Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad (R) S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers' and manufacturers' only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. 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Registered Firm ISO 9001:1994 Certificate QSR-219 QS-9000 Third Edition Certificate Number, QSR-QS-017 JANUARY 2002 (c) Copyright The Bergquist Company TABLE OF CONTENTS Introduction Thermal Properties and Testing Interface Material Selection Guide Gap Gap Gap Gap Gap Pad(R) Thermally Conductive Materials Pad(R) Comparison Data Pad(R) Frequently Asked Questions Pad(R) VO Pad(R) VO Soft 2 4 5 6 7 8 9 Gap Pad VO Ultra Soft Gap Pad(R) 1500 Gap Pad(R) 1500R Gap Pad(R) A2000 Gap Pad(R) A3000 HC1000 HC1100 Gap Filler 1000 Gap Filler 2000 10 11 12 13 14 15 16 17 18 19 Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Hi-Flow(R) Phase Change Interface Materials Comparison Data 105 115-AC 200G 225F-AC 225U 225UT 625 818 Frequently Asked Questions 20 21 22 23 24 25 26 27 28 29 30 SterlingTM-7500 Thermal Interface Compound 31 (R) Sil-Pad(R) Thermally Conductive Insulators Sil-Pad(R) Comparison Data Sil-Pad(R) Features and Benefits Sil-Pad(R) Mechanical and Electrical Properties Sil-Pad(R) Thermal Properties Sil-Pad(R) Applications Sil-Pad(R) Selection Guide Sil-Pad(R) 400 Sil-Pad(R) 800 32 33 34 36 38 39 40 42 Sil-Pad 900S Sil-Pad(R) 950 Sil-Pad(R) 980 Sil-Pad(R) 1500 Sil-Pad(R) A1500 Sil-Pad(R) 1750 Sil-Pad(R) 2000 Sil-Pad(R) A2000 Sil-Pad(R) K-4 Sil-Pad(R) K-6 Sil-Pad(R) K-10 Q-Pad(R) II Q-Pad(R) 3 Softface(R) Poly-Pad(R) Bond-Ply(R) 100 Bond-Ply(R) 660 Sil-Pad(R) Tubes Sil-Pad(R) Shield 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 Solutions For Surface Mount Applications Ordering Procedure Building A Part Number Sil-Pad(R) Configurations Hi-Flow(R) Configurations 64 66 68 70 76 (R) INTRODUCTION INTRODUCTION Financially Stable ORDERING High Demand Products 2 SIL-PAD(R) We make it our business to know your business. We understand your problems. We also know that there will always be a better way to help you reach your goals and objectives. To that end, our company continually invests considerable time and money into research and development. The Bergquist Company is focused on a single purpose - discovering the need, then developing and delivering technologically advanced solutions backed by superior service. TIC Worldwide Locations At Bergquist, developing high quality components for the electronics industry is our first priority. As a growing world leader with state-of-the-art facilities producing Thermal Products, Touchscreens and Membrane Switches, and distributing Electronic Components, we supply a multitude of industries worldwide including automotive, computer, military, aerospace, telecommunications and more. HI-FLOWTM Entrepreneurial Spirit GAP PAD(R) Customer Oriented A World Leader in Thermal Management Through Technology, Innovation & Service Committed to Quality INTRODUCTION GAP PAD(R) Bergquist's Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Used by many of the world's largest OEMs in various industries including automotive, computer, power supply, military and motor control, these materials include: Sil-Pad(R) - Thermally Conductive Insulators Gap Pad(R) - Thermally Conductive Gap Filling Materials Hi-Flow(R) - Phase Change Interface Materials SterlingTM-7500 - Thermal Interface Compound Thermal Clad(R) - Insulated Metal Substrates WORLD CLASS OPERATIONS AROUND THE GLOBE TIC In the United States, the Thermal Products Group's 75,000 square foot primary manufacturing facility is located in Cannon Falls, Minnesota. A 40,000 square foot facility in Prescott, Wisconsin, houses the Thermal Clad printed circuit board operations. A new 130,000 square foot facility in Chanhassen, Minnesota is the location for Bergquist's new corporate headquarters and state of the art research and development facilities. Worldwide, Bergquist has facilities in The Netherlands, Germany, the United Kingdom, Taiwan, Korea, Hong Kong and China with sales representatives in 30 countries to support worldwide growth. A LEGACY OF INDUSTRY-LEADING TECHNOLOGY SIL-PAD(R) HI-FLOWTM BERGQUIST TAKES THE HEAT For over 35 years, outstanding quality, innovation and engineering have been hallmarks of the Bergquist Company. Today, developing innovative products for the electronics industry remains our first priority. Bergquist has developed over 260 materials which provide thermal solutions for a wide variety of electronic applications. Many of our products were originally developed to satisfy a customer request for a specific material designed to perform to their particular specifications. This kind of "can do" attitude and customized technology has earned The Bergquist Company these coveted industry certifications: ISO 9001, QS 9000, Ford Q1 and GM Targets For Excellence. ORDERING RESEARCH AND DEVELOPMENT AT THE SPEED OF CHANGE Keeping pace in the incredibly aggressive electronics industry demands continual anticipation of change and the ability to develop solutions quickly and efficiently for our customers. At our Chanhassen, MN, headquarters, we house a state-of-the-art development laboratory and engineering department staffed with highly skilled chemical engineers, laboratory technicians and manufacturing engineers - all dedicated to researching, developing and testing new materials. From such dedication has come many industry-standard proprietary products including Thermal Clad(R), Sil-Pad(R), Gap Pad(R), SterlingTM and Hi-Flow(R) materials. 3 THERMAL CONDUCTIVITY THERMAL RESISTANCE The time rate of heat flow through a unit area producing a unit temperature difference across a unit thickness. The opposition to the flow of heat through a unit area of material across an undefined thickness. k = dt *dqA ** zT R = kz Thermal conductivity is an inherent or absolute property of the material. Thermal resistance varies with thickness. THERMAL IMPEDANCE A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady state heat flow through them. z Z = k * A + Ri Factors affecting thermal impedance include: Area: Increasing the area of thermal contact decreases thermal impedance. Thickness: Increasing the insulator thickness increases thermal impedance. Pressure: Increasing mounting pressure under ideal conditions decreases thermal impedance. Time: Thermal impedance decreases over time. Thermal impedance is affected by the method of temperature measurement. TEST METHODS - ASTM D5470 Thermal Impedance (m2-K/W) INTRODUCTION Thermal Properties and Testing Heater T1 T2 Upper Meter Block Test Sample (1, 2 and 3 layers) T3 T4 T5 T6 Lower Meter Block Reference Calorimeter R3 z k = R (W/m-K) R2 R = R1 Ri Water Cooled Heatsink z1 z2 z3 Thickness (m) 2 in. diameter stack (ref. 3.14 in2) - 10-500* psi, 1 hour per layer * Bergquist modified Thermal Impedance Per Bergquist TO-220 Thermal Performance (25C Cold Plate Testing) FORCE TO-220 Leads Dielectric Metal Base TO-220 is an IRF 840 Tc Ts Shortest thermal path from die to sink 4 Z = T PD z k (m2-K/W) Interface Material Selection Guide Mounting Methods Computer Applications: CPU, GPU, ASICs, Hard Drives Clip, Low Pressure Screw / Rivets, High Pressure Sheet Stock Roll-Form Continuous Standard Configurations Custom External Shapes Custom Internal Features Adhesive PSA Availability Q-Pad II T T T T T T A A A A A A Materials Q-Pad 3 T T T T T T A A A A A A Hi-Flow 105 T AS AS T A A A A A A A A A A A A A A A A A T A A A AS NA T T A A A A A A AS AS NA T T A A A A A A A A A A A A Hi-Flow 115-AC T T T T Hi-Flow 200G T T T T Hi-Flow 225F-AC T T T T Hi-Flow 225UT Hi-Flow 225U Hi-Flow 625 Thin-Film Bonding Bond-Ply 660 T T T T T A A A A A A Bonding (Fiber-Glass) Bond-Ply 100 - 5 mil T T T T T A A A A A A Bond-Ply 100 - 8 mil T T T T T T T T T T A A A A A A A A A A A A A A A A A A A A A A A A T A A A A A A T A A A A A A Bond-Ply 100 - 11 mil Sil-Pad (Fiber-Glass) T T AS Grease Replacement Materials, Insulated Hi-Flow 818 T T Not Applicable Electronic Modules for Telecom and Power Supplies Grease Replacement Electrical Insulator Electronic Modules for Automotive: Motor & Wiper Controls, Anti-Lock, etc. Active Power Compensators: Capacitors, Inductors, Resistors Products Typical Converted Options Market Applications Discrete Power Devices for Power Supplies, Computers, Telecom (Thru-Hole) Interface Applications Sil-Pad 400 T T T T T Sil-Pad 800 T T T T T Sil-Pad 900S T T T T T T T T Sil-Pad 980 T Sil-Pad 1500 T T T T AS T A A A A A A Sil-Pad A1500 T T T T T T A A A A A A Sil-Pad 2000 - 10 mil T T T T AS T A A A A A A Sil-Pad 2000 - 15 mil T T T T AS T A A A A A A Sil-Pad 2000 - 20 mil T T T T AS T A A A A A A Sil-Pad A2000 - 11 mil T T T T AS T A A A A A A Sil-Pad A2000 - 15 mil T T T T T T T T AS AS T T A A A A A A A A A A A A Sil-Pad A2000 - 20 mil Thin-Film Sil-Pad Sil-Pad K4 T T T T T T A A A A A A (Kapton) Sil-Pad K6 Sil-Pad K10 T T T T T T T T T T T T A A A A A A A A A A A A Gap Pad VO T T T T T T T A A* A A AS A Gap Pad VO Soft T T T T T T T A A* A A AS A Gap Pad VO Ultra Soft T T T T T T T A A* A A AS A Gap Pad HC1000 T T T T T A A* A A A Gap Pad HC1100 T T Gap Pad 1500 T T Gap Pad 1500R T T Gap Pad A2000 T T T T T T T T Gap Pad Gap Filler Gap Pad A3000 Gap Filler 1000 Gap Filler 2000 T T T A A* A A A T T T T A A* A A AS T T T A A* A A A T T T AS AS T T T T A A A* A* A A A A A A T T T T AS AS T T T T= Typical , AS= Application Specific (please contact Bergquist Sales) , A= Available, * = up to 40 mils only Note: For Hi-Flow 225UT and Hi-Flow 225F-AC the adhesive is not a PSA. INTRODUCTION Product Overview A A Rev: 11-16-01 5 Gap Pad(R) Thermally Conductive Materials SOLUTION-DRIVEN THERMAL MANAGEMENT PRODUCTS FOR ELECTRONIC DEVICES A complete range of choices for filling air gaps and enhancing thermal conductivity GAP PAD(R) The Bergquist Company, a world leader in thermal interface materials, developed the Gap Pad family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application. The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement. FEATURES BENEFITS Each of the many products within the Gap Pad family is unique in its construction, properties and performance. Following is an overview of the important features offered by the Gap Pad family. Gap Pad thermal designed to improve thermal performance while saving time Specifically: products are an assembly's and reliability and money. * Low-modulus polymer material * Eliminates air gaps to reduce thermal resistance * Fiberglass, rubber carriers or non-reinforced * High conformability reduces interfacial resistance * Special fillers to achieve specific performance characteristics * Replaces messy grease * Highly conformable to uneven and rough surfaces * Shock absorbing * Low-stress vibration dampening OPTIONS APPLICATIONS Some Gap Pad products have special features for particular applications, including: Gap Pad products are well suited to a wide variety of electronics, automotive, medical, aerospace and military applications such as: * Available with or without adhesive * Rubber-coated fiberglass reinforcement * Thicknesses from 0.010'' to 0.250'' * Between a CPU and heat spreader * Between a semiconductor and heat sink * Available in custom die-cut parts, sheets and rolls (converted or unconverted) * CD-ROM cooling * Custom thicknesses and constructions * Heat pipe assemblies * Between heat generating devices and chassis * RDRAM memory modules * Easy material handling * Drive cooling * Simplified application * Power supply * Puncture, shear and tear resistance * Fiber optic pumps * Variety of thicknesses and hardnesses * Improved performance for high-heat assemblies * Signal amplifiers * Range of thermal conductivities * Compatible with automated dispensing equipment * Electrically isolating * Naturally tacky one-side or tacky on both sides with protective liner * Available in sheets and die-cut parts 6 Gap Pad(R) Comparison Data CONDUCTIVITY, HARDNESS AND GENERAL OVERVIEW Gap Pad Thermal Conductivity Comparison 3.0 2.5 2.0 2.0 1.5 1.5 Gap Pad 1500R Gap Pad 1500 GAP PAD(R) Thermal Conductivity (W/mK) 3.0 1.5 1.0 1.0 0.8 0.8 Gap Pad VO Gap Pad VO Soft 1.0 1.0 0.5 0 Gap Pad VO Ultra Soft HC1000 HC1100 Gap Pad A2000 Gap Pad A3000 Gap Pad Material Gap Pad Hardness Comparison Bulk Hardness (Shore 00) 70 64 60 55 50 40 40 30 40 40 Gap Pad 1500R Gap Pad 1500 25 20 20 15 15 Gap Pad VO Ultra Soft HC1000 10 0 Gap Pad VO Gap Pad VO Soft HC1100 Gap Pad A2000 Gap Pad A3000 Gap Pad Material Gap Pad Overview Comparison 80 Thermal Conductivity (W/mK) 3.0 2.5 Thermal Conductivity 70 Hardness 60 2.0 50 40 1.5 30 1.0 20 0.5 0 10 Gap Pad VO Gap Pad VO Soft Gap Pad VO Ultra Soft HC1000 HC1100 Gap Pad 1500R Gap Pad 1500 Gap Pad A2000 Gap Pad A3000 0 Gap Pad Material 7 Frequently Asked Questions Q Q A A What thermal conductivity test method was used to achieve the values given on the data sheets? What is the shelf life of Gap Pad? The Anter Quickline 10 was used to run this test. Bergquist has published an application note about the modifications to the ASTM D5470 test method to appropriately test Gap Pad materials at low 10 psi pressure; see Bergquist Application Note #112. Average shelf life is three (3) years, dependent upon the specific material, tack requirements and type of liner. Please contact Bergquist Sales for more information. Is Gap Pad offered with an adhesive? GAP PAD(R) Q A Currently the standard Gap Pads, which include Gap Pad VO, Gap Pad VO Soft, and Gap Pad VO Ultra Soft are offered with or without an adhesive on the SP800/900 carrier side of the material. All other surfaces on the standard Gap Pad as well as the higher performance Gap Pads, have naturally tacky surfaces. Is the adhesive repositionable? Q A Depending on the surface being applied to, if care is taken, the pad may be repositioned. Special care should be taken when removing the pad from aluminum or anodized surfaces to avoid tearing or delamination. What is the shelf life of Gap Pad with adhesive? Q A The standard Gap Pad VO materials come with an optional silicone adhesive, which has a shelf life of six (6) months. What are the upper processing temperature limits for Gap Pad and for how long? Q A Gap Pads that are pink, mauve or gold in color are more stable at elevated temperatures. Gap Pad in general can be exposed to temporary processing temperatures of 250 C for 5 minutes and 300 C for 1 minute. Is Gap Pad electrically isolating? What is meant by naturally tacky? Q A The characteristic of the rubber itself has a natural inherent tack, without the addition of an adhesive. As with adhesive backed products, the naturally tacky surfaces may help in the assembly process to temporarily hold the pad in place while the application is being assembled. Natural tack varies from one material to another and is greatest for the Gap Pad VO Ultra Soft, Gap Pad VO Soft, HC1000, Gap Pad 1500 and Gap Pad 1500R materials. Gap Pad A2000 and Gap Pad A3000 have less natural tack due to their high filler levels. Is the naturally tacky side of the Gap Pad repositionable? Q A Again, depending on the material that the pad is applied to, in most cases they are repositionable. Again, care should be taken when removing the pad from aluminum or anodized surfaces as to avoid tearing or delaminating the pad. The naturally tacky side is always easier to reposition then an adhesive side. Is Gap Pad reworkable? Q A Depending on the application and the pad being used, Gap Pad has been reworked in the past. Bergquist has customers that are currently using the same pad for reassembling their applications after burnin processes and after fieldwork repairs. However, this is left up to the design engineer's judgment as to whether or not the Gap Pad will withstand reuse. Will heat make the material softer? Q A In the temperature range of -60 C to 200 C, there is no significant variance in hardness. What is the life expectancy of Gap Pad? Q A 8 The silicone rubber industry recognizes a twenty-year life for silicone rubber when used within specified operation parameters. Bergquist has made pad material that has been in applications for some thirty years without any known signs of deterioration. Q A Yes, all Gap Pad materials are electrically isolating. However, it has to be remembered that Gap Pad is designed to FILL gaps, not for guaranteeing them in high stress applications. How much force will the pad place on my device? Q A Refer to the pressure vs. deflection charts on the data sheet for an approximation and refer to Bergquist Application Note #116. Carefully read the side notes on the data sheet regarding the test method used. Will Gap Pad work in my application (what size gaps will Gap Pad accommodate)? Q A Wherever air can be replaced with a Gap Pad, such as between a heat generating device and a heat sink, heat spreader or housing. This can be done by using one sheet of Gap Pad or individual pieces of appropriate thicknesses if stack-up tolerances and height variations are significant. What is meant by compliance and conformability, why is this important? Q A The better a Gap Pad complies and conforms to a rough or stepped surface, the less interfacial resistance will be present due to air voids and air gaps. This leads to a lower overall thermal resistance of the pad between the two interfaces. Is anything given off by the material (i.e. extractables, outgassing)? Q A 1: Gap Pad, like all silicone pads, can extract silicone fluid; refer to Bergquist Application Note #56. It must also be noted that Gap Pad has the lowest extraction value for gap filling products on the market. 2: Primarily for aerospace applications, Gap Pad outgassing data is detailed in Bergquist Application Note #117, tested per ASTM E595. How is extraction testing performed? Q A The test method used is the Bellcore Extraction method #TR-NWT-000930; refer to Bergquist Application Note #56. PadTM VO Gap Pad VO (R) Conformable, Thermally Conductive Material for Filling Air Gaps Gap Pad VO is a thermally conductive cost effective material that acts as a thermal interface between a heat sink and an electronic device. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure. Pressure vs. Percent Deflection Gap Pad Color Thickness Specific Gravity Heat Capacity Hardness (Shore Type 00) Young's Modulus psi (1) Typical Value Gold / Pink 0.020" to 0.250" 1.6 g/cc 1.0 J/g-K Thickness Hardness .020" - .250" 80 - 40 Modulus 100 Rate 0.01"/min. Continuous Use Temp. 45 40 35 Test Method Visual ASTM D374 ASTM D792 ASTM C351 ASTM D2240 ASTMD575 -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity Flame Rating 50 Pressure (Psi) Property >6 kV ASTM D149 5.5 1011 Ohm-meter 94 V-O ASTM D150 ASTM D257 U.L. 0.8 W/m-K ASTM D5470 Thermal 30 25 Thermal Conductivity 20 15 10 5 0 0 5 10 15 20 25 30 35 40 45 50 Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. (1) Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus refer to Bergquist Application Note #116. Gap Pad VO is available in die-cut parts and sheets. Standard sheet size is 8" X 16", with or without adhesive. Thickness vs. Thermal Resistance Gap Pad 250 Thickness (mils) 200 150 100 50 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Thermal Resistance (deg C*sq in/W) www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Gap Pad(R): U.S. Patent 5,679,457 others. Rev: Aug.and 22, 2001 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 9 GAP PAD(R) Gap Pad VO is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling and enhanced puncture, shear, and tear resistance. The material is available in thickness from 0.020" to 0.250" with a removable liner applied to the light pink side of the material. The range in thickness and the materials flexibility allow Gap Pad VO to be used in a variety of applications where surface texture vary and the space between surfaces is uneven. Typical Properties of Gap Pad VO Gap Pad VO Soft PadTM VO Soft (R) Highly Conformable, Thermally Conductive Material for Filling Air Gaps Gap Pad VO Soft is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The conformable nature of Gap Pad VO Soft allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad VO Soft is a highly conformable, low modulus filled silicone polymer on a rubber coated fiberglass carrier. The material is available in thickness from 0.020" to 0.160" with a removable liner applied to the light pink side of the material. To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure.* Pressure vs. Percent Deflection VO Soft 18 16 14 Pressure (Psi) Typical Properties of Gap Pad VO Soft Property Color Thickness Specific Gravity Heat Capacity Hardness (Shore Type 00) Young's Modulus psi (1) Continuous Use Temp. Typical Value Mauve / Pink 0.020" to 0.160" 1.6 g/cc 1.0 J/g-K Thickness Hardness .020" - .160" 65 - 25 Modulus 40 Rate 0.01"/min. Test Method Visual ASTM D374 ASTM D792 ASTM C351 ASTM D2240 ASTMD575 -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity Flame Rating 20 >6 kV ASTM D149 5.5 1011 Ohm-meter 94 V-O ASTM D150 ASTM D257 U.L. 0.8 W/m-K ASTM D5470 Thermal 12 10 Thermal Conductivity 8 6 4 2 0 0 5 10 15 20 25 30 35 40 45 50 Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. Thickness vs. Thermal Resistance VO Soft 160 (1) Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus refer to Bergquist Application Note #116. The range in thickness and the materials flexibility allow Gap Pad VO Soft to be used in a variety of applications where surface texture vary and the space between surfaces is uneven. The material is available in die-cut parts and sheets. Standard sheet size is 8" X 16", with or without adhesive. Typical Applications 140 * * * 120 Thickness (mils) GAP PAD(R) Gap Pad VO Soft is a cost-effective material recommended for low stress applications. These include applications where the material is used as an interface and one side is in contact with a leaded device. 100 80 * * 60 40 Between chassis wall and other surface CDROM Cooling Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader. Between CPU and Heat Spreader Between a semiconductor and heat sink 20 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 Thermal Resistance (deg C*sq in/W) www.bergquistcompany.com 10 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Rev: Aug. 22, others. 2001 Gap Pad(R): U.S. Patent 5,679,457 and The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Gap Pad VO Ultra Soft PadTM VO Ultra Soft (R) (R) Additional Conformability & Thermal Conductivity for Filling Air Gaps GP Ultra Soft is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high voltage, bare leaded devices. GP Ultra Soft is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling and enhanced puncture, shear, and tear resistance. To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure.* Pressure vs. Percent Deflection Ultra Soft 4.0 Property Color Thickness Specific Gravity Heat Capacity Hardness (Shore Type 00) Young's Modulus psi (1) Continuous Use Temp. Typical Value Mauve / Pink 0.020" to 0.250" 1.6 g/cc 1.0 J/g-K Thickness Hardness .020" - .250" 73 - 5 Modulus 8 Rate 0.01"/min. 3.0 2.5 Test Method Visual ASTM D374 ASTM D792 ASTM C351 ASTM D2240 ASTMD575 -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity Flame Rating 3.5 Pressure (Psi) Typical Properties of Gap Pad VO Ultra Soft >6 kV ASTM D149 5.5 1011 Ohm-meter 94 V-O ASTM D150 ASTM D257 U.L. 1 W/m-K ASTM D5470 Thermal 2.0 Thermal Conductivity 1.5 1.0 0.5 0.0 0 5 10 15 20 25 30 35 40 45 50 Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. Thickness vs. Thermal Resistance Ultra Soft 250 (1) Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus refer to Bergquist Application Note #116. GP Ultra Soft is offered in thickness from 0.020" to 0.250" with the rubber-coated carrier on one side and removable protective liner on the naturally tacky side of the material. Material is available in die-cut parts and sheets, 0.020" material is also offered in roll form. Standard sheet size is 8" X 16", with or without adhesive. 225 Typical Applications 200 * * * Thickness (mils) 175 150 125 100 * * 75 50 Between chassis wall and other surface CDROM Cooling Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader. Between CPU and Heat Spreader Between a semiconductor and heat sink 25 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 Thermal Resistance (deg C*sq in/W) www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Rev: Sept. 21, others. 2001 Gap Pad(R): U.S. Patent 5,679,457 and The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 11 GAP PAD(R) Gap Pad VO Ultra Soft is recommended for extremely low stress applications that require a thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with steps, rough surfaces, and high stack up tolerances. The viscoelastic nature of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. Gap PadTM 1500 Pad 1500 (R) (R) Gap Pad 1500 is designed to cost-effectively maximize heat transfer from electronic components to heat sinks or heat spreaders. The material has an ideal filler blend that gives its low modulus characteristic yet maintains optimal thermal performance, the combination of which minimizes thermal resistance between heat generating devices and heat sinks. GP1500 is an electrically isolating material that allows its use in applications requiring isolation between heat sinks and high voltage, bare leaded devices. Typical Properties of Gap Pad 1500 Typical Value Test Method Color Thickness Specific Gravity Heat Capacity Black 0.020" to 0.200" 2.1 g/cc 1.0 J/g-K Visual ASTM D374 ASTM D792 ASTM C351 GP1500 is a highly conformable low-modulus material that fills air gaps due to steps, rough surfaces, and high stack-up tolerances. The softness relieves stress and absorbs shocks minimizing damage to delicate leads. The tacky nature of both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance. Hardness (Shore Type 00) 40 ASTM D2240 To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure. Electrical Pressure vs. Percent Deflection GP1500 20 Pressure (Psi) Property Modulus 45 Young's Modulus psi (1) Continuous Use Temp. Rate 0.01"/min. ASTMD575 -60C to 200C Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity Flame Rating 25 >6 kVAC ASTM D149 5.5 1011 Ohm-meter 94 V-O ASTM D150 ASTM D257 U.L. 1.5 W/m-K ASTM D5470 Thermal 15 Thermal Conductivity 10 5 (1) 0 0 5 10 15 20 25 30 35 40 45 50 Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. Thickness vs. Thermal Resistance GP1500 Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus refer to Bergquist Application Note #116. GP1500 is available in thickness from 0.020" to 0.200". The standard material is offered without reinforcement, however, 0.010", 0.015" and 0.020" thick materials are also offered with reinforcement denoted as GP1500R. Gap Pad 1500 is available in die-cut or sheet form with protective liners on both sides. The material is compatible with dispensing equipment for high volume production. 200 180 Typical Applications 160 140 Thickness (mils) GAP PAD(R) High Thermally Conductive Gap Filling Material 120 100 80 60 40 20 Heat Pipe Assemblies RDRAMTM Memory Modules CDROM Cooling Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader. Between CPU and Heat Spreader 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Thermal Resistance (deg C*sq in/W) www.bergquistcompany.com 12 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Rev. Aug.and 22, 2001 Gap Pad(R): U.S. Patent 5,679,457 others. The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Pad 1500R Gap PadTM 1500R (R) (R) High Thermally Conductive Gap Filling Material Gap Pad 1500R has the same highly conformable low modulus polymer as the standard GP1500 family of products with the addition of a fiberglass reinforcing substrate in the center. The fiberglass enforcement allows for easy material handling and enhances puncture, shear, and tear resistance. GP1500R has an ideal polymer and filler blend that gives its low modulus characteristic yet maintains optimal thermal performance, minimizing thermal resistance. The highly conformable low-modulus nature of the material fills air gaps due to rough surfaces and high stack-up tolerances and is also vibration dampening. The tacky nature of both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance. Typical Value Test Method Color Thickness Specific Gravity Heat Capacity Black 0.010" to 0.020" 2.1 g/cc 1.3 J/g-K @ 85 C Visual ASTM D374 ASTM D792 ASTM C351 Hardness (Shore Type 00) 75 (@ 20 mils) ASTM D2240 Property Modulus 45 Young's Modulus psi (1) Continuous Use Temp. Rate 0.01"/min. ASTMD575 -60C to 200C Electrical To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure.* Dielectric Constant Volume Resistivity Flame Rating Pressure vs. Percent Deflection GP1500R @20mil 250 225 200 175 150 125 100 75 50 25 0 Pressure (Psi) Dielectric Breakdown Voltage >6 kVAC ASTM D149 6.0 1011 Ohm-meter 94 V-O ASTM D150 ASTM D257 U.L. 1.5 W/m-K ASTM D5470 Thermal Thermal Conductivity (1) Graphs and data generated from Young's Modulus @ 10% deflection, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2 and 20 mils thick. For more information on Gap Pad modulus refer to Bergquist Application Note #116. 0 5 10 15 20 25 30 35 40 45 50 Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. GP1500R is available in 0.010", 0.015", & 0.020" thickness and is available in 8" x 16" sheets, die-cut parts, and rolls in converted or unconverted form. GP1500R is offered with removable protective liners on both sides of the material. GP1500R is compatible with dispensing equipment for high volume production. Thickness vs. Thermal Resistance GP1500R 20 Typical Applications Thickness (mils) 18 16 14 12 Heat Pipe Assemblies RDRAMTM Memory Modules CDROM Cooling Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader. Between CPU and Heat Spreader 10 0.25 0.30 0.35 0.40 0.45 0.50 0.55 Thermal Resistance (deg C*sq in/W) Gap Pad(R): U.S. Patent 5,679,457 others. Rev. Aug.and 22, 2001 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 13 GAP PAD(R) GP1500R is an electrically isolating material that allows its use in applications requiring isolation between heat sinks and high voltage, bare leaded devices. Typical Properties of Gap Pad 1500R Gap Pad PadTM A2000 A2000 (R) (R) High Performance Thermally Conductive Gap Filling Material This high thermally conductive reinforced material is available in thickness from 0.010" to 0.040". Material in the thickness range of 10 to 20 mil is supplied with natural tack on both sides of the material, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with tack on one side only, allowing for burn-in processes and easy rework. To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure. Example: 0.020" thickness at 60psi yields 20% (0.20) deflection. Pressure vs. Percent Deflection GPA2000 @ 20 mil 140 Property Color Thickness Specific Gravity Heat Capacity Hardness (Shore Type 00) Young's Modulus (1) (psi) Typical Value Grey 0.010" to 0.040" 2.9 g/cc 1.0 J/g-K Thickness Hardness 0.020" 80 Modulus 55 Rate 0.01"/min. Continuous Use Temp. 100 80 Test Method Visual ASTM D374 ASTM D792 ASTM C351 ASTM D2240 ASTMD575 -60C to 200C Electrical Dielectric Constant Volume Resistivity Flame Rating 120 Pressure (psi) Typical Properties of Gap Pad A2000 Dielectric Breakdown Voltage 160 >3 kV ASTM D149 5 1011 Ohm-meter 94 V-O ASTM D150 ASTM D257 U.L. 2.0 W/m-K ASTM D5470 Thermal 60 Thermal Conductivity 40 20 0 0 5 10 15 20 25 30 35 40 45 50 (1) Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. Example: 0.020" * 0.20 = 0.004" Deflection Resultant Thickness: 0.020" - 0.004" = 0.016" Thermal Resistance: 0.32 C in2/watt Thickness vs. Thermal Resistance GPA2000 35 30 Typical Applications 25 20 Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2on 20-mil material. For more information on Gap Pad modulus refer to Bergquist Application Note #116. Gap Pad A2000 is available in die-cut parts and in roll form (converted or unconverted). The material is compatible with dispensing equipment for high volume production. 40 Thickness (mil) GAP PAD(R) Gap Pad A2000 is a highly conductive low modulus material that acts as a thermal interface between electrical components and heat sinks. The conformable nature allows the material to fill air gaps to enhance the thermal performance of electrical systems. Heat Pipe Assemblies RDRAMTM Memory Modules CDROM Cooling Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader. Between CPU and Heat Spreader 15 10 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Thermal Resistance (deg C*sq in/W) www.bergquistcompany.com 14 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Gap Pad(R): U.S. Patent 5,679,457 others. Rev. Aug.and 22, 2001 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Pad A3000 Gap PadTM A3000 (R) (R) Improved High Performance Gap Pad Material, One Side Tacky Gap Pad A3000 is a highly conductive gap filling material that acts as a thermal interface between electrical components and heat sinks. This material maintains a conformable nature, which allows it to fill air gaps and enhance the thermal performance of electrical systems. Gap Pad A3000 is a thermally conductive filled polymer laminate, supplied on a reinforcing mesh for easy material handling and enhanced puncture, shear, and tear resistance. To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure. Example: 0.020" thickness at 100psi yields 20% (0.20) deflection. Pressure vs. Percent Deflection GPA3000 @ 20 mils 300 Pressure (psi) 250 Property Color Thickness Specific Gravity Heat Capacity Hardness (Shore Type 00) Young's Modulus (1) (psi) Continuous Use Temp. Gold 0.010" to 0.020" 3.2 g/cc 1.0 J/g-K Thickness Hardness 0.020" 80 Modulus Rate 50 0.01"/min. Test Method Visual ASTM D374 ASTM D792 ASTM C351 ASTM D2240 ASTMD575 -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity Flame Rating 200 Thermal 150 Thermal Conductivity >5 kV ASTM D149 7 1011 Ohm-meter 94 V-O (pending) ASTM D150 ASTM D257 U.L. 3.0 W/m-K ASTM D5470 100 (1) 50 0 0 5 10 15 20 25 30 35 40 45 50 Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. Example: 0.020" * 0.20 = 0.004" Deflection Resultant Thickness: 0.020" - 0.004" = 0.016" Thermal Resistance: 0.22 C in2/watt Thickness vs. Thermal Resistance GPA3000 Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2 on 20 mil material. For more information on Gap Pad modulus refer to Bergquist Application Note #116. Gap Pad A3000 is inherently tacky on one side for stickin-place characteristics while offering a non blocking surface on the other for burn-in and rework processes. Gap Pad A3000 is available in 0.010", 0.015", & 0.020" thickness and is offered in 8" x 16" sheets, die-cut parts, and rolls in converted or unconverted form. Gap Pad A3000 is offered with removable protective liners on both sides of the material. Typical Applications * CPU & Heat Pipe Assemblies * CDROM Cooling * Burn-in Processes * Graphic Chip Cooling * Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader. 20 18 Thickness (mils) Typical Value 15 13 10 8 5 0.05 0.1 0.15 0.2 0.25 0.3 Thermal Resistance (deg C*sq in/W) www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Gap Pad(R): U.S. Patent 5,679,457 others. Rev: Aug.and 22, 2001 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 15 GAP PAD(R) Gap Pad A3000 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high voltage, bare leaded devices. Typical Properties of Gap Pad A3000 HC1000 "Gel-Like" Modulus Gap Filling Material The tacky nature of both sides of the material allows for good compliance and excellent conformability to adjacent surfaces of components. This thermally conductive reinforced material is available in thickness from 0.010" to 0.020". To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure. Typical Value Test Method Color Thickness Specific Gravity Heat Capacity Grey 0.010" to 0.020" 1.6 g/cc 1.0 J/g-K Visual ASTM D374 ASTM D792 ASTM C351 Hardness (Shore Type 00) 60 (@ 20 mils) ASTM D2240 Property Young's Modulus psi (1) Modulus 15 Continuous Use Temp. Rate 0.01"/min. ASTMD575 -60C to 200C Dielectric Breakdown Voltage 140 120 100 Pressure (Psi) Typical Properties of HC1000 Electrical Pressure vs. Percent Deflection HC1100 @20 mil Dielectric Constant Volume Resistivity Flame Rating 80 60 40 >5 kVAC ASTM D149 6.0 1011 Ohm-meter 94 V-O ASTM D150 ASTM D257 U.L. 1.0 W/m-K ASTM D5470 Thermal 20 0 0 5 10 15 20 25 30 35 40 45 50 Percent Deflection (%) Thermal Conductivity (1) Graphs and data generated from Young's Modulus @ 10% deflection, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2 and 20 mils thick. For more information on Gap Pad modulus refer to Bergquist Application Note #116. The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. Thickness vs. Thermal Resistance HC1100 Gap Pad HC1000 is available in 0.010", 0.015", & 0.020" thickness and is offered in 8" x 16" sheets, die-cut parts, and rolls in converted or unconverted form. Gap Pad HC1000 is offered with removable protective liners on both sides of the material. 20 18 Thickness (mils) GAP PAD(R) Gap Pad HC 1000 is an extremely conformable low modulus polymer that acts as a thermal interface between electrical components and heat sinks. The "gel-like" modulus allows this material to fill air gaps to enhance the thermal performance of electrical systems. 16 14 12 10 0.25 0.30 0.35 0.40 0.45 0.50 0.55 Thermal Resistance (deg C*sq in/W) Typical Applications Areas where irregular surfaces need to make a thermal interface to a heat sink. RDRAMTM Memory Modules Heat interfaces to frames, chassis, or other heat spreading devices. CDROM Cooling Between CPU and Heat Spreader Gap Pad(R): U.S. Patent 5,679,457 others. Rev. Aug.and 22, 2001 www.bergquistcompany.com 16 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 HC1100 Gap Filling Material with "Gel-Like" Modulus, One Sided Tack HC1100 is offered with tack on the bottom side only! This material simplifies material handling for part dispensing and pick-and-place automation. The top, tackfree surface does not require a protective liner since it does not attract dust and dirt from surrounding areas. To calculate the approximate amount of deflection for a specific material thickness, at a given pressure, refer to the graph below. Multiply the thickness of the material by the percentage at the given pressure. Pressure vs. Percent Deflection HC1100 @20 mil 140 100 Pressure (Psi) Typical Value Test Method Color Thickness Specific Gravity Heat Capacity Grey 0.015" to 0.020" 1.6 g/cc 1.0 J/g-K Visual ASTM D374 ASTM D792 ASTM C351 Hardness (Shore Type 00) 60 (@ 20 mils) ASTM D2240 Property Modulus 15 Young's Modulus psi (1) Continuous Use Temp. 80 Rate 0.01"/min. ASTMD575 -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity Flame Rating 120 >5 kVAC ASTM D149 6.0 1011 Ohm-meter 94 V-1 ASTM D150 ASTM D257 U.L. 1.0 W/m-K ASTM D5470 Thermal 60 Thermal Conductivity 40 20 0 0 5 10 15 20 25 30 35 40 45 50 (1) Graphs and data generated from Young's Modulus @ 10% deflection, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2 and 20 mils thick. For more information on Gap Pad modulus refer to Bergquist Application Note #116. HC1100 is viscoelastic, which gives it excellent low stress vibration dampening and shock absorbing characteristics. HC1100 is an electrically isolating material, allowing for its use between high voltage, bare leaded devices and metal sinks. Percent Deflection (%) The resultant thickness of the Gap Pad will determine the thermal resistance. Subtracting the initial gap pad thickness by the deflection value, obtained above, will give the resultant thickness. Refer to the graph below to obtain the thermal resistance of the material. HC1100 is a filled thermally conductive polymer supplied with an imbedded reinforcement resulting in improved material handling and enhanced puncture, shear, and tear resistance. Gap Pad HC1100 is available in 0.015" & 0.020" thickness and is available in 8" x 16" sheets, die-cut parts, and rolls in converted or unconverted form. Gap Pad HC1100 is offered with removable protective liners on both sides of the material. Gap Pad HC1100 is compatible with dispensing equipment for high volume production. Thickness vs. Thermal Resistance HC1100 20 18 Thickness (mils) Typical Properties of HC1100 16 Typical Applications 14 12 10 0.25 0.30 0.35 0.40 0.45 0.50 0.55 Thermal Resistance (deg C*sq in/W) Areas where irregular surfaces need to make a thermal interface to a heat sink. RDRAMTM Memory Modules Heat interfaces to frames, chassis, or other heat spreading devices. For ASIC and PC Cooling Between CPU and Heat Spreader Rev. Aug. 22, 2001 Gap Pad(R): U.S. Patent 5,679,457 and others. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 17 GAP PAD(R) HC1100 is a cost-effective material, recommended for extremely low stress applications that require a thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between heat generating devices and heat sinks or metal chassis with rough surfaces, steps, and high stack up tolerances. This thermally conductive reinforced material is available in thickness from 0.015" & 0.020". FillerTM 1000 Gap Filler 1000 Gap Filler 1000 is a high performance thermally conductive liquid GAP FILLING MATERIAL. It is supplied as a twocomponent, room or elevated temperature curing system. It is formulated to provide a balance of cured material properties highlighted by "gel-like" modulus and good compression set (memory). These properties result in a soft, thermally conductive, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. The viscosity of the mixed uncured material also makes it suitable as a thermally conductive alternative in the following applications: * Replacement for thermal grease - Before cure, it flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. * As a low modulus thermally conductive potting material. * As a thermally conductive vibration dampening material. Gap Filler 1000 is supplied as a two-part kit comprised of Part A and Part B components. The two components are colored to assist as a mix indicator (1:1 ratio by weight or volume). The mixed system will cure at either ambient or elevated temperature to form a soft thermally conductive interface material. Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 1000 is intended for use in thermal interface applications where a structural bond is not a requirement. This material is formulated for low cohesive strength and "gel-like" properties. This product is characterized by these special properties: * High Thermal Conductivity - 1.0 W/m-K * Stress Absorbing Flexibility (low modulus) * "Clean-Release" from many heat sink and electronic packaging materials (re-workable) * Excellent Low and High Temperature Mechanical and Chemical Stability * 100% Solids - No Cure By-Products * Versatile Cure Schedules - Both Ambient and Accelerated Cure Schedules Gap Filler 1000 is available in standard 50 cc, 200 cc, or 400 cc MixPacTM cartridges. It is also available in 2 Gallon and 10 Gallon Kits. Typical Properties of Gap Filler 1000 Property Typical Value Test Method As Supplied Appearance Part A Appearance Part B Viscosity As Mixed (1) Specific Gravity Mix Ratio Shelf Life @ 25C Grey White 100,000 cps 1.63 1:1 6 months Visual Visual ASTM ASTM D792 As Cured - Physical Appearance Hardness Shore Type "00" Continuous Use Temp Heat Capacity Thermal Conductivity Flame Rating Grey 30 -60C - +175C 1 J/g-K 1.0 W/mK 94 V-O Visual ASTM D2240 ASTM C351 ASTM D5470 U.L. As Cured-Electrical Dielectric Strength Volume Resistivity Dielectric Constant 500 Volts/mil 1E +14 ohm-cm 5 @ 1 MHz ASTM D149 ASTM D257 ASTM D150 Cure Schedule Pot Life @ 25 C Cure @ 25 C Cure @ 100 C 15 min (2) 60 - 120 min (3) 5 min (3) (1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25 C (2) Time for viscosity to double (3) Cure Schedule (Rheometer - Time to reach 90% cure) Application Gap Filler 1000 can be applied using the following methods: * Mixed and dispensed using dual tube cartridge packs with static mixers and a manual or pneumatic gun * Mixed and dispensed using industry standard high volume mixing and dispensing equipment Thickness vs Thermal Resistance 300 Thickness (mils) GAP PAD(R) Thermally Conductive Liquid Gap Filling Material 250 200 150 100 50 0 0 1 2 3 4 5 6 7 8 9 10 11 Thermal Resistance (deg C*sq in/W) Rev. Aug. 22, 2001 Gap Pad(R): U.S. Patent 5,679,457 and others. www.bergquistcompany.com 18 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Gap Filler 2000 FillerTM 2000 High Performance Thermally Conductive Liquid Gap Filling Material Gap Filler 2000 is intended for use in thermal interface applications where a structural bond is not a requirement. This material is formulated for low cohesive strength and "gel-like" properties. This product is characterized by these special properties: * High Thermal Conductivity - 2.0 W/m-K * Stress Absorbing Flexibility (low modulus) * "Clean-Release" from many heat sink and electronic packaging materials (re-workable) * Excellent Low and High Temperature Mechanical and Chemical Stability * 100% Solids - No Cure By-Products * Versatile Cure Schedules - Both Ambient and Accelerated Cure Schedules Gap Filler 2000 is available in standard 50 cc, 200 cc, or 400 cc MixPacTM cartridges. It is also available in 2 Gallon and 10 Gallon Kits. Property Typical Value Test Method As Supplied Appearance Part A Appearance Part B Viscosity As Mixed (1) Specific Gravity Mix Ratio Shelf Life @ 25C Pink White 300,000 cps 2.8 1:1 6 months Visual Visual ASTM ASTM D792 As Cured - Physical Appearance Hardness Shore Type "00" Continuous Use Temp Heat Capacity Thermal Conductivity Flame Rating Pink 70 -60C - +200C 1 J/g-K 2.0 W/mK 94 V-O Pending Visual ASTM D2240 ASTM C351 ASTM D5470 U.L. As Cured-Electrical Dielectric Strength Volume Resistivity Dielectric Constant 500 Volts/mil 1E +14 ohm-cm 7 @ 1 MHz ASTM D149 ASTM D257 ASTM D150 Cure Schedule Pot Life @ 25 C Cure @ 25 C Cure @ 100 C 15 min (2) 60 - 120 min (3) 5 min (3) (1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25 C (2) Time for viscosity to double (3) Cure Schedule (Rheometer - Time to reach 90% cure) Application Gap Filler 2000 can be applied using the following methods: * Mixed and dispensed using dual tube cartridge packs with static mixers and a manual or pneumatic gun * Mixed and dispensed using industry standard high volume mixing and dispensing equipment Thickness vs Thermal Resistance 300 Thickness (mils) Gap Filler 2000 is supplied as a two-part kit comprised of Part A and Part B components. The two components are colored to assist as a mix indicator (1:1 ratio by weight or volume). The mixed system will cure at either ambient or elevated temperature to form a soft thermally conductive interface material. Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. Typical Properties of Gap Filler 2000 GAP PAD(R) Gap Filler 2000 is a high performance thermally conductive liquid GAP FILLING MATERIAL. It is supplied as a twocomponent, room or ele vated temperature curing system. It is formulated to provide a balance of cured material properties highlighted by "gel-like" modulus and good compression set (memory). These properties result in a soft, thermally conductive, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. The viscosity of the mixed uncured material also makes it suitable as a thermally conductive alternative in the following applications: * Replacement for thermal grease - Before cure, it flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling. Unlike thermal grease, the cured product is dry to the touch. * As a low modulus thermally conductive potting material. * As a thermally conductive vibration dampening material. 250 200 150 100 50 0 0 1 2 3 4 5 6 Thermal Resistance (deg C*sq in/W) Gap Pad(R): U.S. Patent 5,679,457 and others. Rev. Aug. 22, 2001 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 19 Hi-Flow(R) Phase Change Interface Materials SOLUTION-DRIVEN THERMAL MANAGEMENT PRODUCTS FOR ELECTRONIC DEVICES Use phase change materials for excellent thermal performance without the mess of grease Hi-Flow(R) "phase change" materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink. Hi-Flow materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface - without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle. HI-FLOW(R) The Hi-Flow family of phase change thermal interface materials covers a wide range of applications. The Bergquist Company is a leader in thermal management solutions and works closely with customers to ensure that the proper Hi-Flow material is specified. FEATURES BENEFITS OPTIONS APPLICATIONS Hi-Flow handles like Bergquist's famed Sil-Pad(R) materials at room temperature, but flows like grease at its designed phase change temperature. Following is an overview of the important features shared by the Hi-Flow family. Using Hi-Flow materials instead of grease can save time and money without sacrificing thermal performance. Here are some other benefits: The broad Hi-Flow family offers a variety of choices to meet the customer's performance, handling and process needs. Some of the choices include: Hi-Flow materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications applications such as: * Available with or without adhesive * UPS and SMPS AC/DC, DC/DC or linear power supplies * Comparable thermal performance to mica or grease assemblies * Easier handling - not tacky at room temperature * Thermally conductive phase change compound * Does not require protective liner * Aluminum, film or fiberglass carriers * Low volatility * Easy to handle and apply in the manufacturing environment * Tack-free and scratch-resistant at room temperature 20 * No mess - thixotropic characteristics of the materials keep it from flowing out of the interface * High thermal performance helps ensure CPU reliability * Does not attract contaminants * Easier material handling and shipping * Simplified application process * Aluminum carrier for applications not requiring electrical isolation * Film or fiberglass carrier for electrical isolation * Dry, non-reinforced material * Tabbed parts, punch parts, sheets or rolls * Adhesive specifically for cold application without preheating heat sink * Between a CPU and heat sink, including 700+ MHz chips * Power conversion devices * Fractional and integral motor control * Leaded, surface mount and power module assemblies Hi-Flow(R) Comparison Data TO-220 THERMAL PERFORMANCE Hi-Flow Grease Replacement Materials (Insulating) TO-220 Thermal Performance Thermal Performance, C/W 1.40 1.20 Hi-Flow 115-AC Hi-Flow 225F-AC Hi-Flow 200G Hi-Flow 225UT Hi-Flow 105 Hi-Flow 225U 1.00 0.80 0.60 0.40 0.20 10 25 50 100 200 HI-FLOW(R) Interface Pressure, psi Hi-Flow Grease Replacement Materials (Non-Insulating) TO-220 Thermal Performance 2.30 Thermal Performance, C/W Hi-Flow 625 2.20 Hi-Flow 818 2.10 2.00 1.90 1.80 1.70 1.60 1.50 10 25 50 100 200 Interface Pressure, psi Grease Replacement Materials TO-220 Thermal Performance Thermal Performance, C/W 2.50 Q3 HF 625 2.30 Q2 HF 200R 2.10 818 Hi-FlowHF 115-AC Hi-Flow 105 1.90 1.70 1.50 1.30 1.10 0.90 0.70 0.50 10 25 50 100 200 Interface Pressure, psi 21 Hi-FlowTM Hi-Flow 105 105 (R) Hi-Flow Coated Aluminum Hi-Flow 105 is a "phase change" material designed specifically to replace grease as a thermal interface. Hi-Flow 105 is a filled polymer and is available in a pad form for easier handling and installation. At 65 oC (Phase Change Temperature), Hi-Flow 105 changes from a solid and flows thereby assuring total wet-out of the interface. The thixotropic characteristics of the material keep Hi-Flow 105 from flowing out of the interface. The result is a thermal interface comparable to grease, without the mess, contamination and difficult handling associated with grease. Typical Properties of Hi-Flow 105 Typical Value Test Method Dark Gray 0.0055" 65 oC -30 oC to +130 oC Visual ASTM D374 DSC 3.2 94 V-O ASTM D150 U.L. 0.9 W/m-K ASTM D5470 Physical Property Color Thickness Phase Change Temperature Continuous use Temp. Electrical Dielectric Constant, 100Hz Flame Rating Thermal Thermal Conductivity (2) Thermal Impedance vs. Pressure Pressure (psi) 10 TO-220 Thermal Performance, C/W 0.95 25 0.80 Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 0.39 0.37 HI-FLOW(R) o 50 0.74 100 0.69 200 0.64 0.36 0.33 0.30 1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was conditioned at 70 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Hi-Flow 105 has thermal performance equal to grease with 0.10 oC-in2 / W contact thermal resistance. Hi-Flow 105 is used in applications where electrical isolation is not required. Typical applications for Hi-Flow 105 include CPUs mounted on a heat sink, power conversion modules or any other spring or clip mount application where grease is used. 2). This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. Hi-Flow 105 features include: * Available in pad form as punched parts, sheets or rolls * Low volatility - less than 1% * Easy to handle in the manufacturing environment * Flows but doesn't run like grease or wax under continuous heat or in vertical applications. * Tack Free & Scratch Resistant at room temperature. Does not require a protective liner in shipment when attached to heat sink. Hi-Flow 105 is coated on both sides of the aluminum substrate. The product is available with or without thermal acrylic adhesive to aid in positioning. Heat Sink Hi-Flow 105 Power Device www.bergquistcompany.com 22 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 Hi-Flow(R): U.S. Patent 4,950,066 and others. Rev: October 4, 2001 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Hi-FlowTM 115-AC Hi-Flow 115-AC (R) Phase Change Thermal Interface Material for Computer Processors Bergquist Hi-Flow 115-AC is a thermally conductive fiber reinforced phase change material. The product consists of a thermally conductive 65oC phase change compound coated on a fiberglass web, and an adhesive coating one side for attachment to cold heat sink. Hi-Flow 115 is designed as a thermal interface material between an computer processor and a heat sink. The pressure sensitive adhesive makes it simple to apply in high volume to heat sinks and the 65oC phase change temperature eliminates shipping and handling problems. Physical Property Typical Value Test Method Gray 0.0055" 900 psi 40% 65 oC 150 oC Visual ASTM D374 ASTM D882A ASTM D882A DSC 300 volt 3.5 > 1010 ASTM D149 ASTM D150 ASTM D257 70 g/in 25 g/in ASTM D1876 ASTM D1876 0.8 W/m-K ASTM D5470 Color Thickness Tensile Strength Elongation Phase Change Temperature Continuous use Temp. Electrical Breakdown Voltage Dielectric Constant, 100Hz Volume Resistivity, Ohm-meter Adhesive Peel Strength Release Peel HI-FLOW(R) Heat Sink Typical Properties of Hi-Flow 115-AC Thermal Thermal Conductivity (2) Thermal Impedance vs. Pressure Hi-Flow 115-AC Pressure (psi) 10 TO-220 Thermal Performance, C/W 1.28 25 1.16 Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 0.44 0.37 o Power Device Hi-Flow 115-AC can be applied directly to a cold heat sink. No need to preheat the heat sink to apply the Hi-Flow 115 AC. Hi-Flow 115-AC requires no protective liner for shipping or handling. The HiFlow coating is tough at room temperature, and it can withstand the handling and shipping process without protection. 50 1.04 100 0.94 200 0.85 0.35 0.27 0.15 1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was conditioned at 70 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 2). This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate. The Hi-Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. Hi-Flow 115-AC is available without adhesive for slightly better thermal performance. The thermal resistance is 0.15 C in2/watt at 50 psi. Hi-Flow 115-AC handles like a Sil Pad at room temperature and flows like high quality grease at elevated temperature. Hi-Flow 115-AC thermal resistance of 0.18 C in2/watt at 50 psi. Hi-Flow(R): U.S. Patent Rev: 4,950,066 and others. October 4, 2001 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-22700-7795 23 Hi-FlowTM 200-G Hi-Flow 200G (R) Fiber GlassReinforced, Reinforced,Phase PhaseChange ChangeThermal ThermalInterface InterfaceMaterial Material Fiberglass Thermal Interface Material for High Performance Computer Processors Hi-Flow 200-G is a thermally conductive phase change material. The product consists of a thermally conductive 55 oC phase change compound coated on a fiberglass web. Hi-Flow 200-G is designed as a thermal interface material between a computer processor and a heat sink. HI-FLOW(R) Above the phase change temperature, Hi-Flow 200-G wets out the thermal interface surfaces and flows to produce the lowest thermal impedance. Hi-Flow 200-G requires pressure of the assembly to cause flow. Hi-Flow 200-G will not drip or run like grease. Heat Sink Typical Properties of Hi-Flow 200-G Physical Property Typical Value Test Method Blue 0.006" 400 psi 40% 55 oC 100 oC Visual ASTM D374 ASTM D882A ASTM D882A DSC Color Thickness Tensile Strength Elongation Phase Change Temperature Continuous use Temp. Electrical Breakdown Voltage Dielectric Constant, 100Hz Volume Resistivity, Ohm-meter Flame Rating 300 volt 3.5 > 108 V-O ASTM D150 ASTM D257 U.L. 1.6 W/m-K ASTM D5470 Thermal Thermal Conductivity (2) Thermal Impedance vs. Pressure / Table #1 Hi-Flow 200-G Pressure (psi) 10 0.96 25 0.92 50 0.88 100 0.86 200 0.83 Microprocessor TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 0.17 0.16 0.16 0.14 0.14 Bergquist suggests the use of spring clips to assure constant pressure on the interface. The spring pressure that will deliver the optimum thermal performance is 50 psi as shown by the Table #1. Application Methods: Hand-apply to 40-50 oC heat sink. The heat sink is heated in oven or heat gun to between 40-50 o C, and then the Hi-Flow 200-G pad is applied like and adhesive pad. The heat sink is cooled to room temperature and packaged. Hand-apply to 20-35 oC heat sink. Hi-Flow 200-G can be applied to a room temperature heat sink with the assistance of a foam roller. The pad is positioned onto the heat sink and a hand roller is used to apply pressure of 30psi. 1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was conditioned at 60 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 2). This is the measured thermal conductivity of the High Flow coating. It represents one conducting layer in a three-layer laminate. The High Flow coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. Hi-Flow 200-G has a patent pending design that eliminates the need for a protective liner on the material during shipping. Automated equipment with 30 psi pressure. A pick and place automated dispensing unit can be used to apply Hi-Flow 200-G to a room temperature heat sink. The placement head should have a soft silicone rubber pad, and apply 30psi pressure to the pad on transfer to the 20-35 oC heat sink. Hi-Flow(R): U.S. Patent Rev: 4,950,066 and others. October 1, 2001 www.bergquistcompany.com 24 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) 225 F-AC Hi-FlowTM Hi-Flow 225F-AC Reinforced Phase Change Thermal Interface Material Thermal Interface High Performance Computer Processors Reinforced PhaseMaterial Change for Thermal Interface Material Hi-Flow 225 F-AC (HF225 F-AC) is designed as a foil-reinforced, adhesive backed version of HF225 F. HF225 F-AC is a high performance, thermal interface material for use between a computer processor and a heatsink. HF225 F-AC consists of a soft, thermally conductive 55oC phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heatsink. Typical Properties of Hi-Flow 225 F-AC Physical Property Color Total Thickness Aluminum Foil Thickness Phase Change Temperature Continuous Use Temperature Thermal Thermal Conductivity (2) Typical Value Black 0.004 inch 0.0015 inch 131 oF 248 oF Material Hi-Flow Adhesive Metric Value Black 0.102 mm 0.038 mm 55 oC 120 oC Value 1.0 W/m-K 0.7 W/m-K Test Method Visual ASTM D374 ASTM D374 DSC TGA Kinetics ASTM D5470 Thermal Impedance vs Pressure Heat Sink Microprocessor HF225 F-AC, above the 55oC phase change temperature, wets out the thermal interface surfaces and flows to produce the lowest thermal impedance. HF225 FAC requires pressure from the assembly to cause material flow. The Hi-Flow coatings will not drip in vertical orientation. Bergquist suggests the use of spring clips, or the like, to assure constant pressure on the interface. Minimal thermal performance gains are seen with increasing interfacial pressures above 50 psi. HF225 F-AC is available in roll form with kiss-cut parts. The material as delivered will include a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact Product Management for applications that are less than 0.7" square. 25 0.68 50 0.57 100 0.50 200 0.45 0.10 0.09 0.08 0.07 HI-FLOW(R) Hi-Flow 225 F-AC Adhesive Side (Top) Dry Side (Bottom) Pressure, psi TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, (1) o C-in2 / W 1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was conditioned at 60 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 2). This is the measured thermal conductivity of the Hi-Flow coating only (per Bergquist Modified ASTM-D5470). The lamination typically includes a base layer of 1.5 mil aluminum foil with a top coating of 2-mil Hi-Flow compound and bottom coating of 2-mil adhesive compound. The Hi-Flow coatings are phase-change, thixotropic compounds and thus respond via compressive flow to heat and pressure induced stress. Knowing the average final thickness of the interface, the overall apparent thermal conductivity of the laminate can be estimated via back-calculation (ref: L = K ) of the Bergquist Modified ASTM-D5470 test results stated. This statement assumes negligible interfacial thermal resistance. Please contact your Bergquist Sales Representative or Bergquist Inside Sales if additional specifications are required. Application Methods: HF225 F-AC roll form piece parts can be manually or automatically applied to the surfaces of room temperature heat sinks. The adhesive side (or bottom side) of the HF225 F-AC pad will adhere with low level tack to a heat sink surface. See Product Management for additional information concerning automated dispensing applications. Rev: October 10, 2001 Hi-Flow(R): U.S. Patent 4,950,066 and others. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers' and manufacturers' only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use and the user assumes all risks and liability whatsoever in connection therewith NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE 25 Hi-Flow 225-U 225U Hi-FlowTM (R) Non-Reinforced Phase Change Thermal Interface Material Thermal Interface Material for High Performance Computer Processors Hi-Flow 225-U is designed as a thermal interface material between a computer processor and a heat sink. Hi-Flow 225-U is a thermally conductive phase change material supplied on carrier liner. The product consists of a thermally conductive 55oC phase change compound coated on red release liner. Hi-Flow 225-U is available in tab parts. See the diagram below. Typical Properties of Hi-Flow 225-U Typical Value Test Method Black 0.0015" / 0.036mm 55 oC / 132oF 150 oC / 212 oF Visual ASTM D374 DSC Physical Property Color Thickness Phase Change Temperature Continuous use Temp. Electrical Flame Rating Pending Thermal Thermal Conductivity HI-FLOWTM Heat Sink Hi-Flow 225-U Power Device Hi-Flow 225-U, above its phase change temperature, wets out the thermal interface surfaces and flows to produce the lowest thermal impedance. Hi-Flow 225-U requires pressure of the assembly to cause flow. Hi-Flow 225-U coatings will not drip. Hi-Flow 225-U is available in roll form with kiss-cut parts. Hi-Flow 225-U is limited to a square or rectangle parts design. Dimensional tolerance is +/- 0.020 inch or 0.5mm. The Hi-Flow 225-U soft layer prohibits the availability of a hole being punched. The unsupported construction prohibits the availability of a space between the parts on the roll. Please contact your Bergquist Sales Representative or Bergquist Inside Sales if additional specifications are required. 1.0 W/m-K ASTM D5470 Thermal Impedance vs. Pressure Pressure (psi) 10 TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 0.53 25 0.47 50 0.39 100 0.34 200 0.32 0.08 0.07 0.06 0.05 0.04 1). The ASTM D5470 (Bergquist Modified) test fixture was used and the test sample was conditioned at 60 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Bergquist suggests the use of spring clips, or the like, to assure constant pressure on the interface. Minimal thermal performance gains are seen with increasing interfacial pressures above 50 psi. Application Methods: Hand-apply to 35-45 C heat sink. The heat sink is heated in an oven or via heat gun to between 35 - 45 C, and then the HF 225-U part is applied like an adhesive pad. The heat sink is cooled to room temperature and packaged. Protective tab liner remains in place until unit is it is ready for final assembly. Protective tab can be readily removed from the applied HF 225-U pad at a maximum temperature of 28 C. Automated equipment with 30-psi pressure. A pick and place automated dispensing unit can be used to apply the HF 225-U pad to a room temperature heat sink. The placement head should have a silicone rubber pad, and should apply approximately 30-psi pressure to the pad on transfer to the 25 - 35 C heat sink. Once applied, the protective tab can be readily removed from the HF 225-U pad at a maximum temperature of 28 C. HF 225-U kiss cut parts PSA Red Tab Hi-Flow(R): U.S. Patent 4,950,066 and others. Cross Sectional View Clear adhesive strip carrier liner Rev: Aug 10, 2001 www.bergquistcompany.com 26 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Hi-Flow Hi-FlowTM 225UT 225UT (R) Non-Reinforced Pressure Pressure Sensitive Sensitive Phase Phase Change Change Thermal Thermal Interface Interface Material Non-Reinforced Thermal Interface Material for High Performance Processors Hi-Flow 225UT is designed as a pressure sensitive, thermal interface material for use between a high performance processor and a heat sink. Hi-Flow 225UT is a thermally conductive, inherently tacky, 55 oC phase change composite. HF225UT is supplied on a polyester carrier liner. Hi-Flow 225UT is available with high visibility protective tabs. Heat Sink Typical Properties of Hi-Flow 225-UT Physical Property Color Total Thickness Phase Change Temperature Continuous Use Temperature Typical Value Black 0.003 inch Metric Value Black 0.077 mm Test Method Visual 131 oF 55 oC DSC 248 oF 120 oC TGA Kinetics 0.7 W/m-K 0.7 W/m-K ASTM D5470 ASTM D374 Thermal Hi-Flow 225UT Thermal Conductivity (2) Thermal Impedance vs Pressure Pressure, psi 10 25 50 100 200 TO-220 Thermal Performance, C/W 0.60 0.53 0.46 0.40 0.35 Thermal Impedance Per ASTM D5470, o C-in2 / W (1) 0.09 0.08 0.07 0.06 0.05 o Hi-Flow 225UT, above its phase change temperature, wets out the thermal interface surfaces and flows to produce the lowest thermal impedance. Hi-Flow 225UT requires pressure of the assembly to cause flow. HiFlow 225UT coatings will not drip. Application Methods: Hand-apply HF 225UT to a room temperature heat sink. The HF 225UT pad exhibits inherent tack and can be hand-applied similar to an adhesive pad. The tab liner can remain on the heat sink and pad throughout shipping and handling until is it is ready for final assembly. HI-FLOW(R) Power Device 1). The ASTM D5470 (Bergquist Modified) test fixture was used with the material sample conditioned at 60 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application thermal performance using Hi-Flow, thin film interface materials is primarily controlled via surface "wet-out" and material "bond-line" or thickness. Within the application, these are directly related to surface roughness, flatness and pressure applied. Competitive "side by side" thermal performance summaries are available upon request. Please contact your Bergquist Sales Representative for additional information and summaries. 2). This is the measured thermal conductivity of the Hi-Flow coating. Since the Hi-Flow coating is a phase change compound, it will respond to heat and pressure induced stresses. The overall thermal conductivity of post-phase change Hi-Flow material is highly dependent upon the heat and pressure applied. These characteristics are not accounted for in ASTM D5470. To request additional information, please contact your Bergquist Sales Representative. HF 225UT Roll-Form, Kiss-Cut Parts Clear/Colored Protective Tab Clear Polyester Carrier Liner www.bergquistcompany.com "Quick-Snap" High Visibility Tab for Removal Adhesive Strip The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Note: Bergquist suggests the use of spring clips to assure constant pressure on the interface. Spring pressure as low as 10 to 20 psi will ensure complete "wet-out" of the interface material. Hi-Flow(R): U.S. Patent 4,950,066 and others. July 17, 2001 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 27 Hi-Flow 625 Hi-FlowTM 625 (R) Electrically Insulating, Thermally Conductive Phase Change Material Bergquist Hi-Flow 625 (HF 625) is a film reinforced phase change material. The product consists of a thermally conductive 65 oC phase change compound coated on Bergquist T-600 film. HF 625 is designed to be used as a thermal interface material between electronic power devices which require electrical isolation and a heat sink. The T-600 reinforcement makes HF 625 easy to handle, and the 65 oC phase change temperature of the coating material eliminates shipping and handling problems. Bergquist T-600 film has a continuous use temperature of 150 oC. Typical Properties of Hi-Flow 625 Physical Property Typical Value Test Method Green 0.005" 30 Kpsi 60% 65 oC 150 oC Visual ASTM D374 ASTM D882A ASTM D882A DSC 4000 volt 3.5 > 1010 94 V-O ASTM D149 ASTM D150 ASTM D257 U.L. 70 g/in 25 g/in ASTM D1876 ASTM D1876 Color Thickness Tensile Strength Elongation Phase Change Temperature Continuous use Temp. Electrical Breakdown Voltage Dielectric Constant, 100Hz Volume Resistivity, Ohm-meter Flame Rating HI-FLOW(R) Adhesive Peel Strength Release Peel Heat Sink Hi-Flow 625 Thermal Thermal Conductivity (2) Hi-Flow T-600 1.0 W/m-K 0.16 W/m-K ASTM D5470 Thermal Impedance vs. Pressure Power Device (R) HF 625 handles like a Sil-Pad at room temperature, and flows like high quality grease at elevated temperature. HF 625 is Tack Free and Scratch Resistant at production temperature and does not require a protective liner in most shipping situations. HF 625 has the thermal performance of 23 mil mica and grease assemblies. HF 625 is available in punch parts, sheets or rolls, with or without pressure sensitive adhesive. Pressure (psi) 10 TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 2.26 25 2.10 50 2.00 100 1.93 200 1.87 0.79 0.71 0.70 0.67 0.61 1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was conditioned at 70 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 2). This is the measured thermal conductivity of the Hi-Flow coating only (per Bergquist Modified ASTM-D5470). This compound is equally coated to both surfaces of Bergquist's T-600 film carrier. This lamination typically includes two layers (one to each side) of 2-mil Hi-Flow compound coated to 1.0-mil T-600 film. The Hi-Flow coatings are phase-change, thixotropic compounds and thus respond via compressive flow to heat and pressure induced stress. Knowing the average final thickness of the interface, the overall apparent thermal conductivity of the laminate can be estimated via back-calculation (ref: L = K ) of the Bergquist Modified ASTM-D5470 test results stated. This statement assumes negligible interfacial thermal resistance. Please contact your Bergquist Sales Representative or Bergquist Inside Sales if additional specifications are required. Hi-Flow(R): U.S. Patent 4,950,066 and others. Rev: Sept. 24, 2001 www.bergquistcompany.com 28 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Hi-FlowTM 818 Hi-Flow 818 (R) Electrically Insulating, Isolating, Thermally Electrically ThermallyConductive ConductivePhase PhaseChange ChangeMaterial Material Hi-Flow 818 is a film reinforced phase change material. The product consists of a thermally conductive 65oC phase change compound coated on a 150oC continuous use temperature thermally conductive film. Hi-Flow 818 is available with and without pressure sensitive adhesive. HiFlow 818 is typically used as a thermal interface material between electronic power devices that requires electrical isolation to its heat sink. The film reinforcement makes the Hi-Flow 818 easy to handle, and 65oC phase change temperature eliminates shipping and handling problems. Typical Properties of Hi-Flow 818 Physical Property Color Thickness Tensile Strength Elongation Phase Change Temperature Continuous use Temp. Breakdown Voltage Dielectric Constant, 100Hz Volume Resistivity, Ohm-meter Flame Rating Mauve 0.0055" 25 Kpsi 82% 65 oC 150 oC Visual ASTM D374 ASTM D882A ASTM D882A DSC 4000 volt 3.5 > 1010 (pending) ASTM D149 ASTM D150 ASTM D257 U.L. Hi-Flow T-800 1.0 W/m-K 0.25 W/m-K HI-FLOW(R) Thermal ASTM D5470 Thermal Impedance vs. Pressure Pressure (psi) Hi-Flow 818 Test Method Electrical Thermal Conductivity (2) Heat Sink Typical Value 10 TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 2.05 25 1.85 50 1.71 100 1.62 200 1.57 0.73 0.69 0.63 0.60 0.56 Power Device Application Notes: 1. Best thermal results are obtained using a spring clip for attachment. 2. In screw mount applications we suggest wave or other type of spring washer to maintain pressure between device and the heat sink. 3. If the spring washers are not used in screw mount assembly, then use a thread lock to prevent screw from vibrating out. 1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was conditioned at 70 oC prior to test. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 2). This is the measured thermal conductivity of the Hi-Flow coating only (per Bergquist Modified ASTM-D5470). This compound is equally coated to both surfaces of Bergquist's T-800 film carrier. This lamination typically includes two layers (one to each side) of 2-mil Hi-Flow compound coated to 1.0-mil T-800 film. The Hi-Flow coatings are phase-change, thixotropic compounds and thus respond via compressive flow to heat and pressure induced stress. Knowing the average final thickness of the interface, the overall apparent thermal conductivity of the laminate can be estimated via back-calculation (ref: L = K ) of the Bergquist Modified ASTM-D5470 test results stated. This statement assumes negligible interfacial thermal resistance. Please contact your Bergquist Sales Representative or Bergquist Inside Sales if additional specifications are required. Hi-Flow(R): U.S. Patent 4,950,066 and others. Rev: October 1, 2001 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 29 Frequently Asked Questions is the ASTM D5470 test modified to characterize Phase Change Thermal Performance? QHow uses the Anter Quickline 10 to characterize our ASTM D5470 test results. The method is modified to condition the phase ABergquist change material to 5 C over the stated phase change temperature. HI-FLOW(R) Understanding that time is also a key variable for material displacement or flow, the over-temperature conditioning is limited to 10 minutes and then allowed to cool, prior to initiating the actual test at the given pressure. The 10-minute time period has been demonstrated to be an acceptable time period for the thermal mass inherent in the Anter setup. Note: Actual application testing may require more or less time to condition, depending upon the heat transfer and thermal mass associated. The performance values are recorded and published at 10, 25, 50, 100, 200 and 500 psi to give the designer a broad-based understanding of our products' performance. Reference the original ASTM application note here. Is the Hi-Flow material re-workable? Q the material has not gone through phase change, the material readily release from the device surface. For this situation, AIfwill the Hi-Flow material will not likely have to be replaced. If the material has gone through the phase change, the material will adhere very well to both surfaces. In this case, Bergquist suggests warming the heat sink to soften the Hi-Flow compound. This allows for easier removal from the processor. In this case, Bergquist suggests replacement with a new piece of Hi-Flow material. What is meant by easy to handle in manufacturing? Q insulated Hi-Flow products are manufactured with inner film support. This film stiffens the material, allowing parts to be more AOur readily die-cut as well as easier to handle. This also allows for ease is the minimum pressure required to optimize the thermal of manual or automated assembly. performance of the Hi-Flow material? QWhat achieving phase change temperature (i.e. pre-conditioning), What is meant by tack free? And why is this important? Bergquist has demonstrated that 10 psi provides adequate pressure AUpon Q to achieve exceptional thermal performance. Bergquist continues to of our Hi-Flow materials have no surface task at room temperresearch lower pressure wet-out characteristics in an effort to minimize ature. The Softer materials will pick up dirt more readily. Softer AMany interfacial losses associated with ultra-thin material interfaces. resins are more difficult to clean if any dirt is on the surface. If you Will the Hi-Flow replace a mechanical fastener? Q fasteners are required. Bergquist recommends the use of spring clips to maintain consistent pressure over time. AMechanical Can I use screw mount devices with Hi-Flow material? Q works best with a clip or spring washer mounted assembly. The continuous force applied by these devices allows the Hi-Flow AHi-Flow material to flow and reduce the cross sectional gap. Bergquist suggests that design engineers evaluate whether a screw mount assembly will have acceptable performance. See TO-220 Technical Note. Is the adhesive in Hi-Flow 225F-AC repositionable? Q try to rub the dirt away, the dirt is easily pushed into the soft phase change materials. Our Hi-Flow coatings are typically hard at room temperature rendering them easier to clean off without embedding dirt. What does more scratch resistance mean on Hi-Flow 625? Q A Our Hi-Flow 625 does not require a protective film during shipment. There are two issues with competitors' materials: 1. Melt point of the material is low enough that it can go through phase change in shipment and be very tacky. Bergquist Hi-Flow has a higher phase change temperature and remains hard to a higher temperature. It can be shipped much like our SoftFace material. 2. The Hi-Flow material is harder and is not as easy to scratch or dent in shipping and handling. Why is our product phase change temperature 65 C? Q 65 C phase change temperature was selected for two reasons. adhesive in the current construction does adhere more to the heat First, it was a low enough temperature for the phase change to occur AThe sink aluminum than to the Hi-Flow material. There is the potential AThe in applications. Second, it would not phase change in transport. that the adhesive will be removed by the heat sink surface when it is removed to reposition on the heat sink. Time and/or pressure will increase the bond to the aluminum increasing the potential for the adhesive to adhere to the heat sink. Bergquist studies show that shipping containers can reach 60 C in domestic and international shipments. The higher phase change temperature eliminates the possibility of a product being ruined in shipment. We offer a standard line of Hi-Flow 225 series products with 55 C phase change for those customers wanting the lower phase change temperature. any surface preparation required before applying the adheHi-Flow to the heat sink? QIssivetherebacked electronics industry cleaning procedures apply. Remove dirt What applications should I avoid using Hi-Flow? or other debris. Best results are attained when the Hi-Flow material AStandard Q is applied to heat sink at a temperature of 25 +/- 10 C. If the heat sink has been surface treated (i.e. anodized or chromated), it is typically ready for assembly. For bare aluminum, mild soap and water wash cleaning processes are typically used to eliminate machine oils and debris. 30 Applications where the device will not reach operation at above phase change temperature. Applications where the operating temperature exceeds the maximum recommended operating temperature of the compound. A Sterling TIC-7500-7500 TM Thermal Interface Compound Thermal Interface Material for High Performance Computer Processors Sterling-7500 is a thermally conductive grease compound and is designed as a thermal interface material between a computer processor and a heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of Sterling7500. Typical Properties of Sterling-7500 Property Typical Value Color Density (Grams/cc or Grams/ml) Viscosity at 25 C 2 RPM 10 RPM Continuous Use Temp. Test Method Gray 4.0 cps 500,000 150,000 100oC Visual ASTM D374 Viscometer TGA Kinetics Electrical Electrical Resistivity Thermal Sterling-7500 compound wets out the thermal interface surfaces and flows to produce the lowest thermal impedance. The Sterling-7500 compound requires pressure of the assembly to cause flow. The Sterling-7500 compound will not drip. Sterling-7500 has a patented technology. For a typical 0.5 x 0.5-inch application at 0.005 inches thick, Bergquist estimates approximately 0.02 ml (cc) of Sterling-7500. Although Bergquist estimates a 0.02 ml (cc) volumetric requirement for a 0.5 x 0.5-inch component interface, dispensed at a thickness of 0.005 inches, Bergquist also recognizes that an optimized application would utilize the minimum volume of Sterling-7500 material necessary to ensure complete wet-out of both mechanical interfaces. ASTM D257 .035 C-in2/W >7.5 W/m-K ASTM D5470 ASTM D5470 C/W Bergquist thermal Test Set Up 0.25 0.45 0.65 0.60 Application Cleanliness: 1. Pre-clean heatsink and component interface with Isopropyl Alcohol prior to assembly or repair. Application Methods: 1. Dispense the Sterling-7500 compound onto the processor or heat sink surface like thermal grease. 2. Assemble the processor and heat sink with clip or screws Environmental Testing: Sterling-7500 compound has been exposed to the following environmental conditions without loss of thermal performance. > 500 h at 125 C > 500 h at 85 RH/85 C > 500 cycles -55/125 C Pass Pass Pass Sterling-7500 is typically supplied in 1-milliliter syringes. Please contact your local Bergquist representative for additional packaging information. SterlingTM: Patent issuing 1-2002 SER. NO. 09/543661. Rev: October 10, 2001 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 31 STERLINGTM For microprocessor applications, traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of Sterling-7500. Thermal Impedance Thermal Conductivity Thermal Impedance T0-220 @ 50 psi Sterling-7500 HF 225 HF 200 U Dow 340 Grease >1.0 X10 E10 W-cm-1 Sil-Pad(R) Thermally Conductive Insulators SOLUTION-DRIVEN THERMAL MANAGEMENT PRODUCTS FOR ELECTRONIC DEVICES Comprehensive choices for a cleaner and more efficient thermal interface More than 20 years ago, Bergquist set the standard for elastomeric thermal interface materials with the introduction of Sil-Pad. Today, Bergquist is a world leader with a complete family of Sil-Pad materials to meet the critical needs of a rapidly changing electronics industry. Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Bergquist application specialists work closely with customers to specify the proper Sil-Pad material for each unique thermal management requirement. FEATURES BENEFITS OPTIONS APPLICATIONS The Sil-Pad family encompasses dozens of products, each with its own unique construction, properties and performance. Here are some of the important features offered by the Sil-Pad family. Choosing Sil-Pad thermal products saves time and money while maximizing an assembly's performance and reliability. Specifically: Some Sil-Pad products have special features for particular applications. Options include: * Excellent thermal performance * Aluminum foil or imbedded graphite construction for applications not requiring electrical insulation The large family of Sil-Pad thermally conductive insulators is extremely versatile. In today's marketplace, Sil-Pads are used in virtually every component of the electronics industry, including: SIL-PAD(R) * Binders of proven silicone rubber * Fiberglass, dielectric film or polyester film carriers * Eliminates the mess of grease * More durable than mica * Less costly than ceramic * Available with or without adhesive * Copper shield layer * Interface between a power transistor, CPU or other heat-generating component and a heat sink or rail * Special fillers to achieve specific performance characteristics * Resistant to electrical shorting * Easier and cleaner to apply * Polyester binder material for silicone sensitive applications * Flexible and conformable * Smooth and textured surfaces * Under time and pressure, thermal resistance will decrease * Polyester film carrier for increased voltage breakdown * Reinforcements to resist cut-through * Better performance for today's high-heat compacted assemblies * Materials with reduced moisture sensitivity * Variety of thicknesses * A specific interfacial performance that matches the need * Available in rolls, sheets, tubes and custom die-cut parts * Consumer electronics * Efficient "total applied cost" that compares favorably with other alternatives * Custom thicknesses and constructions * Telecommunications * Wide range of thermal conductivities and dielectric strengths * Isolate electrical components and power sources from heat sink and/or mounting bracket * Interface for discrete semiconductors requiring low pressure spring clamp mounting * Automotive systems * Aerospace * Military * Medical devices * Industrial controls 32 Sil-Pad(R) Comparison Data TO-220 THERMAL PERFORMANCE Sil-Pad Material Low Pressure TO-220 Thermal Performance Sil-Pad High Dielectric Materials TO-220 Thermal Performance 4.00 7.00 Sil-Pad 400 .007 Sil-Pad 900S Sil-Pad 900S Sil-Pad 1500 Sil-Pad 2000 .020 Sil-Pad 800 3.50 6.00 Sil-Pad A1500 Sil-Pad 2000 .015 Thermal Performance, C/W Thermal Performance, C/W Sil-Pad 2000 .010 5.00 4.00 3.00 2.50 2.00 1.50 2.00 1.00 3.00 1.00 10 25 50 100 10 200 25 50 100 200 Interface Pressure, psi Interface Pressure, psi Bonding Materials TO-220 Thermal Performance Sil-Pad Thin Film Materials TO-220 Thermal Performance 6.50 4.00 Bond-Ply 100 .011 K-4 Bond-Ply 100 .008 K-6 Bond-Ply 660 6.00 K-10 Bond-Ply 100 .005 3.50 SIL-PAD(R) Thermal Performance, C/W Thermal Performance, C/W 5.50 3.00 2.50 5.00 4.50 4.00 3.50 2.00 3.00 1.50 2.50 10 25 50 Interface Pressure, psi 100 200 10 25 50 100 200 Interface Pressure, psi 33 The Bergquist Company established the standard for elastomeric thermally conductive insulation materials with the development of Sil-Pads(R) over 20 years ago. Sil-Pads were developed as a clean, grease-free alternative to mica and grease. Now, a complete family of materials is available to meet the diverse and changing requirements of today's design engineer. MICA AND GREASE Mica insulators have been in use for over 30 years and are still commonly used as an insulator. Mica is inexpensive and has excellent dielectric strength, but it is brittle and is easily cracked or broken. Because mica used by itself has high thermal impedance, thermal grease is commonly applied to it. The grease flows easily and excludes air from the interface to reduce the interfacial thermal resistance. If the mica is also thin (2-3 mils), (50-80 m), a low thermal impedance can be achieved. However, thermal grease introduces a number of problems to the assembly process. It is time-consuming to apply, messy, and difficult to clean. Once thermal grease has been applied to an electronic assembly, solder processes must be avoided to prevent contamination of the solder. Cleaning baths must also be avoided to prevent wash-out of the interface grease, causing a dry joint and contamination of the bath. Assembly, soldering and cleaning processes must be performed in one process while the greased insulators are installed off-line in a secondary process. If the grease is silicone based, migration of silicone molecules occurs over time, drying out the grease and contaminating the assembly. Silicone migration onto electrical contacts can result in pitting of the contacts and loss of electrical conductance. For this reason, silicone based thermal grease has not been used in telecommunications systems. Why Choose Sil-Pad(R) Thermally Conductiv POLYIMIDE FILMS SIL-PAD(R) Polyimide films can also be used as insulators and are often combined with wax or grease to achieve a low thermal impedance. These polyimide films are especially tough and have high dielectric strength. (R) Sil-Pad K-4, K-6 and K-10 incorporate polyimide film as the carrier material. CERAMIC INSULATORS Other insulation materials include ceramic wafer insulators which have higher thermal conductivity than mica. They are often used thicker (20-60 mils), (.5 to 1.5 mm) to reduce capacitive coupling while maintaining a low thermal impedance. Drawbacks to ceramic insulators are high cost and they are rigid like mica and crack easily. Also, ceramic beryllia use requires careful handling since inhalation of beryllia dust can cause lung inflammation (berylliosis). At Bergquist's Cannon Falls, MN, manufacturing facility, a Sil-Pad material runs through a 3-story coating press. 34 SIL-PAD(R) MATERIALS SIL-PAD(R) CONSTRUCTION Sil-Pad Thermally Conductive Insulators are designed to be clean, grease-free and flexible. The combination of a tough carrier material such as fiberglass and silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. Sil-Pads minimize the thermal resistance from the case of a power semiconductor to the heat sink. Sil-Pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough enough to resist puncture by the facing metal surface. With more than 30 different Sil-Pad materials available there is a Sil-Pad matched to almost any application. Sil-Pads are constructed with a variety of different materials including fiberglass, silicone rubber, polyimide film, polyester film and fillers used to enhance performance. Sil-Pads are typically constructed with an elastomeric binder compounded with a thermally conductive filler coated on a carrier. The characteristics of your application often determine which Sil-Pad construction will produce the best performance. ve Insulators? FILLERS Most Sil-Pad products use silicone rubber as the binder. Silicone rubber has a low dielectric constant, high dielectric strength, good chemical resistance and high thermal stability. The thermal conductivity of Sil-Pad products is improved by filling them with ingredients of high thermal conductivity. The fillers change the characteristics of the silicone rubber to enhance thermal and/or physical characteristics. Silicone rubber also exhibits cold flow, which excludes air from the interface as it conforms to the mating surfaces. This flow eliminates the need for thermal grease. A rough surface textured insulator needs to flow more to exclude air than a smooth one. The smoother pads also need less pressure to wet out the surfaces and obtain optimum thermal contact. CARRIERS The carrier provides physical reinforcement and contributes to dielectric strength. High dielectric and physical strength is obtained by using a heavy, tight mesh, but thermal resistance will suffer. A light, open mesh reduces thermal resistance, dielectric strength and cut-through resistance. The carrier materials used in Sil-Pad materials include fiberglass, dielectric film and polyester film which is used in Poly-Pad(R) materials. SIL-PAD(R) BINDERS For instance, some fillers make the silicone rubber hard and tough while still retaining the ability to flow under pressure. A harder silicone helps the material resist cut-through. In other applications a filler is used to make the silicone rubber softer and more conformable to rough surfaces. While the range in thermal resistance of greased mica is quite large, the average is comparable to elastomeric insulators filled with a blend of the appropriate ingredients. * Fiberglass based insulators (Sil-Pad(R) 400 and Sil-Pad(R) 1500) have a rough surface texture and will show a 15-20% decrease in thermal resistance over a 24 hour period. Film based Sil-Pads (Sil-Pad(R) K-4, Sil-Pad(R) K-6 and Sil-Pad(R) K-10) are smoother initially and show a 5% decrease over the same period of time. 35 Choosing the Right Sil-Pad Starts with the M MOUNTING TECHNIQUES AND MOUNTING PRESSURE Typical mounting techniques include: * A Spring clip, which exerts a centralized clamping force on the body of the transistor. The greater the mounting force of the spring, the lower the thermal resistance of the insulator * A screw in the mounting tab. With a screw mounted TO-220, the force on the transistor is determined by the torque applied to the fastener MECHANICAL PROPERTIES Woven fiberglass and films are used in Sil-Pads to provide mechanical reinforcement. The most important mechanical property in Sil-Pad applications is resistance to cut-through to avoid electrical shorting from the device to the heat sink. SIL-PAD(R) * Sil-Pad(R) K-4, Sil-Pad(R) K-6 and Sil-Pad(R) K-10 are very good at resisting cut-through from sharp burrs left on heat sinks after machining operations such as drilling and tapping * Fiberglass is good at resisting the type of cut-through encountered when device mounting flanges are pulled into oversized mounting holes. This occurs when fasteners are torqued. (Sil-Pad(R) 400 and Sil-Pad(R) 2000) Cut-through resistance is very dependent on the application and depends on several factors: * A very sharp burr may cause cut-through with less than 100 pounds while a blunt burr may require several hundred pounds to cause cut-through * When two flat parallel surfaces are brought together on a Sil-Pad, over 1000 pounds of force can be applied without damaging the insulator * The Poly-Pad insulators are the most mechanically durable Sil-Pads overall. The polyester resin used has a higher modulus than silicone rubber. (Poly-Pad(R) 400, Poly-Pad(R) 1000, Poly-Pad(R) K-4 and Poly-Pad(R) K-10) 36 In extremely low pressure applications, an insulator with pressure sensitive adhesive on each side may give the lowest thermal resistance since the adhesive wets out the interface easier than the dry rubber. This decreases the interfacial thermal resistance. Devices with larger surface areas need more pressure to get the insulator to conform to the interface than smaller devices. In most screw mount applications, the torque required to tighten the fastener is sufficient to generate the pressure needed for optimum thermal resistance. There are exceptions where the specified torque on the fastener does not yield the optimum thermal resistance for the insulator being used and either a different insulator or a different mounting scheme should be used. Interfacial thermal resistance decreases as time under pressure increases. In applications where high clamping forces cannot be used, time can be substituted for pressure to achieve lower thermal resistance. The only way to know precisely what the thermal resistance of an insulator will be in an application is to measure it in that application. Mechanical and Electrical Properties ELECTRICAL PROPERTIES If your application does not require electrical insulation, Q-Pad(R) II or Q-Pad(R) 3 are ideal grease replacement materials. These materials do not isolate but have excellent thermal properties. Hi-Flow phase change materials should also be considered for these applications. (Reference pages 20-30 of this guide.) The most important electrical property in a typical assembly where a Sil-Pad insulator is used is dielectric strength. In many cases the dielectric strength of a Sil-Pad will be the determining factor in the design of the apparatus in which it is to be used. * Breakdown voltage decreases as the area of the electrodes increases. This area effect is more pronounced as the thickness of the insulator decreases * Breakdown voltage decreases as temperature increases * Breakdown voltage decreases as humidity increases (Sil-Pad(R) 1750 is less sensitive to moisture) * Breakdown voltage decreases in the presence of partial discharge * Breakdown voltage decreases as the size of the voltagesource (kVA rating) increases Here are some general guidelines regarding electrical properties to consider when selecting a Sil-Pad material; * Breakdown voltage can be decreased by excessive mechanical stress on the insulator * Q-Pad II and Q-Pad 3 are used when electrical isolation is not required * Dielectric breakdown voltage is the total voltage that a dielectric material can withstand. When insulating electrical components from each other and ground, it is desirable to use an insulator with a high breakdown voltage Dielectric strength, dielectric constant and volume resistivity should all be taken into consideration when selecting a Sil-Pad material. If your application requires special electrical performance please contact the factory for more detailed testing information. TYPICAL ELECTRICAL PROPERTIES OF SIL-PADS(R) Dielectric Strength (kV) (Volts/mil) (kV/mm) Material Dielectric Constant Volume Resistivity (Ohm-Metre) Sil-Pad 400(R) -.007 5 700 18 5.5 1 01 1 Sil-Pad 400(R) -.009 7 800 20 5.5 1 01 1 Sil-Pad 1000(R) 7 700 18 4.5 1 01 1 Sil-Pad 2000(R) 12 800 20 4.0 1 01 1 Sil-Pad K-4(R) 7 1200 30 5.0 1 01 2 Sil-Pad K-6(R) 7 1200 30 4.0 1 01 2 Sil-Pad K-10(R) 7 1200 30 3.7 1 01 2 Test MethodASTM D 149* ASTM D 149* ASTM D 257 SIL-PAD(R) Breakdown Voltage ASTM D 150 37 Sil-Pad(R) Thermal Properties Sil-Pad Thermal Performance Overview (TO-220 test at 50 psi) 6.00 5.14 Thermal Performance, C/W 5.00 4.00 3.13 2.90 3.00 2.76 2.68 2.45 2.21 2.01 2.01 2.00 1.76 1.23 1.00 0.00 00 000 500 00S 00 1500 ad 8 ad 1 ad 9 ad 4 ad A Sil-Pad 2 S il- P S il- P S il- P S il- P 0 0 7 S il- P 5 .0 1 . K -4 K -6 K -1 0 Q2 Q3 Bergquist Material HOW THERMAL PROPERTIES AFFECT YOUR SELECTION SIL-PAD(R) The thermal properties of a Sil-Pad material and your requirements for thermal performance probably have more to do with your selection of a Sil-Pad than any other factor. Discrete Semiconductors, under normal operating conditions, dissipate waste power which raises the junction temperature of the device. Unless sufficient heat is conducted out of the device, its electrical performance and parameters are changed. A 10 C rise in junction temperature can reduce the mean-time-to-failure of a device by a factor of two. Also, above 25C, the semiconductor's total power handling capability will be reduced by a derating factor inherent to the device. The thermal properties of Sil-Pad products are thermal impedance, thermal conductivity and thermal resistance. The thermal resistance and conductivity of Sil-Pad products are inherent to the material and do not change. Thermal resistance and thermal conductivity are measured per ASTM D5470 and do not include the interfacial thermal resistance effects. Thermal impedance applies to the thermal transfer in an application and includes the effects of interfacial thermal resistance. As the material is applied in different ways the thermal impedance values will vary from application to application. 38 * The original Sil-Pad material, Sil-Pad(R) 400 continues to be Bergquist's most popular material for many applications. * Sil-Pad(R) 1500 is chosen when more thermal performance is required. Sil-Pad(R) A2000 is ideal for high performance, high reliability applications. Beyond these standard materials many things can contribute to the selection of the correct material for a particular application. Questions regarding the amount of torque and clamping pressure are often asked when selecting a Sil-Pad material. Here are some guidelines: * Interfacial thermal resistance decreases as clamping pressure increases. * The clamping pressure required to minimize interfacial thermal resistance can vary with each type of insulator. * Sil-Pads with smooth surface finishes (Sil-Pad(R) 1500, Sil-Pad(R) 2000, Sil-Pad(R) K-4, Sil-Pad(R) K-6 and Sil-Pad(R) K-10) are less sensitive to clamping pressure than Sil-Pads with rough surface finishes (Sil-Pad(R) 400). Sil-Pad(R) Applications A common Sil-Pad application includes TO-220 transistors mounted in a row on a heat rail. The application above uses punched parts to insulate the transistors from the mounting bracket and a sheet of Sil-Pad to isolate the mounting brackets from the frame of the assembly. Two different Sil-Pad applications show clip mounting of transistors on the left and screw mounting of transistors to an aluminum bracket on the right. The circuit board below shows punched parts interfacing screw-mounted transistors to a finned heat sink. SIL-PAD(R) Gap Pad is applied to the top surface of heat generating components in this assembly. A heat sink mounted over the board dissipates heat. 39 Sil-Pad(R) Thermally Conducti Sil-Pad 400 .007 in Sil-Pad 400 .009 in Gray Gray Sil-Pad 800 Sil-Pad 900S Sil-Pad A1500 Sil-Pad A2000 Sil-Pad K-4 Pink Green White Gray .009 .001 (.23 .025) .010 .001 (.25 .025) .015 .001 (.38 .025) .006 .001 (.15 .025) 2.90 2.21 1.86 3.13 1.6 2.0 3.5 0.9 5500 6000 4000 6000 -60 to 180 N/A N/A -60 to 180 Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Fiberglass Silicone/ Film Gold Color Thickness Inches (mm) .007 .001 (.18 .025) .009 .001 (.23 .025) Thermal Impedance TO-220 Test @ 50 psi C/W 5.14 6.61 Thermal Conductivity W/m-K nominal 0.9 0.9 3500 4500 .005 .001 (.13 .025) 2.45 1.6 1700 Voltage Breakdown Vac -60 to 180 Continuous Use Temperature C Construction -60 to 180 Silicone/ Fiberglass -60 to 180 Silicone/ Fiberglass Silicone/ Fiberglass SIL-PAD(R) 800 SIL-PAD(R) 900-S SIL-PAD(R) K-4 * Sil-Pad K-4 uses a physically tough, thermally conductive, dielectric film and wellknown Sil-Pad rubber. * Designed for low cost applications requiring high thermal performance SIL-PAD(R) 400 * The original Sil-Pad material SIL-PAD(R) * Durable silicone rubber and fiberglass construction for excellent mechanical / physical characteristics * Fiberglass provides excellent cut-through resistance * Thermal performance improves with age * Non-toxic and resists damage from cleaning agents * Contact the factory for special thicknesses of Sil-Pad 400 * These applications also typically have low mounting pressures for component clamping * Sil-Pad 800-S material combines a smooth surface design with high thermal conductivity and electrical insulation * Applications include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips SIL-PAD(R) K-6 SIL-PAD(R) A1500 * Sil-Pad A1500 is a fiberglass reinforced material with enhanced thermal properties * Designed for high performance thermal applications while meeting specific cost considerations * Filled with special ingredients to improve thermalperformance * The film provides a continuous, physically tough dielectric barrier against "cut-through" SIL-PAD(R) A2000 SIL-PAD(R) K-10 * For high performance, high reliability military / aerospace and commercial applications * Sil-Pad A2000 complies with military standards * Special ingredients maximize thermal and dielectric performance 40 * Sil-Pad K-6 is a medium performance film based material * Highest thermal performance of the film based insulators. Minimum thickness helps lower thermal resistance * Designed to replace brittle, ceramic insulators: Beryllium Oxide, Boron Nitride and Alumina ive Insulator Selection Guide Sil-Pad K-6 Sil-Pad K-10 Q-Pad II Q-Pad 3 Poly-Pad 400 Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10 Bluegreen Beige Black Black Mauve Yellow Mauve Yellow .006 .001 (.15 .025) .006 .001 (.15 .025) .006 .001 (.15 .025) .005 (.15 mm) .0055 w/ac .009 .001 (.23 .025) .009 .001 (.23 .025) .006 .001 (.15 .025) .006 .001 (.15 .025) 2.76 2.01 1.23 1.76 5.13 3.74 4.34 2.75 1.1 1.3 2.5 2.0 0.9 01.2 0.9 1.3 6000 6000 N/A N/A 4500 2500 6000 6000 -60 to 180 -60 to 180 -60 to 180 -60 to 180 -20 to 150 -20 to 150 -20 to 150 -30 to 120 Silicone/ Film Silicone/ Film Silicone/ Alum Foil Silicone/ Fiberglass Polyester/ Fiberglass Polyester/ Fiberglass Polyester/ Film Polyester/ Film Bond-Ply 100 Visual White ASTM D 374 .005 .001 (.13 .025) ASTM D5470 3.48 ASTM D 5470 0.8 ASTM D 149 3000 -30 to 120 * Grease replacement material used where electrical insulation is not required * Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations * Q-Pad II can be installed prior to these operations. Q-Pad II also eliminates dust collection which can result in surface shorting or heat build-up Acrylic PSA/ Fiberglass Test Method BOND-PLY(R) 100 * Grease replacement material where electrical insulation is not required * Bergquist Bond-Ply is a thermally conductive, acrylic based PSA bonding material used to permanently mount a heat sink on top of a central processing unit * The material will adhere to the heat sink or integrated circuit with moderate heat (R) * Polyester based Poly-Pad 400, and pressure, forming a Poly-Pad(R) 1000, Poly-Pad(R) bond between components K-4 and Poly-Pad(R) K-10 * When exposed to modest heat and pressure, the elastomer conforms to surface textures thereby creating an air free interface between surfaces POLY-PAD(R) MATERIALS * Q-Pad 3 is fiberglass reinforced and withstands processing stresses without losing physical integrity * Designed for silicone sensitive applications SIL-PAD(R) SHIELD SIL-PAD(R) * Q-Pad II is a composite of .0015 in. aluminum foil coated on both sides with a .00225 in. thermally conductive coating - Q-PAD(R) 3 * Q-Pad 3 consists of graphite imbedded in a polymer matrix Q-PAD(R) II - * Ideally suited for applications * Bergquist Sil-Pad Shield is a bonded laminate of requiring conformal coatings thermally conductive, or applications where silicone electrically isolating Sil-Pad contamination is a concern 400 or Sil-Pad 1000 pads (telecommunications and with a copper shield between aerospace applications) the layers. It is supplied with a pretinned solder point for easy grounding 41 (R) Sil-Pad 400 (R) The Original Sil-Pad Material Sil-Pad 400 is the original Sil-Pad material. Sil-Pad 400 is a composite of silicone rubber and fiberglass. It is flame retardant and is specially formulated for use as a thermally conductive insulator. Primary use is to electrically isolate power sources from heat sinks. Typical Properties of Sil-Pad 400 Property Typical Value Color Thickness Specific Gravity Hardness (Shore Type A) Breaking Strength Elongation Tensile Strength Continuous Use Temp. Gray 0.007" 2.0 - 2.1 Gray 0.009" 2.0 - 2.1 85 85 Test Method 100 lbs./inch 100 lbs./inch 40% 40% 3 kPsi 3 kPsi -60C to 180C Visual ASTM D374 ASTM D792 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 Electrical Breakdown Voltage, minimum Dielectric Constant Volume Resistivity, Ohm-meter 3500 5.5 1011 TO-220 Thermal Performance, C/W @ Standard Thickness, inch o 2 Thermal Impedance, C-in / W (1) @ Standard Thickness, inch Sil-Pad 400 has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. Sil-Pad 400 actually improves its thermal resistance with age. The reinforcing fiberglass gives excellent cut-through resistance and Sil-Pad 400 is non-toxic and resists damage from cleaning agents. ASTM D149 ASTM D150 ASTM D257 0.007 6.62 0.009 8.51 0.007 1.82 Pressure (psi) 25 50 100 5.93 5.14 4.38 7.62 6.61 5.63 1.42 1.13 0.82 0.009 2.34 1.83 Thermal Impedance vs. Pressure o 4500 5.5 1011 10 1.45 1.05 200 3.61 4.64 0.54 0.69 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. SIL-PAD(R) OPTIONS Q-Pad II is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. MIL SPEC. MIL-M-38527/8A MIL-M-38527C MIL-I-49456 MIL-M-87111 U.L. FILE NUMBER E59150 FSCM NUMBER 55285 www.bergquistcompany.com 42 SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 1, and 2001 others. 4,602,678; 4,685,987; 4,842,911 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) Sil-Pad 800 800 (R) High Performance Insulator for Low Pressure Applications The Sil-Pad 800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. Typical Properties of Sil-Pad 800 Property Typical Value Test Method Gold 0.005" 20 12 MPa Visual ASTM D374 ASTM D412 ASTM D412 1.7 kVa-c 3.0 kVa-c 6 1010 ASTM D149 ASTM D149 ASTM D150 ASTM D257 1.6 W/m-K ASTM D5470 Color Thickness Elongation, %45 to warp & fill Tensile Strength Electrical Dielectric Breakdown Voltage Type 1 Electrodes Type 3 Electrodes Dielectric Constant Volume Resistivity, Ohm-meter Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) Sil-Pad 800 material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure. 25 50 100 200 3.56 3.01 2.45 2.05 1.74 0.92 0.60 0.45 0.36 0.29 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. OPTIONS Sil-Pad 800 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. SIL-PAD(R) Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 800 minimizes interfacial thermal resistance and maximizes thermal performance. TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 10, 2001 4,602,678; 4,685,987; 4,842,911 and others. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 43 (R) Sil-Pad 900S 900S (R) High Performance Insulator for Low Pressure Applications The Sil-Pad 900S family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. Typical Properties of Sil-Pad 900S Property Typical Value Test Method Mauve 0.009" 20 9 MPa Visual ASTM D374 ASTM D412 ASTM D412 5.5 kVa-c 8.3 kVa-c 6 1010 ASTM D149 ASTM D149 ASTM D150 ASTM D257 1.6 W/m-k ASTM D5470 Color Thickness Elongation, %45 to warp & fill Tensile Strength Electrical Dielectric Breakdown Voltage Type 1 Electrodes Type 3 Electrodes Dielectric Constant Volume Resistivity, Ohm-meter Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) SIL-PAD(R) Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure. Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance. TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 25 50 100 200 3.96 3.41 2.90 2.53 2.32 0.95 0.75 0.61 0.47 0.41 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. OPTIONS Sil-Pad 900S is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 10, 2001 4,602,678; 4,685,987; 4,842,911 and others. www.bergquistcompany.com 44 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) 950 Sil-Pad 950 (R) The Sil-Pad 900 family of thermally conductive insulation materials are designed for applications requiring high thermal performance. Typical Properties of Sil-Pad 950 Property Color Thickness Specific Gravity Tensile Strength 45 to Warp & Fill Breaking Strength Warp & Fill Tensile Elongation 45 to Warp & Fill Typical Value Test Method Mauve 0.009" 2.5 g/cm3 Visual ASTM D374 ASTM D792 1.6 kpsi ASTM D412 70x20 Lbs./inch ASTM D1458 20% ASTM D412 Electrical Dielectric Breakdown Voltage Type 1 Electrodes Type 3 Electrodes Dielectric Constant, 1 kHz Sil-Pad 950 material uses a heavy fiberglass carrier to increase the mechanical strength and durability of the material. The smooth surface texture of Sil-Pad 950 minimizes interfacial thermal resistance and maximizes thermal performance as well. ASTM D149 4.5 kVa-c 6.0 kVa-c 6 1 x 1010 ASTM D150 ASTM D257 1.4 W/m-K ASTM D5470 Volume Resistivity, Ohm-meter Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 25 50 100 200 3.94 3.50 3.05 2.66 2.42 1.09 .84 .67 .50 .36 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. SIL-PAD(R) TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. OPTIONS Sil-Pad 950 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; October 5,and 2001others. 4,602,678; 4,685,987;Rev: 4,842,911 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 45 (R) Sil-Pad 980 980 (R) High Cut-Through Resistant, Electrically Insulative, Thermally Conductive Material Bergquist Sil Pad 980 is a specially formulated material with high crush resistance to prevent cut through. Sil Pad 980 interface material provides thermal conductivity and electrical insulation. Use Sil Pad 980 material in screw mounted application with cut through problems. The Sil Pad 980 is Bergquist's best material for cut through resistance. The cut through resistance of Sil-Pad 980, K4, SP400KS have been measured using a combination cut-through/voltage breakdown test. A 1"x1" test sample was placed on 2"x2" base plate mounted in an Instron Universal Test Machine. A force probe was installed in a 1000 lbs. load cell in the Instron crosshead. A high potential DC current supply was used to apply 500 Vdc to the test sample. The probe was applied to the test sample with a crosshead speed of 0.05 in/min until breakdown voltage occurred. The applied load at breakdown was read from the chart recorder. Probe Design: Typical Properties of Sil-Pad 980 Property Color Thickness Breaking Strength Elongation Cut Through Continuous Use Temp. Typical Value Test Method Mauve 0.009" 140 lbs./inch 10% 750 lbs -40C to 150C Visual ASTM D374 ASTM D1458 ASTM D412 ASTM D412 4000 VAC 3.5 >1010 ASTM D149 ASTM D150 ASTM D257 1.2 W/m-K ASTM D5470 Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance, o C/W 5.48 5.07 4.52 4.04 3.56 Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 1.51 1.07 .89 .53 1.22 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 1200 1000 Cut Through, lbs. SIL-PAD(R) Round metal probe machined to a 0.060-inch radius and electrically insulated with phenolic resin core material. Contact length is 0.5 inch. 800 600 400 200 0 SPK4 SP400KS SP980 Bergquist Materials www.bergquistcompany.com 46 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 4, 2001 4,602,678; 4,685,987; 4,842,911 and others. The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) Sil-Pad 1500 (R) Electrically Insulating, Thermally Conductive Elastomeric Material Sil-Pad 1500 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease-free, conformable material, capable of meeting or exceeding the thermal and electrical requirements of high reliability electronic packaging applications. Typical Properties of Sil-Pad 1500 Property Color Thickness Hardness (Shore Type A) Breaking Strength Elongation Tensile Strength Continuous Use Temp. Typical Value Test Method Green 0.010" Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D412 ASTM D412 80 65 lbs./inch 20% 1000 psi -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter 4000 VAC 4 1011 ASTM D149 ASTM D150 ASTM D257 2 W/m-K ASTM D5470 Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance, o C/W 3.54 3.18 2.68 2.40 2.22 Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 0.72 0.57 0.46 0.38 0.32 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. SIL-PAD(R) OPTIONS Sil-Pad 1500 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 10, 2001 4,602,678; 4,685,987; 4,842,911 and others. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 47 (R) Sil-Pad A1500 (R) Electrically Insulating, Thermally Conductive Elastomeric Material Bergquist Sil-Pad A1500 (SPA 1500) is a silicone based thermally conductive and electrically insulating material. It consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. SPA 1500 has been designed as an effective alternative to the SP 1500 product filler technologies. Typical Properties of Sil-Pad A1500 Property Color Thickness Specific Gravity Hardness (Shore Type A) Breaking Strength Elongation Continuous Use Temp. Typical Value Test Method Green 0.010" 2.9 g/cc Visual ASTM D374 ASTM D792 ASTM D2240 ASTM D1458 ASTM D412 80 65 lbs./inch 40% -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter Flame Rating 6000 VAC 7 1011 94V-0 ASTM D149 ASTM D150 ASTM D257 U.L. 2 W/m-K ASTM D5470 Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) SPA 1500 is a product of similar performance to the SP 1500 manufactured with a more environmentally friendly, solvent-free process. TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 25 50 100 200 3.03 2.62 2.21 1.92 1.78 0.59 0.50 0.42 0.34 0.31 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. SIL-PAD(R) OPTIONS Sil-Pad A1500 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 4" x 4", 6" x 6", 8" x 8", and 10" x 10" are available. The maximum recommended roll width is 10 inches. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 10, 2001 4,602,678; 4,685,987; 4,842,911 and others. www.bergquistcompany.com 48 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) Sil-Pad 1750 1750 (R) Sil-Pad for High Humidity, High Dielectric (U.L. 1950, IEC 950) Requirements The combination of high thermal conductivity and excellent dielectric strength retention after humidity exposure is formulated into the Sil-Pad 1750 elastomeric pad. Typical Properties of Sil-Pad 1750 Property Typical Value Test Method Green 0.012 .001 (.30) 65 (12) Visual Color Thickness, inches (mm) Breaking Strength, Lbs./inch (kN/m) Hardness (Shore Type A) ASTM D374 ASTM D1458 85 ASTM D2240 6000 ASTM D149 Electrical Dielectric Breakdown Voltage VAC, min. Sil-Pad 1750 relies on processes that minimize the effect of high humidity on the electrical properties of finished material. Therefore, exposure to humid environments during assembly, or over long term operating conditions, will not severely affect the ability of the material to perform. Volume Resistivity, Ohm-meter As Manufactured After 48hrs at 90% rh & 35C After 4hrs at 150C 1.0 x 1012 3.0 x 1011 2.0 x 1014 ASTM D257 Thermal Thermal Conductivity, W/m-K 2.2 ASTM D5470 Thermal Impedance vs. Pressure Pressure (psi) TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 25 50 100 200 3.11 2.87 2.42 2.08 1.90 .86 .68 .53 .39 .28 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. OPTIONS SP 1750 may be purchased as sheets or punched parts. SP 1750 is available with either a Silicone or Acrylic adhesive. SP 1750 is not available in rolls. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev:4,842,911 October 9, 2001 4,602,678; 4,685,987; and others. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 49 SIL-PAD(R) TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. (R) Sil-Pad 2000 (R) The High Performance, High Reliability Insulator Sil-Pad 2000 is a high performance thermally conductive insulator. Sil-Pad 2000 material is designed for demanding military / aerospace and commercial applications. In these applications, SilPad 2000 complies with military standards. Typical Properties of Sil-Pad 2000 Property Typical Value Test Method White 0.015" 0.002 90 -60C to 200C Visual ASTM D374 ASTM D2240 4000 AC-minimum 4 1011 ASTM D149 ASTM D150 ASTM D257 3.5 W/m-K ASTM D5470 Color Thickness Hardness (Shore Type A) Continuous Use Temp. Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter Thermal Thermal Conductivity Thermal Impedance vs. Pressure o TO-220 Thermal Performance, C/W @ Standard Thickness, inch Sil-Pad 2000 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease-free, conformable material, capable of meeting or exceeding the thermal and electrical requirements of high reliability electronic packaging applications. Thermal Impedance, oC-in2 / W (1) @ Standard Thickness, inch 25 2.32 2.34 2.48 0.43 0.48 0.63 50 2.02 2.01 2.21 0.33 0.37 0.55 100 1.65 1.71 1.99 0.25 0.30 0.45 200 1.37 1.56 1.86 0.20 0.24 0.35 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. OUTGASSING DATA FOR SPACECRAFT MATERIALS Post Cure Conditions % TML (1.0% Maximum Acceptable) %CVLM (0.1% Maximum Acceptable) 24 hrs. @ 175C 0.07 0.26 0.03 0.10 No Post Cure SIL-PAD(R) 0.010 0.015 0.020 0.010 0.015 0.020 Pressure (psi) 10 2.61 2.76 2.78 0.57 0.63 0.76 SPECIAL THICKNESS SP 2000 is available in a variety of thickness gages to meet customer requirements. Preferred thickness includes 10, 15, and 20 mil. Please contact Inside Sales for additional thickness information. MIL SPEC. MIL-M-38527/8A MIL-M-38527C MIL-I-49456 UL FILE NUMBER E59150 FSCM NUMBER 55285 TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. OPTIONS SP 2000 is available in sheet or die-cut form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 10, 2001 4,602,678; 4,685,987; 4,842,911 and others. www.bergquistcompany.com 50 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) Sil-Pad A2000 (R) High Performance, High Reliability Thermally Conductive Interface Material Sil-Pad A2000 (SPA-2000) is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks. SPA-2000 is for applications where optimal heat transfer is a requirement. Typical Properties of Sil-Pad A2000 Property Typical Value Test Method Color Thickness Specific Gravity Hardness (Shore Type A) Heat Capacity Continuous Use Temp. White .011", .015", .020" 3.2 g/cc Visual ASTM D374 ASTM D792 ASTM D2240 ASTM C351 90 1.0 J/g-K -60C to 200C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter Flame Rating 4000 AC-minimum 7 1011 94V-0 (pending) ASTM D149 ASTM D150 ASTM D257 U.L. Thermal Thermal Conductivity 3.5 W/m-K Thermal Impedance vs. Pressure This thermally conductive silicone elastomer is formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a "grease-free", conformable material capable of meeting or exceeding the thermal and electrical requirements of high reliability electronic packaging applications. Thermal Impedance, oC-in2 / W (1) @ Standard Thickness, inch 10 2.06 2.05 2.51 0.46 0.53 0.62 25 1.93 1.94 2.46 0.36 0.40 0.52 50 1.82 1.86 2.41 0.32 0.32 0.51 100 1.77 1.79 2.34 0.28 0.28 0.44 200 1.71 1.72 2.24 0.25 0.26 0.41 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. SPECIAL THICKNESS SP A2000 is available in a variety of thickness gages to meet customer requirements. Preferred thickness includes 11, 15, and 20 mil. Please contact Inside Sales for additional thickness information. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. SIL-PAD(R) Typical Applications * Motor Drive Controls * Avionics * High Voltage Power Supplies * Power Transistor / Heat Sink Interface Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader. TO-220 Thermal Performance, oC/W @ Standard Thickness, inch 0.011 0.015 0.020 0.011 0.015 0.020 ASTM D5470 Pressure (psi) OPTIONS Sil-Pad A2000 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 4" x 4", 6" x 6", 8" x 8", and 10" x 10" are available. Maximum roll width is 10inches. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others. Rev: November 20, 2001 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 51 (R) Sil-Pad K-4 (R) BasedInsulator Insulator The Original KaptonTM Kapton(R) Based Sil-Pad K-4 (SP K-4) uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. SP K-4 combines the thermal transfer properties of wellknown Sil-Pad rubber with the physical properties of a film. Typical Properties of Sil-Pad K-4 Property Color Thickness Hardness (Shore Type A) Breaking Strength Elongation, %45 to warp & fill Tensile Strength Construction Continuous Use Temp. Typical Value Test Method Gray 0.006 Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D882A ASTM D412 90 30 lbs/in 5 kN/m 40 5 kPsi Silicone / Kapton -60C to 180C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter 6000 AC-minimum 5 1012 ASTM D149 ASTM D150 ASTM D257 0.9 W/m-K ASTM D5470 Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) SP K-4 is a durable insulator that withstands high voltages and requires no thermal grease to transfer heat. SP K-4 is available in customized shapes and sizes. TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 25 50 100 200 3.66 3.43 3.13 2.74 2.42 1.07 0.68 0.48 0.42 0.38 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. SIL-PAD(R) OPTIONS Sil-Pad K-4 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available with and without pressure sensitive adhesive. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. MIL SPEC. MIL-M-38527/8A MIL-M-38527C MIL-I-49456 MIL-M-87111 UL FILE NUMBER E59150 FSCM NUMBER 55285 www.bergquistcompany.com 52 Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987;Rev: 4,842,911 and others. October 10, 2001 Kapton(R) is a registered trademark of DuPont. The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) Sil-Pad K-6 (R) BasedInsulator Insulator The Medium Performance KaptonTM Kapton(R) Based Sil-Pad K-6 is a medium performance film based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provides a continuous physically tough dielectric barrier against "cut-through" and resultant assembly failures. Typical Properties of Sil-Pad K-6 Property Color Thickness Hardness (Shore Type A) Breaking Strength Elongation, %45 to warp & fill Tensile Strength Construction Continuous Use Temp. Typical Value Test Method Bluegreen 0.006 Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D882A ASTM D412 90 30 lbs/in 5 kN/m 40 5 kPsi Silicone / Kapton -60C to 180C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter 6000 AC-minimum 4 1012 ASTM D149 ASTM D150 ASTM D257 1.1 W/m-K ASTM D5470 Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 25 50 100 200 3.24 3.03 2.76 2.45 2.24 0.82 0.62 0.49 0.41 0.36 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. SIL-PAD(R) OPTIONS Sil-Pad K-6 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available with and without pressure sensitive adhesive. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. MIL SPEC. MIL-M-38527/8A MIL-M-38527C MIL-I-49456 MIL-M-87111 UL FILE NUMBER E59150 FSCM NUMBER 55285 www.bergquistcompany.com Sil-Pad(R): U.S. Patents Rev: 4,574,879; 4,602,125; October 10, 2001 4,602,678; 4,685,987; 4,842,911 and others. The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 53 (R) Sil-Pad K-10 (R) Performance KaptonTM Kapton(R) Based The High Performance BasedInsulator Insulator Sil-Pad K-10 (SP K-10) is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cutthrough properties and excellent thermal performance. Typical Properties of Sil-Pad K-10 Property Color Thickness Hardness (Shore Type A) Breaking Strength Elongation, %45 to warp & fill Tensile Strength Construction Continuous Use Temp. Typical Value Test Method Beige 0.006 Visual ASTM D374 ASTM D2240 ASTM D1458 ASTM D882A ASTM D412 90 30 lbs/in 5 kN/m 40 5 kPsi Silicone / Kapton -60C to 180C Electrical Dielectric Breakdown Voltage Dielectric Constant Volume Resistivity, Ohm-meter 6000 AC-minimum 3.7 1012 ASTM D149 ASTM D150 ASTM D257 1.3 W/m-K ASTM D5470 Thermal Thermal Conductivity Thermal Impedance vs. Pressure SP K-10 is designed to replace ceramic insulators such as Beryllium Oxide, Boron Nitride, and Alumina. These insulators are expensive and they break easily. SP K-10 eliminates breakage and costs much less than ceramics. Pressure (psi) TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 10 25 50 100 200 2.35 2.19 2.01 1.87 1.76 0.86 0.56 0.41 0.29 0.24 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. SIL-PAD(R) OPTIONS Sil-Pad K-10 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available with and without pressure sensitive adhesive. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. MIL SPEC. MIL-M-38527/8A MIL-M-38527C MIL-I-49456 MIL-M-87111 UL FILE NUMBER E59150 FSCM NUMBER 55285 www.bergquistcompany.com 54 Sil-Pad(R): U.S. Patents Rev: 4,574,879; 4,602,125; October 10, 2001 4,602,678; 4,685,987; 4,842,911 and others. The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 (R) Q-Pad II Conductive Pad Pad II Thermally Thermally Conductive (R) The Grease Replacement Material for Maximum Heat Transfer Q-Pad II Eliminates Grease Q-Pad II is a composite of .0015" aluminum foil coated both sides with .0025" thermally/electrically conductive Sil-Pad rubber. It is designed for those applications where maximum heat transfer is needed and electrical isolation is not required. Q-Pad II is the ideal thermal interface material to replace messy thermal grease compounds. Properties of Q-Pad II Property Color Thickness Continuous Use Temp. Typical Value Test Method Black 0.006 0.001 w/ac 0.0065 0.001 180 C w/ac 150 C Visual ASTM D374 Electrical 1.0 x 102 w/ac1.0 x 103 ASTM D257 2.5 W/m-K w/ac 1.3 W/m-K ASTM D5470 Volume Resistivity, Ohm-meter Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. QPad II can be used prior to these operations unlike grease. Q-Pad II also eliminates dust collection which can cause possible surface shorting or heat buildup. 25 50 100 200 2.44 1.73 1.23 1.05 0.92 0.52 0.30 0.22 0.15 0.12 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. OPTIONS Q-Pad II is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SIL-PAD(R) Some applications where Q-Pad II is typically used include: * Between a transistor and a heat sink. * Between two large surfaces such as an L-bracket and the chassis of an assembly. * Between a heat sink and a chassis. * Under electrically isolated power modules or devices such as resistors, transformers and solid state relays. 10 SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. U.L. File Number E59150 Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others. Rev: October 4, 2001 www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 55 (R) Thermally Conductive Q-Pad 33 Thermally Conductive Pad Pad (R) Easy to Handle, Greaseless Thermal Interface Bergquist Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Q-Pad 3 may be installed prior to soldering and cleaning, without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air free interface between heat generating components and heat sinks. Properties of Q-Pad 3 Property Color Thickness Continuous Use Temp. Typical Value Test Method Black 0.005 0.001 w/ac 0.0055 0.001 180 C w/ac 150 C Visual ASTM D374 Electrical 1.0 x 10-1 w/ac1.0 x 101 ASTM D4496 2.0 W/m-K w/ac 1.6 W/m-K ASTM D5470 Volume Resistivity, Ohm-meter Thermal Thermal Conductivity Thermal Impedance vs. Pressure Pressure (psi) TO-220 Thermal Performance, o C/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) SIL-PAD(R) Fiberglass reinforcement enables Q-Pad 3 to withstand processing stresses without losing physical integrity. Some applications where Q-Pad 3 is typically used include: * Between a transistor and a heat sink. * Between two large surfaces such as an L-bracket and the chassis of an assembly. * Between a heat sink and a chassis. * Under electrically isolated power modules or devices such as resistors, transformers and solid state relays. 10 25 50 100 200 2.26 1.99 1.76 1.53 1.30 0.65 0.48 0.35 0.24 0.16 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. OPTIONS Q-Pad 3 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. U.L. File Number E59150 Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: October 2001 4,602,678; 4,685,987; 4,842,911 and4, others. www.bergquistcompany.com 56 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 SOFTFACE TM Softface (R) (R) Automated, Greaseless Greaseless Thermal Thermal Interface Interface Automated, Bergquist Softface eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Softface may be installed prior to soldering and cleaning, without worry. Softface is supplied on a polyester film. The material is transferred to a heat sink or device using commercial hot-stamping equipment. Typical Properties of Softface Property Color Thickness, inches Insulating Value Non-Insulating Value Test Method White Black Visual .005 & .008 .003, .005 & .008 ASTM D374 500 NA ASTM D149 4 Non-Insulating ASTM D150 Electrical Dielectric Strength, V/mil Dielectric Constant, @ 1 KHz Volume Resistivity, Ohm-Cm 1010 ------------------------------ ------------------------------ 101 ASTM D257 ASTM D4496 3.5 3.5 ASTM D5470 .06 / .09 .06 / .09 ASTM D5470 Thermal Thermal Conductivity, W/mK Thermal Resistance, C-in2/W Manufacturing Requirements With Softface applied to a component or other surface you have a built-in thermal interface. Rapid assembly of the material eliminates labor and Softface has the same thermal resistance as grease. Storage Life, @ 25C 1 year (min) 1 year (min) --- Cleanability, Alcohol (IPA) Water &/or Isopropyl Alcohol Water &/or Isopropyl Alcohol --- OPTIONS: Softface material is available in roll form only. Hot-stamp equipment will accommodate many different roll sizes. For more information on hot-stamping equipment and techniques, please contact a Bergquist Sales Representative. SIL-PAD(R) Softface can be supplied already applied to a heat sink or other surface in the assembly. The heat sink or other part can be sent to the factory and Bergquist will apply Softface before shipping to the customer for pre-production quantities. If rework is required, the heat sink or component can be removed and then reused without replacing Softface. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; Rev: Octoberand 9, 2001 4,602,678; 4,685,987; 4,842,911 others. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 57 Poly-Pad (R) (R) The Poly-Pad Family of Polyester-Based Polyester-Based Thermally Conductive Insulation Materials Poly-Pads... For Silicone Sensitive Applications Polyester based, thermally conductive insulators from Bergquist provide a complete family of material for silicone-sensitive applications. PolyPads are ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecomm & certain aerospace applications). Poly-Pads are constructed with ceramic filled polyester resins coating either side of a fiberglass carrier or a film carrier. The Poly-Pad family offers a complete range of performance characteristics to match individual applications. Typical Poly-Pad Properties Test Method PP 400 PP 1000 PP K-4 PP K-10 Color Mauve Yellow Mauve Yellow Visual Thickness 0.009" 0.009" 0.006" 0.006" ASTM D374 Elongation, %45 to warp and fill 10 10 40 40 ASTM D412 Hardness, Shore A 5 90 90 90 90 ASTM D2240 Breaking Strength, Lbs./inch 100 100 30 30 ASTM D1458 7 7 5 5 ASTM D412 ASTM D792 Tensile Strength, kPsi %45 to warp and fill Specific Gravity Continuous Use Temp. Dielectric Breakdown Voltage, Volts a-c Min Dielectric Constant, 1000 Cps Volume Resistivity, Ohm-meter Thermal Conductivity, W/mK 2.0 1.5 1.8 1.3 -20C to -20C to -20C to -20C to 150C 150C 150C 150C 4500 2500 6000 6000 ASTM D149 5.5 4.5 5.0 3.7 ASTM D150 1.0 x 1011 1.0 x 1011 1.0 x 1012 1.0 x 1012 ASTM D257 0.9 1.2 0.9 1.3 ASTM D5470 --- Thermal Impedance vs. Pressure - PP 400 Pressure (psi) TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) Poly-Pad 400 25 5.61 50 5.13 100 4.59 200 4.12 1.62 1.35 1.13 .86 .61 10 4.7 25 4.25 50 3.74 100 3.27 200 2.89 1.30 1.02 .82 .61 .43 10 5.64 25 5.04 50 4.34 100 3.69 200 3.12 1.55 1.21 .95 .70 .46 10 3.76 25 3.35 50 2.75 100 2.3 200 2.03 1.04 .80 .60 .43 .30 Thermal Impedance vs. Pressure - PP 1000 Poly-Pad 400 is a fiberglass-based insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Poly-Pad 1000 Poly-Pad 1000 is also a fiberglass-based insulator coated with a filled polyester resin. Poly-Pad 1000 offers superior thermal resistance for high performance applications. SIL-PAD(R) 10 5.85 Poly-Pad K-4 Poly-Pad K-4 is a composite of film coated with a polyester resin. PPK-4 is an economical insulator and the film carrier provides excellent dielectric and physical strength. Poly-Pad K-10 Poly-Pad K-10 is a composite of film coated with a polyester resin. PPK-10 offers superior thermal performance for your most critical applications with thermal resistance of 0.2 oC-in2/Watt as well as Pressure (psi) TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) Thermal Impedance vs. Pressure - PP K-4 Pressure (psi) TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) Thermal Impedance vs. Pressure - PP K-10 Pressure (psi) TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. TOLERANCES 0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your sales representative if tighter tolerances are required. OPTIONS Sil-Pad 950 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available. SPECIAL SHAPES We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. excellent dielectric strength. Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others. Rev: October 5, 2001 www.bergquistcompany.com 58 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 BOND PLY Bond-Ply 100100 (R) Tape Thermally Conductive, Pressure Sensitive Adhesive Tape Bergquist Bond-Ply 100 is a thermally conductive, double-sided pressure sensitive adhesive tape. The tape consists of a high performance, thermally conductive acrylic adhesive coated with a fiberglass reinforced interweave. BondPly 100 is designed to attain high bond strength to a variety of surfaces and maintain high bond strength with long term exposure to moderate heat and high humidity. Use Bond-Ply 100 for: * * * * * Mount heat sink onto BGA graphic processor Mount heat sink to computer processor Mount heat sink onto drive processor Mount heat spreader onto power converter PCB Mount heat spreader onto motor control PCB Typical Properties of Bond-Ply 100 Property Typical Value Test Method Color Short Term Temperature Resistance, 30Sec Continuous Use Temperature Elongation, 45 Warp Tape Tensile Strength CTE Glass Transition Lap shear at RT Lap shear After 5 hr @ 100 C Lap shear After 2 minutes @ 200 C Static Dead Weight Shear Thermal Conductivity White 200 C -30C to +120C 70% 0.9Kpsi 325 ppm -30 C 100 psi 200 psi 200 psi 150 C 0.8 W/m-K 0.005 0.008 0.011 Test Method Breakdown Voltage, KVAC Surface Flatness, inch/inch Application 3 0.001 6.5 0.002 8.5 0.0025 ASTM D149 Processors Processors Thermal Impedance vs. Pressure TO-220 Thermal Performance, oC/W @ Standard Thickness, inch Thermal Impedance, oC-in2 / W (1) @ Standard Thickness, inch Heat Cure Adhesive Screw Mounting Clip Mounting ASTM D412 ASTM D412 TMA DSC ASTM D1002 ASTM D1002 ASTM D1002 PSTC#7 ASTM D5470 Property @ (inch) Use Bond-Ply 100 instead of: * * * Visual 10 0.005 0.008 4.39 5.11 0.011 6.26 0.005 0.78 0.008 1.28 0.011 2.47 PCB Pressure (psi) 25 50 100 4.02 3.48 3.15 4.69 4.53 4.45 5.92 5.73 5.63 0.61 0.58 0.55 0.94 0.90 0.86 1.22 1.19 1.14 200 3.05 4.38 5.53 0.54 0.84 1.11 * Single layer test that includes interfacial thermal resistance Bond-Ply 100 is available in sheets, rolls and punch part form. Standard sheet size is 10" by 10". Standard Roll size is 10" by 300'. Punch parts can be supplied on rolls and individual parts. Shelf Life: The double-sided pressure sensitive adhesive (PSA) inherent with Bond-Ply products require the use of dual liners to protect the surfaces from environmental contamination and accidental contact. The adhesive bond strength between the PSA and the protective liner will typically increase while in storage conditions. Thus, the worst-case shelf life for Bond-Ply products is limited not by the material characteristics of Bond-Ply, but by the adhesion of the Bond-Ply PSA to the protective liner. Bergquist recommends a 6 month shelf life at a maximum continuous storage temperature of 35C, or 3 month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C. October 1, 2001 Bond-Ply(R): U.S. PatentRev: 5,090,484 and others. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 59 SIL-PAD(R) Bond-Ply 100 is made in standard thickness of 5, 8 and 11 mil. In the case that these thickness will not work for your application, Bergquist will coat custom thickness of 4 to 12 mils. BOND PLY Bond-Ply 660660 (R) Thermally Conductive, Conductive, Electrically Electrically Insulating, Insulating, Pressure Pressure Sensitive Sensitive Adhesive Tape Bond-Ply 660 is a thermally conductive, electrically insulating double-sided pressure sensitive adhesive tape. The tape consists of a high performance, thermally conductive acrylic adhesive coated on both sides of Bergquist T-600 film. Use Bond-Ply 660 in applications to replace mechanical fasteners or screws. BondPly 660 is designed specifically for applications that require electrical isolation. Typical Properties of Bond-Ply 660 Physical Property Color Thickness Tensile Strength Elongation TCE Glass Transition Typical Value Test Method White 0.14 mm 0.0055 in 210 MPa 30 kpsi 40% 250 ppm -30 C Visual ASTM D374 ASTM D882A ASTM D882A TMA DSC 0.7 MPa 100 psi 1.4 MPa 200 psi 1.4 MPa 200 psi 150 C ASTM D1002 ASTM D1002 ASTM D1002 PSTC#7 7 KVac -30 to 120C 200 C ASTM D-149 0.4 W/m-K ASTM D5470 Adhesion Lap shear at RT Lap shear After 5 hr @ 100 C Lap shear 2 minutes @ 200 C Static Dead Weight Shear Electrical Breakdown Voltage as received Continuous Use Temperature Short Term Temp.Resistance,10min. FR4 or Flex Circuit Thermal Bond-Ply 660 Thermal Conductivity Metal Heat Spreader Thermal Impedance vs. Pressure Pressure (psi) TO-220 Thermal Performance, oC/W Thermal Impedance Per ASTM D5470, oC-in2 / W (1) SIL-PAD(R) Bond-Ply 660 is available in roll form with kiss-cut or die-cut parts. The material as delivered will include a continuous base liner with differential release properties to allow simplicity in roll form pakaging and application assembly. The Bergquist T-600 film has UL746B electrical mechanical RTI rating of 150C. Bergquist File Number is E59150. 10 5.30 25 4.94 50 4.38 100 4.02 200 3.88 1.15 0.79 0.74 0.72 0.70 1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Shelf Life: The double-sided pressure sensitive adhesive (PSA) inherent with Bond-Ply products require the use of dual liners to protect the surfaces from environmental contamination and accidental contact. The adhesive bond strength between the PSA and the protective liner will typically increase while in storage conditions. Thus, the worst-case shelf life for Bond-Ply products is limited not by the material characteristics of Bond-Ply, but by the adhesion of the Bond-Ply PSA to the protective liner. Bergquist recommends a 6 month shelf life at a maximum continuous storage temperature of 35C, or 3 month shelf life at a maximum continuous storage temperature of 45C, for maintenance of controlled adhesion to the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60C. Rev: October 1, 2001 Bond-Ply(R): U.S. Patent 5,090,484 and others. www.bergquistcompany.com 60 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Sil-Pad Tubes (R) SPT 400 and SPT 1000 SPT 400 and SPT 1000 ("Sil-Pad Tubes") provide thermally conductive insulation for clip mounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube 1000 is best suited for higher thermal performance and Sil-Pad Tube 400 is ideal for applications requiring average thermal performance and economy. Sil-Pad Tube standard configurations are available for TO-220, TO-218, TO-247 and TO-3P plastic power packages. Special thicknesses and diameters can also be ordered. SPT 400 and SPT 1000 are designed to meet VDE, UL and TUV agency requirements. Typical properties of Sil-Pad Tube are shown in the table below. Test Color Thermal Resistance C-in2/Watt SPT 400 SPT 1000 Method Gray/Green 0.6 Brown 0.4 Visual ASTM D5470 Thermal Conductivity, W/m-k 0.9 1.2 ASTM D5470 Breakdown Voltage, minimum 5000 5000 ASTM D149 Dielectric Constant, 1000 (Hz) 5.5 4.5 ASTM D150 -60 to + 180 -60 to + 200 -- 80 80 ASTM D2240 .012 (.30) .012 ( .30) ASTM D374 6 (1) 6 (1) ASTM D1458 1.0 x 1011 1.0 x 1011 ASTM D257 Continuous Use Temp. C Hardness, Shore A Thickness/Wall (Inches) (mm) Breaking Strength lbs./in. (kN/m) Volume Resistivity, Ohm Meter SIL-PAD(R) Standard Dimensions B A = Wall Thickness: B = Inner Diameter: C = Length C A .30 mm (.012") + .10 mm/-0.0 mm (+.004"/-0.0") 11 mm (.433") and 13.5 mm (.532") 1.0 mm (.039") 25 mm (.985") and 30 mm (1.18") +3.18 mm/-0.0 mm (+.125"/-0.0") Special lengths are available. For more information contact the factory. Ordering Procedure: Sample: www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 SPT400 ___ ___ ___ "A" -"B" -"C" The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others. The Bergquist Company-Asia 9F-1, No.314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 61 (R) (R) Shield Sil-Pad Shield Bonded Bonded Laminate Laminate of of Sil-Pad with a Copper Shield Sil-Pad Shield Typical Properties of Sil-Pad Shield Bergquist Sil-Pad Shield is a bonded laminate of thermally conductive, electrically isolating Sil-Pad 400 or Sil-Pad 1000 pads with a copper shield between the layers. It is supplied with a pre-tinned solder point for easy grounding. Property Typical Value Test Method Thickness (total) inches 0.019 0.004 -- Shield Thickness, inches Copper Thickness 0.0015 -- .85 to 1.0C/W -- 4500 Volts ASTM D149 50 pico F -- 0.0155 ASTM D150 5.5 ASTM D150 -60 to +180 -- 6-8 inch Lbs. -- Approx. Thermal Resistance (TO-3) Min. Breakdown Voltage Between Device and Copper Capacitance at 1000 Hz and 5 Volts Dissipation Factor at 1000 Hz and 5 Volts (TO-3) Power Factor Dielectric Constant at 1000 Hz and 5 Volts SIL-PAD(R) Continuous Use Temp. C RFI Produced by Heat Sink Current Recommended Torque (TO-3) The Capacitance between a TO-3 encapsulated transistor and its heat sink is typically 100pf when a mica or other insulating washer is used. A power supply constructed with a standard insulator and a grounded heat sink can be expected to produce about 10 times more interference than is permitted. Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive insulators. Sil-Pad Shield provides: * Shielding effectiveness of 50dB or higher. * Electrical isolation of 500 volts minimum. * Good thermal transfer. * Reduced labor costs due to the elimination of having to apply thermal grease. A solution to the problem can be accomplished by: SPECIAL SHAPES Sil-Pad Shield is available in many custom configurations to meet special requirements. Tooling charges vary depending on tolerances and complexity of the part. 1. The use of chokes, filters and LC networks which have to be designed into the circuitry. OR 2. Constructing a shield between the transistor and its heat sink by replacing the mica insulator with a Sil-Pad Shield. Transistor Lead Wire To Negative Sil-Pad(R) 400 Copper Shield Grounded Sink (See illustration) Sil-Pad(R): U.S. Patents 4,574,879; 4,602,125; October 8, 2001 4,602,678; 4,685,987;Rev: 4,842,911 and others. www.bergquistcompany.com 62 The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 Sil-Pad Shield (R) Sil-Pad Shield Standard Configurations .4 3 .2 1 1.125 .125 DIA. tinned copper (to ground) 5 0 .125 DIA 3 HOLES .062 .6 6 6 1.125 87 .375 1.1 .393 .1.125 33 .125 DIA. tinned copper (to ground) .562 .312 .171 DIA. 2 HOLES .673 .437 .147 DIA. 1.125 .450 .312 1.378 .375 .125 DIA. tinned copper (to ground) .374 .250 .157 DIA 1.673 P/N 09SPS01-002 (TO-220) P/N 09SPS01-001 (TO-3) P/N 09SPS01-009 .500 .250 1.187 .072 C .593 .100 .075 DIA 2 HOLES .093 DIA .480 .250 .125 .995 .350 .200 1.200 .125 DIA. tinned copper (to ground) .590 .840 1.980 P/N 09SPS01-011 (TO-5) 1.680 P/N 09SPS01-016 (TO-3) .600 .250 .125 DIA. tinned copper (to ground) .100 .625 . .430 1.250 .140 DIA 2 HOLES .406 .875 .500 .040DIA 3 HOLES .960 .140 DIA (2) .215 .250 .200 DIA .125 DIA. tinned copper (to ground) P/N 09SPS01-017 (TO-66) 1.750 1.190 N.T.S. .860 .430 1.210 .18 7 .215 30 .430 .605 .447 .625 .260 DIA .140 DIA 2 HOLES .595 .438 .625 .15 2 .30 5 .652 .070 .875 .187 .200 DIA. .125 DIA. tinned copper (to ground) SIL-PAD(R) .438 1.250 .093 DIA 2 HOLES .187 .430 .860 .125 DIA. tinned copper (to ground) 1.250 P/N 09SPS01-020 (DO-5) P/N 09SPS01-023 (TO-3) P/N 09SPS01-019 (DO-4) Contact the factory for other configurations. www.bergquistcompany.com The Bergquist Company North American Headquarterss 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-4156 The Bergquist Company-Europe Bramenberg 9a 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company-Asia 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan, ROC 106 Phone: 886-2-2700-7796 Fax: 886-2-2700-7795 63 Bergquist Solutions for Surface Mount Applications This guide covers Sil-Pad products specifically, but Bergquist offers a wide array of thermal solutions for any surface mount application. Reasons for selecting one material over another are varied, but typically the decision is power density driven. Maximum Power 100 Watts plus per square inch Hi-Flow and Heat Spreader with or without Thermal Clad High Power 40 to 100 Watts per square inch Bergquist Thermal Clad (CML, MP, LTI and HT) Medium Power 10 to 50 Watts per square inch Bergquist Sil-Pad or Bond-Ply with Heat Spreader Low Power 1 to 15 Watts per square inch Bergquist Gap Pad with or without Heat Spreader HI-FLOW(R) The Hi-Flow family of Phase Change Materials (PCM) offers an easy to apply thermal interface for many surface mount packages. At the phase change temperature, Hi-Flow materials change from a solid and flow with minimal applied pressure. This characteristic optimizes heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to replace messy thermal grease. Bergquist PCMs are specially compounded to prevent pump out of the interface area, which is often associated with thermal grease. Power Device Thermal Clad Hi-Flow High Power Application Hi-Flow with Thermal Clad Processor Hi-Flow ORDERING High Power Application Hi-Flow without Thermal Clad Typical applications include: * Pentium(R), Athlon(R), and other high performance CPUs * DC/DC Converters * Power modules Hi-Flow materials are manufactured with or without film or foil carriers. Custom shapes and sizes for non-standard applications are also available. 64 Where Thermal Solutions All Come Together SIL-PAD(R) Sil-Pad is the benchmark in thermal interface materials. The Sil-Pad family of materials are thermally conductive and electrically insulating. Sil-Pad materials come in a variety of different thicknesses and are frequently used in SMT applications such as: * Interface between thermal via's in a PCB, and a heatsink or casting * Heat sink interface to many surface mount packages Sil-Pad is available in custom shapes, sheets, and rolls. Power Device FR4 Sil-Pad or Bond-Ply Mid Power Application with Sil-Pad or Bond-Ply BOND-PLY(R) The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a PSA or laminating format, is reinforced with fiberglass or film and comes in a variety of different thicknesses. Bond-Ply provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion. Typical applications include: * Bonding bus bars in a variety of electronic modules and sub assemblies * Attaching a metal-based component to a heatsink * Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages * Bonding flexible circuits to a rigid heat spreader or thermal plane * Assembly tapes for BGA heat spreader GAP PAD(R) The Gap Pad product family offers a line of thermally conductive materials which are highly conformable. Varying degrees of thermal conductivities and compression deflection characteristics are available. Typical applications include: * On top of a semiconductor package such as a QFP or BGA (Often times, several packages with varying heights can use a common heatsink when utilizing Gap Pad) * Between a PCB or substrate and a chassis, frame, or other heat spreader * Areas where heat needs to be transferred to any type of heat spreader Gap Pads are available in thickness of 0.010" to 0.200", and in custom shapes, with or without adhesive. Power Device Gap Pad Lower Power Application with Gap Pad ORDERING TOP EFFICIENCY IN THERMAL MATERIALS FOR TODAY'S CHANGING TECHNOLOGY. Contact Bergquist for additional information regarding our Thermal Solutions. We are constantly innovating to offer you the greatest selection of options and flexibility to meet today's changing technology. 65 Ordering Procedure, PSA Characteristics, Mil-Spec ORDERING PROCEDURE: SHEETS: The last 2 or 3 digits define the part number selected. The "foot print" and dimensions are shown on pages 70-76. Each material has a prefix as shown on page 69. Standard sheet size for most materials is 12" x 12", with or without adhesive as specified on the individual data sheet. When ordering sheets, please specify material type, thickness and include all dimensions. Contact Bergquist Sales if other sizes are required. SPECIAL SHAPES: For applications requiring non standard or custom Sil-Pad configurations contact the factory. We produce thousands of specials. Engineering charges are about $200 for simple parts. Increased complexity or tighter tolerances increase engineering charges. TOLERANCES: Typical converting tolerances are held on length (L), width (W), hole diameter and hole location for most materials as noted below: ORDERING Sil-Pads Part Dimension Length & Width < 6" .010" 6" - 12" .015" > 12" .020" Gap Pads Material Thickness 10 mil 15 mil 20 mil 30 mil 40 mil 50 mil 60 mil 80 mil 100 mil 125 mil 140 mil 160 mil 200 mil 225 mil 250 mil ROLLS: Sil-Pad materials are available in roll form, with or without adhesive, with the exception of Sil-Pad 1750, Sil-Pad 2000 and Sil-Pad A2000. Hi-Flow materials are available in roll form. Certain Gap Pad materials are available in roll form. Please contact Bergquist Sales for more information. ADHESIVES: Bergquist offers two primary types of adhesives for all materials. Hole Location & Diameter .005" .010" TBD Tolerance .015" .015" .020" .030" .035" .040" .050" .050" .060" .075" .100" .100" .125" .160" .160" Note: Dependent upon material and application requirements, tighter tolerances may be feasible and available. Please contact Bergquist Sales for these requests and additional information regarding tolerances. 66 Note: Sil-Pad A2000 maximum sheet size is 10" x 12". Gap Pad standard sheet size is 8" x 16". SILICONE: (AC) - Unloaded (TAC) - Loaded (Thermally Enhanced) ACRYLIC: (AAC) - Unloaded (TAAC) - Thermally Loaded (EAAC) - Thermally Enhanced THICKNESS: .0005-.001,(12-25m) (Adhesive only) PEEL STRENGTH: See data below. POL = Peel Off Liner (force per lineal strength of the liner to the adhesive). QS = Quick Stick (Simulated force per lineal strength of the adhesive to the heat sink). g/in = Grams per inch. ADHESIVE Silicone AC Silicone TAC Acrylic AAC Acrylic TAAC Acrylic EAAC POL 50-150 g/in 50-150 g/in 5-70 g/in 5-70 g/in 5-60 g/in QS 50-150 g/in 50-150 g/in 100-800 g/in 100-400 g/in 100-200 g/in Note: These values are typical after the material has aged for 2-3 weeks and are significantly different immediately after coating. Upon completion of coating, QS is 250-500 g/in and POL is 3-20 g/in for all silicone adhesives. SHELF LIFE: MATERIAL SPECIFICATIONS: Silicone Adhesives: Six (6) months from DOM (date of manufacture) when stored in original packaging at 70F (21C) and 50% relative humidity. Bergquist will supply a Thermal Insulation Material Cross Reference Listing for all pertinent military part numbers included in the following Mil-Specs: Acrylic Adhesives: One (1) year from DOM (date of manufacture) when stored in original packaging at 70F (21C) and 50% relative humidity. Peel adhesion data is available upon request. Please contact Bergquist Sales for more information. MIL M-38527 / 08 MIL I-49466 / 02 MIL H-87111 MIL I-49456A NAS 4117 NAS 4118 PSA CHARACTERISTICS: Each Bergquist part number specifies a Bergquist grade of thermal insulation material and a transistor case configuration. Details of different Bergquist thermal insulation materials as well as details on different thermal insulator configurations are found on previous pages of the Sil-Pad Selection Guide. Standard pressure sensitive adhesive (AC) coated on one side of a Sil-Pad will increase the thermal resistance (per ASTM D5470) by 0.2 C/in2/W. Standard PSA on 2 sides increases the thermal impedance by 0.4 C/in2/W. MIL-I-49456A specifies a fiberglass reinforced elastomeric sheet material showing type and class. MIL-I-49466-02, MIL M-38527 / 08 and MIL-H-87111 specify thermal insulator configurations. Thermally conductive PSA (TAC) on one side increases the thermal resistance by 0.05 C/in2/W and on two sides by 0.1 C/in2/W. The effect of AC and TAC on the thermal impedance in an application will vary. In low pressure applications, the pressure sensitive adhesive will wet out the interface easier and eliminate the interfacial thermal resistance. Note: Bergquist adhesives are designed for ease of application during assembly. If an automated dispensing method is preferred, Bergquist will recommend manufacturers of automated dispensing equipment upon request. Please contact Bergquist Sales for more information on this subject. Note: Bergquist cannot be responsible for dispensing equipment selection and/or performance of specific materials on said equipment. It is the customer's responsibility to determine the suitability and compatibility of the specific Bergquist material with the selected equipment. MIL I-49466 / 02 supersedes the part numbers covered under MIL M-38527 / 08. M49466 / 02 is the most complete listing of military part numbers. Each of the military part numbers in M49466 / 02 is cross referenced to specific Bergquist part numbers. Please use MIL-I-49466 whenever possible. Please contact The Bergquist Company for the complete MIL Spec Reference Guide. FSCM NUMBER 55285 U.L.(R) RECOGNITION: For information regarding the UL (Underwriters Laboratories, Inc.) recognition status of Bergquist Sil-Pad, Gap Pad and Hi-Flow materials, the UL web site provides the most current information. Using the address: http://www.ul.com, select "Online Certification Directory." You may then enter one of the following file numbers for the applicable Bergquist file: ORDERING QMFZ2.E59150: Plastics - Component. This category includes all Sil-Pad, Gap Pad and Hi-Flow materials. QOQW2.E81718: Polymeric Adhesive Systems, Electrical Equipment - Component. This category includes Bond-Ply Adhesive only. In each group there is a "Guide Information" section which gives a detailed description of the categories listed and all recognized materials will be listed with supporting data. 67 Building a Part Number MATERIAL THICKNESS: SIL-PAD(R) 400 .007" .009" .015" ADHESIVE 1 SIDE ADHESIVE 2 SIDES Q-PAD(R) 3 GAP PAD(R) 1500R .005" ADHESIVE 1 SIDE SOFTFACE(R) (INSULATING) (NON-INSULATING) SIL-PAD(R) 800 .005" DRY .005" ADHESIVE SIL-PAD(R) 900S .009" DRY .009" ADHESIVE SIL-PAD(R) 950 .009" ADHESIVE 1 SIDE ADHESIVE 2 SIDES SIL-PAD(R) 980 .009" ADHESIVE 1 SIDE ADHESIVE 2 SIDES SIL-PAD(R) 1500 & A1500 .010" ADHESIVE 1 SIDE ADHESIVE 2 SIDES SIL-PAD(R) 1750 .012" DRY .012" ADHESIVE SIL-PAD(R) 2000 & A2000 .010" .015" .020" .030" .040" .050" .060" .080" ADHESIVE 1 SIDE ADHESIVE 2 SIDES SIL-PAD(R) K-4 .006" ADHESIVE 1 SIDE ADHESIVE 2 SIDES SIL-PAD(R) K-6 .006" ADHESIVE 1 SIDE ADHESIVE 2 SIDES (R) ORDERING SIL-PAD K-10 .006" ADHESIVE 1 SIDE ADHESIVE 2 SIDES Q-PAD(R) II .006" ADHESIVE 1 SIDE 68 .003" .005" .005" .008" .008" .010" .020" .015" GAP PAD(R) A2000 .010" .020" .015" .040" GAP PAD(R) A3000 .010" .015" .020" POLY-PAD(R) 400 .009" ADHESIVE 1 SIDE ADHESIVE 2 SIDES POLY-PAD(R) 1000 .009" ADHESIVE 1 SIDE ADHESIVE 2 SIDES POLY-PAD(R) K-4 .006" ADHESIVE 1 SIDE ADHESIVE 2 SIDES POLY-PAD(R) K-10 .006" ADHESIVE 1 SIDE ADHESIVE 2 SIDES (R) BOND-PLY 100 .005" .008" .011" GAP PAD(R) HC 1100 .015" .020" HI-FLOW(R) 105 (THICKNESS WITH SUBSTRATE) .0055" HI-FLOW(R) 115-AC .0055" HI-FLOW(R) 200G .0055" HI-FLOW(R) 225F-AC .004" HI-FLOW(R) 225U HI-FLOW(R) 225UT .0055" .003" HI-FLOW(R) 625 SIL-PAD(R) SHIELD SP1000 GAP PAD(R) VO & VO ULTRA SOFT .020" .080" .160" .040" .100" .200" .060" .125" .250" ADHESIVE 1 SIDE GAP PAD(R) VO SOFT .020" .100" .040" .125" .060" .160" .080" ADHESIVE 1 SIDE GAP PAD(R) 1500 .020" .100" .040" .125" .060" .160" .080" .200" .010" .015" .020" .0015" BOND-PLY(R) 660 SP400 GAP PAD(R) HC 1000 .005" HI-FLOW(R) 818 .0055" NOTE: The following Gap PadTM materials are available with adhesive: Gap Pad(R) VO - all thicknesses Gap Pad(R) VO Soft - all thicknesses Gap Pad(R) VO Ultra Soft - all thicknesses Adhesive is applied to one side only of the material. The other surface has a natural inherent tack. All Gap Pads(R) that are not offered with adhesive have this natural tack (with the exception of HC 1100). CALL 1-800-347-4572 TO ORDER FREE SAMPLES. Building a Part Number (2) PART NUMBER CODING: Complete the part number with a 2 or 3 digit part number suffix from standard configurations as listed on the following pages. SIL-PAD(R) 400 SIL-PAD(R) 2000 7 mil - dry 3223-07FR-_____ 15 mil - dry 9 mil - dry 7403-09FR-_____ 15 mil - adhesive 2015AC-_____ 7 mil - adhesive 3223-07AC-_____ 9 mil - adhesive 7403-09AC-_____ 2015-_____ SIL-PAD(R) A2000 15 mil - dry SIL-PAD(R) 800 5 mil - dry SP800S-_____ 5 mil - adhesive SP800SAC-_____ A2015-_____ 15 mil - adhesive A2015AC-_____ SIL-PAD(R) K-4 SIL-PAD(R) 900S 9 mil - dry SP900-_____ 9 mil - adhesive SP900AC-_____ POLY-PAD(R) 1000 9 mil - dry PP1000-_____ 9 mil - adhesive PP1000AC-_____ POLY-PAD(R) K-10 6 mil - dry PPK10-_____ 6 mil - adhesive PPK10AC-_____ BOND-PLY(R) 100 6 mil - dry K4-_____ 5 mil - adhesive 6 mil - adhesive K4AC-_____ 8 mil - adhesive BP105-_____ BP108-_____ 11 mil - adhesive BP111-_____ (double-sided adhesive only) SIL-PAD(R) K-6 SIL-PAD(R) 950 9 mil - dry SP950-_____ 9 mil - adhesive SP950AC-_____ 6 mil - dry K6-_____ 6 mil - adhesive K6AC-_____ BOND-PLY(R) 660 .0055" BP660-_____ (double-sided adhesive only) SIL-PAD(R) K-10 SIL-PAD(R) 980 9 mil - dry SP980-_____ 9 mil - adhesive SP980AC-_____ 6 mil - dry K10-_____ 6 mil - adhesive K10AC-_____ SIL-PAD(R) SHIELD 400 09SPS01-_____ Q-PAD(R) II SIL-PAD(R) 1500 10 mil - dry 1510-_____ 6 mil - dry Q2-_____ 6 mil - adhesive Q2AC-_____ SIL-PAD(R) SHIELD 1000 01SPS01-_____ 10 mil - adhesive 1510AC-_____ CALL 1-800-347-4572 TO ORDER FREE SAMPLES. Q-PAD(R) 3 SIL-PAD(R) A1500 A1510-_____ Q3-_____ 5 mil - adhesive Q3AC-_____ ORDERING 10 mil - dry 5 mil - dry 10 mil - adhesive A1510AC-_____ POLY-PAD(R) 400 SIL-PAD(R) 1750 12 mil - dry 1750-_____ 9 mil - dry PP400-_____ 9 mil - adhesive PP400AC-_____ 12 mil - adhesive 1750AC-_____ 69 Sil-Pad(R) Configurations 4 Lead TO-66 Part Number Suffix -84 Plastic Power Part Number Suffix Various TO-220 (Clip Mount) TO-126 Various Various TO-220 TO-202 Various TO-220 TO-126 Various TO-220 Various Various TO-218 Various Various Various Various -35 -43 -50 -51 -52 -54 -55 -56 -58 -60 -61 -62 -63 -64 -68 -70 -90 -102 -103 Power Module "C" "D" "E" "F" "G" 1.312 .762 .140 .062 .960 .200 .100 "B" .710 .750 .437 .687 .855 .750 .610 .855 .750 .437 .750 .750 .750 .500 1.125 1.410 .860 .866 .750 .500 .500 .312 .562 .630 .500 .560 .562 .500 .312 .410 .600 .600 .385 .625 .810 .740 .650 .800 Part Number Suffix Dimensions "C" "D" .160 .141 .140 .218 .230 .187 .245 .218 .187 .140 .225 .240 .240 .170 .200 .355 .200 .217 .150 093 .125 .093 .147 .125 .125 .125 .122 .156 .150 .115 .120 .145 .147 .160 .142 .160 Part Number Suffix Various Various Various Various Various Various Various Various Various TO-3P Various Various Various Various Various Various Various Various Various -104 -107 -110 -114 -116 -117 -118 -119 -120 -122 -126 -128 -131 -132 -133 -134 -136 -137 -138 Dimensions "A" "B" 1.000 .810 .984 .827 .855 .827 .748 .437 .728 1.140 .945 .984 .709 .472 .866 .945 1.250 1.250 1.250 .750 .910 .787 .945 .630 .709 .551 .311 .472 .810 .748 1.654 .512 .315 .709 .709 1.000 1.000 1.000 "C" "D" .300 .170 .140 .147 .197 .228 .256 .217 .142 .157 .355 .256 .315 .177 .157 .256 .228 .150 .122 .126 .126 .110 .098 .147 .162 .157 .122 .126 .126 .126 .258 .258 .127 .148 "A" "B" "C" "D" "E" "F" 1.500 2.500 .900 2.000 .150 .344 1.200 1.812 .450 1.000 .075 .156 "A" "B" "C" "D" "E" "F" "G" .910 .983 .500 .750 .200 .432 .125 .156 .580 .665 .046 .101 .265 .217 "A" "B" "C" "D" "E" "F" "G" "H" -66 1.000 .500 .200 .141 .626 .046 .219 .032 Power Part Number Resistors Suffix "A" "B" "C" "E" "F" "G" "H" "I" 1.205 1.265 .771 .890 1.180 1.236 .234 .265 .140 .127 .231 .198 .469 .530 .280 .250 .425 .404 .212 .210 .140 .130 .190 .132 .156 .255 .156 .190 .270 .263 .719 1.563 .445 .551 .688 1.569 .781 .845 .491 .630 .800 .972 .140 .140 .093 .121 .147 .130 "A" "B" "C" "D" "E" "F" # Of Holes 1.000 1.500 2.000 2.500 3.000 3.500 4.000 .750 .750 .750 .750 .750 .750 .750 .187 .187 .187 .187 .187 .187 .187 .125 .125 .125 .125 .125 .125 .125 .250 .250 .250 .250 .250 .250 .250 .500 .500 .500 .500 .500 .500 .500 2 3 4 5 6 7 8 "A" "B" "C" "D" "E" "F" 4.600 4.598 2.279 2.280 2.400 2.402 2.402 1.450 2.125 2.098 2.102 1.270 .500 0.500 0.488 0.490 1.800 1.799 0.650 0.650 .125 0.150 0.150 0.130 Plastic Power Part Number Suffix -57 -89 Plastic Power RH-25 RH-50 RH-5 RH-10 RH-25 RH-50 TO-220 Multiples ORDERING "B" "A" -67 -101 Part Number Suffix -94 -95 -96 -97 -98 -99 1.187 2.093 .725 .805 1.150 1.965 Part Number Suffix 2 Parts 3 Parts -34 -36 -37 -38 -39 -40 -41 Power Module Part Number Suffix -108 -140 -141 -142 70 "A" "D" Sil-Pad(R) Configurations C E D-DIA Part Number Suffix Multiwatt "A" "B" "C" "D" "E" .872 .866 .790 .787 .160 .157 .148 .154 "A" "B" "C" "D" "E" "F" 1.350 .800 .140 .400 .960 .480 "A" Dimensions "B" -19 -20 -21 -22 -25 -26 -27 -28 -32 .510 .510 .800 .625 1.000 .812 .812 1.000 1.500 .140 .200 .260 .200 .260 .145 .115 .140 .500 Suffix "A" Dimensions "B" "C" -08 1.063 .690 .190 Part Number Suffix "A" "B" "C" .360 .250 .250 .360 .390 .390 .200 .100 .100 .200 .200 .200 .040 .036 .036 .040 .040 .040 Dimensions Suffix "A" "B" "C" B -124 -125 .118 x 45 .079 x 45 A Multi-Lead TO-66 Part Number Suffix -93 Diode Washer Part Number Suffix Various DO-4 DO-5 DO-4 (oversized) DO-5 (oversized) Various Various Various Various Part Number TO-36 Small Power Devices TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes -09 -12 -13 -33 -44 -45 Part Number Rectifier -46 -47 -48 TIP Packages Part Number Suffix Clip Mount TIP-36 Plastic Tip TO-3P Plastic Clip Power Module -42 -53 -65 -73 Part Number Suffix -100 -123 Part Number Suffix -105 C D Quarz Part Number Suffix Various Various Various DO-8 Various Various Various Various Various 1.250 1.125 1.000 1.250 1.125 1.000 "A" "B" .984 .865 1.260 .984 .787 .650 .787 .787 "A" "B" 2.510 1.614 1.260 1.102 .630 .551 "A" "B" 1.450 -75 -76 -77 -78 -79 -80 -81 -82 -111 Dimensions "A" "B" .360 .750 .800 .875 1.180 1.250 1.500 .512 .591 .260 .125 .190 .313 .515 .380 .200 .161 .217 .200 .140 .187 "C" "D" "E" .140 .142 .142 .205 .205 .205 .205 Dimensions "C" "D" "E" "F" "G" .305 .157 1.900 1.220 .205 .118 .205 .118 "C" "D" "E" "F" "G" .838 .612 .245 .960 .170 .120 "A" "B" "C" "D" .472 .197 .193 .031 "A" "B" "C" "D" "E" "F" "G" 1.350 .642 .321 .195 .960 .060 .125 .650 .984 .708 ORDERING SIP Package Part Number Suffix B -115 A E F RAD (TYP) B Power Module Part Number Suffix C D (2) G Dia -109 A 71 Sil-Pad(R) Configurations TO-3 & TO-66 Part Number Style Suffix -02 -03 -04 -05 -06 -07 -10 -11 -15 -16 -17 -18 -23 -24 -29 -30 -31 -59 Leadless -112 -113 -127 -129 -135 A 3 LeadPart Number TO-3 Suffix I F -92 B C DIA. (2) Dimensions "D" "A" "B" "C" 1.780 1.563 1.650 1.650 1.650 1.780 1.440 1.312 1.780 2.070 1.650 1.563 1.593 1.700 1.650 1.250 1.375 1.650 1.780 1.563 1.307 1.654 1.650 1.250 1.050 1.140 1.140 1.140 1.250 1.000 .762 1.250 1.560 1.140 1.050 1.100 1.187 1.065 .700 .825 1.140 1.248 1.051 .819 1.063 1.142 .140 .140 .122 .140 .165 .165 .140 .140 .140 .122 .140 .140 .156 .156 .140 .140 .140 .165 .165 .165 .165 .138 .165 Dimensions "C" "D" "E" "F" "G" .430 .430 .430 .430 .430 .430 .200 .200 .430 .430 .430 .430 .430 .430 .430 .200 .200 .072 .072 .072 .072 .072 .072 .100 .100 .072 .072 .072 .072 .072 .072 .072 .100 .100 .063 .079 .063 .059 .142 1.187 1.187 1.187 1.187 1.187 1.187 .960 .960 1.187 1.187 1.187 1.187 1.187 1.187 1.187 .960 .960 1.187 1.185 1.185 .909 1.181 1.187 .429 .429 .236 .433 .429 .073 .073 .061 .071 ..072 "E" "F" "G" "H" "I" .155 .718 .093 .080 .062 .093 .062 .094 .075 .062 .046 .062 .046 .140 .062 .062 .046 .062 .062 "A" "B" 1.650 1.140 .140 .093 1.187 .430 .400 "A" "B" "C" "D" "E" "F" "G" 1.560 1.563 1.050 1.050 .156 .156 .080 .063 1.170 1.187 .470 .470 72 72 "A" "B" "C" "D" "E" "F" "G" 1.655 1.187 .156 .060 1.187 40 .500 "A" "B" "C" "D" "E" "F" "G" "H" 1.650 1.140 .165 .040 1.187 .593 .500 32.7 "A" "B" "C" "D" "E" "F" "G" "H" 1.275 .750 .156 .100 .960 .200 .100 .200 "A" "B" "C" "D" "E" "F" "G" "H" 1.440 1.000 .140 .055 .960 .480 .325 36 "A" "B" "C" "D" "E" 1.600 .480 .165 1.197 .240 H D DIA. (3) G E F DIA. 4 Lead TO-3 A D DIA. (4) -86 -87 B C DIA. (2) Part Number Suffix 18 E G 8 Lead TO-3 Part Number Suffix -88 10 Lead TO-3 Part Number Suffix -91 3 Lead TO-66 Part Number Suffix -85 ORDERING 9 Lead TO-66 Part Number Suffix -83 D E Power Module Part Number Suffix B -130 C - DIA. (2) 72 A Sil-Pad(R) Configurations (SI Measurements) 4 Lead TO-66 Part Number Suffix -84 Plastic Power Part Number Suffix Various (Clip Mount) TO-220 TO-126 Various Various TO-220 TO-202 Various TO-220 TO-126 Various TO-220 Various Various TO-218 Various Various Various Various Power Module -35 -43 -50 -51 -52 -54 -55 -56 -58 -60 -61 -62 -63 -64 -68 -70 -90 -102 -103 RH-25 RH-50 RH-5 RH-10 RH-25 RH-50 TO-220 Multiples "D" "E" "F" "G" 33.32 19.35 3.56 1.57 24.38 5.08 2.54 18.03 19.05 11.10 17.45 21.72 19.05 15.49 21.72 19.05 11.10 19.05 19.05 19.05 12.70 28.58 35.81 21.84 22.00 19.05 12.70 12.70 7.92 14.27 16.00 12.70 14.22 14.27 12.70 7.92 10.41 15.24 15.24 9.78 15.88 20.57 18.80 16.51 20.32 Number Suffix 4.06 3.58 3.56 5.54 5.84 4.75 6.22 5.54 4.75 3.56 5.72 6.10 6.10 4.32 5.08 9.02 5.08 5.51 3.81 2.36 3.18 2.36 3.73 3.18 3.18 3.18 3.10 3.96 3.81 2.92 3.05 3.68 3.73 4.06 3.61 4.06 Part Number Suffix Various Various Various Various Various Various Various Various Various TO-3P Various Various Various Various Various Various Various Various Various -104 -107 -110 -114 -116 -117 -118 -119 -120 -122 -126 -128 -131 -132 -133 -134 -136 -137 -138 Dimensions "A" "B" 25.40 20.57 24.99 21.01 21.72 21.01 19.00 11.10 18.49 28.96 24.00 24.99 18.01 11.99 22.00 24.00 31.75 31.75 31.75 19.05 23.11 19.99 24.00 16.00 18.01 14.00 7.90 11.99 20.57 19.00 42.01 13.00 8.00 18.01 18.01 25.40 25.40 25.40 "C" "D" 7.62 4.32 3.56 3.73 5.00 5.79 6.50 5.51 3.61 3.99 9.02 6.50 8.00 4.50 3.99 6.50 5.79 3.81 3.10 3.20 3.20 2.79 2.49 3.73 4.11 3.99 3.10 3.20 3.20 3.20 6.55 6.55 3.23 3.76 "C" "D" "E" "F" 38.10 63.50 22.86 50.80 3.81 8.74 30.48 46.02 11.43 25.40 1.90 3.96 "A" "B" "C" "D" "E" "F" "G" 23.11 24.97 12.70 19.05 5.08 10.97 3.18 3.96 14.73 16.89 1.17 2.57 6.73 5.51 "A" "B" "C" "D" "E" "F" "G" "H" 25.40 12.70 5.08 3.58 15.90 1.17 5.56 0.81 "A" "B" "C" "D" "E" "F" "G" "H" 30.15 53.16 18.42 20.45 29.21 49.91 30.61 32.13 19.58 22.61 29.97 31.39 5.94 6.73 3.56 3.23 5.87 5.03 11.91 13.46 7.11 6.35 10.80 10.26 5.38 5.33 3.56 3.30 4.83 3.35 3.96 6.48 3.96 4.83 6.86 6.68 18.26 39.70 11.30 14.00 17.48 39.85 19.84 21.46 12.47 16.00 20.32 24.69 "A" "B" "C" "D" "E" "F" # Of Holes 25.40 38.10 50.80 63.50 76.20 88.90 101.60 19.05 19.05 19.05 19.05 19.05 19.05 19.05 4.75 4.75 4.75 4.75 4.75 4.75 4.75 3.18 3.18 3.18 3.18 3.18 3.18 3.18 6.35 6.35 6.35 6.35 6.35 6.35 6.35 12.70 12.70 12.70 12.70 12.70 12.70 12.70 2 3 4 5 6 7 8 "A" "B" "C" "D" "E" "F" 116.84 116.8 57.90 57.91 60.96 61.00 61.00 36.83 53.97 53.30 53.40 32.26 12.70 12.70 12.40 12.45 45.72 45.70 16.50 16.50 3.18 3.80 3.80 3.30 Part Number Suffix Part Number Suffix -94 -95 -96 -97 -98 -99 Part Number Suffix 2 Parts 3 Parts -34 -36 -37 -38 -39 -40 -41 Power Module Part Number Suffix "I" 3.56 3.56 2.36 3.07 3.73 3.30 ORDERING "B" Part Number Suffix -108 -140 -141 -142 Dimensions "C" "D" "A" -66 Power Resistors "C" "B" -57 -89 Plastic Power "B" "A" -67 -101 Plastic Power "A" 73 Sil-Pad(R) Configurations (SI Measurements) C D-DIA E Multiwatt B Part Number Suffix -124 -125 "A" "B" "C" "D" " E" 22.15 22.00 20.07 19.99 4.06 3.99 3.76 3.91 3.0 x 45 2.0 x 45 "A" "B" "C" "D" "E" "F" 34.29 20.32 3.56 10.16 24.38 12.19 "A" Dimensions "B" 12.95 12.95 20.32 15.88 25.40 20.62 20.62 25.40 38.10 3.56 5.08 6.60 5.08 6.60 3.68 2.92 3.56 12.70 "A" "B" 27.00 17.53 4.83 A Multi-Lead TO-66 Part Number Suffix -93 Diode Washer Part Number Suffix Various DO-4 DO-5 DO-4 (oversized) DO-5 (oversized) Various Various Various Various -19 -20 -21 -22 -25 -26 -27 -28 -32 Part Number Suffix TO-36 -08 9.14 19.05 20.32 22.23 29.97 31.75 38.10 13.00 15.01 6.60 3.18 4.83 7.95 13.08 9.65 5.08 4.09 5.51 Dimensions "C" "A" "B" "C" TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes -09 -12 -13 -33 -44 -45 9.14 6.35 6.35 9.14 9.91 9.91 5.08 2.54 2.54 5.08 5.08 5.08 1.02 0.91 0.91 1.02 1.02 1.02 Suffix "A" Dimensions "B" "C" 31.75 28.58 25.40 31.75 28.58 25.40 5.08 3.56 4.75 "A" "B" "C" "D" "E" 24.99 21.97 32.00 24.99 19.99 16.51 19.99 19.99 16.51 24.99 17.98 3.56 3.61 3.61 5.21 5.21 5.21 5.21 "A" "B" Dimensions "C" "D" "E" "F" "G" 63.75 41.00 32.00 27.99 16.00 14.00 7.75 3.99 48.26 30.99 5.21 3.00 5.21 3.00 "A" "B" "C" "D" "E" "F" "G" 36.83 21.29 15.54 6.22 24.38 4.32 3.05 "A" "B" "C" "D" 11.99 5.00 4.90 0.79 "A" "B" "C" "D" "E" "F" "G" 34.29 16.31 8.15 4.95 24.38 1.52 3.18 -46 -47 -48 TIP Packages Part Number Suffix Clip Mount TIP-36 Plastic Tip TO-3P Plastic Clip Power Module -42 -53 -65 -73 Part Number Suffix -100 -123 SIP Package Part Number Suffix -105 ORDERING -75 -76 -77 -78 -79 -80 -81 -82 -111 Dimensions "B" Part Number Suffix Part Number C Various Various Various DO-8 Various Various Various Various "A" Small Power Devices Rectifier Power Module D Part Number Suffix B Part Number Suffix -115 A E F RAD (TYP) Power Module Part Number Suffix B C -109 D A 74 (2) G Dia Sil-Pad(R) Configurations (SI Measurements) TO-3 Style Part Number Suffix -02 -03 -04 -05 -06 -07 -10 -11 -15 -16 -17 -18 -23 -24 -29 -30 -31 -59 Leadless -112 -113 -127 -129 -135 A Dimensions "D" "A" "B" "C" 45.21 39.70 41.91 41.91 41.91 45.21 36.58 33.32 45.21 52.58 41.91 39.70 40.46 43.18 41.91 31.75 34.92 41.91 45.21 39.70 33.20 42.01 41.91 31.75 26.67 28.96 28.96 28.96 31.75 25.40 19.35 31.75 39.62 28.96 26.67 27.94 30.15 27.05 17.78 20.96 28.96 31.70 26.70 20.80 27.00 29.01 3.56 3.56 3.10 3.56 4.19 4.19 3.56 3.56 3.56 3.10 3.56 3.56 3.96 3.96 3.56 3.56 3.56 4.19 4.19 4.19 4.19 3.51 4.19 2.36 2.03 1.57 2.36 1.57 2.39 1.90 1.57 1.17 1.57 1.17 3.56 1.57 1.57 1.17 1.57 1.57 1.60 2.01 1.60 1.50 3.61 "E" "F" "G" 30.15 30.15 30.15 30.15 30.15 30.15 24.38 24.38 30.15 30.15 30.15 30.15 30.15 30.15 30.15 24.38 24.38 30.15 30.10 30.10 23.09 30.00 30.15 10.92 10.92 10.92 10.92 10.92 10.92 5.08 5.08 10.92 10.92 10.92 10.92 10.92 10.92 10.92 5.08 5.08 1.83 1.83 1.83 1.83 1.83 1.83 2.54 2.54 1.83 1.83 1.83 1.83 1.83 1.83 1.83 2.54 2.54 10.90 10.90 5.99 11.00 10.90 1.85 1.85 1.55 1.80 1.83 I Dimensions F 3 Lead TO-3 B C DIA. (2) Part Number Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I" 41.91 28.96 3.56 2.36 30.15 10.92 10.16 3.94 18.24 "A" "B" "C" "D" "E" "F" "G" 39.62 39.70 26.67 26.67 3.96 3.96 2.03 1.60 29.72 30.15 11.94 11.94 72 72 "A" "B" "C" "D" "E" "F" "G" 42.04 30.15 3.96 1.52 30.15 40 12.70 "A" "B" "C" "D" "E" "F" "G" "H" 41.91 28.96 4.19 1.02 30.15 15.06 12.70 32.7 "A" "B" "C" "D" "E" "F" "G" "H" 32.38 19.05 3.96 2.54 24.38 5.08 2.54 5.08 "A" "B" "C" "D" "E" "F" "G""H" 36.58 25.40 3.56 1.40 24.38 12.19 8.26 "A" "B" "C" "D" "E" 40.64 12.19 4.19 30.40 6.10 H D DIA. (3) -92 G E F DIA. A 4 Lead TO-3 D DIA. (4) Part Number Suffix B C DIA. (2) -86 -87 18 E G 8 Lead TO-3 Part Number Suffix -88 10 Lead TO-3 Part Number Suffix -91 3 Lead TO-66 Part Number Suffix -85 Part Number Suffix -83 D A 36 E B C - DIA. (2) ORDERING 9 Lead TO-66 Power Module Part Number Suffix -130 75 Hi-Flow(R) Configurations HI-FLOW 225U CONFIGURATIONS ("B") MATERIAL LINER -.500+.030 PSA STRIP .080+.000 .040 LINER ("B") ("A") Part "A" +/-.015 "B" +/-.015 "C" +/-.015 MIN. PCS/ROLL Number BG409490 1.500 1.500 2.500 5000 BG410344 1.378 1.378 2.378 5000 BG411198 1.250 1.250 2.250 5000 BG410345 1.000 1.000 2.000 7500 BG410346 .700 .700 1.700 10000 BG410347 .500 .500 1.500 15000 BG411444 .300 1.000 2.000 22500 ("A") ("C") HI-FLOW 225UT CONFIGURATIONS .750+.063 YELLOW PSA TAPE Part "A" +/-.015 "B" +/-.015 "C" +/-.015 MIN. PCS/ROLL Number LINER .500+.030 PSA STRIP MATERIAL ("B") CLEAR PSA TAPE .750+.063 .250+.125 LINER ("B") ("A") ("A") BG411595 1.650 1.650 2.650 3000 BG411594 1.500 1.500 2.500 5000 BG411550 1.375 1.375 2.375 5000 BG411549 1.250 1.250 2.250 5000 BG411548 1.000 1.000 2.000 7500 BG411547 .700 .700 1.700 10000 BG411546 .500 .500 1.500 15000 ORDERING ("C") HI-FLOW 225F-AC HF 225F-AC Die Size Minimum, 0.7 x 0.7 inches. 76 DOMESTIC AGENTS For a complete list of Bergquist sales representatives in the U.S. contact The Bergquist Company: 1-800-347-4572. INTERNATIONAL SALES OFFICES THE NETHERLANDS The Bergquist Company European Headquarters Bramenberg 9a 3755 BT Eemnes The Netherlands Tel: 31-35-5380684 Fax: 31-35-5380295 Peter de Vries, European Sales Director GERMANY Bergquist ITC GmbH Haderslebener Str. 19A, D-25421 Pinneberg Tel: 49-4101-803-230 Fax: 49-4101-803-100 ENGLAND TAIWAN Asian Headquarters The Bergquist Company Greater China Operations 9F-1, No. 314, Section 4 Ren Ai Road Taipei, Taiwan ROC 106 Tel: 886-2-2700-7796 Fax: 886-2-2700-7795 David Liang, General Manager KOREA AUSTRALIA AUSTRIA BELGIUM BRAZIL CANADA CHINA DENMARK The Bergquist Company Rm. 1118, Block B, Lucky Tower No. 3 Dong San Huan Beilu Chao Yang District, Beijing, China 100027 Tel: 86-10-6462-9755 Fax: 86-10-6462-9754 Michael Cheng Wei Jun, Sales Manager HONG KONG The Bergquist Company Korea, Ltd. #5303 Dongil Technotown Anyang 7 Dong Manan Ku, Anyang Si Kyunggi Do Korea, 430-817 Tel: 82-31-448-0382 Fax: 82-31-448-0383 The Bergquist Company Room 15, 8/F Wah Wai Industrial Centre No. 38-40, Au Pui Wan Street Fotan, Shatin, N.T. Hong Kong Tel: 852-2690-9296 Fax: 852-2690-2344 FINLAND FRANCE HOLLAND HONG KONG ISRAEL ITALY JAPAN MALAYSIA MEXICO NEW ZEALAND NORWAY PORTUGAL RUSSIA SINGAPORE SPAIN SWEDEN SWITZERLAND TAIWAN THAILAND TURKEY Bergquist UK Ltd. Unit 27 Darin Court Crownhill Ind. Est. Milton Keynes MK80AD Tel: 44-1908-263663 Fax: 44-1908-263773 INTERNATIONAL AGENTS CHINA Corporate Headquarters and Sales Office: 18930 West 78th Street Chanhassen, MN 55317 Manufacturing Facility: 301 Washington Street Cannon Falls, MN 55009 Toll Free: (800) 347-4572 * Main: (952) 835-2322 * Fax: (952) 835-0430 * www.bergquistcompany.com Thermal Products * Membrane Switches * Touchscreens * Electronic Components Visit Our Web Site http://www.bergquistcompany.com For access to 38 technical papers on Sil-Pad Products go to the "Technical Corner" in the Bergquist web site. Here's a sample of the technical papers available from The Bergquist Company: * What is Thermal Management at Bergquist by Staff Topic: Insulation Published by Bergquist * Comparison of Semiconductor Isolation Materials by Hanson Topic: Insulation; Compares Sil-Pad type materials Published by PCIM * Thermal Testing Procedures by Hanson Topic: TSP Published by Bergquist * Two Layer Thermal Clad(R), Thermal Clad Bond-Ply(R), and Low Modulus Bond-Ply(R) by Fick Topic: Thermal Clad, Two Layer Published by Bergquist