PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
84151012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
8415101RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
8415101RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
8415101SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
8415101SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
84152012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
8415201RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
8415201SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
84153012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
8415301RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
8415301SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
SN54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN54LS684J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN54LS688J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN74LS682DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS682N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS682NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS682NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
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Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LS682NSR ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682NSR ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS682NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS684NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS684NSR ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS684NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS686DW OBSOLETE SOIC DW 24 TBD Call TI Call TI
SN74LS686NT OBSOLETE PDIP NT 24 TBD Call TI Call TI
SN74LS687NT OBSOLETE PDIP NT 24 TBD Call TI Call TI
SN74LS687NT OBSOLETE PDIP NT 24 TBD Call TI Call TI
SN74LS688DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688N ACTIVE PDIP N 20 20 Pb-Free CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
(RoHS)
SN74LS688N3 OBSOLETE PDIP N 20 TBD Call TI Call TI
SN74LS688NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS688NSR ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS688NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54LS682FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS682FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54LS682W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
SNJ54LS682W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
SNJ54LS684FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS684J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54LS684W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
SNJ54LS688FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS688J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54LS688W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
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Addendum-Page 4