supply currents to less than 1A when the regulator is turned off. A typical application circuit is shown in Figure 22. VIN VIN VOUT IN VOUT OUT TPS793xx EN 0.1F GND NR 2.2F 0.01F Figure 22. Typical Application Circuit External Capacitor Requirements A 0.1F or larger ceramic input bypass capacitor, connected between IN and GND and located close to the TPS793xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated or the device is located several inches from the power source. Like most low-dropout regulators, the TPS793xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance is 2.2F. Any 2.2F or larger ceramic capacitor is suitable, provided the capacitance does not vary significantly over temperature. If load current is not expected to exceed 100mA, a 1.0F ceramic capacitor can be used. The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has an NR pin which is connected to the voltage reference through a 250k internal resistor. The 250k internal resistor, in conjunction with an external bypass capacitor connected to the NR pin, creates a low-pass filter to reduce the voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR drop across the internal resistor, thus creating an output error. Therefore, the bypass capacitor must have minimal leakage current. The bypass capacitor should be no more than 0.1F to ensure that it is fully charged during the quickstart time provided by the internal switch shown in the Functional Block Diagrams. As an example, the TPS79328 exhibits only 32VRMS of output voltage noise using a 0.1F ceramic bypass capacitor and a 2.2F ceramic output capacitor. Note that the output starts up slower as the bypass capacitance increases due to the RC time constant at the NR pin that is created by the internal 250k resistor and external capacitor. Board Layout Recommendation to Improve PSRR and Noise Performance To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device. 8 Submit Documentation Feedback Copyright (c) 2001-2007, Texas Instruments Incorporated TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 Power Dissipation and Junction Temperature Specified regulator operation is assured to a junction temperature of +125C; the maximum junction temperature should be restricted to +125C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max). The maximum power dissipation limit is determined using Equation 1: T max *T A P D(max) + J R QJA (1) Where: * * * TJmax is the maximum allowable junction temperature. RJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings Table). TA is the ambient temperature. The regulator dissipation is calculated using Equation 2: P D + VIN*V OUT I OUT (2) Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal protection circuit. Programming the TPS79301 Adjustable LDO Regulator The output voltage of the TPS79301 adjustable regulator is programmed using an external resistor divider as shown in Figure 23. The output voltage is calculated using Equation 3: V OUT + VREF 1 ) RR 1 2 (3) Where: * VREF = 1.2246V typ (the internal reference voltage) Resistors R1 and R2 should be chosen for approximately 50A divider current. Lower value resistors can be used for improved noise performance, but the solution consumes more power. Higher resistor values should be avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially increases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended design procedure is to choose R2 = 30.1k to set the divider current at 50A, C1 = 15pF for stability, and then calculate R1 using Equation 4: R1 + VV OUT REF *1 R2 (4) In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be placed between OUT and FB. For voltages less than 1.8V, the value of this capacitor should be 100pF. For voltages greater than 1.8V, the approximate value of this capacitor can be calculated as shown in Equation 5: (3 x 10*7) x (R 1 ) R 2) C1 + (R 1 x R2) (5) The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is not used (such as in a unity-gain configuration) or if an output voltage less than 1.8V is chosen, then the minimum recommended output capacitor is 4.7F instead of 2.2F. Copyright (c) 2001-2007, Texas Instruments Incorporated Submit Documentation Feedback 9 TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 OUTPUT VOLTAGE PROGRAMMING GUIDE VIN IN 1m F OUT TPS79301 EN NR GND 0.01mF VOUT R1 FB R2 C1 2.2mF OUTPUT VOLTAGE R1 R2 C1 1.22V short open 0pF 2.5V 31.6kW 30.1kW 22pF 3.3V 51kW 30.1kW 15pF 3.6V 59kW 30.1kW 15pF Figure 23. TPS79301 Adjustable LDO Regulator Programming Regulator Protection The TPS793xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (for example, during power-down). Current is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate. The TPS793xx features internal current limiting and thermal protection. During normal operation, the TPS793xx limits output current to approximately 400mA. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum voltage ratings of the device. If the temperature of the device exceeds approximately +165C, thermal-protection circuitry shuts it down. Once the device has cooled down to below approximately +140C, regulator operation resumes. 10 Submit Documentation Feedback Copyright (c) 2001-2007, Texas Instruments Incorporated TPS793xx www.ti.com SLVS348K - JULY 2001 - REVISED OCTOBER 2007 TPS793xxYEQ, YZQ NanoStarTM Wafer Chip Scale Information 0,79 0,84 1,30 1,34 0.625 Max NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. NanoStar package configuration. NanoStar is a trademark of Texas Instruments. Figure 24. NanoStarTM Wafer Chip Scale Package Copyright (c) 2001-2007, Texas Instruments Incorporated Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS79301DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79301DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79318DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79318DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79318DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79318DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79318YEQR NRND DSBGA YEQ 5 3000 TBD Call TI Call TI TPS79318YEQT NRND DSBGA YEQ 5 250 TBD Call TI Call TI TPS79318YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPS79318YZQT ACTIVE DSBGA YZQ 5 250 SNAGCU Level-1-260C-UNLIM TPS79325DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79325DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79325YEQR NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79325YEQT NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79325YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPS793285DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS793285DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS793285DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS793285DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS793285YEQR NRND DSBGA YEQ 5 TBD Call TI Call TI TPS793285YEQT NRND DSBGA YEQ 5 TBD Call TI Call TI TPS793285YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPS793285YZQT ACTIVE DSBGA YZQ 5 250 SNAGCU Level-1-260C-UNLIM TPS79328DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79328DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79328YEQR NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79328YEQT NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79328YZQR ACTIVE DSBGA YZQ 5 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) Addendum-Page 1 Lead/Ball Finish SNAGCU MSL Peak Temp (3) Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS79328YZQT ACTIVE DSBGA YZQ 5 250 TPS79330DBVR ACTIVE SOT-23 DBV 5 TPS79330DBVRG4 ACTIVE SOT-23 DBV TPS79330YEQR NRND DSBGA TPS79330YEQT NRND DSBGA TPS79330YZQR ACTIVE TPS79330YZQT Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) SNAGCU Level-1-260C-UNLIM 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM YEQ 5 3000 TBD Call TI Call TI YEQ 5 250 TBD Call TI Call TI DSBGA YZQ 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM ACTIVE DSBGA YZQ 5 250 SNAGCU Level-1-260C-UNLIM TPS79333DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS79333DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS793475DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS793475DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS79301, TPS79318, TPS79325, TPS793285, TPS79333, TPS793475 : Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2009 TPS79301-Q1, TPS79318-Q1, TPS79325-Q1, TPS793285-Q1, TPS79333-Q1, TPS793475-Q1 * Automotive: Enhanced Product: TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79333-EP, TPS793475-EP * NOTE: Qualified Version Definitions: - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Automotive * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 12-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TPS79301DBVR SOT-23 DBV 6 3000 179.0 8.4 TPS79318DBVR SOT-23 DBV 5 3000 179.0 TPS79318DBVT SOT-23 DBV 5 250 179.0 TPS79318YZQR DSBGA YZQ 5 3000 TPS79318YZQT DSBGA YZQ 5 TPS79325DBVR SOT-23 DBV TPS79325YZQR DSBGA YZQ TPS793285DBVR SOT-23 W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS793285DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS793285YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS793285YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS79328DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS79328YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS79328YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS79330DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS79330YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS79330YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS79333DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Sep-2009 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS79333DBVR SOT-23 DBV 5 3000 179.0 8.4 TPS793475DBVR SOT-23 DBV 5 3000 179.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 3.2 3.2 1.4 4.0 8.0 Q3 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS79301DBVR SOT-23 DBV 6 3000 195.0 200.0 45.0 TPS79318DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS79318DBVT SOT-23 DBV 5 250 195.0 200.0 45.0 TPS79318YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS79318YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79325DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS79325YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS793285DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS793285DBVT SOT-23 DBV 5 250 195.0 200.0 45.0 TPS793285YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS793285YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79328DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS79328YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS79328YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79330DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Sep-2009 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS79330YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS79330YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79333DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TPS79333DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS793475DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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