PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 6-A NON-ISOLATED DDR/QDR MEMORY BUS TERMINATION MODULES FEATURES * * * * * * * * * VTT Bus Termination Output (Output Tracks the System VREF) 6 A Output Current (8 A Peak) 3.3-V, 5-V or 12-V Input Voltage DDR and QDR Compatible On/Off Inhibit (for VTT Standby) Undervoltage Lockout Operating Temperature: -40C to 85C Efficiencies up to 88% Output Overcurrent Protection (Non-Latching, Auto-Reset) * * * 50 W/in3 Power Density Safety Agency Approvals: UL/cUL60950, EN60950, VDE Point-of-Load Alliance (POLATM) Compatible NOMINAL SIZE =0.87 in x 0.5 in (22,1 mm x 12,57 mm) DESCRIPTION The PTHxx050Y are a series of ready-to-use switching regulator modules from Texas Instruments designed specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V input, the modules generate a VTT output that will source or sink up to 6 A of current (8 A transient) to accurately track their VREF input. VTT is the required bus termination supply voltage, and VREF is the reference voltage for the memory and chipset bus receiver comparators. VREF is usually set to half the VDDQ power supply voltage. Both the PTHxx050Y series employs an actively switched synchronous rectifier output to provide state-of-the-art stepdown switching conversion. The products are small in size (0.87 in x 0.5 in), and are an ideal choice where space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module. Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off inhibit feature allows the VTT bus to be turned off to save power in a standby mode of operation. Package options include both throughhole and surface mount configurations. STANDARD APPLICATION VIN VDDQ VREF 1k 1% 1 2 3 1k 1% 4 Standby Q1 BSS138 (Optional) VTT PTHxx050Y (Top View) Con hf-Ceramic 5 Co1 Low-ESR (Required) Co2 Ceramic (Optional) VTTTermination Island CIN (Required) 6 SSTL-2 Bus GND CIN = Required Electrolytic Capacitor; 220F (3.3 5 V Input), 560 F (12 V Input). Co1 = Required Low-ESR Electrolyitic Capacitor; 470 F (3.3 5 V Input), 940 F (12 V Input). Co2 = Ceramic Capacitance for Response to a 3 A (+ 1.5 A) Load Transient; 200 F (3.3 5 V Input), 400 F (12 V Input). Con = Distributed hf-Ceramic Decoupling Capacitors for VTT bus; as Recommended for DDR Memory Applications. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. POLA is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2004-2005, Texas Instruments Incorporated PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 ORDERING INFORMATION PTHXX050Y (Base Part Number) Input Voltage Part Number 3.3 V 5V 12 V (1) (2) (3) (4) (1) DESCRIPTION Pb - free and RoHS (3) Mechanical Package (2) PTH03050YAH Horizontal T/H Yes PTH03050YAS Standard SMD No (4) EUU EUV EUV PTH03050YAZ Optional SMD Yes (3) PTH05050YAH Horizontal T/H Yes (3) EUU PTH05050YAS Standard SMD No (4) EUV EUV PTH05050YAZ Optional SMD Yes (3) PTH12050YAH Horizontal T/H Yes (3) EUU PTH12050YAS Standard SMD No (4) EUV PTH12050YAZ Optional SMD Yes (3) EUV Add T to end of part number for tape and reel on SMD packages only. Reference the applicable package reference drawing for the dimensions and PC board layout. Lead (Pb) -free option specifies Sn/Ag pin solder material. Standard option specifies 63/37, Sn/Pb pin solder material. ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS voltages are with respect to GND UNIT VREF Control input voltage TA Operating temperature range Over VIN range Twave Wave solder temperature Surface temperature of module body or pins (5 seconds) Treflow Solder reflow temperature Surface temperature of module body or pins Ts Storage temperature -0.3 V to Vi+0.3 V 2 260C (2) PTHXX050YAS 235C (2) PTHXX050YAZ 260C (2) -40C to 125C Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 Sine, mounted 500 G Mechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 20 G Flammability (2) PTHXX050YAH Mechanical shock Weight (1) -40C to 85C (1) 2.9 grams Meets UL 94V-O For operation below 0C the external capacitors m ust bave stable characteristics, use either a low ESR tantalum, Os-Con, or ceramic capacitor. During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated maximum. PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 ELECTRICAL SPECIFICATIONS TA = 25C; nominal VIN; VREF = 1.25 V; CIN, CO1, and CO2 = typical values; and Io = Iomax (unless otherwise stated) PARAMETER IO Output current TEST CONDITIONS Over VREF range Continuous Input voltage range Over IO range VREF Tracking range for VREF |VTT- VREF| Tracking tolerance to VREF Over line, load and temperature Efficiency Io = 4 A TYP 0 Repetitive pulse PTH03050Y VIN MIN 2.95 MAX UNIT 6 (1) A 8 (2) A 3.65 PTH05050Y 4.5 5.5 PTH12050Y 10.8 13.2 0.55 1.8 V -10 10 mV PTH03050Y V 88% PTH05050Y 87% PTH12050Y 84% Vr Vo Ripple (pk-pk) 20 MHz bandwidth 20 Io trip Overcurrent threshold Reset, followed by auto recovery 12 A 80 sec ttr Load transient response Vtr 15 A/s load step, from: - 1.5 A to 1.5 A (3) VIN Increasing UVLO Under-voltage lockout VIN Dncreasing Inhibit control (pin 4) Input high voltage VIH Inhibit control (pin 4) Input low voltage IIL inhibit Inhibit control (pin 4) Input low curent Pin to GND IIN inh Input standby current Inhibit control (pin 4) to GND Switching frequency CIN External input capacitance Over VIN and IO ranges Capacitance value: Nonceramic Co1, Co2 External output capacitance VO over/undershoot 25 40 PTH03050Y 2.45 2.8 PTH05050Y 4.3 4.45 PTH12050Y 9.5 10.4 PTH03050Y 2.0 2.40 PTH05050Y 3.4 3.7 PTH12050Y 8.8 9 Referenced to GND VIL fs Recovery time Capacitance value: Ceramic (1) (2) (3) (4) (5) (6) (7) Reliability VIN-0.5 Open (4) -0.2 0.6 10 600 650 PTH12050Y 200 250 300 PTH03050Y/PTH05050Y 220 (5) PTH12050Y 560 (5) PTH03050Y/PTH05050Y 470 (3) 3300 (6) PTH12050Y 940 (3) 3300 (6) V kHz F PTH03050Y/PTH05050Y 200 (3) 300 PTH12050Y 400 (3) 600 6 V mA 550 4 (7) V A PTH03050Y/PTH05050Y Per Bellcore TR-332 50 % stress, TA = 40C, ground benign mV V 130 Equiv. series resistance (non-ceramic) MTBF mVpp F F m 106 Hrs Rating is conditional on the module being directly soldered to a 4-layer PCB with 1 oz. copper. See the SOA curves or contact the factory for appropriate derating. The PTH03050Y and PTH05050Y require no derating up to 85C operating temperature and natural convection airflow. Up to 10 ms pulse period at 10% maximum duty. The minimum value of external output capacitance value ensures that VTT meets the specified transient performance requirements for the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is consistently less than 3 A. This control pin has an internal pull-up to the input voltage VIN. If it is left open-circuit the module will operate when input power is applied. A small low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult the related application note. An input capacitor is required for proper operation. The capacitor must be rated for a minimum of 300 mA rms (750 mA rms for 12-V input) of ripple current. This is the calculated maximum. The minimum ESR limitation will often result in a lower value. Consult the application notes for further guidance. This is the typcial ESR for all the electrolytic (non-ceramic) output capacitance. Use 8 m as the minimum when using max-ESR values to calculate. 3 PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 Terminal Functions TERMINAL NAME NO. DESCRIPTION VIN 3 The positive input voltage power node to the module, which is referenced to common GND. GND 1 This is the common ground connection for the VIN and VTT power connections. It is also the 0-VDC reference for the control inputs. VREF 2 The module senses the voltage at this input to regulate the output voltage, VTT. The voltage at VREF is also the reference voltage for the system bus receiver comparators. It is normally set to precisely half the bus driver supply voltage (VDDQ/ 2), using a resistor divider. The Thevenin impedance of the network driving the VREF pin should not exceed 500 . See the Typical DDR Application Diagram in the Application Information section for reference. VTT 6 This is the regulated power output from the module with respect to the GND node, and the tracking termination supply for the application data and address buses. It is precisely regulated to the voltage applied to the module's VREF input, and is active active about 20 ms after a valid input source is applied to the module. Once active it will track the voltage applied at VREF. Inhibit 4 The Inhibit pin is an open-collector/drain negative logic input that is referenced to GND. Applying a low-level ground signal to this input turns off the output voltage, VTT. Although the module is inhibited, a voltage, VDDQ will be present at the output terminals, fed through the DDR memory. When the Inhibit is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open circuit, the module will produce an output whenever a valid input source is applied. See the Typical DDR Application Diagram in the Application Information section for reference. N/C 5 No Connection 1 2 3 4 4 6 PTHXX050 (Top View) 5 PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 TYPICAL CHARACTERISTICS (VREF =1.25 V) (1) (2) EFFICIENCY vs LOAD CURRENT OUTPUT RIPPLE vs LOAD CURRENT Efficiency - % 80 VIN = 3.3 V Output Ripple - mV VIN = 5 V 90 VIN = 12 V 70 1. 5 40 1. 2 30 VIN = 12 V 20 VIN = 3.3 V 0 0 1 2 3 4 5 6 0 1 IL - Load Current - A 6 VIN = 5 V 0. 6 VIN = 3.3 V 0. 3 0 0 1 2 3 4 5 6 IL - Load Current - A Figure 3. PTH03050Y/PTH05050Y AT NOMINAL VIN TEMPERTURE DERATING vs LOAD CURRENT PTH12050Y ONLY; VIN = 12 V TEMPERTURE DERATING vs LOAD CURRENT TRANSIENT PERFORMANCE, 4-A LOAD CHANGE PTH03050Y/PTH05050Y/PTH12050Y: SINK TO SOURCE TRANSIENT 90 Airflow = Nat Conv TA- Ambient Temperature 5-C TA- Ambient Temperature 5-C 5 0. 9 Figure 2. 80 70 60 50 40 30 20 0 1 2 3 4 IL - Load Current - A Figure 4. (2) 2 3 4 IL - Load Current - A VIN = 12 V Figure 1. 90 (1) VIN = 5 V 10 60 50 50 PD - Power Dissipation - W 10 0 POWER DISSIPATION vs LOAD CURRENT 5 6 80 Nat Cinv VTT - VREF (50 mV/div) 100 LFM 70 200 LFM 400 LFM 60 50 40 +VTT (5 30 20 A/div) VIN = 12 V 0 1 2 3 4 IL - Load Current - A Figure 5. 5 6 100 ms/div Figure 6. The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for the converter. Applies to Figure 1, Figure 2, and Figure 3. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to modules soldered directly to a 4 mm x 4 mm double-sided PCB with 1 oz. copper. For surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power pins. Please refer to the mechanical specification for more information. Applies to Figure 4, and Figure 5. 5 PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 APPLICATION INFORMATION Typical DDR Application Diagram Auto-Track VI= 5V VI + Margin +Sense PTH05010W VDDQ I/O Memory +VADJ Inhibit 470 F 5.51 k 47 F VI + 220 F Inhibit PTH05050Y DDR Termination VDDQ = 1.8 V VO + 2x 330 F 2x 22 F VTT = 0.9 V VTT +VREF DDRII/ QDRII + 2x 330 F 2x 22 F 1 k 47 F 1 k UDG-05096 CAPACITOR RECOMMENDATIONS FOR THE PTH03050Y & PTH05050Y DDR POWER MODULES (3.3-V/5-V OPTION) Input Capacitor The recommended input capacitor(s) is determined by the 220 F minimum capacitance and 500 mArms minimum ripple current rating. Ripple current and less than 100 m equivalent series resistance (ESR) values are the major considerations, along with temperature, when designing with different types of capacitors. Unlike polymer tantalum, regular tantalum capacitors have a recommended minimum voltage rating of 2 x (maximum DC voltage + AC ripple). This is standard practice to insure reliability. For improved ripple reduction on the input bus, ceramic capacitors may be substituted for electrolytic types using the minimum required capacitance. Output Capacitors For applications with load transients (sudden changes in load current), regulator response will benefit from external output capacitance. The recommended output capacitance of 470 F will allow the module to meet its transient response specification (see Electrical Specifications table). For most applications, a high quality computer-grade aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range, 2 kHz to 150 kHz, and are suitable when ambient temperatures are above 0C. For operation below 0C tantalum, ceramic or Os-Con type capacitors are recommended. When using one or more non-ceramic capacitors, the calculated equivalent ESR should be no lower than 4 m (8 m using the manufacturer's maximum ESR for a single capacitor). A list of preferred low-ESR type capacitors are identified in Table 1. 6 PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 APPLICATION INFORMATION (continued) Ceramic Capacitors (Recommended) Above 150 kHz the performance of aluminum electrolytic capacitors becomes less effective. To further improve the reflected input ripple current or the output transient response. Multilayer ceramic capacitors have very low ESR and their resonant frequency higher than the bandwidth of the regulator. They can be used to reduce the reflected ripple current at the input as well as improve the transient response of the output. When used on the output their combined ESR is not critical as long as the total value of ceramic capacitance does not exceed 300 F. Also, to prevent the formation of local resonances, do not place more than five identical ceramic capacitors in parallel with values of 10 F or greater. Tantalum Capacitors Tantalum type capacitors can be used at both the input and output, and are recommended for applications where the ambient operating temperature can be less than 0C. The AVX TPS, Sprague 593D/594/595 and Kemet T495/T510 capacitor series are suggested over many other tantalum types due to their higher rated surge, power dissipation, and ripple current capability. As a caution many general purpose tantalum capacitors have considerably higher ESR, reduced power dissipation and lower ripple current capability. These capacitors are also less reliable when determining their power dissipation and surge current rating. Tantalum capacitors that do not have a stated ESR or surge current rating are not recommended for power applications. When specifying Os-Con and polymer tantalum capacitors for the output, the minimum ESR limit will be encountered well before the maximum capacitance value is reached. Capacitor Table Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple current (rms) ratings. The recommended number of capacitors required at both the input and output buses is identified for each capacitor type. This is not an extensive capacitor list. Capacitors from other vendors are available with comparable specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical parameters necessary to insure both optimum regulator performance and long capacitor life. Table 1. Input/Output Capacitors (1) Capacitor Characteristics Capacitor Vendor, Type/Series (Style) Working Voltage (V) FC (Radial) FK (SMD) FC (SMD) Quantity Physical Size (mm) Vendor Part Number Value (F) Max ESR at 100 kHz () Max Ripple Current at 85C (Irms) (mA) 10 470 0.117 555 8x10 1 1 EEUFC1A471 25 470 0.080 850 10x10.2 1 1 EEVFK1E471P 16 470 0.150 670 10x10.2 1 1 EEVFC1C471P Input Bus Output Bus Panasonic, Aluminum United Chemi-Con PXA, Poly-Aluminum (SMD) 6.3 470 0.020 >4100 10x7.7 1 2 PS, Poly-Aluminum (Radial) 6.3 390 0.012 4770 8x11.5 1 1 (2) PSA, Poly-Aluminum (Radial) 10 470 0.008 5650 8x11,5 1 1 PSA10VB470MJ11 LXZ, Aluminum (Radial) 16 470 0.090 760 10x12.5 1 1 LXZ16VB471M10X12LL Panasonic, Poly-Aluminum S/SE (SMD) 6.3 180 0.005 4000 7.3x4.3x4.2 2 N/R (3) (1) (2) (3) PXA6.3VC471MJ80TP 6PS390MH11 EEFSE0J181R Capacitor Supplier Verification Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term consideration for obsolescence. RoHS, Lead-free and Material Details Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements. Component designators or part number deviations can occur when material composition or soldering requirements are updated. The total capacitance can be slightly lower than recommended minimum, but is acceptable based on the combined ripple current rating. This capacitor is not recommended for the VO bus. The capacitor ESR is below the specified minimum for non-ceramic capacitor. 7 PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 APPLICATION INFORMATION (continued) Table 1. Input/Output Capacitors (continued) Capacitor Characteristics Capacitor Vendor, Type/Series (Style) Working Voltage (V) Value (F) Max ESR at 100 kHz () Max Ripple Current at 85C (Irms) (mA) Quantity Physical Size (mm) Input Bus Output Bus Vendor Part Number Nichicon Aluminum WG (SMD) 10 470 0.150 670 10x10 1 1 UWG1A471MNR1GS HD (Radial) 10 470 0.072 760 8x11.5 1 1 UHD1A471MPR PM (Radial) 10 470 0.120 600 10x12.5 1 1 UPM1A471MPH6 SP, Os-con (Radial) 10 470 0.015 4500 10x10.5 1 2 10SP470M SVPA (SMD) 6.3 470 0.020 >4100 7,9x10 1 2 6SVPA470M TPE, Poscap (SMD) 6.3 220 0.025 2400 7.3x4.3 1 3 6TPE220ML AVX, Tantalum 10 330 0.045 1723 1 5 TPSE337M010R0045 TPS (SMD) 10 330 0.060 1826 7.3L x5.7W x4.1H 1 5 TPSV337M010R0060 T520 (SMD) 10 330 0.040 1800 T530 (SMD) 10 330 0.010 >5000 595D, Tantalum (SMD) 10 330 0.100 1040 594D, Tantalum (SMD) 10 330 0.045 2360 94SVP, Poly-Aluminum (Radial) 6.3 330 0.025 3500 Kemet, Ceramic X5R (SMD) 16 10 0.002 - 6.3 47 0.002 6.3 100 0.002 6.3 47 0.002 16 22 16 Sanyo Kemet, Poly-Tantalum 4.3W x7.3L x4.0H 1 5 T520X337M010ASE045 1 1 T530X337M010ASE010 1 5 595D377x0010D2T 1 5 594D337X0016R2T 1 3 94SA337X06R3FBP 1210 /3225 1 5 C1210C106M4PAC 3225 mm 1 5 C1210C476K9PAC 3225 mm 1 (4) 3 GRM32ER60J107M 3225 mm 1 (4) 5 GRM32ER60J476M 0.002 1 (4) 5 GRM32ER61C226K 10 0.002 1 (4) 5 GRM32DR61C106K 6.3 100 0.002 3225 mm 1 (4) 3 C3225X5R0J107MT 6.3 47 0.002 3225 mm 1 (4) 5 C3225X5R0J476MT 16 22 0.002 1 (4) 5 C3225X5R1C226MT 16 10 0.002 1 (4) 5 C3225X5R1C106MT Vishay-Sprague Murata, Ceramic X5R (SMD) TDK, Ceramic X5R (SMD) (4) - - 7.2Lx6W x4.1H 10x10.5 A ceramic capacitor can be used to compliment electrolytic types at the input to further reduce high-frequency ripple current. Designing for Very Fast Load Transients The transient response of the DC/DC converter has been characterized using a load transient with a di/dt of 1 A/s. The typical voltage deviation for this load transient is given in the data sheet specification table using the optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter's regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with any DC/DC converter once the speed of the transient exceeds its bandwidth capability. If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors selected. If the transient performance requirements exceed that specified in the data sheet, or the total amount of load capacitance is above 3300 F, the selection of output capacitors becomes more important. 8 www.ti.com PTH03050Y PTH05050Y PTH12050Y SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 CAPACITOR RECOMMENDATIONS FOR THE PTH12050Y DDR POWER MODULES PTH12050Y (12-V OPTION) Input Capacitor The recommended input capacitance is determined by the 560 F minimum capacitance and 750 mArms minimum ripple current rating. A 10-F X5R/X7R ceramic capacitor can be added to reduce the reflected input ripple current. The ceramic capacitor should be located between the input electrolytic and the module. Ripple current, less than 100 m equivalent series resistance (ESR) and temperature, are major considerations when selecting input capacitors. Unlike polymer-tantalum capacitors, regular tantalum capacitors have a recommended minimum voltage rating of 2 x (max. dc voltage + ac ripple). No tantalum capacitors were found with sufficient voltage rating to meet this requirement. At temperatures below 0C, the ESR of aluminum electrolytic capacitors increases. For these applications, Os-Con, polymer-tantalum, and polymer-aluminum types should be considered. Output Capacitors For applications with load transients (sudden changes in load current), regulator response will benefit from external output capacitance. The recommended minimum output capacitance of 940 F will allow the module to meet its transient response specification (see Electrical Specifications table). For most applications, a high quality computer-grade aluminum electrolytic capacitor is adequate. These capacitors provide decoupling over the frequency range, 2 kHz to 150 kHz, and are suitable when ambient temperatures are above 0C. For operation below 0C tantalum, ceramic or Os-Con type capacitors are recommended. When using one or more non-ceramic capacitors, the calculated equivalent ESR should be no lower than 4 m (8 m using the manufacturer's maximum ESR for a single capacitor) A list of preferred low-ESR type capacitors are identified in Table 2. In addition to electrolytic capacitance, adding a 10-F to 22-F X5R/X7R ceramic capacitor to the output reduces the output ripple voltage and improves the regulator's transient response. The measurement of both the output ripple and transient response is also best achieved across a 10-F ceramic capacitor. Ceramic Capacitors Above 150 kHz, the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic capacitors have a low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be used to reduce the reflected ripple current at the input, and improve the transient response of the output. When used on the output, their combined ESR is not critical as long as the total value of ceramic capacitance does not exceed 300 F. Also, to prevent the formation of local resonances, do not place more than five identical ceramic capacitors in parallel with values of 10 F or greater. Tantalum Capacitors Tantalum type capacitors are most suited for use on the output bus, and are recommended for applications where the ambient operating temperature can be less than 0C. The AVX TPS, Sprague 593D/594/595, and Kemet T495/T510 capacitor series are suggested over other tantalum types due to their higher rated surge, power dissipation, and ripple current capability. As a caution, many general-purpose tantalum capacitors have considerably higher ESR, reduced power dissipation, and lower ripple current capability. These capacitors are also less reliable as they have lower power dissipation and surge current ratings. Tantalum capacitors that do not have a stated ESR or surge current rating are not recommended for power applications. When specifying Os-con and polymer tantalum capacitors for the output, the minimum ESR limit is encountered well before the maximum capacitance value is reached. Capacitor Table Table 2 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple current (rms) ratings. The recommended number of capacitors required at both the input and output buses is identified for each capacitor type. Note: This is not an extensive capacitor list. Capacitors from other vendors are available with comparable specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical parameters necessary to insure both optimum regulator performance and long capacitor life. 9 PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 Table 2. Input/Output Capacitors (1) Capacitor Characteristics Quantity Working Voltage (V) Value (F) Max ESR at 100 kHz () Max Ripple Current at 85C (Irms) (mA) Panasonic, Aluminum FC Radial 25 560 0.065 1205 12,5 x 15 1 1 EEUFC1E561S FK (SMD) 16 680 0.080 850 10 x 10,2 1 2 EEVFK1C681P PXA, Poly-Aliminum (SMD) 16 330 0.014 5050 10 x 12,5 2 2 PXA16VC331MJ12TP PS, Poly-Aluminum (Radial) 16 330 0.0014 5050 10 x 12,5 2 2 16PS330MJ12 LXZ, Aluminum (Radial) 16 680 0.068 1050 10 x 16 1 1 LXZ16VB681M10X16LL Nichicon Aluminum 25 560 0.060 1060 12,5 x 15 1 1 UPM1E561MHH6 PM (Radial) 16 680 0.038 1430 10 x 16 1 2 UHD1C681MHR HD (Radial) 35 560 0.048 1360 16 x 15 1 1 UPM1V561MHH6 1 EEFSE0J181R Capacitor Vendor, Type/Series (Style) Physical Size (mm) Input Bus Output Bus Vendor Number United Chemi-Con 6.3 180 0.005 4000 7,3 x 4,3 x 4,2 N/R (2) Panasonic, Poly-Alum S/SE (SMD) TPE, ps-Ccap (SMD) 10 330 0.025 3000 7,3 L x 5,7 W N/R (2) 3 10TPE330M SEPC Os-con (Radial) 16 470 0.010 >6100 10 x 13 1 (3) 1 16SEPC470M SVP, Os-con (SMD) 16 330 0.016 4700 11 x 12 2 2 16SVP330M SVPC Os-con (SMD) 4 1200 0.010 4700 8 x 11,9 N/R (2) 1 4SVPC1200M AVX, Tantalum TPS (SMD) 10 470 0.045 >1723 7,3 x 5,7 x 4,1 N/R (2) 5 TPSE477M019R0045 10 330 0.045 >1723 N/R (2) 5 TPSE337M019R0045 6.3 470 0.040 1800 N/R (2) 5 T520X477M006ASE040 T530, Tantalum/Organic 4 680 0.010 >5100 N/R (2) 1 T530X687M004ASE010 T530, Tantalum/Organic 6.3 470 0.010 5200 N/R (2) 1 T530X477M006ASE010 594D, Tantalum (SMD) 10 470 0.100 1440 7,2 x 6 x 4,1 N/R (2) 5 595D477X0010R2T 94SVP, Os-con (SMD) 16 330 0.017 >4500 10 x 12,7 2 2 94SVP337X0016F12 94SA, Organic (Radial) 16 1000 0.015 >9700 16 x 25 1 2 94SA108X0016HBP Kemet, Ceramic X5R (SMD) 16 10 0.002 3225 mm 1 (4) 5 C1210C106M4PAC 6.3 47 0.002 3225 mm N/R (2) 5 C1210C476K9PAC Murata, Ceramic X5R (SMD) 6.3 100 0.002 3225 mm N/R (2) 3 GRM32ER60J107M 6.3 47 3225 mm N/R (2) 5 GRM32ER60J476M Sanyo Kemet T520, Poly-Tantalum (SMD) 4,3 x 7,3 x 4 Vishay-Sprague TDK, Ceramic X5R (SMD) (1) (2) (3) (4) 10 16 22 1 (4) 5 GRM32ER61C226K 16 10 1 (4) 5 GRM32DR61C106K 6.3 100 3225 mm N/R (2) 3 C3225X5R0J107MT 6.3 47 3225 mm N/R (2) 5 C3225X5R0J476MT 16 22 1 (4) 5 C3225X5R1C226MT 16 10 1 (4) 5 C3225X5R1C106MT 0.002 Capacitor Supplier Verification Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term consideration for obsolescence. RoHS, Lead-free and Material Details Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements. Component designators or part number deviations can occur when material composition or soldering requirements are updated. N/R - Not recommended. The capacitor voltage rating does not meet the minimum operating limits. A total capacitance of 470 F is acceptable based on the combined ripple current rating. Ceramic capacitors are recommended to complement electrolytic types at the input and to reduce high-frequency ripple current. www.ti.com PTH03050Y PTH05050Y PTH12050Y SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 Designing for Very Fast Load Transients The transient response of the DC/DC converter has been characterized using a load transient with a di/dt of 1 A/s. The typical voltage deviation for this load transient is given in the data sheet specification table using the optional value of output capacitance. As the di/dt of a transient is increased, the response of a converter's regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent limitation with any DC/DC converter once the speed of the transient exceeds its bandwidth capability. If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with additional output capacitor decoupling. In these cases special attention must be paid to the type, value and ESR of the capacitors selected. If the transient performance requirements exceed that specified in the data sheet, or the total amount of load capacitance is above 3300 F, the selection of output capacitors becomes more important. 11 PTH03050Y PTH05050Y PTH12050Y SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 TAPE AND REEL SPECIFICATION 12 www.ti.com PTH03050Y PTH05050Y PTH12050Y www.ti.com SLTS221A - MARCH 2004 - REVISED OCTOBER 2005 TRAY SPECIFICATION 13 PACKAGE OPTION ADDENDUM www.ti.com 20-May-2011 PACKAGING INFORMATION Orderable Device (1) Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) PTH03050YAH ACTIVE ThroughHole Module EUU 6 56 Pb-Free (RoHS) SN PTH03050YAS ACTIVE Surface Mount Module EUV 6 56 TBD SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS PTH03050YAST ACTIVE Surface Mount Module EUV 6 250 TBD SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS PTH03050YAZ ACTIVE Surface Mount Module EUV 6 56 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR PTH03050YAZT ACTIVE Surface Mount Module EUV 6 250 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR PTH03050YBH ACTIVE ThroughHole Module EUU 6 56 Pb-Free (RoHS) Call TI N / A for Pkg Type PTH05050YAH ACTIVE ThroughHole Module EUU 6 56 Pb-Free (RoHS) SN N / A for Pkg Type PTH05050YAS ACTIVE Surface Mount Module EUV 6 56 TBD SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS PTH05050YAST ACTIVE Surface Mount Module EUV 6 250 TBD SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS PTH05050YAZ ACTIVE Surface Mount Module EUV 6 56 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR PTH05050YAZT ACTIVE Surface Mount Module EUV 6 250 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR PTH12050YAH ACTIVE ThroughHole Module EUU 6 56 Pb-Free (RoHS) SN PTH12050YAS ACTIVE Surface Mount Module EUV 6 56 TBD SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS PTH12050YAST ACTIVE Surface Mount Module EUV 6 250 TBD SNPB Level-1-235C-UNLIM/ Level-3-260C-168HRS PTH12050YAZ ACTIVE Surface Mount Module EUV 6 56 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR PTH12050YAZT ACTIVE Surface Mount Module EUV 6 250 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR The marketing status values are defined as follows: Addendum-Page 1 Samples N / A for Pkg Type N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 20-May-2011 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee(R) Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated