Thermally Conductive
Interface Materials for
Cooling Electronic Assemblies
Sil-Pad
®
SELECTION GUIDE
JANUARY 2002
Sil-Pad
JANUARY 2002 ©Copyright The Bergquist Company
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITYAND FITNESS FOR PURPOSE. Sellers' and manufacturers' only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability
whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALLBE LIABLE EITHER IN T ORT OR IN CONTRACT FOR ANYLOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement,
purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
Registered Firm
ISO 9001:1994
Certificate QSR-219
QS-9000 Third Edition
Certificate Number,
QSR-QS-017
TABLE OF CONTENTS
Introduction 2
Thermal Proper ties and Testing 4
Interface Material Selection Guide 5
Gap Pad®Thermally Conductive Materials 6
Gap Pad®Comparison Data 7
Gap Pad®Frequently Asked Questions 8
Gap Pad®VO 9
Gap Pad®VO Soft 10
Gap Pad®VO Ultra Soft 11
Gap Pad®1500 12
Gap Pad®1500R 13
Gap Pad®A2000 14
Gap Pad®A3000 15
HC1000 16
HC1100 17
Gap Filler 1000 18
Gap Filler 2000 19
Hi-Flow®Phase Change Interface Materials 20
Hi-Flow®Comparison Data 21
Hi-Flow®105 22
Hi-Flow®115-AC 23
Hi-Flow®200G 24
Hi-Flow®225F-AC 25
Hi-Flow®225U 26
Hi-Flow®225UT 27
Hi-Flow®625 28
Hi-Flow®818 29
Hi-Flow®Frequently Asked Questions 30
Sterling™-7500 Thermal Interface Compound 31
Sil-Pad®Thermally Conductive Insulators 32
Sil-Pad®Comparison Data 33
Sil-Pad®Features and Benefits 34
Sil-Pad®Mechanical and Electrical Properties 36
Sil-Pad®Thermal Proper ties 38
Sil-Pad®Applications 39
Sil-Pad®Selection Guide 40
Sil-Pad®400 42
Sil-Pad®800 43
Sil-Pad®900S 44
Sil-Pad®950 45
Sil-Pad®980 46
Sil-Pad®1500 47
Sil-Pad®A1500 48
Sil-Pad®1750 49
Sil-Pad®2000 50
Sil-Pad®A2000 51
Sil-Pad®K-4 52
Sil-Pad®K-6 53
Sil-Pad®K-10 54
Q-Pad®II 55
Q-Pad®356
Softface®57
Poly-Pad®58
Bond-Ply®100 59
Bond-Ply®660 60
Sil-Pad®Tubes 61
Sil-Pad®Shield 62
Solutions For Surface Mount Applications 64
Ordering Procedure 66
Building A Par t Number 68
Sil-Pad®Configurations 70
Hi-Flow®Configurations 76
INTRODUCTION
INTRODUCTION GAP PAD®HI-FLOW™TIC SIL-PAD®ORDERING
2
Financially Stable
Committed to Quality
Worldwide Locations
High Demand Products
Customer Oriented
Entrepreneurial Spirit
At Bergquist, developing high quality components
for the electronics industry is our first priority. As a
growing world leader with state-of-the-art facilities
producing Thermal Products, Touchscreens and
Membrane Switches, and distributing Electronic
Components, we supply a multitude of industries
worldwide including automotive, computer,
military, aerospace, telecommunications and more.
We make it our business to know your business. We
understand your problems. We also know that there
will always be a better way to help you reach your
goals and objectives. To that end, our company
continually invests considerable time and money
into research and development. The Bergquist
Company is focused on a single purpose –
discovering the need, then developing and deliver-
ingtechnologically advanced solutions backed by
superior service.
A World Leader in
Thermal Management Through
Technology, Innovation & Service
INTRODUCTIONGAP PAD®HI-FLOW™TICSIL-PAD®
ORDERING
3
BERGQUIST TAKES THE HEAT
Bergquist's Thermal Products Group is a world leading developer and
manufacturer of thermal management materials which provide product
solutions to control and manage heat in electronic assemblies and printed
circuit boards. Used by many of the world's largest OEMs in various
industries including automotive, computer, power supply, military and
motor control, these materials include:
Sil-Pad® – Thermally Conductive Insulators
Gap Pad® – Thermally Conductive Gap Filling Materials
Hi-Flow®– Phase Change Interface Materials
Sterling™-7500 – Thermal Interface Compound
Thermal Clad® – Insulated Metal Substrates
WORLD CLASS OPERATIONS
AROUND THE GLOBE
In the United States, the Thermal Products Group’s 75,000 square foot
primary manufacturing facility is located in Cannon Falls, Minnesota.
A40,000 square foot facility in Prescott, Wisconsin, houses the
Thermal Clad printed circuit board operations. A new 130,000 square
foot facility in Chanhassen, Minnesota is the location for Bergquist's
new corporate headquarters and state of the art research and develop-
ment facilities. Worldwide, Bergquist has facilities in The Netherlands,
Germany, the United Kingdom, Taiwan, Korea, Hong Kong and China
with sales representatives in 30 countries to support worldwide growth.
A LEGACY OF INDUSTRY-LEADING TECHNOLOGY
For over 35 years, outstanding quality, innovation and engineering have
been hallmarks of the Bergquist Company. Today, developing innovative
products for the electronics industry remains our first priority. Bergquist
has developed over 260 materials which provide thermal solutions for a
wide variety of electronic applications. Many of our products were
originally developed to satisfy a customer request for a specific material
designed to perform to their particular specifications. This kind of “can do”
attitude and customized technology has earned The Bergquist Company
these coveted industry certifications: ISO 9001, QS 9000, Ford Q1 and
GM Targets For Excellence.
RESEARCH AND DEVELOPMENT
AT THE SPEED OF CHANGE
Keeping pace in the incredibly aggressive electronics industry
demands continual anticipation of change and the ability to develop
solutions quickly and efficiently for our customers. At our Chanhassen,
MN, headquarters, we house a state-of-the-art development laboratory
and engineering department staffed with highly skilled chemical engi-
neers, laboratory technicians and manufacturing engineers – all dedi-
cated to researching, developing and testing new materials. From such
dedication has come many industry-standard proprietary products
including Thermal Clad®, Sil-Pad®, Gap Pad®, Sterling™and Hi-Flow®
materials.
INTRODUCTION
4
Thermal Properties and Testing
The time rate of heat flow through a unit area producing a
unit temperature difference across a unit thickness.
Thermal conductivity is an inherent or absolute property of
the material.
= dq • z
dt • A • ∆T
k
The opposition to the flow of heat through a unit area of
material across an undefined thickness.
Thermal resistance varies with thickness.
= z
k
Rθ
A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady state
heat flow through them.
Factors affecting thermal impedance include:
Area: Increasing the area of thermal contact decreases thermal impedance.
Thickness: Increasing the insulator thickness increases thermal impedance.
Pressure: Increasing mounting pressure under ideal conditions decreases thermal impedance.
Time: Thermal impedance decreases over time.
Thermal impedance is affected by the method of temperature measurement.
Thermal Impedance Per Bergquist TO-220 Thermal Performance (25˚C Cold Plate Testing)
= +
ZR
i
z
k • A
θ
Heater
T1
T2
T3
T4
T5
T6Reference Calorimeter
Water Cooled Heatsink
Upper Meter Block
Test Sample (1, 2 and 3 layers)
Lower Meter Block
= ∆
∆z(W/m-K)
R 3
R 2
R 1
Ri
z1z2z3
R
=
z(m2-K/W)
k
k
θ
θ
θRθ
TO-220
Leads
Tc
Ts
Dielectric
Metal Base
Shortest thermal path from die to sink
= ∆T
PD
Zθ
2 in. diameter stack (ref. 3.14 in2) – 10-500* psi, 1 hour per layer
* Bergquist modified
Thickness (m)
Thermal Impedance (m2-K/W)
THERMAL CONDUCTIVITY THERMAL RESISTANCE
TEST METHODS – ASTM D5470
FORCE
THERMAL IMPEDANCE
TO-220 is an IRF 840
INTRODUCTION
Interface Material Selection Guide
Grease Replacement T T T T T T AAAAA A
Materials T T T T T T AAAAA A
TASAST AAAAA A
TTTT AAAAA A
TTTTAS AAAA A
TTTAAAAS NA
TT AAAAS NA
TT AAAAS
Grease Replacement T T T AAAAA A
Materials, Insulated T T T AAAAA A
Thin-Film Bonding T T T T T AAAAA A
Bonding (Fiber-Glass) T T T T T AAAAA A
TTTT TAAAAA A
TTTT TAAAAA A
Sil-Pad (Fiber-Glass) T T T T T T AAAAA A
TTTTTAAAAA A
TTTTTT AAAAA A
TT TT AAAAA A
TTTTAS T AAAAA A
TTTTTT AAAAA A
TTTTAS T AAAAA A
TTTTAS T AAAAA A
TTTTAS T AAAAA A
TTTTAS T AAAAA A
TTTTAS T AAAAA A
TTTTAS T AAAAA A
Thin-Film Sil-Pad T T T T T T AAAAA A
(Kapton) T T T T T T AAAAA A
TTTTTT AAAAA A
Gap Pad TTTTTTT AA*AAASA
TTTTTTT AA*AAASA
TTTTTTT AA*AAASA
TT TTT AA* A A A
TT TTT AA* A A A
TT TTTT AA*AAAS
TTT TTT AA*AAA
TT TASTT AA* A A A
TTTTASTT AA*AAA
Gap Filler Gap Filler 1000 TTTT AST A
Gap Filler 2000 TTTT AST A
T= T
yp
ical
,
AS= A
pp
lication S
p
ecific
(p
lease contact Ber
gq
uist Sales
)
,
A= Available
,
* = u
p
to 40 mils onl
y
Rev: 11-16-01Note: For Hi-Flow 225UT and Hi-Flow 225F-AC the adhesive is not a PSA.
Ga
p
Pad A3000
Ga
p
Pad A2000
Ga
p
Pad 1500R
Ga
p
Pad 1500
Ga
p
Pad HC1100
Ga
p
Pad HC1000
Ga
p
Pad VO
Ga
p
Pad VO Soft
Ga
p
Pad VO Ultra Soft
Sil-Pad A2000 - 20 mil
Sil-Pad K4
Sil-Pad K6
Sil-Pad K10
Sil-Pad 2000 - 15 mil
Sil-Pad 2000 - 20 mil
Sil-Pad A2000 - 11 mil
Sil-Pad A2000 - 15 mil
Sil-Pad 980
Sil-Pad 1500
Sil-Pad A1500
Sil-Pad 2000 - 10 mil
Bond-Pl
y
100 - 5 mil
Sil-Pad 400
Sil-Pad 800
Sil-Pad 900S
Bond-Pl
y
100 - 11 mil
Bond-Pl
y
100 - 8 mil
Hi-Flow 225U
Hi-Flow 625
Hi-Flow 818
Bond-Pl
y
660
Hi-Flow 115-AC
Hi-Flow 200G
Hi-Flow 225F-AC
Hi-Flow 225UT
Q-Pad II
Q-Pad 3
Hi-Flow 105
Product Overview Typical Converted
OptionsInterface Applications Mounting
Methods
Market Applications
Products
Discrete Power Devices for Power
Supplies, Computers, Telecom
(Thru-Hole)
Active Power Compensators:
Capacitors, Inductors, Resistors
Electronic Modules for
Automotive: Motor & Wiper
Controls, Anti-Lock, etc.
Electronic Modules for Telecom
and Power Supplies
Computer Applications: CPU,
GPU, ASICs, Hard Drives
Electrical Insulator
Clip, Low Pressure
Screw / Rivets, High Pressure
Not Applicable
Sheet Stock
Roll-Form Continuous
Standard Configurations
Custom External Shapes
Custom Internal Features
Adhesive PSA Availability
5
GAP PAD®
The Bergquist Company, a world leader in thermal interface materials,
developed the Gap Pad family to meet the electronics industry’s
growing need for interface materials with greater conformability,
higher thermal performance and easier application.
The extensive Gap Pad family provides an effective thermal interface
between heat sinks and electronic devices where uneven surface
topography, air gaps and rough surface textures are present. Bergquist
application specialists work closely with customers to specify the proper
Gap Pad material for each unique thermal management requirement.
A complete range of choices f or filling air gaps
and enhancing thermal conductivity
SOLUTION-DRIVEN THERMAL MANAGEMENT PRODUCTS FOR ELECTRONIC DEVICES
FEATURES
Each of the many products within the
Gap Pad family is unique in its
construction, properties and perform-
ance. Following is an overview of the
important features offered by the Gap
Pad family.
• Low-modulus polymer material
• Fiberglass, rubber carriers
or non-reinforced
• Special fillers to achieve specific
performance characteristics
• Highly conformable to uneven and
rough surfaces
• Electrically isolating
• Naturally tacky one-side or tacky
on both sides with protective liner
• Variety of thicknesses
and hardnesses
• Range of thermal conductivities
• Available in sheets and die-cut parts
BENEFITS
Gap Pad thermal products are
designed to improve an assembly’s
thermal performance and reliability
while saving time and money.
Specifically:
• Eliminates air gaps to reduce
thermal resistance
• High conformability reduces
interfacial resistance
• Replaces messy grease
• Low-stress vibration dampening
• Shock absorbing
• Easy material handling
• Simplified application
• Puncture, shear and tear resistance
• Improved performance for
high-heat assemblies
• Compatible with automated
dispensing equipment
OPTIONS
Some Gap Pad products have special
features for particular applications,
including:
• Available with or without adhesive
• Rubber-coated fiberglass
reinforcement
• Thicknesses from 0.010'' to 0.250''
• Available in custom die-cut parts,
sheets and rolls (converted or
unconverted)
• Custom thicknesses and
constructions
APPLICATIONS
Gap Pad products are well suited to a
wide variety of electronics, automo-
tive, medical, aerospace and military
applications such as:
• Between a CPU and heat spreader
• Between a semiconductor and heat
sink
• CD-ROM cooling
• Between heat generating devices
and chassis
• Heat pipe assemblies
• RDRAM memory modules
• Drive cooling
• Power supply
• Fiber optic pumps
• Signal amplifiers
6
Gap Pad®Thermally Conductive Materials
GAP PAD®
7
Gap Pad
VO
40
25
15 15 20
40 40
55
64
Gap Pad
VO Soft Gap Pad
VO Ultra Soft HC1000 HC1100 Gap Pad
1500R Gap Pad
1500 Gap Pad
A2000 Gap Pad
A3000
0
70
60
50
40
30
20
10
Gap Pad Material
Gap Pad Thermal Conductivity Comparison
Thermal Conductivity (W/mK)
Gap Pad Material
Gap Pad Hardness Comparison
Bulk Hardness (Shore 00)
Gap Pad Material
Thermal Conductivity
Hardness
Gap Pad Overview Comparison
Thermal Conductivity (W/mK)
0
0.5
1.0
1.5
2.0
2.5
3.0
Gap Pad
VO
0.8 0.8 1.0 1.0 1.0
1.5 1.5
2.0
3.0
Gap Pad
VO Soft Gap Pad
VO Ultra Soft HC1000 HC1100 Gap Pad
1500R Gap Pad
1500 Gap Pad
A2000 Gap Pad
A3000
CONDUCTIVITY,HARDNESS AND GENERAL OVERVIEW
Gap Pad®Comparison Data
GAP PAD®
Frequently Asked Questions
QWhat thermal conductivity test method was used to achieve the
values given on the data sheets?
AThe Anter Quickline 10 was used to run this test. Bergquist has
published an application note about the modifications to the
ASTM D5470 test method to appropriately test Gap Pad materials
at low 10 psi pressure; see Bergquist Application Note #112.
QIs Gap Pad offered with an adhesive?
ACurrently the standard Gap Pads, which include Gap Pad VO,
Gap Pad VO Soft, and Gap Pad VO Ultra Soft are offered with or
without an adhesive on the SP800/900 carrier side of the material.
All other surfaces on the standard Gap Pad as well as the higher
performance Gap Pads, have naturally tacky surfaces.
QIs the adhesive repositionable?
ADepending on the surface being applied to, if care is taken, the pad may
be repositioned. Special care should be taken when removing the pad
from aluminum or anodized surfaces to avoid tearing or delamination.
QWhat is meant by naturally tacky?
AThe characteristic of the rubber itself has a natural inherent tack,
without the addition of an adhesive. As with adhesive backed prod-
ucts, the naturally tacky surfaces may help in the assembly process
to temporarily hold the pad in place while the application is being
assembled. Natural tack varies from one material to another and is
greatest for the Gap Pad VO Ultra Soft, Gap Pad VO Soft,
HC1000, Gap Pad 1500 and Gap Pad 1500R materials. Gap Pad
A2000 and Gap Pad A3000 have less natural tack due to their high
filler levels.
QIs the naturally tacky side of the Gap Pad repositionable?
AAgain, depending on the material that the pad is applied to, in most
cases they are repositionable. Again, care should be taken when
removing the pad from aluminum or anodized surfaces as to avoid
tearing or delaminating the pad. The naturally tacky side is always
easier to reposition then an adhesive side.
QIs Gap Pad reworkable?
ADepending on the application and the pad being used, Gap Pad has
been reworked in the past. Bergquist has customers that are current-
ly using the same pad for reassembling their applications after burn-
in processes and after fieldwork repairs. However, this is left up to
the design engineer ’s judgment as to whether or not the Gap Pad will
withstand reuse.
QWill heat make the material softer?
AIn the temperature range of -60 C to 200 C, there is no significant
variance in hardness.
QWhat is the life expectancy of Gap Pad?
AThe silicone rubber industry recognizes a twenty-year life for
silicone rubber when used within specified operation parameters.
Bergquist has made pad material that has been in applications for
some thirty years without any known signs of deterioration.
QWhat is the shelf life of Gap Pad?
AAverage shelf life is three (3) years, dependent upon the specific
material, tack requirements and type of liner. Please contact
Bergquist Sales for more information.
QWhat is the shelf life of Gap Pad with adhesive?
AThe standard Gap Pad VO materials come with an optional
silicone adhesive, which has a shelf life of six (6) months.
QWhat are the upper processing temperature limits for Gap Pad and
for how long?
AGap Pads that are pink, mauve or gold in color are more stable
at elevated temperatures. Gap Pad in general can be exposed to
temporary processing temperatures of 250 C for 5 minutes and
300 C for 1 minute.
QIs Gap Pad electrically isolating?
AYes, all Gap Pad materials are electrically isolating. However,
it has to be remembered that Gap Pad is designed to FILL gaps,
not for guaranteeing them in high stress applications.
QHow much force will the pad place on my device?
ARefer to the pressure vs. deflection charts on the data sheet for an
approximation and refer to Bergquist Application Note #116. Carefully
read the side notes on the data sheet regarding the test method used.
QWill Gap Pad work in my application (what size gaps will Gap Pad
accommodate)?
AWherever air can be replaced with a Gap Pad, such as between a heat
generating device and a heat sink, heat spreader or housing. This can be
done by using one sheet of Gap Pad or individual pieces of appropriate
thicknesses if stack-up tolerances and height variations are significant.
QWhat is meant by compliance and conformability, why is this impor-
tant?
AThe better a Gap Pad complies and conforms to a rough or stepped
surface, the less interfacial resistance will be present due to air
voids and air gaps. This leads to a lower overall thermal resistance
of the pad between the two interfaces.
QIs anything given off by the material (i.e. extractables, outgassing)?
A1: Gap Pad, like all silicone pads, can extract silicone fluid; refer to
Bergquist Application Note #56. It must also be noted that Gap Pad
has the lowest extraction value for gap filling products on the market.
2: Primarily for aerospace applications, Gap Pad outgassing data is
detailed in Bergquist Application Note #117, tested per ASTM E595.
QHow is extraction testing performed?
AThe test method used is the Bellcore Extraction method
#TR-NWT-000930; refer to Bergquist Application Note #56.
8
Gap Pad™ VO
Conformable, Thermally Conductive Material for Filling Air Gaps
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Pad VO is a thermally conductive cost effective
material that acts as a thermal interface between a heat
sink and an electronic device. The conformable nature of
Gap Pad VO allows the pad to fill in air gaps between PC
boards and heat sinks or a metal chassis.
Gap Pad VO is a filled thermally conductive polymer
supplied on a rubber coated fiberglass carrier allowing for
easy material handling and enhanced puncture, shear, and
tear resistance. The material is available in thickness from
0.020" to 0.250" with a removable liner applied to the
light pink side of the material. The range in thickness and
the materials flexibility allow Gap Pad VO to be used in a
variety of applications where surface texture vary and the
space between surfaces is uneven.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Typical Properties of Gap Pad VO
Property Typical Value Test
Method
Color Gold / Pink Visual
Thickness 0.020" to 0.250" ASTM D374
S
p
ecific Gravit
y
1.6
g
/cc ASTM D792
Heat Ca
p
acit
y
1.0 J/
g
-K ASTM C351
Thickness Hardness
Hardness
(Shore Type 00) .020" - .250" 80 - 40 ASTM D2240
Modulus Rate
Young’s Modulus psi
(1) 100 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >6 kV ASTM D149
Dielectric Constant 5.5 ASTM D150
Volume Resistivity
1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-O U.L.
Thermal
Thermal
Conductivity 0.8 W/m-K ASTM D5470
(1) Graphs and data generated from Young’s Modulus, calculated
using 0.01 inch/min. step rate of strain with a sample size of 0.79
inch2. For more information on Gap Pad modulus refer to
Bergquist Application Note #116.
Gap Pad VO is available in die-cut parts and sheets.
Standard sheet size is 8" X 16", with or without adhesive.
Pressure vs. Percent Deflection Gap Pad
0
5
10
15
20
25
30
35
40
45
50
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (Psi)
Thickness vs. Thermal Resistance Gap Pad
0
50
100
150
200
250
12345678910 11 12 13
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
Rev: Aug. 22, 2001
9
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
Gap Pad
®
VO
Color Mauve / Pink Visual
Thickness 0.020" to 0.160" ASTM D374
S
p
ecific Gravit
y
1.6
g
/cc ASTM D792
Heat Ca
p
acit
y
1.0 J/
g
-K ASTM C351
Modulus Rate
(
1
)
40 0.01"/min.
Dielectric Constant 5.5 ASTM D150
1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-O U.L.
10
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
Gap Pad
®
VO Soft
Gap Pad™ VO Ultra Soft
Additional Conformability & Thermal Conductivity for Filling Air Gaps
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Pad VO Ultra Soft is recommended for extremely low
stress applications that require a thermally conductive interface
material. The highly conformable nature of the material allows
the pad to fill in air voids and air gaps between PC boards and
heat sinks or metal chassis with steps, rough surfaces, and high
stack up tolerances. The viscoelastic nature of the material also
gives excellent low stress vibration dampening and shock
absorbing characteristics.
GP Ultra Soft is an electrically isolating material, which
allows its use in applications requiring isolation between heat
sinks and high voltage, bare leaded devices.
GP Ultra Soft is a filled thermally conductive polymer supplied
on a rubber coated fiberglass carrier allowing for easy material
handling and enhanced puncture, shear, and tear resistance.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.*
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Typical Properties of Gap Pad VO Ultra Soft
Property Typical Value Test
Method
Color Mauve / Pink Visual
Thickness 0.020" to 0.250" ASTM D374
S
p
ecific Gravit
y
1.6
g
/cc ASTM D792
Heat Ca
p
acit
y
1.0 J/
g
-K ASTM C351
Thickness Hardness
Hardness
(Shore Type 00) .020" - .250" 73 - 5 ASTM D2240
Modulus RateYoung’s Modulus psi
(
1
)
8 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >6 kV ASTM D149
Dielectric Constant 5.5 ASTM D150
Volume Resistivity 1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-O U.L.
Thermal
Thermal
Conductivity 1 W/m-K ASTM D5470
(1) Graphs and data generated from Young’s Modulus, calculated
using 0.01 inch/min. step rate of strain with a sample size of 0.79
inch2. For more information on Gap Pad modulus refer to
Bergquist Application Note #116.
GP Ultra Soft is offered in thickness from 0.020" to 0.250" with
the rubber-coated carrier on one side and removable protective
liner on the naturally tacky side of the material. Material is
available in die-cut parts and sheets, 0.020" material is also
offered in roll form. Standard sheet size is 8" X 16", with or
without adhesive.
Typical Applications
• Between chassis wall and other surface
• CDROM Cooling
• Area where heat needs to be transferred to a frame, chassis,
or other type of heat spreader.
• Between CPU and Heat Spreader
• Between a semiconductor and heat sink
Pressure vs. Percent Deflection Ultra Soft
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (Psi)
Thickness vs. Thermal Resistance Ultra Soft
0
25
50
75
100
125
150
175
200
225
250
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
Rev: Sept. 21, 2001
11
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
®
Gap Pad
®
VO Ultra Soft
Gap Pad™ 1500
High Thermally Conductive Gap Filling Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Pad 1500 is designed to cost-effectively maximize heat
transfer from electronic components to heat sinks or heat
spreaders. The material has an ideal filler blend that gives its
low modulus characteristic yet maintains optimal thermal
performance, the combination of which minimizes thermal
resistance between heat generating devices and heat sinks.
GP1500 is an electrically isolating material that allows its use in
applications requiring isolation between heat sinks and high
voltage, bare leaded devices.
GP1500 is a highly conformable low-modulus material that fills
air gaps due to steps, rough surfaces, and high stack-up
tolerances. The softness relieves stress and absorbs shocks
minimizing damage to delicate leads. The tacky nature of both
sides of the material allows for good compliance to adjacent
surfaces of components, minimizing interfacial resistance.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Typical Properties of Gap Pad 1500
Property Typical Value Test
Method
Color Black Visual
Thickness 0.020" to 0.200" ASTM D374
S
p
ecific Gravit
y
2.1
g
/cc ASTM D792
Heat Ca
p
acit
y
1.0 J/
g
-K ASTM C351
Hardness
(Shore Type 00) 40 ASTM D2240
Modulus Rate
Young’s Modulus psi
(1) 45 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >6 kVAC ASTM D149
Dielectric Constant 5.5 ASTM D150
Volume Resistivity 1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-O U.L.
Thermal
Thermal
Conductivity 1.5 W/m-K ASTM D5470
(1) Graphs and data generated from Young’s Modulus, calculated using 0.01 inch/min.
step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus refer to Bergquist Application Note #116.
GP1500 is available in thickness from 0.020" to 0.200". The
standard material is offered without reinforcement, however,
0.010", 0.015" and 0.020" thick materials are also offered with
reinforcement denoted as GP1500R.
Gap Pad 1500 is available in die-cut or sheet form with
protective liners on both sides. The material is compatible with
dispensing equipment for high volume production.
Typical Applications
Heat Pipe Assemblies
RDRAMTM Memory Modules
CDROM Cooling
Area where heat needs to be transferred to a frame, chassis, or
other type of heat spreader.
Between CPU and Heat Spreader
Rev. Aug. 22, 2001
Pressure vs. Percent Deflection GP1500
0
5
10
15
20
25
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (Psi)
Thickness vs. Thermal Resistance GP1500
0
20
40
60
80
100
120
140
160
180
200
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
12
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
®
Gap Pad
®
1500
Gap Pad™ 1500R
High Thermally Conductive Gap Filling Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Pad 1500R has the same highly conformable low modulus
polymer as the standard GP1500 family of products with the
addition of a fiberglass reinforcing substrate in the center. The
fiberglass enforcement allows for easy material handling and
enhances puncture, shear, and tear resistance.
GP1500R is an electrically isolating material that allows its use
in applications requiring isolation between heat sinks and high
voltage, bare leaded devices.
GP1500R has an ideal polymer and filler blend that gives its
low modulus characteristic yet maintains optimal thermal
performance, minimizing thermal resistance. The highly
conformable low-modulus nature of the material fills air gaps
due to rough surfaces and high stack-up tolerances and is also
vibration dampening. The tacky nature of both sides of the
material allows for good compliance to mating surfaces of
components, further reducing thermal resistance.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.*
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Typical Properties of Gap Pad 1500R
Property Typical Value Test
Method
Color Black Visual
Thickness 0.010" to 0.020" ASTM D374
S
p
ecific Gravit
y
2.1
g
/cc ASTM D792
Heat Ca
p
acit
y
1.3 J/
g
-K @ 85 C ASTM C351
Hardness
(Shore Type 00) 75 (@ 20 mils) ASTM D2240
Modulus Rate
Young’s Modulus psi
(1) 45 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >6 kVAC ASTM D149
Dielectric Constant 6.0 ASTM D150
Volume Resistivity 1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-O U.L.
Thermal
Thermal
Conductivity 1.5 W/m-K ASTM D5470
(1) Graphs and data generated from Young’s Modulus @ 10% deflection, calculated
using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2 and 20 mils thick.
For more information on Gap Pad modulus refer to Bergquist Application Note #116.
GP1500R is available in 0.010", 0.015", & 0.020" thickness
and is available in 8" x 16" sheets, die-cut parts, and rolls in
converted or unconverted form. GP1500R is offered with
removable protective liners on both sides of the material.
GP1500R is compatible with dispensing equipment for high
volume production.
Typical Applications
Heat Pipe Assemblies
RDRAMTM Memory Modules
CDROM Cooling
Area where heat needs to be transferred to a frame, chassis, or
other type of heat spreader.
Between CPU and Heat Spreader
Rev. Aug. 22, 2001
Pressure vs. Percent Deflection GP1500R @20mil
0
25
50
75
100
125
150
175
200
225
250
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (Psi)
Thickness vs. Thermal Resistance GP1500R
10
12
14
16
18
20
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
13
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
®
Gap Pad
®
1500R
Gap Pad™ A2000
High Performance Thermally Conductive Gap Filling Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Pad A2000 is a highly conductive low modulus
material that acts as a thermal interface between electrical
components and heat sinks. The conformable nature
allows the material to fill air gaps to enhance the thermal
performance of electrical systems.
This high thermally conductive reinforced material is
available in thickness from 0.010" to 0.040". Material in
the thickness range of 10 to 20 mil is supplied with natural
tack on both sides of the material, allowing for excellent
compliance to the adjacent surfaces of components. The
40 mil material thickness is supplied with tack on one side
only, allowing for burn-in processes and easy rework.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.
Example: 0.020" thickness at 60psi yields 20% (0.20) deflection.
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Example: 0.020" * 0.20 = 0.004" Deflection
Resultant Thickness: 0.020" – 0.004" = 0.016"
Thermal Resistance: 0.32 °C in2/watt
Typical Properties of Gap Pad A2000
Property Typical Value Test
Method
Color Gre
y
Visual
Thickness 0.010" to 0.040" ASTM D374
S
p
ecific Gravit
y
2.9
g
/cc ASTM D792
Heat Ca
p
acit
y
1.0 J/
g
-K ASTM C351
Thickness Hardness
Hardness
(Shore Type 00) 0.020" 80 ASTM D2240
Modulus Rate
Young’s Modulus (1)
(psi) 55 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >3 kV ASTM D149
Dielectric Constant 5 ASTM D150
Volume Resistivity 1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-O U.L.
Thermal
Thermal
Conductivity 2.0 W/m-K ASTM D5470
(1) Graphs and data generated from Young’s Modulus, calculated using 0.01 inch/min.
step rate of strain with a sample size of 0.79 inch2on 20-mil material. For more
information on Gap Pad modulus refer to Bergquist Application Note #116.
Gap Pad A2000 is available in die-cut parts and in roll
form (converted or unconverted). The material is
compatible with dispensing equipment for high volume
production.
Typical Applications
Heat Pipe Assemblies
RDRAMTM Memory Modules
CDROM Cooling
Area where heat needs to be transferred to a frame,
chassis, or other type of heat spreader.
Between CPU and Heat Spreader
Rev. Au
g
. 22
,
2001
Pressure vs. Percent Deflection GPA2000 @ 20 mil
0
20
40
60
80
100
120
140
160
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (psi)
Thickness vs. Thermal Resistance GPA2000
10
15
20
25
30
35
40
0.2 0.3 0.4 0.5 0.6 0.7 0.8
Thermal Resistance (deg C*sq in/W)
Thickness (mil)
14
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
®
Gap Pad
®
A2000
Gap Pad™ A3000
Improved High Performance Gap Pad Material, One Side Tacky
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Pad A3000 is a highly conductive gap filling material
that acts as a thermal interface between electrical
components and heat sinks. This material maintains a
conformable nature, which allows it to fill air gaps and
enhance the thermal performance of electrical systems.
Gap Pad A3000 is an electrically isolating material, which
allows its use in applications requiring isolation between
heat sinks and high voltage, bare leaded devices.
Gap Pad A3000 is a thermally conductive filled polymer
laminate, supplied on a reinforcing mesh for easy material
handling and enhanced puncture, shear, and tear
resistance.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.
Example: 0.020" thickness at 100psi yields 20% (0.20) deflection.
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Example: 0.020" * 0.20 = 0.004" Deflection
Resultant Thickness: 0.020" – 0.004" = 0.016"
Thermal Resistance: 0.22 °C in2/watt
Typical Properties of Gap Pad A3000
Property Typical Value Test
Method
Color Gold Visual
Thickness 0.010" to 0.020" ASTM D374
Specific Gravity 3.2 g/cc ASTM D792
Heat Capacity 1.0 J/g-K ASTM C351
Thickness Hardness
Hardness
(Shore Type 00) 0.020" 80 ASTM D2240
Modulus RateYoung’s Modulus (1)
(psi) 50 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >5 kV ASTM D149
Dielectric Constant 7 ASTM D150
Volume Resistivity 1011 Ohm-meter ASTM D257
Flame Rating 94 V-O (pending) U.L.
Thermal
Thermal
Conductivity 3.0 W/m-K ASTM
D5470
(1) Graphs and data generated from Young’s Modulus, calculated using 0.01 inch/min.
step rate of strain with a sample size of 0.79 inch2 on 20 mil material. For more
information on Gap Pad modulus refer to Bergquist Application Note #116.
Gap Pad A3000 is inherently tacky on one side for stick-
in-place characteristics while offering a non blocking
surface on the other for burn-in and rework processes.
Gap Pad A3000 is available in 0.010", 0.015", & 0.020"
thickness and is offered in 8" x 16" sheets, die-cut parts,
and rolls in converted or unconverted form. Gap Pad
A3000 is offered with removable protective liners on both
sides of the material.
Typical Applications
• CPU & Heat Pipe Assemblies
• CDROM Cooling
• Burn-in Processes
• Graphic Chip Cooling
• Area where heat needs to be transferred to a frame,
chassis, or other type of heat spreader.
Rev: Aug. 22, 2001
Pressure vs. Percent Deflection GPA3000 @ 20 mils
0
50
100
150
200
250
300
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (psi)
Thickness vs. Thermal Resistance GPA3000
5
8
10
13
15
18
20
0.05 0.1 0.15 0.2 0.25 0.3
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
15
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
®
Gap Pad
®
A3000
HC1000
“Gel-Like” Modulus Gap Filling Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Pad HC 1000 is an extremely conformable low
modulus polymer that acts as a thermal interface between
electrical components and heat sinks. The “gel-like”
modulus allows this material to fill air gaps to enhance the
thermal performance of electrical systems.
The tacky nature of both sides of the material allows for
good compliance and excellent conformability to adjacent
surfaces of components.
This thermally conductive reinforced material is available
in thickness from 0.010" to 0.020".
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Typical Properties of HC1000
Property Typical Value Test
Method
Color Gre
y
Visual
Thickness 0.010" to 0.020" ASTM D374
S
p
ecific Gravit
y
1.6
g
/cc ASTM D792
Heat Ca
p
acit
y
1.0 J/
g
-K ASTM C351
Hardness
(Shore Type 00) 60 (@ 20 mils) ASTM D2240
Modulus Rate
Young’s Modulus psi
(1) 15 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >5 kVAC ASTM D149
Dielectric Constant 6.0 ASTM D150
Volume Resistivity 1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-O U.L.
Thermal
Thermal
Conductivity 1.0 W/m-K ASTM D5470
(1) Graphs and data generated from Young’s Modulus @ 10% deflection, calculated
using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2 and 20 mils thick.
For more information on Gap Pad modulus refer to Bergquist Application Note #116.
Gap Pad HC1000 is available in 0.010", 0.015", & 0.020"
thickness and is offered in 8" x 16" sheets, die-cut parts,
and rolls in converted or unconverted form. Gap Pad
HC1000 is offered with removable protective liners on
both sides of the material.
Typical Applications
Areas where irregular surfaces need to make a thermal
interface to a heat sink.
RDRAMTM Memory Modules
Heat interfaces to frames, chassis, or other heat
spreading devices.
CDROM Cooling
Between CPU and Heat Spreader
Rev. Aug. 22, 2001
Thickness vs. Thermal Resistance HC1100
10
12
14
16
18
20
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
Pressure vs. Percent Deflection HC1100 @20 mil
0
20
40
60
80
100
120
140
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (Psi)
16
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
HC1100
Gap Filling Material with “Gel-Like” Modulus, One Sided Tack
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
HC1100 is a cost-effective material, recommended for
extremely low stress applications that require a thermally
conductive interface material. The highly conformable
nature of the material allows the pad to fill in air voids and
air gaps between heat generating devices and heat sinks or
metal chassis with rough surfaces, steps, and high stack up
tolerances. This thermally conductive reinforced material
is available in thickness from 0.015" & 0.020".
HC1100 is offered with tack on the bottom side only!
This material simplifies material handling for part
dispensing and pick-and-place automation. The top, tack-
free surface does not require a protective liner since it does
not attract dust and dirt from surrounding areas.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Typical Properties of HC1100
Property Typical Value Test
Method
Color Gre
y
Visual
Thickness 0.015" to 0.020" ASTM D374
S
p
ecific Gravit
y
1.6
g
/cc ASTM D792
Heat Ca
p
acit
y
1.0 J/
g
-K ASTM C351
Hardness
(Shore Type 00) 60 (@ 20 mils) ASTM D2240
Modulus Rate
Young’s Modulus psi
(1) 15 0.01"/min. ASTMD575
Continuous Use
Temp. -60°C to 200°C
Electrical
Dielectric Breakdown
Voltage >5 kVAC ASTM D149
Dielectric Constant 6.0 ASTM D150
Volume Resistivity 1011 Ohm-meter ASTM D257
Flame Ratin
g
94 V-1 U.L.
Thermal
Thermal
Conductivity 1.0 W/m-K ASTM D5470
(1) Graphs and data generated from Young’s Modulus @ 10% deflection, calculated
using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2 and 20 mils thick.
For more information on Gap Pad modulus refer to Bergquist Application Note #116.
HC1100 is viscoelastic, which gives it excellent low stress vibration
dampening and shock absorbing characteristics. HC1100 is an
electrically isolating material, allowing for its use between high
voltage, bare leaded devices and metal sinks.
HC1100 is a filled thermally conductive polymer supplied with an
imbedded reinforcement resulting in improved material handling and
enhanced puncture, shear, and tear resistance.
Gap Pad HC1100 is available in 0.015" & 0.020" thickness and is
available in 8" x 16" sheets, die-cut parts, and rolls in converted or
unconverted form. Gap Pad HC1100 is offered with removable
protective liners on both sides of the material. Gap Pad HC1100 is
compatible with dispensing equipment for high volume production.
Typical Applications
Areas where irregular surfaces need to make a thermal interface to
a heat sink.
RDRAMTM Memory Modules
Heat interfaces to frames, chassis, or other heat spreading devices.
For ASIC and PC Cooling
Between CPU and Heat Spreader
Rev. Aug. 22, 2001
Thickness vs. Thermal Resistance HC1100
10
12
14
16
18
20
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
Pressure vs. Percent Deflection HC1100 @20 mil
0
20
40
60
80
100
120
140
051015 20 25 30 35 40 45 50
Percent Deflection (%)
Pressure (Psi)
17
GAP PAD®
Gap Pad®: U.S. Patent 5,679,457 and others.
Gap Filler™ 1000
Thermally Conductive Liquid Gap Filling Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Filler 1000 is a high performance thermally conductive
liquid GAP FILLING MATERIAL. It is supplied as a two-
component, room or elevated temperature curing system. It is
formulated to provide a balance of cured material properties
highlighted by “gel-like” modulus and good compression set
(memory). These properties result in a soft, thermally
conductive, form-in-place elastomer ideal for coupling “hot”
electronic components mounted on PC boards with an adjacent
metal case or heat sink. The viscosity of the mixed uncured
material also makes it suitable as a thermally conductive
alternative in the following applications:
• Replacement for thermal grease – Before cure, it flows
under pressure like a grease. After cure, it does not pump
from the interface as a result of thermal cycling. Unlike
thermal grease, the cured product is dry to the touch.
• As a low modulus thermally conductive potting material.
• As a thermally conductive vibration dampening material.
Gap Filler 1000 is supplied as a two-part kit comprised of Part A
and Part B components. The two components are colored to
assist as a mix indicator (1:1 ratio by weight or volume). The
mixed system will cure at either ambient or elevated temperature
to form a soft thermally conductive interface material. Unlike
cured Gap Filling materials, the liquid approach offers infinite
thickness with little or no stress during displacement. It also
eliminates the need for specific pad thickness and die-cut shapes
for individual applications.
Gap Filler 1000 is intended for use in thermal interface
applications where a structural bond is not a requirement. This
material is formulated for low cohesive strength and “gel-like”
properties.
This product is characterized by these special properties:
• High Thermal Conductivity – 1.0 W/m-K
• Stress Absorbing Flexibility (low modulus)
• “Clean-Release” from many heat sink and electronic
packaging materials (re-workable)
• Excellent Low and High Temperature Mechanical and
Chemical Stability
• 100% Solids – No Cure By-Products
• Versatile Cure Schedules – Both Ambient and Accelerated
Cure Schedules
Gap Filler 1000 is available in standard 50 cc, 200 cc, or 400 cc
MixPacTM cartridges. It is also available in 2 Gallon and 10
Gallon Kits.
Typical Properties of Gap Filler 1000
Property Typical Value Test Method
As Supplied
Appearance Part A Grey Visual
Appearance Part B White Visual
Viscosity As Mixed (1) 100,000 cps ASTM
Specific Gravity 1.63 ASTM D792
Mix Ratio 1:1
Shelf Life @ 25°C6 months
As Cured – Physical
Appearance Grey Visual
Hardness Shore Type “00” 30 ASTM D2240
Continuous Use Temp -60°C - +175°C
Heat Capacity 1 J/g-K ASTM C351
Thermal Conductivity 1.0 W/mK ASTM D5470
Flame Rating 94 V-O U.L.
As Cured-Electrical
Dielectric Strength 500 Volts/mil ASTM D149
Volume Resistivity 1E +14 ohm-cm ASTM D257
Dielectric Constant 5 @ 1 MHz ASTM D150
Cure Schedule
Pot Life @ 25 °C15 min (2)
Cure @ 25 °C60 – 120 min (3)
Cure @ 100 °C5 min (3)
(1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25 °C
(2) Time for viscosity to double
(3) Cure Schedule (Rheometer – Time to reach 90% cure)
Application
Gap Filler 1000 can be applied using the following methods:
• Mixed and dispensed using dual tube cartridge packs with
static mixers and a manual or pneumatic gun
• Mixed and dispensed using industry standard high volume
mixing and dispensing equipment
Rev. Aug. 22, 2001
Thickness vs Thermal Resistance
0
50
100
150
200
250
300
01234567891011
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
18
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
Gap Filler 1000
Gap Filler™ 2000
High Performance Thermally Conductive Liquid Gap Filling Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Gap Filler 2000 is a high performance thermally conductive
liquid GAP FILLING MATERIAL. It is supplied as a two-
component, room or ele vated temperature curing system. It is
formulated to provide a balance of cured material properties
highlighted by “gel-like” modulus and good compression set
(memory). These properties result in a soft, thermally
conductive, form-in-place elastomer ideal for coupling “hot”
electronic components mounted on PC boards with an adjacent
metal case or heat sink. The viscosity of the mixed uncured
material also makes it suitable as a thermally conductive
alternative in the following applications:
• Replacement for thermal grease – Before cure, it flows
under pressure like a grease. After cure, it does not pump
from the interface as a result of thermal cycling. Unlike
thermal grease, the cured product is dry to the touch.
• As a low modulus thermally conductive potting material.
• As a thermally conductive vibration dampening material.
Gap Filler 2000 is supplied as a two-part kit comprised of Part A
and Part B components. The two components are colored to
assist as a mix indicator (1:1 ratio by weight or volume). The
mixed system will cure at either ambient or elevated temperature
to form a soft thermally conductive interface material. Unlike
cured Gap Filling materials, the liquid approach offers infinite
thickness with little or no stress during displacement. It also
eliminates the need for specific pad thickness and die-cut shapes
for individual applications.
Gap Filler 2000 is intended for use in thermal interface
applications where a structural bond is not a requirement. This
material is formulated for low cohesive strength and “gel-like”
properties.
This product is characterized by these special properties:
• High Thermal Conductivity – 2.0 W/m-K
• Stress Absorbing Flexibility (low modulus)
• “Clean-Release” from many heat sink and electronic
packaging materials (re-workable)
• Excellent Low and High Temperature Mechanical and
Chemical Stability
• 100% Solids – No Cure By-Products
• Versatile Cure Schedules – Both Ambient and Accelerated
Cure Schedules
Gap Filler 2000 is available in standard 50 cc, 200 cc, or 400 cc
MixPacTM cartridges. It is also available in 2 Gallon and 10
Gallon Kits.
Typical Properties of Gap Filler 2000
Property Typical Value Test Method
As Supplied
Appearance Part A Pink Visual
Appearance Part B White Visual
Viscosity As Mixed (1) 300,000 cps ASTM
Specific Gravity 2.8 ASTM D792
Mix Ratio 1:1
Shelf Life @ 25°C6 months
As Cured – Physical
Appearance Pink Visual
Hardness Shore Type “00” 70 ASTM D2240
Continuous Use Temp -60°C - +200°C
Heat Capacity 1 J/g-K ASTM C351
Thermal Conductivity 2.0 W/mK ASTM D5470
Flame Rating 94 V-O Pending U.L.
As Cured-Electrical
Dielectric Strength 500 Volts/mil ASTM D149
Volume Resistivity 1E +14 ohm-cm ASTM D257
Dielectric Constant 7 @ 1 MHz ASTM D150
Cure Schedule
Pot Life @ 25 °C15 min (2)
Cure @ 25 °C60 – 120 min (3)
Cure @ 100 °C5 min (3)
(1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25 °C
(2) Time for viscosity to double
(3) Cure Schedule (Rheometer – Time to reach 90% cure)
Application
Gap Filler 2000 can be applied using the following methods:
• Mixed and dispensed using dual tube cartridge packs with
static mixers and a manual or pneumatic gun
• Mixed and dispensed using industry standard high volume
mixing and dispensing equipment
Rev. Au
g
. 22
,
2001
Thickness vs Thermal Resistance
0
50
100
150
200
250
300
0123456
Thermal Resistance (deg C*sq in/W)
Thickness (mils)
19
Gap Pad®: U.S. Patent 5,679,457 and others.
GAP PAD®
Gap Filler 2000
HI-FLOW®
20
Hi-Flow®"phase change" materials are an excellent replacement for
grease as a thermal interface between a CPU or power device and a
heat sink. Hi-Flow materials change from a solid at specific phase
change temperatures and flow to assure a total wet-out of the
interface – without overflow. The result is a thermal interface
comparable to grease,without the mess, contamination and hassle .
The Hi-Flow family of phase change thermal interface materials covers
a wide range of applications. The Bergquist Company is a leader in
thermal management solutions and works closely with customers to
ensure that the proper Hi-Flow material is specified.
Use phase change materials f or excellent thermal
performance without the mess of gr ease
FEATURES
Hi-Flow handles like Bergquist’s
famed Sil-Pad®materials at room
temperature, but flows like grease at
its designed phase change temperature.
Following is an overview of the
important features shared by the
Hi-Flow family.
• Comparable thermal performance
to mica or grease assemblies
• Thermally conductive phase
change compound
• Aluminum, film or fiberglass
carriers
• Low volatility
• Easy to handle and apply in the
manufacturing environment
• Tack-free and scratch-resistant at
room temperature
BENEFITS
Using Hi-Flow materials instead of
grease can save time and money
without sacrificing thermal perform-
ance. Here are some other benefits:
• No mess – thixotropic characteristics
of the materials keep it from flowing
out of the interface
• Easier handling – not tacky at
room temperature
• Does not require protective liner
• High thermal performance
helps ensure CPU reliability
• Does not attract contaminants
• Easier material handling and
shipping
• Simplified application process
OPTIONS
The broad Hi-Flow family offers a
variety of choices to meet the
customer’s performance, handling
and process needs. Some of the
choices include:
• Available with or without adhesive
• Aluminum carrier for applications
not requiring electrical isolation
• Film or fiberglass carrier for
electrical isolation
• Dry, non-reinforced material
• Tabbed parts, punch parts, sheets
or rolls
• Adhesive specifically for cold
application without preheating
heat sink
APPLICATIONS
Hi-Flow materials are suited for
consumer and industrial electronics,
automotive, medical, aerospace and
telecommunications applications
such as:
• UPS and SMPS AC/DC, DC/DC or
linear power supplies
• Between a CPU and heat sink,
including 700+ MHz chips
• Power conversion devices
• Fractional and integral motor
control
• Leaded, surface mount and power
module assemblies
SOLUTION-DRIVEN THERMAL MANAGEMENT PRODUCTS FOR ELECTRONIC DEVICES
Hi-Flow®Phase Change Interface Materials
HI-FLOW®
1.40
10 25 50 100 200
1.20
1.00
0.80
0.60
0.40
0.20
10 25 50 100 200
2.10
2.20
2.30
2.00
1.90
1.80
1.70
1.60
1.50
Interface Pressure, psi
Hi-Flow Grease Replacement Materials (Insulating) TO-220 Thermal Performance
Thermal Performance , ˚C/W
Interface Pressure, psi
Grease Replacement Materials TO-220 Thermal Performance
Hi-Flow Grease Replacement Materials (Non-Insulating) TO-220 Thermal Performance
Thermal Performance , ˚C/W
Interface Pressure, psi
Thermal Performance , ˚C/W
Hi-Flow 115-AC
Hi-Flow 200G
Hi-Flow 105
Hi-Flow 225F-AC
Hi-Flow 225UT
Hi-Flow 225U
21
Hi-Flow 625
Hi-Flow 818
HF 625
HF 200R
HF 818
10 25 50 100 200
1.70
1.90
2.10
2.30
2.50
1.50
1.30
1.10
0.90
0.70
0.50
Q3
Q2
Hi-Flow 115-AC
Hi-Flow 105
TO-220 THERMAL PERFORMANCE
Hi-Flow®Comparison Data
Hi-Flow™ 105
Hi-Flow Coated Aluminum
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Hi-Flow 105 is a “phase change” material
designed specifically to replace grease as
a thermal interface. Hi-Flow 105 is a filled
polymer and is available in a pad form for
easier handling and installation.
At 65 oC (Phase Change Temperature),
Hi-Flow 105 changes from a solid and
flows thereby assuring total wet-out of the
interface. The thixotropic characteristics
of the material keep Hi-Flow 105 from
flowing out of the interface. The result is a
thermal interface comparable to grease,
without the mess, contamination and
difficult handling associated with grease.
Hi-Flow 105 has thermal performance
equal to grease with 0.10 oC-in2 / W
contact thermal resistance. Hi-Flow 105 is
used in applications where electrical
isolation is not required.
Typical applications for Hi-Flow 105
include CPUs mounted on a heat sink,
power conversion modules or any other
spring or clip mount application where
grease is used.
Hi-Flow 105 is coated on both sides of the
aluminum substrate. The product is
available with or without thermal acrylic
adhesive to aid in positioning.
Typical Properties of Hi-Flow 105
Physical Property Typical Value Test Method
Color Dark Gray Visual
Thickness 0.0055" ASTM D374
Phase Change Temperature 65 oCDSC
Continuous use Temp. -30 oC to +130 oC
Electrical
Dielectric Constant, 100Hz 3.2 ASTM D150
Flame Rating 94 V-O U.L.
Thermal
Thermal Conductivity (2) 0.9 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 0.95 0.80 0.74 0.69 0.64
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.39 0.37 0.36 0.33 0.30
1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was
conditioned at 70 oC prior to test. The recorded value includes interfacial thermal
resistance. These values are given to the customer for reference only. Actual application
performance is directly related to the surface roughness, flatness and pressure applied.
2). This is the measured thermal conductivity of the Hi-Flow coating. It represents one
conducting layer in a three-layer laminate. The Hi-Flow coatings are phase change
compounds. These layers will respond to heat and pressure induced stresses. The overall
conductivity of the material in post-phase change, thin film products is highly dependent
upon the heat and pressure applied. This characteristic is not accounted for in ASTM
D5470. Please contact Bergquist Product Management if additional specifications are
required.
Hi-Flow 105 features include:
• Available in pad form as punched parts, sheets or rolls
• Low volatility – less than 1%
• Easy to handle in the manufacturing environment
• Flows but doesn’t run like grease or wax under continuous heat or in
vertical applications.
• Tack Free & Scratch Resistant at room temperature. Does not require a
protective liner in shipment when attached to heat sink.
Rev: October 4, 2001
Heat Sink
Power Device
Hi-Flow 105
22
Hi-Flow®:
U.S. Patent
4,950,066
and others.
HI-FLOW®
Hi-Flow
®
105
Hi-Flow™ 115-AC
Phase Change Thermal Interface Material for Computer Processors
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-22700-7795
Bergquist Hi-Flow 115-AC is a thermally
conductive fiber reinforced phase change
material. The product consists of a
thermally conductive 65oC phase change
compound coated on a fiberglass web, and
an adhesive coating one side for
attachment to cold heat sink.
Hi-Flow 115 is designed as a thermal
interface material between an computer
processor and a heat sink. The pressure
sensitive adhesive makes it simple to
apply in high volume to heat sinks and the
65oC phase change temperature eliminates
shipping and handling problems.
Hi-Flow 115-AC can be applied directly
to a cold heat sink. No need to preheat
the heat sink to apply the Hi-Flow 115
AC.
Hi-Flow 115-AC requires no protective
liner for shipping or handling. The Hi-
Flow coating is tough at room
temperature, and it can withstand the
handling and shipping process without
protection.
Hi-Flow 115-AC handles like a
Sil Pad at room temperature and flows
like high quality grease at elevated
temperature.
Hi-Flow 115-AC thermal resistance of
0.18 °C in2/watt at 50 psi.
Typical Properties of Hi-Flow 115-AC
Physical Property Typical Value Test Method
Color Gray Visual
Thickness 0.0055" ASTM D374
Tensile Strength 900 psi ASTM D882A
Elongation 40% ASTM D882A
Phase Change Temperature 65 oCDSC
Continuous use Temp. 150 oC
Electrical
Breakdown Voltage 300 volt ASTM D149
Dielectric Constant, 100Hz 3.5 ASTM D150
Volume Resistivity, Ohm-meter > 1010 ASTM D257
Adhesive
Peel Strength 70 g/in ASTM D1876
Release Peel 25 g/in ASTM D1876
Thermal
Thermal Conductivity (2) 0.8 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 1.28 1.16 1.04 0.94 0.85
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.44 0.37 0.35 0.27 0.15
1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was
conditioned at 70 oC prior to test. The recorded value includes interfacial thermal resistance. These
values are given to the customer for reference only. Actual application performance is directly related
to the surface roughness, flatness and pressure applied.
2). This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting
layer in a three-layer laminate. The Hi-Flow coatings are phase change compounds. These layers will
respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase
change, thin film products is highly dependent upon the heat and pressure applied. This characteristic
is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional
specifications are required.
Hi-Flow 115-AC is available without adhesive for slightly better thermal
performance. The thermal resistance is 0.15 °C in2/watt at 50 psi.
Heat Sink
Power Device
Hi-Flow 115-AC
Rev: October 4, 2001
23
Hi-Flow®: U.S. Patent 4,950,066 and others.
HI-FLOW®
Hi-Flow
®
115-AC
Hi-Flow™ 200-G
Fiber Glass Reinforced, Phase Change Thermal Interface Material
Thermal Interface Material for High Performance Computer Processors
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Hi-Flow 200-G is a thermally conductive
phase change material. The product
consists of a thermally conductive 55 oC
phase change compound coated on a fiberglass
web. Hi-Flow 200-G is designed as a thermal
interface material between a computer
processor and a heat sink.
Above the phase change temperature, Hi-Flow
200-G wets out the thermal interface surfaces
and flows to produce the lowest thermal
impedance. Hi-Flow 200-G requires pressure
of the assembly to cause flow. Hi-Flow 200-G
will not drip or run like grease.
Bergquist suggests the use of spring clips to
assure constant pressure on the interface. The
spring pressure that will deliver the optimum
thermal performance is 50 psi as shown by the
Table #1.
Application Methods:
Hand-apply to 40-50 oC heat sink. The heat sink is
heated in oven or heat gun to between 40-50oC,
and then the Hi-Flow 200-G pad is applied like and
adhesive pad. The heat sink is cooled to room
temperature and packaged.
Hand-apply to 20-35 oC heat sink. Hi-Flow 200-G
can be applied to a room temperature heat sink with
the assistance of a foam roller. The pad is
positioned onto the heat sink and a hand roller is
used to apply pressure of 30psi.
Automated equipment with 30 psi pressure. A
pick and place automated dispensing unit can be
used to apply Hi-Flow 200-G to a room temperature
heat sink. The placement head should have a soft
silicone rubber pad, and apply 30psi pressure to the
pad on transfer to the 20-35 oC heat sink.
Typical Properties of Hi-Flow 200-G
Physical Property Typical Value Test Method
Color Blue Visual
Thickness 0.006" ASTM D374
Tensile Strength 400 psi ASTM D882A
Elongation 40% ASTM D882A
Phase Change Temperature 55 oCDSC
Continuous use Temp. 100 oC
Electrical
Breakdown Voltage 300 volt
Dielectric Constant, 100Hz 3.5 ASTM D150
Volume Resistivity, Ohm-meter > 108ASTM D257
Flame Rating V-O U.L.
Thermal
Thermal Conductivity (2) 1.6 W/m-K ASTM D5470
Thermal Impedance vs. Pressure / Table #1
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 0.96 0.92 0.88 0.86 0.83
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.17 0.16 0.16 0.14 0.14
1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test
sample was conditioned at 60 oC prior to test. The recorded value includes
interfacial thermal resistance. These values are given to the customer for
reference only. Actual application performance is directly related to the surface
roughness, flatness and pressure applied.
2). This is the measured thermal conductivity of the High Flow coating. It
represents one conducting layer in a three-layer laminate. The High Flow coatings
are phase change compounds. These layers will respond to heat and pressure
induced stresses. The overall conductivity of the material in post-phase change,
thin film products is highly dependent upon the heat and pressure applied. This
characteristic is not accounted for in ASTM D5470. Please contact Bergquist
Product Management if additional specifications are required.
Hi-Flow 200-G has a patent pending design that eliminates the need for a
protective liner on the material during shipping.
Heat Sink
Microprocessor
Hi-Flow 200-G
Rev: October 1, 2001
24
Hi-Flow®: U.S. Patent 4,950,066 and others.
HI-FLOW®
Hi-Flow
®
200G
Fiberglass Reinforced, Phase Change Thermal Interface Material
Hi-Flow™ 225 F-AC
Reinforced Phase Change Thermal Interface Material
Thermal Interface Material for High Performance Computer Processors
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the
product for its intended use and the user assumes all risks and liability whatsoever in connection therewith NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE
Hi-Flow 225 F-AC (HF225 F-AC) is
designed as a foil-reinforced, adhesive
backed version of HF225 F. HF225 F-AC
is a high performance, thermal interface
material for use between a computer
processor and a heatsink. HF225 F-AC
consists of a soft, thermally conductive
55oC phase change compound coated to the
top surface of an aluminum carrier with a
soft, thermally conductive adhesive
compound coated to the bottom surface to
improve adhesion to the heatsink.
HF225 F-AC, above the 55oC phase
change temperature, wets out the thermal
interface surfaces and flows to produce the
lowest thermal impedance. HF225 F-
AC requires pressure from the assembly to
cause material flow. The Hi-Flow
coatings will not drip in vertical
orientation.
Bergquist suggests the use of spring clips,
or the like, to assure constant pressure on
the interface. Minimal thermal
performance gains are seen with increasing
interfacial pressures above 50 psi.
HF225 F-AC is available in roll form with
kiss-cut parts. The material as delivered
will include a base carrier liner with
differential release properties to facilitate
simplicity in roll form packaging and
application assembly. Please contact
Product Management for applications that
are less than 0.7" square.
Typical Properties of Hi-Flow 225 F-AC
Physical Property Typical
Value Metric
Value Test
Method
Color Black Black Visual
Total Thickness 0.004
inch 0.102
mm ASTM D374
Aluminum Foil Thickness 0.0015 inch 0.038 mm ASTM D374
Phase Change Temperature 131 oF 55 oC DSC
Continuous Use Temperature 248 oF 120 oC TGA Kinetics
Thermal Material Value
Hi-Flow 1.0 W/m-K
Thermal Conductivity (2) Adhesive 0.7 W/m-K ASTM D5470
Thermal Impedance vs Pressure
Pressure, psi 25 50 100 200
TO-220 Thermal Performance, oC/W 0.68 0.57 0.50 0.45
Thermal Impedance Per ASTM D5470, (1)
oC-in2 / W 0.10 0.09 0.08 0.07
1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test sample was
conditioned at 60 oC prior to test. The recorded value includes interfacial thermal
resistance. These values are given to the customer for reference only. Actual application
performance is directly related to the surface roughness, flatness and pressure applied.
2). This is the measured thermal conductivity of the Hi-Flow coating only (per Bergquist
Modified ASTM-D5470). The lamination typically includes a base layer of 1.5 mil
aluminum foil with a top coating of 2-mil Hi-Flow compound and bottom coating of 2-mil
adhesive compound. The Hi-Flow coatings are phase-change, thixotropic compounds and
thus respond via compressive flow to heat and pressure induced stress. Knowing the
average final thickness of the interface, the overall apparent thermal conductivity of the
laminate can be estimated via back-calculation (ref: L = K θ) of the Bergquist Modified
ASTM-D5470 test results stated. This statement assumes negligible interfacial thermal
resistance. Please contact your Bergquist Sales Representative or Bergquist Inside Sales if
additional specifications are required.
Application Methods:
HF225 F-AC roll form piece parts can be manually or automatically applied
to the surfaces of room temperature heat sinks. The adhesive side (or bottom
side) of the HF225 F-AC pad will adhere with low level tack to a heat sink
surface. See Product Management for additional information concerning
automated dispensing applications.
Heat Sink
Microprocessor
Hi-Flow 225 F-AC
Adhesive Side (Top)
Dry Side (Bottom)
Rev: October 10, 2001
25
Hi-Flow®: U.S. Patent 4,950,066 and others.
HI-FLOW®
Hi-Flow
®
225F-AC
Reinforced Phase Change Thermal Interface Material
Hi-Flow™ 225-U
Non-Reinforced Phase Change Thermal Interface Material
Thermal Interface Material for High Performance Computer Processors
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Hi-Flow 225-U is designed as a thermal
interface material between a computer
processor and a heat sink. Hi-Flow 225-U
is a thermally conductive phase change
material supplied on carrier liner. The
product consists of a thermally conductive
55oC phase change compound coated on
red release liner. Hi-Flow 225-U is
available in tab parts. See the diagram
below.
Hi-Flow 225-U, above its phase change
temperature, wets out the thermal
interface surfaces and flows to produce
the lowest thermal impedance. Hi-Flow
225-U requires pressure of the assembly
to cause flow. Hi-Flow 225-U coatings
will not drip.
Hi-Flow 225-U is available in roll form
with kiss-cut parts. Hi-Flow 225-U is
limited to a square or rectangle parts
design. Dimensional tolerance is +/- 0.020
inch or 0.5mm. The Hi-Flow 225-U soft
layer prohibits the availability of a hole
being punched. The unsupported
construction prohibits the availability of a
space between the parts on the roll.
Please contact your Bergquist Sales
Representative or Bergquist Inside Sales
if additional specifications are required.
Typical Properties of Hi-Flow 225-U
Physical Property Typical Value Test Method
Color Black Visual
Thickness 0.0015" / 0.036mm ASTM D374
Phase Change Temperature 55 oC / 132oFDSC
Continuous use Temp. 150 oC / 212 oF
Electrical
Flame Rating Pending
Thermal
Thermal Conductivity 1.0 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 0.53 0.47 0.39 0.34 0.32
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.08 0.07 0.06 0.05 0.04
1). The ASTM D5470 (Bergquist Modified) test fixture was used and the test sample was
conditioned at 60 oC prior to test. The recorded value includes interfacial thermal
resistance. These values are given to the customer for reference only. Actual application
performance is directly related to the surface roughness, flatness and pressure applied.
Bergquist suggests the use of spring clips, or the like, to assure constant
pressure on the interface. Minimal thermal performance gains are seen
with increasing interfacial pressures above 50 psi.
Application Methods:
Hand-apply to 35-45 °C heat sink. The heat sink is heated in an oven or via heat
gun to between 35 - 45 °C, and then the HF 225-U part is applied like an adhesive
pad. The heat sink is cooled to room temperature and packaged. Protective tab
liner remains in place until unit is it is ready for final assembly. Protective tab can
be readily removed from the applied HF 225-U pad at a maximum temperature of
28 °C.
Automated equipment with 30-psi pressure. A pick and place automated
dispensing unit can be used to apply the HF 225-U pad to a room temperature heat
sink. The placement head should have a silicone rubber pad, and should apply
approximately 30-psi pressure to the pad on transfer to the 25 - 35 °C heat sink.
Once applied, the protective tab can be readily removed from the HF 225-U pad at
a maximum temperature of 28 °C.
Heat Sink
Power Device
Hi-Flow 225-U
Clear adhesive strip
carrier liner
HF 225-U
kiss cut parts
Red Tab
Cross Sectional
View
Rev: Aug 10, 2001
PSA
26
Hi-Flow®: U.S. Patent 4,950,066 and others.
HI-FLOW™
Hi-Flow
®
225U
Non-Reinforced Phase Change Thermal Interface Material
Hi-Flow™ 225UT
Non-Reinforced Pressure Sensitive Phase Change Thermal Interface Material
Thermal Interface Material for High Performance Processors
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Hi-Flow 225UT is designed as a pressure
sensitive, thermal interface material for use
between a high performance processor and a
heat sink. Hi-Flow 225UT is a thermally
conductive, inherently tacky, 55 oC phase
change composite. HF225UT is supplied on a
polyester carrier liner. Hi-Flow 225UT is
available with high visibility protective tabs.
Hi-Flow 225UT, above its phase change
temperature, wets out the thermal interface
surfaces and flows to produce the lowest
thermal impedance. Hi-Flow 225UT requires
pressure of the assembly to cause flow. Hi-
Flow 225UT coatings will not drip.
Application Methods:
Hand-apply HF 225UT to a room temperature
heat sink. The HF 225UT pad exhibits inherent
tack and can be hand-applied similar to an
adhesive pad. The tab liner can remain on the
heat sink and pad throughout shipping and
handling until is it is ready for final assembly.
Typical Properties of Hi-Flow 225-UT
Physical Property Typical
Value Metric
Value Test
Method
Color Black Black Visual
Total Thickness 0.003
inch 0.077
mm ASTM D374
Phase Change
Temperature 131 oF 55 oC DSC
Continuous Use
Temperature 248 oF 120 oC TGA Kinetics
Thermal
Thermal Conductivity (2) 0.7
W/m-K 0.7
W/m-K ASTM D5470
Thermal Impedance vs Pressure
Pressure, psi 10 25 50 100 200
TO-220 Thermal Performance, oC/W 0.60 0.53 0.46 0.40 0.35
Thermal Impedance Per ASTM D5470,
oC-in2 / W (1) 0.09 0.08 0.07 0.06 0.05
1). The ASTM D5470 (Bergquist Modified) test fixture was used with the
material sample conditioned at 60 oC prior to test. The recorded value includes
interfacial thermal resistance. These values are given to the customer for
reference only. Actual application thermal performance using Hi-Flow, thin film
interface materials is primarily controlled via surface “wet-out” and material
“bond-line” or thickness. Within the application, these are directly related to
surface roughness, flatness and pressure applied. Competitive “side by side”
thermal performance summaries are available upon request. Please contact your
Bergquist Sales Representative for additional information and summaries.
2). This is the measured thermal conductivity of the Hi-Flow coating. Since the
Hi-Flow coating is a phase change compound, it will respond to heat and pressure
induced stresses. The overall thermal conductivity of post-phase change Hi-Flow
material is highly dependent upon the heat and pressure applied. These
characteristics are not accounted for in ASTM D5470. To request additional
information, please contact your Bergquist Sales Representative.
Note: Bergquist suggests the use of spring clips to assure constant
pressure on the interface. Spring pressure as low as 10 to 20 psi
will ensure complete “wet-out” of the interface material.
“Quick-Snap” High Visibility
Tab for Removal
July 17, 2001
Heat Sink
Power
Device
Hi-Flow 225UT
Clear/Colored
Protective Tab
Clear Polyester
Carrier Liner
HF 225UT
Roll-Form,
Kiss-Cut Parts
Adhesive
Strip
27
Hi-Flow®: U.S. Patent 4,950,066 and others.
HI-FLOW®
Hi-Flow
®
225UT
Non-Reinforced Pressure Sensitive Phase Change Thermal Interface Material
Hi-Flow™ 625
Electrically Insulating, Thermally Conductive Phase Change Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Bergquist Hi-Flow 625 (HF 625) is a film
reinforced phase change material. The
product consists of a thermally conductive
65 oC phase change compound coated on
Bergquist T-600 film. HF 625 is designed
to be used as a thermal interface material
between electronic power devices which
require electrical isolation and a heat sink.
The T-600 reinforcement makes HF 625
easy to handle, and the 65 oC phase
change temperature of the coating
material eliminates shipping and handling
problems. Bergquist T-600 film has a
continuous use temperature of 150 oC.
HF 625 handles like a Sil-Pad® at room
temperature, and flows like high quality
grease at elevated temperature.
HF 625 is Tack Free and Scratch Resistant
at production temperature and does not
require a protective liner in most shipping
situations.
HF 625 has the thermal performance of 2-
3 mil mica and grease assemblies. HF 625
is available in punch parts, sheets or rolls,
with or without pressure sensitive
adhesive.
Typical Properties of Hi-Flow 625
Physical Property Typical Value Test Method
Color Green Visual
Thickness 0.005" ASTM D374
Tensile Strength 30 Kpsi ASTM D882A
Elongation 60% ASTM D882A
Phase Change Temperature 65 oCDSC
Continuous use Temp. 150 oC
Electrical
Breakdown Voltage 4000 volt ASTM D149
Dielectric Constant, 100Hz 3.5 ASTM D150
Volume Resistivity, Ohm-meter > 1010 ASTM D257
Flame Rating 94 V-O U.L.
Adhesive
Peel Strength 70 g/in ASTM D1876
Release Peel 25 g/in ASTM D1876
Thermal Hi-Flow 1.0 W/m-K
Thermal Conductivity (2) T-600 0.16 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 2.26 2.10 2.00 1.93 1.87
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.79 0.71 0.70 0.67 0.61
1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test
sample was conditioned at 70 oC prior to test. The recorded value includes
interfacial thermal resistance. These values are given to the customer for
reference only. Actual application performance is directly related to the surface
roughness, flatness and pressure applied.
2). This is the measured thermal conductivity of the Hi-Flow coating only (per
Bergquist Modified ASTM-D5470). This compound is equally coated to both
surfaces of Bergquist’s T-600 film carrier. This lamination typically includes two
layers (one to each side) of 2-mil Hi-Flow compound coated to 1.0-mil T-600
film. The Hi-Flow coatings are phase-change, thixotropic compounds and thus
respond via compressive flow to heat and pressure induced stress. Knowing the
average final thickness of the interface, the overall apparent thermal conductivity
of the laminate can be estimated via back-calculation (ref: L = K θ) of the
Bergquist Modified ASTM-D5470 test results stated. This statement assumes
negligible interfacial thermal resistance. Please contact your Bergquist Sales
Representative or Bergquist Inside Sales if additional specifications are required.
Heat Sink
Power Device
Hi-Flow 625
Rev: Sept. 24, 2001
28
Hi-Flow®: U.S. Patent 4,950,066 and others.
HI-FLOW®
Hi-Flow
®
625
Electrically Insulating, Thermally Conductive Phase Change Material
Hi-Flow™ 818
Electrically Isolating, Thermally Conductive Phase Change Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Hi-Flow 818 is a film reinforced phase
change material. The product consists of
a thermally conductive 65oC phase change
compound coated on a 150oC continuous
use temperature thermally conductive
film. Hi-Flow 818 is available with and
without pressure sensitive adhesive. Hi-
Flow 818 is typically used as a thermal
interface material between electronic
power devices that requires electrical
isolation to its heat sink. The film
reinforcement makes the Hi-Flow 818
easy to handle, and 65oC phase change
temperature eliminates shipping and
handling problems.
Application Notes:
1. Best thermal results are obtained
using a spring clip for attachment.
2. In screw mount applications we
suggest wave or other type of spring
washer to maintain pressure between
device and the heat sink.
3. If the spring washers are not used in
screw mount assembly, then use a
thread lock to prevent screw from
vibrating out.
Typical Properties of Hi-Flow 818
Physical Property Typical Value Test Method
Color Mauve Visual
Thickness 0.0055" ASTM D374
Tensile Strength 25 Kpsi ASTM D882A
Elongation 82% ASTM D882A
Phase Change Temperature 65 oCDSC
Continuous use Temp. 150 oC
Electrical
Breakdown Voltage 4000 volt ASTM D149
Dielectric Constant, 100Hz 3.5 ASTM D150
Volume Resistivity, Ohm-meter > 1010 ASTM D257
Flame Rating (pending) U.L.
Thermal Hi-Flow 1.0 W/m-K
Thermal Conductivity (2) T-800 0.25 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 2.05 1.85 1.71 1.62 1.57
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.73 0.69 0.63 0.60 0.56
1). The ASTM D5470 (Bergquist Corrected) test fixture was used and the test
sample was conditioned at 70 oC prior to test. The recorded value includes
interfacial thermal resistance. These values are given to the customer for
reference only. Actual application performance is directly related to the surface
roughness, flatness and pressure applied.
2). This is the measured thermal conductivity of the Hi-Flow coating only (per
Bergquist Modified ASTM-D5470). This compound is equally coated to both
surfaces of Bergquist’s T-800 film carrier. This lamination typically includes two
layers (one to each side) of 2-mil Hi-Flow compound coated to 1.0-mil T-800
film. The Hi-Flow coatings are phase-change, thixotropic compounds and thus
respond via compressive flow to heat and pressure induced stress. Knowing the
average final thickness of the interface, the overall apparent thermal conductivity
of the laminate can be estimated via back-calculation (ref: L = K θ) of the
Bergquist Modified ASTM-D5470 test results stated. This statement assumes
negligible interfacial thermal resistance. Please contact your Bergquist Sales
Representative or Bergquist Inside Sales if additional specifications are required.
Heat Sink
Power Device
Hi-Flow 818
Rev: October 1, 2001
29
Hi-Flow®: U.S. Patent 4,950,066 and others.
HI-FLOW®
Hi-Flow
®
818
Electrically Insulating, Thermally Conductive Phase Change Material
HI-FLOW®
30
Frequently Asked Questions
Q
How is the ASTM D5470 test modified to characterize Phase
Change Thermal Performance?
A
Bergquist uses the Anter Quickline 10 to characterize our ASTM
D5470 test results. The method is modified to condition the phase
change material to 5 C over the stated phase change temperature.
Understanding that time is also a key variable for material displacement
or flow, the over-temperature conditioning is limited to 10 minutes
and then allowed to cool, prior to initiating the actual test at the
given pressure. The 10-minute time period has been demonstrated
to be an acceptable time period for the thermal mass inherent in the
Anter setup. Note: Actual application testing may require more or
less time to condition, depending upon the heat transfer and thermal
mass associated. The performance values are recorded and pub-
lished at 10, 25, 50, 100, 200 and 500 psi to give the designer a
broad-based understanding of our products’ performance. Reference
the original ASTM application note here.
Q
What is the minimum pressure required to optimize the thermal
performance of the Hi-Flow material?
A
Upon achieving phase change temperature (i.e. pre-conditioning),
Bergquist has demonstrated that 10 psi provides adequate pressure
to achieve exceptional thermal performance. Bergquist continues to
research lower pressure wet-out characteristics in an effort to minimize
interfacial losses associated with ultra-thin material interfaces.
Q
Will the Hi-Flow replace a mechanical fastener?
A
Mechanical fasteners are required. Bergquist recommends the use of
spring clips to maintain consistent pressure over time.
Q
Can I use screw mount devices with Hi-Flow material?
A
Hi-Flow works best with a clip or spring washer mounted assembly.
The continuous force applied by these devices allows the Hi-Flow
material to flow and reduce the cross sectional gap. Bergquist suggests
that design engineers evaluate whether a screw mount assembly will
have acceptable performance. See TO-220 Technical Note.
Q
Is the adhesive in Hi-Flow 225F-AC repositionable?
A
The adhesive in the current construction does adhere more to the heat
sink aluminum than to the Hi-Flow material. There is the potential
that the adhesive will be removed by the heat sink surface when it is
removed to reposition on the heat sink. Time and/or pressure will
increase the bond to the aluminum increasing the potential for the
adhesive to adhere to the heat sink.
Q
Is there any surface preparation required before applying the adhe-
sive backed Hi-Flow to the heat sink?
A
Standard electronics industry cleaning procedures apply. Remove dirt
or other debris. Best results are attained when the Hi-Flow material
is applied to heat sink at a temperature of 25 +/- 10 C. If the heat
sink has been surface treated (i.e. anodized or chromated), it is typically
ready for assembly. For bare aluminum, mild soap and water wash
cleaning processes are typically used to eliminate machine oils and
debris.
Q
Is the Hi-Flow material re-workable?
A
If the material has not gone through phase change, the material
will readily release from the device surface. For this situation,
the Hi-Flow material will not likely have to be replaced.
If the material has gone through the phase change, the material will
adhere very well to both surfaces. In this case, Bergquist suggests
warming the heat sink to soften the Hi-Flow compound. This allows
for easier removal from the processor. In this case, Bergquist suggests
replacement with a new piece of Hi-Flow material.
Q
What is meant by easy to handle in manufacturing?
A
Our insulated Hi-Flow products are manufactured with inner film
support. This film stiffens the material, allowing parts to be more
readily die-cut as well as easier to handle. This also allows for ease
of manual or automated assembly.
Q
What is meant by tack free? And why is this important?
A
Many of our Hi-Flow materials have no surface task at room temper-
ature. The Softer materials will pick up dirt more readily. Softer
resins are more difficult to clean if any dirt is on the surface. If you
try to rub the dirt away, the dirt is easily pushed into the soft phase
change materials. Our Hi-Flow coatings are typically hard at room
temperature rendering them easier to clean off without embedding dirt.
Q
What does more scratch resistance mean on Hi-Flow 625?
A
Our Hi-Flow 625 does not require a protective film during shipment.
There are two issues with competitors’ materials: 1. Melt point of the
material is low enough that it can go through phase change in shipment
and be very tacky. Bergquist Hi-Flow has a higher phase change
temperature and remains hard to a higher temperature. It can be
shipped much like our SoftFace material. 2. The Hi-Flow material
is harder and is not as easy to scratch or dent in shipping and handling.
Q
Why is our product phase change temperature 65˚ C?
A
The 65˚ C phase change temperature was selected for two reasons.
First, it was a low enough temperature for the phase change to occur
in applications. Second, it would not phase change in transport.
Bergquist studies show that shipping containers can reach 60˚ C in
domestic and international shipments. The higher phase change
temperature eliminates the possibility of a product being ruined in
shipment. We offer a standard line of Hi-Flow 225 series products
with 55˚ C phase change for those customers wanting the lower
phase change temperature.
Q
What applications should I avoid using Hi-Flow?
A
Applications where the device will not reach operation at above
phase change temperature. Applications where the operating temper-
ature exceeds the maximum recommended operating temperature of
the compound.
TIC-7500
Thermal Interface Compound
Thermal Interface Material for High Performance Computer Processors
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sterling-7500 is a thermally conductive grease
compound and is designed as a thermal
interface material between a computer
processor and a heat sink. Other high watt
density applications will benefit from the
extremely low thermal impedance of Sterling-
7500.
Sterling-7500 compound wets out the thermal
interface surfaces and flows to produce the
lowest thermal impedance. The Sterling-7500
compound requires pressure of the assembly
to cause flow. The Sterling-7500 compound
will not drip.
For microprocessor applications, traditional
screw fastening or clamping methods
will provide adequate force to optimize the
thermal performance of Sterling-7500.
Sterling-7500 has a patented technology.
For a typical 0.5 x 0.5-inch application at
0.005 inches thick, Bergquist estimates
approximately 0.02 ml (cc) of Sterling-7500.
Although Bergquist estimates a 0.02 ml (cc)
volumetric requirement for a 0.5 x 0.5-inch
component interface, dispensed at a thickness
of 0.005 inches, Bergquist also recognizes
that an optimized application would utilize
the minimum volume of Sterling-7500 material
necessary to ensure complete wet-out of both
mechanical interfaces.
Typical Properties of Sterling-7500
Property Typical Value Test Method
Color Gray Visual
Density (Grams/cc or Grams/ml) 4.0 ASTM D374
Viscosity at 25 C cps Viscometer
2 RPM 500,000
10 RPM 150,000
Continuous Use Temp. 100oC TGA Kinetics
Electrical
Electrical Resistivity >1.0 X10 E10
W-cm-1 ASTM D257
Thermal
Thermal Impedance .035 °C-in2/W ASTM D5470
Thermal Conductivity >7.5 W/m-K ASTM D5470
Thermal Impedance
T0-220 @ 50 psi °C/W Bergquist thermal Test Set Up
Sterling-7500 0.25
HF 225 0.45
HF 200 U 0.65
Dow 340 Grease 0.60
Application Cleanliness:
1. Pre-clean heatsink and component interface with Isopropyl Alcohol prior to
assembly or repair.
Application Methods:
1. Dispense the Sterling-7500 compound onto the processor or heat sink surface
like thermal grease.
2. Assemble the processor and heat sink with clip or screws
Environmental Testing:
Sterling-7500 compound has been exposed to the following environmental conditions
without loss of thermal performance.
> 500 h at 125 C Pass
> 500 h at 85 RH/85 °CPass
> 500 cycles -55/125 C Pass
Sterling-7500 is typically supplied in 1-milliliter syringes. Please contact your local
Bergquist representative for additional packaging information.
Rev: October 10, 2001
°
31
Sterling™: Patent issuing 1-2002 SER. NO. 09/543661.
STERLING™
Sterling
™
-7500
Thermal Interface Compound
SIL-PAD®
More than 20 years ago, Bergquist set the standard for elastomeric
thermal interface materials with the introduction of Sil-Pad. Today,
Bergquist is a world leader with a complete family of Sil-Pad materials
to meet the critical needs of a rapidly changing electronics industr y.
Sil-Pad thermally conductiv e insulators,in their many forms,continue to
be a clean and efficient alternative to mica, ceramics or grease for a
wide range of electronic applications. Bergquist application specialists
work closely with customers to specify the proper Sil-Pad material for
each unique thermal management requirement.
Comprehensive choices for a cleaner
and more efficient thermal interface
FEATURES
The Sil-Pad family encompasses
dozens of products, each with its own
unique construction, properties and
performance. Here are some of the
important features offered by the
Sil-Pad family.
• Binders of proven silicone rubber
• Fiberglass, dielectric film or
polyester film carriers
• Special fillers to achieve specific
performance characteristics
• Flexible and conformable
• Smooth and textured surfaces
• Reinforcements to resist
cut-through
• Variety of thicknesses
• Wide range of thermal
conductivities and dielectric
strengths
BENEFITS
Choosing Sil-Pad thermal products
saves time and money while maxi-
mizing an assembly’s performance
and reliability. Specifically:
• Excellent thermal performance
• Eliminates the mess of grease
• More durable than mica
• Less costly than ceramic
• Resistant to electrical shorting
• Easier and cleaner to apply
• Under time and pressure, thermal
resistance will decrease
• Better performance for today’s
high-heat compacted assemblies
• A specific interfacial performance
that matches the need
• Efficient “total applied cost” that
compares favorably with other
alternatives
OPTIONS
Some Sil-Pad products have special
features for particular applications.
Options include:
• Available with or without adhesive
• Aluminum foil or imbedded
graphite construction for
applications not requiring
electrical insulation
• Copper shield layer
• Polyester binder material for
silicone sensitive applications
• Polyester film carrier for increased
voltage breakdown
• Materials with reduced moisture
sensitivity
• Available in rolls, sheets, tubes
and custom die-cut parts
• Custom thicknesses and
constructions
APPLICATIONS
The large family of Sil-Pad thermally
conductive insulators is extremely
versatile. In today’s marketplace,
Sil-Pads are used in virtually every
component of the electronics
industry, including:
• Interface between a power
transistor, CPU or other
heat-generating component and
a heat sink or rail
• Isolate electrical components and
power sources from heat sink
and/or mounting bracket
• Interface for discrete semiconduc-
tors requiring low pressure
spring clamp mounting
• Consumer electronics
• Automotive systems
• Telecommunications
• Aerospace
• Military
• Medical devices
• Industrial controls
32
SOLUTION-DRIVEN THERMAL MANAGEMENT PRODUCTS FOR ELECTRONIC DEVICES
Sil-Pad®Thermally Conductive Insulators
SIL-PAD®
33
10 25 50 100 200
7.00
6.00
5.00
4.00
3.00
2.00
1.00
10 25 50 100 200
4.00
3.50
3.00
2.50
2.00
1.50
1.00
10 25 50 100 200
4.00
3.50
3.00
2.50
2.00
1.50
10 25 50 100 200
5.00
5.50
6.00
6.50
4.50
4.00
3.50
3.00
2.50
Interface Pressure, psi
Interface Pressure, psi Interface Pressure, psi
Interface Pressure, psi
Sil-Pad Material Low Pressure TO-220 Thermal Performance Sil-Pad High Dielectric Materials TO-220 Thermal Performance
Sil-Pad Thin Film Materials TO-220 Thermal Performance Bonding Materials TO-220 Thermal Performance
Thermal Performance , ˚C/W
Thermal Performance , ˚C/W
Thermal Performance , ˚C/W Thermal Performance , ˚C/W
Sil-Pad 400 .007
Sil-Pad 900S
Sil-Pad 800
Sil-Pad 900S
Sil-Pad 1500
Sil-Pad 2000 .020
Sil-Pad A1500
Sil-Pad 2000 .015
Sil-Pad 2000 .010
K-4
K-6
K-10
Bond-Ply 100 .011
Bond-Ply 100 .008
Bond-Ply 660
Bond-Ply 100 .005
TO-220 THERMAL PERFORMANCE
Sil-Pad®Comparison Data
SIL-PAD®
The Bergquist Company established the standard for
elastomeric thermally conductive insulation materials with the
development of Sil-Pads®over 20 years ago. Sil-Pads were
developed as a clean, grease-free alternative to mica and grease.
Now, a complete family of materials is available to meet the
diverse and changing requirements of today’s design engineer.
MICA AND GREASE
Mica insulators have been in use for over 30 years and are still
commonly used as an insulator. Mica is inexpensive and has
excellent dielectric strength, but it is brittle and is easily cracked
or broken. Because mica used by itself has high thermal imped-
ance, thermal grease is commonly applied to it. The grease flows
easily and excludes air from the interface to reduce the interfacial
thermal resistance. If the mica is also thin (2-3 mils), (50-80 µm),
a low thermal impedance can be achieved.
However, thermal grease introduces a number of problems to
the assembly process. It is time-consuming to apply, messy, and
difficult to clean. Once thermal grease has been applied to an
electronic assembly, solder processes must be avoided to prevent
contamination of the
solder. Cleaning
baths must also be
avoided to prevent
wash-out of the
interface grease,
causing a dry joint
and contamination of
the bath. Assembly,
soldering and clean-
ing processes must
be performed in one
process while the greased insulators are installed off-line in a
secondary process. If the grease is silicone based, migration of
silicone molecules occurs over time, drying out the grease and
contaminating the assembly. Silicone migration onto electrical
contacts can result in pitting of the contacts and loss of electrical
conductance. For this reason, silicone based thermal grease has not
been used in telecommunications systems.
POLYIMIDE FILMS
Polyimide films can also be used as insulators and
are often combined with wax or grease to achieve a
low thermal impedance. These polyimide films are
especially tough and have high dielectric strength.
Sil-Pad®K-4, K-6 and K-10 incorporate polyimide
film as the carrier material.
CERAMIC INSULATORS
Other insulation materials include ceramic wafer
insulators which have higher thermal conductivity
than mica. They are often used thicker (20-60 mils),
(.5 to 1.5 mm) to reduce capacitive coupling while
maintaining a low thermal impedance.
Drawbacks to ceramic insulators are high cost and
they are rigid like mica and crack easily. Also, ceramic
beryllia use requires careful handling since inhalation
of beryllia dust can cause lung inflammation (berylliosis).
At Bergquist's Cannon Falls, MN, manufacturing facility,
a Sil-Pad material runs through a 3-story coating press.
Why Choose Sil-Pad®Thermally Conductiv
34
SIL-PAD®
SIL-PAD®MATERIALS
Sil-Pad Thermally Conductive Insulators are designed to be
clean, grease-free and flexible. The combination of a tough carrier
material such as fiberglass and silicone rubber which is conformable,
provides the engineer with a more versatile material than mica or
ceramics and grease. Sil-Pads minimize the thermal resistance from
the case of a power semiconductor to the heat sink. Sil-Pads
electrically isolate the semiconductor from the heat sink and have
sufficient dielectric strength to withstand high voltage. They are
also tough enough to resist puncture by the facing metal surface.
With more than 30 different Sil-Pad materials available there is a
Sil-Pad matched to almost any application.
BINDERS
Most Sil-Pad products use silicone rubber as the binder. Silicone
rubber has a low dielectric constant, high dielectric strength, good
chemical resistance and high thermal stability.
Silicone rubber also exhibits cold flow, which excludes air from
the interface as it conforms to the mating surfaces. This flow
eliminates the need for thermal grease. A rough surface textured
insulator needs to flow more to exclude air than a smooth one. The
smoother pads also need less pressure to wet out the surfaces and
obtain optimum thermal contact.
CARRIERS
The carrier provides physical reinforcement and contributes to
dielectric strength. High dielectric and physical strength is obtained
by using a heavy, tight mesh, but thermal resistance will suffer. A
light, open mesh reduces thermal resistance, dielectric strength
and cut-through resistance. The carrier materials used in Sil-Pad
materials include fiberglass, dielectric film and polyester film
which is used in Poly-Pad
®
materials.
SIL-PAD®CONSTRUCTION
Sil-Pads are constructed with a variety of different materials
including fiberglass, silicone rubber, polyimide film, polyester film
and fillers used to enhance performance. Sil-Pads are typically
constructed with an elastomeric binder compounded with a
thermally conductive filler coated on a carrier. The characteristics
of your application often determine which Sil-Pad construction will
produce the best performance.
FILLERS
The thermal conductivity of Sil-Pad products is improved by
filling them with ingredients of high thermal conductivity. The
fillers change the characteristics of the silicone rubber to enhance
thermal and/or physical characteristics.
For instance, some fillers make the silicone rubber hard and tough
while still retaining the ability to flow under pressure. Aharder silicone
helps the material resist cut-through. In other applications a filler is
used to make the silicone rubber softer and more conformable to rough
surfaces. While the range in thermal resistance of greased mica is quite
large, the average is comparable to elastomeric insulators filled with a
blend of the appropriate ingredients.
• Fiberglass based insulators (Sil-Pad®400 and Sil-Pad®1500)
have a rough surface texture and will show a 15-20% decrease in
thermal resistance over a 24 hour period. Film based Sil-Pads
(Sil-Pad®K-4, Sil-Pad®K-6 and Sil-Pad®K-10) are smoother initially
and show a 5% decrease over the same period of time.
ve Insulators?
35
SIL-PAD®
Choosing the Right Sil-Pad Starts with the M
MECHANICAL PROPERTIES
Woven fiberglass and films are used in Sil-Pads to provide
mechanical reinforcement. The most important mechanical property
in Sil-Pad applications is resistance to cut-through to avoid electrical
shorting from the device to the heat sink.
• Sil-Pad
®
K-4, Sil-Pad
®
K-6and Sil-Pad
®
K-10 are very good at
resisting cut-through from sharp burrs left on heat sinks after
machining operations such as drilling and tapping
• Fiberglass is good at resisting the type of cut-through
encountered when device mounting flanges are pulled
into oversized mounting holes. This occurs when fasteners
are torqued. (Sil-Pad
®
400 and Sil-Pad
®
2000)
Cut-through resistance is very dependent on the application and
depends on several factors:
• A very sharp burr may cause cut-through with less than
100 pounds while a blunt burr may require several
hundred pounds to cause cut-through
• When two flat parallel surfaces are brought together on
a Sil-Pad, over 1000 pounds of force can be applied
without damaging the insulator
• The Poly-Pad insulators are the most mechanically durable
Sil-Pads overall. The polyester resin used has a higher
modulus than silicone rubber. (Poly-Pad
®
400,
Poly-Pad
®
1000, Poly-Pad
®
K-4 and Poly-Pad
®
K-10)
MOUNTING TECHNIQUES AND MOUNTING
PRESSURE
Typical mounting techniques include:
• A Spring clip, which exerts a centralized clamping force
on the body of the transistor. The greater the mounting
force of the spring, the lower the thermal resistance of
the insulator
• A screw in the mounting tab. With a screw mounted
TO-220, the force on the transistor is determined by the
torque applied to the fastener
In extremely low pressure applications, an insulator with
pressure sensitive adhesive on each side may give the lowest
thermal resistance since the adhesive wets out the interface
easier than the dry rubber. This decreases the interfacial
thermal resistance.
Devices with larger surface areas need more pressure to
get the insulator to conform to the interface than smaller
devices. In most screw mount applications, the torque
required to tighten the fastener is sufficient to generate the
pressure needed for optimum thermal resistance. There are
exceptions where the specified torque on the fastener does
not yield the optimum thermal resistance for the insulator
being used and either a different insulator or a different
mounting scheme should be used.
Interfacial thermal resistance decreases as time under
pressure increases. In applications where high clamping
forces cannot be used, time can be substituted for pressure to
achieve lower thermal resistance. The only way to know
precisely what the thermal resistance of an insulator will be
in an application is to measure it in that application.
36
SIL-PAD®
ELECTRICAL PROPERTIES
If your application does not require electrical insulation,
Q-Pad
®
II or Q-Pad
®
3 are ideal grease replacement materials.
These materials do not isolate but have excellent thermal properties.
Hi-Flow phase change materials should also be considered for
these applications. (Reference pages 20-30 of this guide.)
The most important electrical property in a typical assembly
where a Sil-Pad insulator is used is dielectric strength. In many
cases the dielectric strength of a Sil-Pad will be the determining
factor in the design of the apparatus in which it is to be used.
Here are some general guidelines regarding electrical
properties to consider when selecting a Sil-Pad material;
• Q-Pad II and Q-Pad 3 are used when electrical isolation
is not required
• Dielectric breakdown voltage is the total voltage that a
dielectric material can withstand. When insulating
electrical components from each other and ground, it is
desirable to use an insulator with a high breakdown voltage
• Breakdown voltage decreases as the area of the electrodes
increases. This area effect is more pronounced as the
thickness of the insulator decreases
• Breakdown voltage decreases as temperature increases
•Breakdown voltage decreases as humidity increases (Sil-Pad
®
1750 is less sensitive to moisture)
•Breakdown voltage decreases in the presence of partial
discharge
• Breakdown voltage decreases as the size of the voltage-
source (kVA rating) increases
• Breakdown voltage can be decreased by excessive
mechanical stress on the insulator
Dielectric strength, dielectric constant and volume resistivity
should all be taken into consideration when selecting a Sil-Pad
material. If your application requires special electrical performance
please contact the factory for more detailed testing information.
Mechanical and Electrical Properties
Breakdown Dielectric Dielectric Volume
Voltage Strength Constant Resistivity
Material (kV) (Volts/mil) (kV/mm) (Ohm-Metre)
Sil-Pad 400®-.007 5 700 1 8 5.5 1011
Sil-Pad 400®-.009 7 800 2 0 5.5 1011
Sil-Pad 1000®7700 18 4.5 1 011
Sil-Pad 2000®12 8 00 20 4.0 1 011
Sil-Pad K-4®7 1200 30 5.0 1012
Sil-Pad K-6®7 1200 30 4.0 1012
Sil-Pad K-10®71200 30 3.7 1012
Test MethodASTM D 149* ASTM D 149* ASTM D 150
ASTM D 257
TYPICAL ELECTRICAL PROPERTIES OF SIL-PADS®
37
SIL-PAD®
HOW THERMAL PROPERTIES
AFFECT YOUR SELECTION
The thermal properties of a Sil-Pad material and your
requirements for thermal performance probably have more to do
with your selection of a Sil-Pad than any other factor.
Discrete Semiconductors, under normal operating conditions,
dissipate waste power which raises the junction temperature of
the device. Unless sufficient heat is conducted out of the device,
its electrical performance and parameters are changed. A 10° C
rise in junction temperature can reduce the mean-time-to-failure
of a device by a factor of two. Also, above 25°C, the semicon-
ductor's total power handling capability will be reduced by a
derating factor inherent to the device.
The thermal properties of Sil-Pad products are thermal
impedance, thermal conductivity and thermal resistance .
The thermal resistance and conductivity of Sil-Pad products are
inherent to the material and do not change. Thermal resistance
and thermal conductivity are measured per ASTM D5470 and
do not include the interfacial thermal resistance effects. Thermal
impedance applies to the thermal transfer in an application and
includes the effects of interfacial thermal resistance. As the
material is applied in different ways the thermal impedance
values will vary from application to application.
• The
original Sil-Pad material, Sil-Pad®400 continues to
be Bergquist's most popular material for many applications.
•
Sil-Pad®1500 is chosen when more thermal performance
is required. Sil-Pad®A2000 is ideal for high performance,
high reliability applications.
Beyond these standard materials many things can contribute to
the selection of the correct material for a particular application.
Questions regarding the amount of torque and clamping pressure
are often asked when selecting a Sil-Pad material. Here are some
guidelines:
•
Interfacial thermal resistance decreases as clamping
pressure increases.
•
The clamping pressure required to minimize interfacial
thermal resistance can vary with each type of insulator.
•
Sil-Pads with smooth surface finishes (Sil-Pad®1500,
Sil-Pad®2000, Sil-Pad®K-4, Sil-Pad®K-6 and Sil-Pad®K-10)
are less sensitive to clamping pressure than Sil-Pads with
rough surface finishes (Sil-Pad®400).
0.00
1.00
2.00
3.00
4.00
5.00
6.00
5.14
2.45
2.90
Sil-Pad 400
.007Sil-Pad 800
Sil-Pad 900S
Sil-Pad 1500
Sil-Pad A1500
Sil-Pad 2000
.015K-4K-6K-10Q2Q3
2.68
2.21 2.01
3.13
2.76
2.01
1.23
1.76
Thermal Performance, ˚C/W
38
Bergquist Material
Sil-Pad Thermal Performance Over view (TO-220 test at 50 psi)
Sil-Pad®Thermal Properties
SIL-PAD®
A common Sil-Pad application includes TO-220 transistors mounted in a row on a heat rail.
Two different Sil-Pad applications show clip mounting of transistors on the left and screw
mounting of transistors to an aluminum bracket on the right.
Gap Pad is applied to the top surface of heat generating components in this assembly.
A heat sink mounted over the board dissipates heat.
The application above uses punched parts to insulate
the transistors from the mounting bracket and a sheet
of Sil-Pad to isolate the mounting brackets from the
frame of the assembly.
The circuit board below shows punched parts interfac-
ing screw-mounted transistors to a finned heat sink.
39
Sil-Pad®Applications
SIL-PAD®
SIL-PAD®400
• The original Sil-Pad material
• Durable silicone rubber and
fiberglass construction
for excellent mechanical /
physical characteristics
• Fiberglass provides excellent
cut-through resistance
• Thermal performance
improves with age
• Non-toxic and resists
damage from cleaning agents
• Contact the factory for special
thicknesses of Sil-Pad 400
SIL-PAD®800
SIL-PAD®900-S
• Designed for low cost
applications requiring
high thermal performance
•These applications also
typically have low
mounting pressures for
component clamping
•Sil-Pad 800-S material
combines a smooth surface
design with high thermal
conductivity and electrical
insulation
•Applications include
discrete semiconductors
(TO-220, TO-247 and
TO-218) mounted with
spring clips
SIL-PAD®A1500
• Sil-Pad A1500 is a fiberglass
reinforced material with
enhanced thermal properties
• Designed for high
performance thermal
applications while meeting
specific cost considerations
SIL-PAD®A2000
• For high performance, high
reliability military / aerospace
and commercial applications
• Sil-Pad A2000 complies with
military standards
• Special ingredients maximize
thermal and dielectric
performance
SIL-PAD®K-4
• Sil-Pad K-4 uses a physically
tough, thermally conductive,
dielectric film and well-
known Sil-Pad rubber.
SIL-PAD®K-6
• Sil-Pad K-6 is a medium
performance film based
material
• Filled with special ingredients
to improve thermalperformance
• The film provides a continu-
ous, physically tough
dielectric barrier against
“cut-through”
SIL-PAD®K-10
• Highest thermal performance
of the film based insulators.
Minimum thickness helps
lower thermal resistance
• Designed to replace brittle,
ceramic insulators: Beryllium
Oxide,
Boron Nitride and
Alumina
Sil-Pad®Thermally Conducti
Sil-Pad 400
.007 in
Gray
.007 ±.001
(.18 ±.025)
5.14
0.9
3500
-60 to 180
Silicone/
Fiberglass
Sil-Pad 400
.009 in
Gray
.009 ±.001
(.23 ±.025)
6.61
0.9
4500
-60 to 180
Silicone/
Fiberglass
Sil-Pad 800
Gold
.005 ±.001
(.13 ±.025)
2.45
1.6
1700
-60 to 180
Silicone/
Fiberglass
Sil-Pad
900S
Pink
.009 ±.001
(.23 ±.025)
2.90
1.6
5500
-60 to 180
Silicone/
Fiberglass
Sil-Pad
A1500
Green
.010 ±.001
(.25 ±.025)
2.21
2.0
6000
N/A
Silicone/
Fiberglass
Sil-Pad
A2000
White
.015 ±.001
(.38 ±.025)
1.86
3.5
4000
N/A
Silicone/
Fiberglass
Sil-Pad
K-4
Gray
.006±.001
(.15 ±.025)
3.13
0.9
6000
-60 to 180
Silicone/
Film
Color
Thickness Inches
(mm)
Thermal Impedance
TO-220 Test @ 50 psi ˚C/W
Thermal Conductivity
W/m-K nominal
Voltage Breakdown Vac
Continuous Use Temperature °C
Construction
40
SIL-PAD®
Q-PAD®II
• Grease replacement material
used where electrical
insulation is not required
• Q-Pad II is a composite of
.0015 in. aluminum
foil coated on both sides
with a .00225 in. thermally
conductive coating
• Q-Pad II eliminates problems
associated with grease such
as contamination of reflow
solder or cleaning operations
• Q-Pad II can be installed
prior to these operations.
Q-Pad II also eliminates
dust collection which can
result in surface shorting or
heat build-up
Q-PAD®3
• Grease replacement
material where electrical
insulation is not required
• Q-Pad 3 consists of graphite
imbedded in a polymer
matrix
•When exposed to modest
heat and pressure, the
elastomer conforms to
surface textures thereby
creating an air free interface
between surfaces
•Q-Pad 3 is fiberglass
reinforced and withstands
processing stresses without
losing physical integrity
POLY-PAD®MATERIALS
•Polyester based Poly-Pad®400,
Poly-Pad®1000, Poly-Pad®
K-4 and Poly-Pad®K-10
• Designed for silicone
sensitive applications
• Ideally suited for applications
requiring conformal coatings
or applications where silicone
contamination is a concern
(telecommunications and
aerospace applications)
BOND-PLY®100
•Bergquist Bond-Ply is a
thermally conductive,
acrylic based PSA bonding
material used to permanently
mount a heat sink on top of
a central processing unit
• The material will adhere to
the heat sink or integrated
circuit with moderate heat
and pressure, forming a
bond between components
SIL-PAD®SHIELD
• Bergquist Sil-Pad Shield is a
bonded laminate of
thermally conductive,
electrically isolating Sil-Pad
400 or Sil-Pad 1000 pads
with a copper shield between
the layers. It is supplied with
a pretinned solder point for
easy grounding
ive Insulator Selection Guide
Sil-Pad
K-6
Bluegreen
.006 ±.001
(.15 ±.025)
2.76
1.1
6000
-60 to 180
Silicone/
Film
Sil-Pad
K-10
Beige
.006 ±.001
(.15 ±.025)
2.01
1.3
6000
-60 to 180
Silicone/
Film
Q-Pad II
Black
.006 ±.001
(.15 ±.025)
1.23
2.5
N/A
-60 to 180
Silicone/
Alum Foil
Q-Pad 3
Black
.005 (.15 mm)
.0055 w/ac
1.76
2.0
N/A
-60 to 180
Silicone/
Fiberglass
Poly-Pad
400
Mauve
.009 ±.001
(.23 ±.025)
5.13
0.9
4500
-20 to 150
Polyester/
Fiberglass
Poly-Pad
1000
Yellow
.009 ±.001
(.23 ±.025)
3.74
01.2
2500
-20 to 150
Polyester/
Fiberglass
Poly-Pad
K-4
Mauve
.006 ±.001
(.15 ±.025)
4.34
0.9
6000
-20 to 150
Polyester/
Film
Poly-Pad
K-10
Yellow
.006 ±.001
(.15 ±.025)
2.75
1.3
6000
-30 to 120
Polyester/
Film
Bond-Ply 100
White
.005 ±.001
(.13 ±.025)
3.48
0.8
3000
-30 to 120
Acrylic PSA/
Fiberglass
Test Method
Visual
ASTM D 374
ASTM D5470
ASTM D 5470
ASTM D 149
-
-
41
Sil-Pad®
400
The Original Sil-Pad Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad 400 is the original Sil-Pad
material. Sil-Pad 400 is a composite of
silicone rubber and fiberglass. It is flame
retardant and is specially formulated for
use as a thermally conductive insulator.
Primary use is to electrically isolate
power sources from heat sinks.
Sil-Pad 400 has excellent mechanical and
physical characteristics. Surfaces are
pliable and allow complete surface
contact with excellent heat dissipation.
Sil-Pad 400 actually improves its thermal
resistance with age. The reinforcing
fiberglass gives excellent cut-through
resistance and Sil-Pad 400 is non-toxic
and resists damage from cleaning agents.
MIL SPEC. MIL-M-38527/8A
MIL-M-38527C
MIL-I-49456
MIL-M-87111
U.L. FILE NUMBER E59150
FSCM NUMBER 55285
Typical Properties of Sil-Pad 400
Property Typical Value Test Method
Color Gray Gray Visual
Thickness 0.007" 0.009" ASTM D374
Specific Gravity 2.0 - 2.1 2.0 - 2.1 ASTM D792
Hardness (Shore Type A) 85 85 ASTM D2240
Breaking Strength 100 lbs./inch 100 lbs./inch ASTM D1458
Elongation 40% 40% ASTM D412
Tensile Strength 3 kPsi 3 kPsi ASTM D412
Continuous Use Temp. -60°C to 180°C
Electrical
Breakdown Voltage, minimum 3500 4500 ASTM D149
Dielectric Constant 5.5 5.5 ASTM D150
Volume Resistivity, Ohm-meter 1011 1011 ASTM D257
Pressure (psi)
Thermal Impedance vs. Pressure 10 25 50 100 200
0.007 6.62 5.93 5.14 4.38 3.61
TO-220 Thermal Performance, oC/W
@ Standard Thickness, inch 0.009 8.51 7.62 6.61 5.63 4.64
0.007 1.82 1.42 1.13 0.82 0.54
Thermal Impedance, oC-in2 / W (1)
@ Standard Thickness, inch 0.009 2.34 1.83 1.45 1.05 0.69
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes
interfacial thermal resistance. These values are given to the customer for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole
locations. Please contact your sales representative if tighter tolerances are
required.
OPTIONS
Q-Pad II is available in sheet, die-cut, or roll form, with and without
pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x
8", 10" x 10", and 12" x 12" are available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on
tolerances and complexity of the part.
Rev: October 1, 2001
42
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
400
Sil-Pad® 800
High Performance Insulator for Low Pressure Applications
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
The Sil-Pad 800 family of thermally
conductive insulation materials is
designed for applications requiring high
thermal performance and electrical
isolation. These applications also
typically have low mounting pressures
for component clamping.
Sil-Pad 800 material combines a
smooth and highly compliant surface
characteristic with high thermal
conductivity. These features optimize
the thermal resistance properties at low
pressure.
Applications requiring low component
clamping forces include discrete
semiconductors (TO-220, TO-247 and
TO-218) mounted with spring clips.
Spring clips assist with quick assembly
but apply a limited amount of force to the
semiconductor. The smooth surface
texture of Sil-Pad 800 minimizes
interfacial thermal resistance and
maximizes thermal performance.
Typical Properties of Sil-Pad 800
Property Typical Value Test Method
Color Gold Visual
Thickness 0.005" ASTM D374
Elongation, %45° to warp & fill 20 ASTM D412
Tensile Strength 12 MPa ASTM D412
Electrical
Dielectric Breakdown Voltage
Type 1 Electrodes 1.7 kVa-c ASTM D149
Type 3 Electrodes 3.0 kVa-c ASTM D149
Dielectric Constant 6 ASTM D150
Volume Resistivity, Ohm-meter 1010 ASTM D257
Thermal
Thermal Conductivity 1.6 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.56 3.01 2.45 2.05 1.74
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.92 0.60 0.45 0.36 0.29
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad 800 is available in sheet, die-cut, or roll form, with and without pressure sensitive
adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are
available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
43
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
800
Sil-Pad® 900S
High Performance Insulator for Low Pressure Applications
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
The Sil-Pad 900S family of thermally
conductive insulation materials is
designed for applications requiring high
thermal performance and electrical
isolation. These applications also
typically have low mounting pressures
for component clamping.
Sil-Pad 900S material combines a
smooth and highly compliant surface
characteristic with high thermal
conductivity. These features optimize
the thermal resistance properties at low
pressure.
Applications requiring low component
clamping forces include discrete
semiconductors (TO-220, TO-247 and
TO-218) mounted with spring clips.
Spring clips assist with quick assembly
but apply a limited amount of force to the
semiconductor. The smooth surface
texture of Sil-Pad 900S minimizes
interfacial thermal resistance and
maximizes thermal performance.
Typical Properties of Sil-Pad 900S
Property Typical Value Test Method
Color Mauve Visual
Thickness 0.009" ASTM D374
Elongation, %45° to warp & fill 20 ASTM D412
Tensile Strength 9 MPa ASTM D412
Electrical
Dielectric Breakdown Voltage
Type 1 Electrodes 5.5 kVa-c ASTM D149
Type 3 Electrodes 8.3 kVa-c ASTM D149
Dielectric Constant 6 ASTM D150
Volume Resistivity, Ohm-meter 1010 ASTM D257
Thermal
Thermal Conductivity 1.6 W/m-k ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.96 3.41 2.90 2.53 2.32
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.95 0.75 0.61 0.47 0.41
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad 900S is available in sheet, die-cut, or roll form, with and without pressure sensitive
adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are
available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
44
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
900S
Sil-Pad®
950
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
The Sil-Pad 900 family of thermally
conductive insulation materials are
designed for applications requiring high
thermal performance.
Sil-Pad 950 material uses a heavy
fiberglass carrier to increase the
mechanical strength and durability of the
material. The smooth surface texture of
Sil-Pad 950 minimizes interfacial
thermal resistance and maximizes
thermal performance as well.
Typical Properties of Sil-Pad 950
Property Typical Value Test Method
Color Mauve Visual
Thickness 0.009" ASTM D374
Specific Gravity 2.5 g/cm3ASTM D792
Tensile Strength
45˚ to Warp & Fill 1.6 kpsi ASTM D412
Breaking Strength
Warp & Fill 70x20 Lbs./inch ASTM D1458
Tensile Elongation
45˚ to Warp & Fill 20% ASTM D412
Electrical
Dielectric Breakdown Voltage ASTM D149
Type 1 Electrodes 4.5 kVa-c
Type 3 Electrodes 6.0 kVa-c
Dielectric Constant, 1 kHz 6 ASTM D150
Volume Resistivity, Ohm-meter 1 x 1010 ASTM D257
Thermal
Thermal Conductivity 1.4 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.94 3.50 3.05 2.66 2.42
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.09 .84 .67 .50 .36
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad 950 is available in sheet, die-cut, or roll form, with and without pressure sensitive
adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are
available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 5, 2001
45
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
950
Sil-Pad® 980
High Cut-Through Resistant, Electrically Insulative, Thermally Conductive Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Bergquist Sil Pad 980 is a specially
formulated material with high crush
resistance to prevent cut through. Sil Pad
980 interface material provides thermal
conductivity and electrical insulation.
Use Sil Pad 980 material in screw
mounted application with cut through
problems. The Sil Pad 980 is Bergquist’s
best material for cut through resistance.
The cut through resistance of Sil-Pad 980,
K4, SP400KS have been measured using a
combination cut-through/voltage breakdown
test. A 1"x1" test sample was placed on
2"x2" base plate mounted in an Instron
Universal Test Machine.
A force probe was installed in a 1000 lbs.
load cell in the Instron crosshead. A high
potential DC current supply was used to
apply 500 Vdc to the test sample. The probe
was applied to the test sample with a
crosshead speed of 0.05 in/min until
breakdown voltage occurred. The applied
load at breakdown was read from the chart
recorder.
Probe Design:
Round metal probe machined to a 0.060-inch
radius and electrically insulated with
phenolic resin core material. Contact length
is 0.5 inch.
Typical Properties of Sil-Pad 980
Property Typical Value Test Method
Color Mauve Visual
Thickness 0.009" ASTM D374
Breaking Strength 140 lbs./inch ASTM D1458
Elongation 10% ASTM D412
Cut Through 750 lbs ASTM D412
Continuous Use Temp. -40°C to 150°C
Electrical
Dielectric Breakdown Voltage 4000 VAC ASTM D149
Dielectric Constant 3.5 ASTM D150
Volume Resistivity, Ohm-meter >1010 ASTM D257
Thermal
Thermal Conductivity 1.2 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 5.48 5.07 4.52 4.04 3.56
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.51 1.22 1.07 .89 .53
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded
value includes interfacial thermal resistance. These values are given to the
customer for reference only. Actual application performance is directly related to
the surface roughness, flatness and pressure applied.
Rev: October 4, 2001
0
200
400
600
800
1000
1200
SPK4 SP400KS SP980
Bergquist Materials
Cut Through, lbs.
46
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
980
Sil-Pad®
1500
Electrically Insulating, Thermally Conductive Elastomeric Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad 1500 is a silicone elastomer
formulated to maximize the thermal and
dielectric performance of the filler/binder
matrix. The result is a grease-free,
conformable material, capable of
meeting or exceeding the thermal and
electrical requirements of high reliability
electronic packaging applications.
Typical Properties of Sil-Pad 1500
Property Typical Value Test Method
Color Green Visual
Thickness 0.010" ASTM D374
Hardness (Shore Type A) 80 ASTM D2240
Breaking Strength 65 lbs./inch ASTM D1458
Elongation 20% ASTM D412
Tensile Strength 1000 psi ASTM D412
Continuous Use Temp. -60°C to 200°C
Electrical
Dielectric Breakdown Voltage 4000 VAC ASTM D149
Dielectric Constant 4 ASTM D150
Volume Resistivity, Ohm-meter 1011 ASTM D257
Thermal
Thermal Conductivity 2 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.54 3.18 2.68 2.40 2.22
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.72 0.57 0.46 0.38 0.32
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded
value includes interfacial thermal resistance. These values are given to the
customer for reference only. Actual application performance is directly related to
the surface roughness, flatness and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad 1500 is available in sheet, die-cut, or roll form, with and without pressure sensitive
adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are
available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
47
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
1500
Sil-Pad®
A1500
Electrically Insulating, Thermally Conductive Elastomeric Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Bergquist Sil-Pad A1500 (SPA 1500) is a
silicone based thermally conductive and
electrically insulating material. It
consists of a cured silicone elastomeric
compound coated on both sides of a
fiberglass reinforcement layer.
SPA 1500 has been designed as an
effective alternative to the SP 1500
product filler technologies.
SPA 1500 is a product of similar
performance to the SP 1500 manufac-
tured with a more environmentally
friendly, solvent-free process.
Typical Properties of Sil-Pad A1500
Property Typical Value Test Method
Color Green Visual
Thickness 0.010" ASTM D374
Specific Gravity 2.9 g/cc ASTM D792
Hardness (Shore Type A) 80 ASTM D2240
Breaking Strength 65 lbs./inch ASTM D1458
Elongation 40% ASTM D412
Continuous Use Temp. -60°C to 200°C
Electrical
Dielectric Breakdown Voltage 6000 VAC ASTM D149
Dielectric Constant 7 ASTM D150
Volume Resistivity, Ohm-meter 1011 ASTM D257
Flame Rating 94V-0 U.L.
Thermal
Thermal Conductivity 2 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.03 2.62 2.21 1.92 1.78
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.59 0.50 0.42 0.34 0.31
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded
value includes interfacial thermal resistance. These values are given to the
customer for reference only. Actual application performance is directly related to
the surface roughness, flatness and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad A1500 is available in sheet, die-cut, or roll form, with and without pressure
sensitive adhesive. Standard sheet sizes of 4" x 4", 6" x 6", 8" x 8", and 10" x 10" are
available. The maximum recommended roll width is 10 inches.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
48
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
A1500
Sil-Pad®
1750
Sil-Pad for High Humidity, High Dielectric (U.L. 1950, IEC 950) Requirements
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
The combination of high thermal
conductivity and excellent dielectric
strength retention after humidity
exposure is formulated into the
Sil-Pad 1750 elastomeric pad.
Sil-Pad 1750 relies on processes that
minimize the effect of high humidity on
the electrical properties of finished
material. Therefore, exposure to humid
environments during assembly, or over
long term operating conditions, will not
severely affect the ability of the material
to perform.
Typical Properties of Sil-Pad 1750
Property Typical Value Test Method
Color Green Visual
Thickness,
inches (mm) 0.012± .001
(.30) ASTM D374
Breaking Strength,
Lbs./inch (kN/m) 65
(12) ASTM D1458
Hardness
(Shore Type A) 85 ASTM D2240
Electrical
Dielectric Breakdown Voltage
VAC, min. 6000 ASTM D149
Volume Resistivity, Ohm-meter
As Manufactured 1.0 x 1012
After 48hrs at 90% rh & 35°C3.0 x 1011
After 4hrs at 150°C2.0 x 1014
ASTM D257
Thermal
Thermal Conductivity,
W/m-K 2.2 ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.11 2.87 2.42 2.08 1.90
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) .86 .68 .53 .39 .28
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
SP 1750 may be purchased as sheets or punched parts. SP 1750 is available with either a
Silicone or Acrylic adhesive. SP 1750 is not available in rolls. Standard sheet sizes of
6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 9, 2001
49
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
1750
Sil-Pad®
2000
The High Performance, High Reliability Insulator
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad 2000 is a high performance
thermally conductive insulator. Sil-Pad
2000 material is designed for demanding
military / aerospace and commercial
applications. In these applications, Sil-
Pad 2000 complies with military
standards.
Sil-Pad 2000 is a silicone elastomer
formulated to maximize the thermal and
dielectric performance of the filler/binder
matrix. The result is a grease-free,
conformable material, capable of meeting
or exceeding the thermal and electrical
requirements of high reliability electronic
packaging applications.
MIL SPEC. MIL-M-38527/8A
MIL-M-38527C
MIL-I-49456
UL FILE NUMBER E59150
FSCM NUMBER 55285
Typical Properties of Sil-Pad 2000
Property Typical Value Test Method
Color White Visual
Thickness 0.015" ± 0.002 ASTM D374
Hardness (Shore Type A) 90 ASTM D2240
Continuous Use Temp. -60°C to 200°C
Electrical
Dielectric Breakdown Voltage 4000 AC-minimum ASTM D149
Dielectric Constant 4 ASTM D150
Volume Resistivity, Ohm-meter 1011 ASTM D257
Thermal
Thermal Conductivity 3.5 W/m-K ASTM D5470
Pressure (psi)
Thermal Impedance vs. Pressure 10 25 50 100 200
0.010 2.61 2.32 2.02 1.65 1.37
0.015 2.76 2.34 2.01 1.71 1.56
TO-220 Thermal Performance, oC/W
@ Standard Thickness, inch 0.020 2.78 2.48 2.21 1.99 1.86
0.010 0.57 0.43 0.33 0.25 0.20
0.015 0.63 0.48 0.37 0.30 0.24
Thermal Impedance, oC-in2 / W (1)
@ Standard Thickness, inch 0.020 0.76 0.63 0.55 0.45 0.35
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes
interfacial thermal resistance. These values are given to the customer for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
OUTGASSING DATA FOR SPACECRAFT MATERIALS
Post Cure
Conditions % TML
(1.0% Maximum Acceptable) %CVLM
(0.1% Maximum Acceptable)
24 hrs. @ 175°C
No Post Cure
0.07
0.26 0.03
0.10
SPECIAL THICKNESS
SP 2000 is available in a variety of thickness gages to meet customer requirements.
Preferred thickness includes 10, 15, and 20 mil. Please contact Inside Sales for additional
thickness information.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
SP 2000 is available in sheet or die-cut form, with and without pressure sensitive adhesive.
Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
50
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
2000
Sil-Pad®
A2000
High Performance, High Reliability Thermally Conductive Interface Material
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad A2000 (SPA-2000) is a
conformable elastomer with very high
thermal conductivity that acts as a
thermal interface between electrical
components and heat sinks. SPA-2000 is
for applications where optimal heat
transfer is a requirement.
This thermally conductive silicone
elastomer is formulated to maximize the
thermal and dielectric performance of the
filler/binder matrix. The result is a
“grease-free”, conformable material
capable of meeting or exceeding the
thermal and electrical requirements of
high reliability electronic packaging
applications.
Typical Applications
• Motor Drive Controls
• Avionics
• High Voltage Power Supplies
• Power Transistor / Heat Sink
Interface
Area where heat needs to be transferred
to a frame, chassis, or other type of heat
spreader.
Typical Properties of Sil-Pad A2000
Property Typical Value Test Method
Color White Visual
Thickness .011", .015", .020" ASTM D374
Specific Gravity 3.2 g/cc ASTM D792
Hardness (Shore Type A) 90 ASTM D2240
Heat Capacity 1.0 J/g-K ASTM C351
Continuous Use Temp. -60°C to 200°C
Electrical
Dielectric Breakdown Voltage 4000 AC-minimum ASTM D149
Dielectric Constant 7 ASTM D150
Volume Resistivity, Ohm-meter 1011 ASTM D257
Flame Rating 94V-0 (pending) U.L.
Thermal
Thermal Conductivity 3.5 W/m-K ASTM D5470
Pressure (psi)
Thermal Impedance vs. Pressure 10 25 50 100 200
0.011 2.06 1.93 1.82 1.77 1.71
0.015 2.05 1.94 1.86 1.79 1.72
TO-220 Thermal Performance, oC/W
@ Standard Thickness, inch 0.020 2.51 2.46 2.41 2.34 2.24
0.011 0.46 0.36 0.32 0.28 0.25
0.015 0.53 0.40 0.32 0.28 0.26
Thermal Impedance, oC-in2 / W (1)
@ Standard Thickness, inch 0.020 0.62 0.52 0.51 0.44 0.41
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes
interfacial thermal resistance. These values are given to the customer for reference only. Actual
application performance is directly related to the surface roughness, flatness and pressure applied.
SPECIAL THICKNESS
SP A2000 is available in a variety of thickness gages to meet customer requirements.
Preferred thickness includes 11, 15, and 20 mil. Please contact Inside Sales for additional
thickness information.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad A2000 is available in sheet, die-cut, or roll form, with and without pressure
sensitive adhesive. Standard sheet sizes of 4" x 4", 6" x 6", 8" x 8", and 10" x 10" are
available. Maximum roll width is 10inches.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: November 20, 2001
51
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
A2000
Sil-Pad®
K-4
The Original Kapton™ Based Insulator
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad K-4 (SP K-4) uses a specially
developed film which has high thermal
conductivity, high dielectric strength and
is very durable. SP K-4 combines the
thermal transfer properties of well-
known Sil-Pad rubber with the physical
properties of a film.
SP K-4 is a durable insulator that
withstands high voltages and requires no
thermal grease to transfer heat. SP K-4 is
available in customized shapes and sizes.
MIL SPEC. MIL-M-38527/8A
MIL-M-38527C
MIL-I-49456
MIL-M-87111
UL FILE NUMBER E59150
FSCM NUMBER 55285
Typical Properties of Sil-Pad K-4
Property Typical Value Test Method
Color Gray Visual
Thickness 0.006 ASTM D374
Hardness (Shore Type A) 90 ASTM D2240
Breaking Strength 30 lbs/in 5 kN/m ASTM D1458
Elongation, %45° to warp & fill 40 ASTM D882A
Tensile Strength 5 kPsi ASTM D412
Construction Silicone / Kapton
Continuous Use Temp. -60°C to 180°C
Electrical
Dielectric Breakdown Voltage 6000 AC-minimum ASTM D149
Dielectric Constant 5 ASTM D150
Volume Resistivity, Ohm-meter 1012 ASTM D257
Thermal
Thermal Conductivity 0.9 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.66 3.43 3.13 2.74 2.42
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.07 0.68 0.48 0.42 0.38
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad K-4 is available in sheet, die-cut, or roll form, with and without pressure sensitive
adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are
available with and without pressure sensitive adhesive.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
52
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
Kapton® is a registered trademark of DuPont.
SIL-PAD®
Sil-Pad
®
K-4
The Original Kapton®Based Insulator
Sil-Pad®
K-6
The Medium Performance Kapton™ Based Insulator
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad K-6 is a medium performance
film based thermally conductive
insulator. The film is coated with a
silicone elastomer to deliver high
performance and provides a continuous
physically tough dielectric barrier against
“cut-through” and resultant assembly
failures.
MIL SPEC. MIL-M-38527/8A
MIL-M-38527C
MIL-I-49456
MIL-M-87111
UL FILE NUMBER E59150
FSCM NUMBER 55285
Typical Properties of Sil-Pad K-6
Property Typical Value Test Method
Color Bluegreen Visual
Thickness 0.006 ASTM D374
Hardness (Shore Type A) 90 ASTM D2240
Breaking Strength 30 lbs/in 5 kN/m ASTM D1458
Elongation, %45° to warp & fill 40 ASTM D882A
Tensile Strength 5 kPsi ASTM D412
Construction Silicone / Kapton
Continuous Use Temp. -60°C to 180°C
Electrical
Dielectric Breakdown Voltage 6000 AC-minimum ASTM D149
Dielectric Constant 4 ASTM D150
Volume Resistivity, Ohm-meter 1012 ASTM D257
Thermal
Thermal Conductivity 1.1 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 3.24 3.03 2.76 2.45 2.24
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.82 0.62 0.49 0.41 0.36
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad K-6 is available in sheet, die-cut, or roll form, with and without pressure sensitive
adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are
available with and without pressure sensitive adhesive.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
53
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
K-6
The Medium Performance Kapton®Based Insulator
Sil-Pad®
K-10
The High Performance Kapton™ Based Insulator
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad K-10 (SP K-10) is a high
performance insulator. It combines
special film with a filled silicone rubber.
The result is a product with good cut-
through properties and excellent thermal
performance.
SP K-10 is designed to replace ceramic
insulators such as Beryllium Oxide,
Boron Nitride, and Alumina. These
insulators are expensive and they break
easily. SP K-10 eliminates breakage and
costs much less than ceramics.
MIL SPEC. MIL-M-38527/8A
MIL-M-38527C
MIL-I-49456
MIL-M-87111
UL FILE NUMBER E59150
FSCM NUMBER 55285
Typical Properties of Sil-Pad K-10
Property Typical Value Test Method
Color Beige Visual
Thickness 0.006 ASTM D374
Hardness (Shore Type A) 90 ASTM D2240
Breaking Strength 30 lbs/in 5 kN/m ASTM D1458
Elongation, %45° to warp & fill 40 ASTM D882A
Tensile Strength 5 kPsi ASTM D412
Construction Silicone / Kapton
Continuous Use Temp. -60°C to 180°C
Electrical
Dielectric Breakdown Voltage 6000 AC-minimum ASTM D149
Dielectric Constant 3.7 ASTM D150
Volume Resistivity, Ohm-meter 1012 ASTM D257
Thermal
Thermal Conductivity 1.3 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 2.35 2.19 2.01 1.87 1.76
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.86 0.56 0.41 0.29 0.24
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please
contact your sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad K-10 is available in sheet, die-cut, or roll form, with and without pressure sensitive
adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are
available with and without pressure sensitive adhesive.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and
complexity of the part.
Rev: October 10, 2001
54
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
K-10
The High Performance Kapton®Based Insulator
Q-Pad® II Thermally Conductive Pad
The Grease Replacement Material for Maximum Heat Transfer
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Q-Pad II Eliminates Grease
Q-Pad II is a composite of .0015"
aluminum foil coated both sides with
.0025" thermally/electrically conductive
Sil-Pad rubber. It is designed for those
applications where maximum heat
transfer is needed and electrical isolation
is not required. Q-Pad II is the ideal
thermal interface material to replace
messy thermal grease compounds.
Q-Pad II eliminates problems associated
with grease such as contamination of
reflow solder or cleaning operations. Q-
Pad II can be used prior to these
operations unlike grease. Q-Pad II also
eliminates dust collection which can
cause possible surface shorting or heat
buildup.
Some applications where Q-Pad II is
typically used include:
• Between a transistor and a heat sink.
• Between two large surfaces such as
an L-bracket and the chassis of an
assembly.
• Between a heat sink and a chassis.
• Under electrically isolated power
modules or devices such as resistors,
transformers and solid state relays.
Properties of Q-Pad II
Property Typical Value Test Method
Color Black Visual
Thickness 0.006 ± 0.001
w/ac 0.0065 ± 0.001 ASTM D374
Continuous Use Temp. 180 ˚ C
w/ac 150˚ C
Electrical
Volume Resistivity, Ohm-meter 1.0 x 102
w/ac1.0 x 103ASTM D257
Thermal
Thermal Conductivity 2.5 W/m-K
w/ac 1.3 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 2.44 1.73 1.23 1.05 0.92
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.52 0.30 0.22 0.15 0.12
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole
locations. Please contact your sales representative if tighter tolerances are
required.
OPTIONS
Q-Pad II is available in sheet, die-cut, or roll form, with and without
pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x
8", 10" x 10", and 12" x 12" are available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on
tolerances and complexity of the part.
U.L. File Number E59150
Rev: October 4, 2001
55
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Q-Pad
®
II
Thermally Conductive Pad
Q-Pad® 3 Thermally Conductive Pad
Easy to Handle, Greaseless Thermal Interface
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Bergquist Q-Pad 3 eliminates problems
associated with thermal grease such as
contamination of electronic assemblies
and reflow solder baths. Q-Pad 3 may be
installed prior to soldering and cleaning,
without worry. When clamped between
two surfaces, the elastomer conforms to
surface textures thereby creating and air
free interface between heat generating
components and heat sinks.
Fiberglass reinforcement enables
Q-Pad 3 to withstand processing stresses
without losing physical integrity.
Some applications where Q-Pad 3 is
typically used include:
• Between a transistor and a heat sink.
• Between two large surfaces such as
an L-bracket and the chassis of an
assembly.
• Between a heat sink and a chassis.
• Under electrically isolated power
modules or devices such as resistors,
transformers and solid state relays.
Properties of Q-Pad 3
Property Typical Value Test Method
Color Black Visual
Thickness 0.005 ± 0.001
w/ac 0.0055 ± 0.001 ASTM D374
Continuous Use Temp. 180 ˚ C
w/ac 150˚ C
Electrical
Volume Resistivity, Ohm-meter 1.0 x 10-1
w/ac1.0 x 101ASTM D4496
Thermal
Thermal Conductivity 2.0 W/m-K
w/ac 1.6 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance,
oC/W 2.26 1.99 1.76 1.53 1.30
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 0.65 0.48 0.35 0.24 0.16
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value
includes interfacial thermal resistance. These values are given to the customer for reference
only. Actual application performance is directly related to the surface roughness, flatness
and pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole
locations. Please contact your sales representative if tighter tolerances are
required.
OPTIONS
Q-Pad 3 is available in sheet, die-cut, or roll form, with and without
pressure sensitive adhesive. Standard sheet sizes of 6" x 6", 6" x 12", 8" x
8", 10" x 10", and 12" x 12" are available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on
tolerances and complexity of the part.
U.L. File Number E59150
Rev: October 4, 2001
56
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Q-Pad
®
3
Thermally Conductive Pad
Easy to Handle, Greaseless Thermal Interface
SOFTFACE ™
Automated, Greaseless Thermal Interface
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Bergquist Softface eliminates problems
associated with thermal grease such as
contamination of electronic assemblies
and reflow solder baths. Softface may be
installed prior to soldering and cleaning,
without worry.
Softface is supplied on a polyester film.
The material is transferred to a heat sink
or device using commercial hot-stamping
equipment.
With Softface applied to a component or
other surface you have a built-in thermal
interface. Rapid assembly of the material
eliminates labor and Softface has the
same thermal resistance as grease.
Softface can be supplied already applied
to a heat sink or other surface in the
assembly. The heat sink or other part can
be sent to the factory and Bergquist will
apply Softface before shipping to the
customer for pre-production quantities.
If rework is required, the heat sink or
component can be removed and then
reused without replacing Softface.
Typical Properties of Softface
Property Insulating
Value Non-Insulating
Value Test Method
Color White Black Visual
Thickness, inches .005 & .008 .003, .005 & .008 ASTM D374
Electrical
Dielectric Strength,
V/mil 500 NA ASTM D149
Dielectric Constant,
@ 1 KHz 4 Non-Insulating ASTM D150
Volume Resistivity,
Ohm-Cm 1010
------------------------------
------------------------------
101ASTM D257
ASTM D4496
Thermal
Thermal Conductivity,
W/mK 3.5 3.5 ASTM D5470
Thermal Resistance,
C-in2/W .06 / .09 .06 / .09 ASTM D5470
Manufacturing Requirements
Storage Life,
@ 25°C1 year (min) 1 year (min) ---
Cleanability,
Alcohol (IPA)
Water &/or
Isopropyl
Alcohol
Water &/or
Isopropyl
Alcohol ---
OPTIONS:
Softface material is available in roll form only. Hot-stamp equipment will
accommodate many different roll sizes. For more information on
hot-stamping equipment and techniques, please contact a Bergquist Sales
Representative.
Rev: October 9, 2001
57
®
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Softface
®
Automated, Greaseless Thermal Interface
Poly-Pad®
The Poly-Pad Family of Polyester-Based Thermally Conductive Insulation Materials
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Poly-Pads… For Silicone Sensitive Applications
Polyester based, thermally conductive insulators
from Bergquist provide a complete family of
material for silicone-sensitive applications. Poly-
Pads are ideally suited for applications requiring
conformal coatings or applications where silicone
contamination is a concern (telecomm & certain
aerospace applications). Poly-Pads are constructed
with ceramic filled polyester resins coating either
side of a fiberglass carrier or a film carrier. The
Poly-Pad family offers a complete range of
performance characteristics to match individual
applications.
Poly-Pad 400
Poly-Pad 400 is a fiberglass-based insulator coated
with a filled polyester resin. Poly-Pad 400 is
economical and designed for most standard
applications.
Poly-Pad 1000
Poly-Pad 1000 is also a fiberglass-based insulator
coated with a filled polyester resin. Poly-Pad 1000
offers superior thermal resistance for high
performance applications.
Poly-Pad K-4
Poly-Pad K-4 is a composite of film coated with a
polyester resin. PPK-4 is an economical insulator
and the film carrier provides excellent dielectric
and physical strength.
Poly-Pad K-10
Poly-Pad K-10 is a composite of film coated with
a polyester resin. PPK-10 offers superior thermal
performance for your most critical applications
with thermal resistance of 0.2 oC-in2/Watt as well as
excellent dielectric strength.
Typical Poly-Pad Properties Test Method
PP 400 PP 1000 PP K-4 PP K-10
Color Mauve Yellow Mauve Yellow Visual
Thickness 0.009" 0.009" 0.006" 0.006" ASTM D374
Elongation,
%45° to warp and fill 10 10 40 40 ASTM D412
Hardness, Shore A ± 5 90 90 90 90 ASTM D2240
Breaking Strength,
Lbs./inch 100 100 30 30 ASTM D1458
Tensile Strength, kPsi
%45° to warp and fill 7755ASTM D412
Specific Gravity 2.0 1.5 1.8 1.3 ASTM D792
Continuous Use Temp. -20°C to
150°C
-20°C to
150°C
-20°C to
150°C
-20°C to
150°C---
Dielectric Breakdown
Voltage, Volts a-c Min 4500 2500 6000 6000 ASTM D149
Dielectric Constant,
1000 Cps 5.5 4.5 5.0 3.7 ASTM D150
Volume Resistivity,
Ohm-meter 1.0 x 1011 1.0 x 1011 1.0 x 1012 1.0 x 1012 ASTM D257
Thermal Conductivity,
W/mK 0.9 1.2 0.9 1.3 ASTM D5470
Thermal Impedance vs. Pressure – PP 400
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 5.85 5.61 5.13 4.59 4.12
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.62 1.35 1.13 .86 .61
Thermal Impedance vs. Pressure – PP 1000
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 4.7 4.25 3.74 3.27 2.89
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.30 1.02 .82 .61 .43
Thermal Impedance vs. Pressure – PP K-4
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 5.64 5.04 4.34 3.69 3.12
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.55 1.21 .95 .70 .46
Thermal Impedance vs. Pressure – PP K-10
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 3.76 3.35 2.75 2.3 2.03
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.04 .80 .60 .43 .30
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded value includes interfacial thermal resistance. These values
are given to the customer for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
TOLERANCES
0.015 inch tolerances are held on width, length, hole diameters and hole locations. Please contact your
sales representative if tighter tolerances are required.
OPTIONS
Sil-Pad 950 is available in sheet, die-cut, or roll form, with and without pressure sensitive adhesive.
Standard sheet sizes of 6" x 6", 6" x 12", 8" x 8", 10" x 10", and 12" x 12" are available.
SPECIAL SHAPES
We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the
part.
Rev: October 5
,
2001
58
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Poly-Pad
®
The Poly-Pad Family of Polyester-Based Thermally Conductive Insulation Materials
BOND PLY 100
Thermally Conductive, Pressure Sensitive Adhesive Tape
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Bergquist Bond-Ply 100 is a thermally
conductive, double-sided pressure
sensitive adhesive tape. The tape consists
of a high performance, thermally
conductive acrylic adhesive coated with a
fiberglass reinforced interweave. Bond-
Ply 100 is designed to attain high bond
strength to a variety of surfaces and
maintain high bond strength with long
term exposure to moderate heat and high
humidity.
Use Bond-Ply 100 for:
• Mount heat sink onto BGA graphic
processor
• Mount heat sink to computer
processor
• Mount heat sink onto drive processor
• Mount heat spreader onto power
converter PCB
• Mount heat spreader onto motor
control PCB
Use Bond-Ply 100 instead of:
• Heat Cure Adhesive
• Screw Mounting
• Clip Mounting
Bond-Ply 100 is made in standard
thickness of 5, 8 and 11 mil. In the case
that these thickness will not work for your
application, Bergquist will coat custom
thickness of 4 to 12 mils.
Bond-Ply 100 is available in sheets, rolls
and punch part form. Standard sheet size
is 10" by 10". Standard Roll size is 10"
by 300’. Punch parts can be supplied on
rolls and individual parts.
Typical Properties of Bond-Ply 100
Property Typical Value Test Method
Color White Visual
Short Term Temperature Resistance, 30Sec 200 °C
Continuous Use Temperature -30°C to +120°C
Elongation, 45° Warp 70% ASTM D412
Tape Tensile Strength 0.9Kpsi ASTM D412
CTE 325 ppm TMA
Glass Transition -30 °CDSC
Lap shear at RT 100 psi ASTM D1002
Lap shear After 5 hr @ 100 °C200 psi ASTM D1002
Lap shear After 2 minutes @ 200 °C200 psi ASTM D1002
Static Dead Weight Shear 150 °CPSTC#7
Thermal Conductivity 0.8 W/m-K ASTM D5470
Property @ (inch) 0.005 0.008 0.011 Test Method
Breakdown Voltage, KVAC 3 6.5 8.5 ASTM D149
Surface Flatness, inch/inch 0.001 0.002 0.0025
Application Processors Processors PCB
Pressure (psi)
Thermal Impedance vs. Pressure 10 25 50 100 200
0.005 4.39 4.02 3.48 3.15 3.05
0.008 5.11 4.69 4.53 4.45 4.38
TO-220 Thermal Performance, oC/W
@ Standard Thickness, inch 0.011 6.26 5.92 5.73 5.63 5.53
0.005 0.78 0.61 0.58 0.55 0.54
0.008 1.28 0.94 0.90 0.86 0.84
Thermal Impedance, oC-in2 / W (1)
@ Standard Thickness, inch 0.011 2.47 1.22 1.19 1.14 1.11
* Single layer test that includes interfacial thermal resistance
Shelf Life: The double-sided pressure sensitive adhesive (PSA) inherent with
Bond-Ply products require the use of dual liners to protect the surfaces from
environmental contamination and accidental contact. The adhesive bond strength
between the PSA and the protective liner will typically increase while in storage
conditions. Thus, the worst-case shelf life for Bond-Ply products is limited not by
the material characteristics of Bond-Ply, but by the adhesion of the Bond-Ply PSA
to the protective liner. Bergquist recommends a 6 month shelf life at a maximum
continuous storage temperature of 35°C, or 3 month shelf life at a maximum
continuous storage temperature of 45°C, for maintenance of controlled adhesion to
the liner. The shelf life of the Bond-Ply material, without consideration of liner
adhesion (which is often not critical for manual assembly processing), is
recommended at 12 months from date of manufacture at a maximum continuous
storage temperature of 60°C.
Rev: October 1, 2001
59
Bond-Ply®: U.S. Patent 5,090,484 and others.
SIL-PAD®
Bond-Ply
®
100
Thermally Conductive, Pressure Sensitive Adhesive Tape
BOND PLY 660
Thermally Conductive, Electrically Insulating, Pressure Sensitive Adhesive Tape
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No.314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Bond-Ply 660 is a thermally conductive,
electrically insulating double-sided
pressure sensitive adhesive tape. The tape
consists of a high performance, thermally
conductive acrylic adhesive coated on
both sides of Bergquist T-600 film. Use
Bond-Ply 660 in applications to replace
mechanical fasteners or screws. Bond-
Ply 660 is designed specifically for
applications that require electrical
isolation.
Bond-Ply 660 is available in roll form
with kiss-cut or die-cut parts. The material
as delivered will include a continuous
base liner with differential release
properties to allow simplicity in roll form
pakaging and application assembly.
The Bergquist T-600 film has UL746B
electrical mechanical RTI rating of 150°C.
Bergquist File Number is E59150.
Typical Properties of Bond-Ply 660
Physical Property Typical Value Test Method
Color White Visual
Thickness 0.14 mm 0.0055 in ASTM D374
Tensile Strength 210 MPa 30 kpsi ASTM D882A
Elongation 40% ASTM D882A
TCE 250 ppm TMA
Glass Transition -30 º C DSC
Adhesion
Lap shear at RT 0.7 MPa 100 psi ASTM D1002
Lap shear After 5 hr @ 100 °C1.4 MPa 200 psi ASTM D1002
Lap shear 2 minutes @ 200 °C1.4 MPa 200 psi ASTM D1002
Static Dead Weight Shear 150 °CPSTC#7
Electrical
Breakdown Voltage as received 7 KVac ASTM D-149
Continuous Use Temperature -30 to 120°C
Short Term Temp.Resistance,10min. 200 °C
Thermal
Thermal Conductivity 0.4 W/m-K ASTM D5470
Thermal Impedance vs. Pressure
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance, oC/W 5.30 4.94 4.38 4.02 3.88
Thermal Impedance
Per ASTM D5470, oC-in2 / W (1) 1.15 0.79 0.74 0.72 0.70
1). The ASTM D5470 (Bergquist Corrected) test fixture was used. The recorded
value includes interfacial thermal resistance. These values are given to the
customer for reference only. Actual application performance is directly related to
the surface roughness, flatness and pressure applied.
Shelf Life: The double-sided pressure sensitive adhesive (PSA) inherent with
Bond-Ply products require the use of dual liners to protect the surfaces from
environmental contamination and accidental contact. The adhesive bond strength
between the PSA and the protective liner will typically increase while in storage
conditions. Thus, the worst-case shelf life for Bond-Ply products is limited not by
the material characteristics of Bond-Ply, but by the adhesion of the Bond-Ply PSA
to the protective liner. Bergquist recommends a 6 month shelf life at a maximum
continuous storage temperature of 35°C, or 3 month shelf life at a maximum
continuous storage temperature of 45°C, for maintenance of controlled adhesion to
the liner. The shelf life of the Bond-Ply material, without consideration of liner
adhesion (which is often not critical for manual assembly processing), is
recommended at 12 months from date of manufacture at a maximum continuous
storage temperature of 60°C.
Rev: October 1, 2001
60
FR4 or
Flex Circuit
Bond-Ply 660
Metal Heat
Spreader
Bond-Ply®: U.S. Patent 5,090,484 and others.
SIL-PAD®
Bond-Ply
®
660
Thermally Conductive, Electrically Insulating, Pressure Sensitive Adhesive Tape
Test
SPT 400 SPT 1000 Method
Color Gray/Green Brown Visual
Thermal Resistance C-in2/Watt 0.6 0.4 ASTM D5470
Thermal Conductivity, W/m-k 0.9 1.2 ASTM D5470
Breakdown Voltage, minimum 5000 5000 ASTM D149
Dielectric Constant, 1000 (Hz) 5.5 4.5 ASTM D150
Continuous Use Temp. °C -60 to + 180 -60 to + 200 —
Hardness, Shore A 80 80 ASTM D2240
Thickness/Wall (Inches) (mm) .012 (.30) .012 ( .30) ASTM D374
Breaking Strength lbs./in. (kN/m) 6 (1) 6 (1) ASTM D1458
Volume Resistivity, Ohm Meter 1.0 x 1011 1.0 x 1011 ASTM D257
SPT 400 and SPT 1000 (“Sil-Pad Tubes”) provide ther-
mally conductive insulation for clip mounted plastic power
packages. Sil-Pad Tubes are made of silicone rubber with
high thermal conductivity. Sil-Pad Tube 1000 is best suited
for higher thermal performance and Sil-Pad Tube 400 is
ideal for applications requiring average thermal performance
and economy.
Sil-Pad Tube standard configurations are available for
TO-220, TO-218, TO-247 and TO-3P plastic power pack-
ages. Special thicknesses and diameters can also be ordered.
SPT 400 and SPT 1000 are designed to meet VDE, UL and
TUV agency requirements. Typical properties of Sil-Pad
Tube are shown in the table below.
A
B
C
Standard Dimensions
A= Wall Thickness: .30 mm (.012") + .10 mm/-0.0 mm (+.004"/-0.0")
B = Inner Diameter: 11 mm (.433") and 13.5 mm (.532") ±1.0 mm (±.039")
C = Length 25 mm (.985") and 30 mm (1.18") +3.18 mm/-0.0 mm (+.125"/-0.0")
Special lengths are available. For more information contact the factory.
Ordering Procedure:
Sample: SPT400 ___ ___ ___
"A" -"B" -"C"
61
Sil-Pad
®
Tubes
SPT 400 and SPT 1000
Sil-Pad®: U.S. Patents
4,574,879; 4,602,125;
4,602,678; 4,685,987;
4,842,911 and others.
SIL-PAD®
Sil-Pad®
Shield
Bonded Laminate of Sil-Pad with a Copper Shield
The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia
North American Headquarterss Bramenberg 9a 9F-1, No. 314, Section 4
18930 West 78th Street 3755 BT Eemnes Ren Ai Road
Chanhassen, MN 55317 Netherlands Taipei, Taiwan, ROC 106
www.bergquistcompany.com Phone: 800-347-4572 Phone: 31-35-5380684 Phone: 886-2-2700-7796
Fax: 952-835-4156 Fax: 31-35-5380295 Fax: 886-2-2700-7795
Sil-Pad Shield
Bergquist Sil-Pad Shield is a bonded
laminate of thermally conductive,
electrically isolating Sil-Pad 400 or
Sil-Pad 1000 pads with a copper shield
between the layers. It is supplied with a
pre-tinned solder point for easy
grounding.
RFI Produced by Heat Sink Current
The Capacitance between a TO-3
encapsulated transistor and its heat sink
is typically 100pf when a mica or other
insulating washer is used. A power
supply constructed with a standard
insulator and a grounded heat sink can be
expected to produce about 10 times more
interference than is permitted.
A solution to the problem can be
accomplished by:
1. The use of chokes, filters and LC
networks which have to be designed
into the circuitry.
OR
2. Constructing a shield between the
transistor and its heat sink by replacing
the mica insulator with a Sil-Pad Shield.
(See illustration)
Typical Properties of Sil-Pad Shield
Property Typical Value Test Method
Thickness (total) inches 0.019± 0.004 --
Shield Thickness, inches
Copper Thickness 0.0015 --
Approx. Thermal Resistance (TO-3) .85° to 1.0°C/W --
Min. Breakdown Voltage
Between Device and Copper 4500 Volts ASTM D149
Capacitance
at 1000 Hz and 5 Volts 50 pico F --
Dissipation Factor at 1000 Hz and
5 Volts (TO-3) Power Factor 0.0155 ASTM D150
Dielectric Constant
at 1000 Hz and 5 Volts 5.5 ASTM D150
Continuous Use Temp. °C-60 to +180 --
Recommended Torque (TO-3) 6-8 inch Lbs. --
Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive
insulators. Sil-Pad Shield provides:
• Shielding effectiveness of 50dB or higher.
• Electrical isolation of 500 volts minimum.
• Good thermal transfer.
• Reduced labor costs due to the elimination of having to apply thermal
grease.
SPECIAL SHAPES
Sil-Pad Shield is available in many custom configurations to meet special requirements.
Tooling charges vary depending on tolerances and complexity of the part.
Rev: October 8, 2001
62
Sil-Pad®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
SIL-PAD®
Sil-Pad
®
Shield
Bonded Laminate of Sil-Pad with a Copper Shield
Grounded
Sink
Copper Shield
Transistor Lead Wire
To Negative
Sil-Pad® 400
1.125
.375
.437
.1.125
.375
.250
.125 DIA. tinned
copper (to ground)
.125 DIA 3 HOLES
.215
.430
1.673 .374
33°
.062
.666
1.187
.3931.378
.673
.125 DIA. tinned copper
(to ground)
.147 DIA. .171 DIA.
2 HOLES
.312
1.125
.562
.450
.312
1.125
.157 DIA
.125 DIA. tinned
copper (to ground)
.875
.250
.040DIA
3 HOLES
.200 DIA
.
.406
.125 DIA. tinned copper
(to ground)
.125
.500
.500
.250
.093 DIA
.215
.430
.072
.125 DIA. tinned
copper (to ground)
1.250
.625
.250
.250
.140 DIA (2)
.593
1.187
C
1.980
.995
.140 DIA
2 HOLES
.100
.480
.100
.960
.075 DIA
2 HOLES
.590 .125 DIA.
tinned
copper
(to ground)
.840
.600
.350
.200
1.200
1.680
.260 DIA
.125 DIA. tinned copper
(to ground)
.438
.625
1.250
.625
.438
1.250
.093 DIA
2 HOLES
.605
.447
.187
.652 .070
.875
.140 DIA
2 HOLES
.595
1.190 N.T.S.
30°
.215
.430
1.210
.
152
.305
1.750
.125 DIA.
tinned copper
(to ground)
.860
.430
.187
.187
.430
.860
.200 DIA.
P/N 09SPS01-002 (TO-220) P/N 09SPS01-001 (TO-3) P/N 09SPS01-009
P/N 09SPS01-011 (TO-5) P/N 09SPS01-016 (TO-3) P/N 09SPS01-017 (TO-66)
P/N 09SPS01-020 (DO-5) P/N 09SPS01-023 (TO-3) P/N 09SPS01-019 (DO-4)
Contact the factor y for other configurations.
63
Sil-Pad
®
Shield
Sil-Pad Shield Standard Configurations
SIL-PAD®
ORDERING
64
High Power Application
Hi-Flow without Thermal Clad
High Power Application
Hi-Flow with Thermal Clad
This guide covers Sil-Pad products specifically, but Bergquist offers a wide array of thermal solutions for any surface mount application. Reasons for
selecting one material over another are varied, but typically the decision is power density driven.
Power Device
Processor
Thermal Clad
Hi-Flow
Typical applications include:
• Pentium®
, Athlon®
, and other high performance CPUs
• DC/DC Converters
• Power modules
Hi-Flow materials are manufactured with or without film or foil carriers.
Custom shapes and sizes for non-standard applications are also available.
HI-FLOW®
The Hi-Flow family of Phase Change Materials (PCM) offers an easy to apply thermal
interface for many surface mount packages. At the phase change temperature, Hi-Flow
materials change from a solid and flow with minimal applied pressure. This characteristic
optimizes heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly
used to replace messy thermal grease.
Bergquist PCMs are specially compounded to prevent pump out of the interface area,
which is often associated with thermal grease.
Hi-Flow
Maximum Power 100 Watts plus per square inch Hi-Flow and Heat Spreader
with or without Thermal Clad
High Power 40 to 100 Watts per square inch Bergquist Thermal Clad
(CML,MP,LT I and HT)
Medium Power 10 to 50 Watts per square inch Bergquist Sil-Pad or Bond-Ply
with Heat Spreader
Low Power 1 to 15 Watts per square inch Bergquist Gap Pad with or
without Heat Spreader
Bergquist Solutions for Surface Mount Applications
ORDERING
65
Mid Power Application with Sil-Pad or Bond-Ply
Power Device
Sil-Pad or Bond-Ply FR4
SIL-PAD®
Sil-Pad is the benchmark in thermal interface materials. The Sil-Pad family of materials are
thermally conductive and electrically insulating. Sil-Pad materials come in a variety of
different thicknesses and are frequently used in SMT applications such as:
• Interface between thermal via's in a PCB, and a heatsink or casting
• Heat sink interface to many surface mount packages
Sil-Pad is available in custom shapes, sheets, and rolls.
BOND-PLY®
The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply
is available in a PSA or laminating format, is reinforced with fiberglass or film and comes in a
variety of different thicknesses. Bond-Ply provides for the mechanical decoupling of bonded
materials with mismatched thermal coefficients of expansion. Typical applications include:
• Bonding bus bars in a variety of electronic modules and sub assemblies
• Attaching a metal-based component to a heatsink
• Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages
• Bonding flexible circuits to a rigid heat spreader or thermal plane
• Assembly tapes for BGA heat spreader
GAP PAD®
The Gap Pad product family offers a line of thermally conductive materials which are highly
conformable. Varying degrees of thermal conductivities and compression deflection characteris-
tics are available. Typical applications include:
• On top of a semiconductor package such as a QFP or BGA (Often times, several packages
with varying heights can use a common heatsink when utilizing Gap Pad)
• Between a PCB or substrate and a chassis, frame, or other heat spreader
• Areas where heat needs to be transferred to any type of heat spreader
Gap Pads are available in thickness of 0.010" to 0.200", and in custom shapes, with or without
adhesive.
TOP EFFICIENCY IN
THERMAL MATERIALS FOR
TODAY'SCHANGING TECHNOLOGY.
Contact Bergquist for additional information regarding our
Thermal Solutions. We are constantly innovating to offer
you the greatest selection of options and flexibility to meet
today's changing technology.
Lower Power Application with Gap Pad
Gap Pad
Power
Device
Where Thermal Solutions All Come Together
ORDERING PROCEDURE:
The last 2 or 3 digits define the part number selected. The “foot
print” and dimensions are shown on pages 70-76. Each material
has a prefix as shown on page 69.
SPECIAL SHAPES:
For applications requiring non standard or custom Sil-Pad
configurations contact the factory.
We produce thousands of specials. Engineering charges are
about $200 for simple parts. Increased complexity or tighter
tolerances increase engineering charges.
TOLERANCES:
Typical converting tolerances are held on length (L), width (W),
hole diameter and hole location for most materials as noted
below:
Sil-Pads
Part Dimension Length & Width Hole Location & Diameter
< 6” ± .010” ± .005”
6” - 12” ± .015” ± .010”
> 12” ± .020” TBD
Gap Pads
Material Thickness Tolerance
10 mil ± .015”
15 mil ± .015”
20 mil ± .020”
30 mil ± .030”
40 mil ± .035”
50 mil ± .040”
60 mil ± .050”
80 mil ± .050”
100 mil ± .060”
125 mil ± .075”
140 mil ± .100”
160 mil ± .100”
200 mil ± .125”
225 mil ± .160”
250 mil ± .160”
Note: Dependent upon material and application requirements,
tighter tolerances may be feasible and available. Please con-
tact Bergquist Sales for these requests and additional informa-
tion regarding tolerances.
SHEETS:
Standard sheet size for most materials is 12” x 12”, with or
without adhesive as specified on the individual data sheet.
When ordering sheets, please specify material type, thickness
and include all dimensions. Contact Bergquist Sales if other
sizes are required.
Note: Sil-Pad A2000 maximum sheet size is 10” x 12”.
Gap Pad standard sheet size is 8” x 16”.
ROLLS:
Sil-Pad materials are available in roll form, with or without
adhesive, with the exception of Sil-Pad 1750, Sil-Pad 2000 and
Sil-Pad A2000. Hi-Flow materials are available in roll form.
Certain Gap Pad materials are available in roll form. Please
contact Bergquist Sales for more information.
ADHESIVES:
Bergquist offers two primary types of adhesives for all materials.
SILICONE: (AC) - Unloaded
(TAC) - Loaded (Thermally Enhanced)
ACRYLIC: (AAC) - Unloaded
(TAAC) - Thermally Loaded
(EAAC) - Thermally Enhanced
THICKNESS: .0005-.001,(12-25µm) (Adhesive only)
PEEL STRENGTH: See data below.
POL = Peel Off Liner (force per lineal strength of the liner to
the adhesive).
QS = Quick Stick (Simulated force per lineal strength of the
adhesive to the heat sink).
g/in = Grams per inch.
ADHESIVE POL QS
Silicone AC 50-150 g/in 50-150 g/in
Silicone TAC 50-150 g/in 50-150 g/in
Acrylic AAC 5-70 g/in 100-800 g/in
Acrylic TAAC 5-70 g/in 100-400 g/in
Acrylic EAAC 5-60 g/in 100-200 g/in
Note: These values are typical after the material has aged for
2-3 weeks and are significantly different immediately after
coating. Upon completion of coating, QS is 250-500 g/in and
POL is 3-20 g/in for all silicone adhesives.
Ordering Procedure, PSA Characteristics, Mil-Spec
66
ORDERING
ORDERING
SHELF LIFE:
Silicone Adhesives: Six (6) months from DOM (date of
manufacture) when stored in original packaging at 70°F (21°C)
and 50% relative humidity.
Acrylic Adhesives: One (1) year from DOM (date of manufac-
ture) when stored in original packaging at 70°F (21°C) and 50%
relative humidity.
Peel adhesion data is available upon request. Please contact
Bergquist Sales for more information.
PSA CHARACTERISTICS:
Standard pressure sensitive adhesive (AC) coated on one side of a
Sil-Pad will increase the thermal resistance (per ASTM D5470) by
0.2 C/in2/W. Standard PSA on 2 sides increases the thermal
impedance by 0.4 C/in2/W.
Thermally conductive PSA (TAC) on one side increases the
thermal resistance by 0.05 C/in2/W and on two sides by 0.1 C/in2/W.
The effect of AC and TAC on the thermal impedance in an
application will vary. In low pressure applications, the pressure
sensitive adhesive will wet out the interface easier and eliminate
the interfacial thermal resistance.
Note: Bergquist adhesives are designed for ease of application
during assembly. If an automated dispensing method is preferred,
Bergquist will recommend manufacturers of automated dispensing
equipment upon request. Please contact Bergquist Sales for more
information on this subject.
Note: Bergquist cannot be responsible for dispensing equip-
ment selection and/or performance of specific materials on said
equipment. It is the customer’s responsibility to determine the
suitability and compatibility of the specif ic Bergquist material
with the selected equipment.
MATERIAL SPECIFICATIONS:
Bergquist will supply a Thermal Insulation Material Cross
Reference Listing for all pertinent military part numbers
included in the following Mil-Specs:
MIL M-38527 / 08 MIL I-49456A
MIL I-49466 / 02 NAS 4117
MIL H-87111 NAS 4118
Each Bergquist part number specifies a Bergquist grade of
thermal insulation material and a transistor case configuration.
Details of different Bergquist thermal insulation materials as
well as details on different thermal insulator configurations are
found on previous pages of the Sil-Pad Selection Guide.
MIL-I-49456A specifies a fiberglass reinforced elastomeric
sheet material showing type and class. MIL-I-49466-02, MIL
M-38527 / 08 and MIL-H-87111 specify thermal insulator
configurations.
MIL I-49466 / 02 supersedes the part numbers covered under MIL
M-38527 / 08.
M49466 / 02 is the most complete listing of mili-
tary part numbers. Each of the military part numbers in M49466
/ 02 is cross referenced to specific Bergquist part numbers.
Please use MIL-I-49466 whenever possible. Please contact The
Bergquist Company for the complete MIL Spec Reference
Guide.
FSCM NUMBER 55285
U.L.®RECOGNITION:
For information regarding the UL (Underwriters Laboratories,
Inc.) recognition status of Bergquist Sil-Pad, Gap Pad and
Hi-Flow materials, the UL web site provides the most current
information.
Using the address: http://www.ul.com, select “Online
Certification Directory.” You may then enter one of the
following file numbers for the applicable Bergquist file:
QMFZ2.E59150: Plastics – Component. This category
includes all Sil-Pad, Gap Pad and Hi-Flow materials.
QOQW2.E81718: Polymeric Adhesive Systems, Electrical
Equipment – Component. This category includes Bond-Ply
Adhesive only.
In each group there is a “Guide Information” section which
gives a detailed description of the categories listed and all
recognized materials will be listed with supporting data.
67
ORDERING
MATERIAL THICKNESS:
SIL-PAD®400
■■.007" ■■.009"
■■.015"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
SIL-PAD®800
■■.005" DRY
■■.005" ADHESIVE
SIL-PAD®900S
■■.009" DRY
■■.009" ADHESIVE
SIL-PAD®950
■■.009"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
SIL-PAD®980
■■.009"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
SIL-PAD®1500 & A1500
■■ .010"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
SIL-PAD®1750
■■.012" DRY
■■.012" ADHESIVE
SIL-PAD®2000 & A2000
■■.010" ■■ .015" ■■ .020" ■■ .030"
■■ .040" ■■ .050" ■■ .060" ■■ .080"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
SIL-PAD®K-4
■■.006"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
SIL-PAD®K-6
■■.006"
■■ADHESIVE 1 SIDE
■■ ADHESIVE 2 SIDES
SIL-PAD®K-10
■■.006"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
Q-PAD®II
■■.006"
■■ADHESIVE 1 SIDE
Q-PAD®3
■■.005"
■■ADHESIVE 1 SIDE
SOFTFACE®
(INSULATING) (NON-INSULATING)
■■.003" ■■.005"
■■.005" ■■.008"
■■.008"
POLY-PAD®400
■■.009"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
POLY-PAD®1000
■■.009"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
POLY-PAD®K-4
■■.006"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
POLY-PAD®K-10
■■.006"
■■ADHESIVE 1 SIDE
■■ADHESIVE 2 SIDES
BOND-PLY®100
■■.005"
■■.008"
■■.011"
BOND-PLY®660
■■.0055"
SIL-PAD®SHIELD
■■ SP400 ■■ SP1000
GAP PAD® VO & VO ULTRA
SOFT
■■.020" ■■.080" ■■.160"
■■.040" ■■.100" ■■.200"
■■.060" ■■.125" ■■.250"
■■ADHESIVE 1 SIDE
GAP PAD®VO SOFT
■■.020" ■■.100"
■■.040" ■■.125"
■■.060" ■■.160"
■■.080"
■■ADHESIVE 1 SIDE
GAP PAD®1500
■■.020" ■■.100"
■■.040" ■■.125"
■■.060" ■■.160"
■■.080" ■■.200"
GAP PAD®1500R
■■.010" ■■.020"
■■.015"
GAP PAD®A2000
■■.010" ■■.020"
■■.015" ■■.040"
GAP PAD®A3000
■■.010" ■■.015" ■■.020"
GAP PAD®HC 1000
■■.010" ■■.015" ■■.020"
GAP PAD®HC 1100
■■.015" ■■.020"
HI-FLOW®105
(THICKNESS WITH SUBSTRA TE)
■■.0055"
HI-FLOW®115-AC
■■.0055"
HI-FLOW®200G
■■.0055"
HI-FLOW®225F-AC
■■.004"
HI-FLOW®225U
■■.0015"
HI-FLOW®225UT
■■.003"
HI-FLOW®625
■■.005"
HI-FLOW®818
■■.0055"
NOTE: The following Gap Pad™materials are available with
adhesive:
Gap Pad®VO – all thicknesses
Gap Pad®VO Soft – all thicknesses
Gap Pad®VO Ultra Soft – all thicknesses
Adhesive is applied to one side only of the material. The
other surface has a natural inherent tack. All Gap Pads®that
are not offered with adhesive have this natural tack (with the
exception of HC 1100).
CALL 1-800-347-4572 TO
ORDER FREE SAMPLES.
Building a Part Number
68
ORDERING
69
PART NUMBER CODING:
Complete the part number with a 2 or 3 digit
part number suffix from standard configurations
as listed on the following pages.
SIL-PAD®400
7 mil - dry 3223-07FR-_____
9 mil - dry 7403-09FR-_____
7 mil - adhesive 3223-07AC-_____
9 mil - adhesive 7403-09AC-_____
SIL-PAD®800
5 mil - dry SP800S-_____
5 mil - adhesive SP800SAC-_____
SIL-PAD®900S
9 mil - dry SP900-_____
9 mil - adhesive SP900AC-_____
SIL-PAD®950
9 mil - dry SP950-_____
9 mil - adhesive SP950AC-_____
SIL-PAD®980
9 mil - dry SP980-_____
9 mil - adhesive SP980AC-_____
SIL-PAD®1500
10 mil - dry 1510-_____
10 mil - adhesive 1510AC-_____
SIL-PAD®A1500
10 mil - dry A1510-_____
10 mil - adhesive A1510AC-_____
SIL-PAD®1750
12 mil - dry 1750-_____
12 mil - adhesive 1750AC-_____
SIL-PAD®2000
15 mil - dry 2015-_____
15 mil - adhesive 2015AC-_____
SIL-PAD®A2000
15 mil - dry A2015-_____
15 mil - adhesive A2015AC-_____
SIL-PAD®K-4
6 mil - dry K4-_____
6 mil - adhesive K4AC-_____
SIL-PAD®K-6
6 mil - dry K6-_____
6 mil - adhesive K6AC-_____
SIL-PAD®K-10
6 mil - dry K10-_____
6 mil - adhesive K10AC-_____
Q-PAD®II
6 mil - dry Q2-_____
6 mil - adhesive Q2AC-_____
Q-PAD®3
5 mil - dry Q3-_____
5 mil - adhesive Q3AC-_____
POLY-PAD®400
9 mil - dry PP400-_____
9 mil - adhesive PP400AC-_____
POLY-PAD®1000
9 mil - dry PP1000-_____
9 mil - adhesive PP1000AC-_____
POLY-PAD®K-10
6 mil - dry PPK10-_____
6 mil - adhesive PPK10AC-_____
BOND-PLY®100
5 mil - adhesive BP105-_____
8 mil - adhesive BP108-_____
11 mil - adhesive BP111-_____
(double-sided adhesive only)
BOND-PLY®660
.0055” BP660-_____
(double-sided adhesive only)
SIL-PAD®SHIELD 400
09SPS01-_____
SIL-PAD®SHIELD 1000
01SPS01-_____
CALL 1-800-347-4572 TO
ORDER FREE SAMPLES.
Building a Part Number (2)
ORDERING
4 Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F" "G"
-84 1.312 .762 .140 .062 .960 .200 .100
Plastic Part Number Dimensions Part Number Dimensions
Power Suffix "A" "B" "C" "D" Suffix "A" "B" "C" "D"
Various -35 .710 .500 .160 .141 Various -104 1.000 .750 .300 .140
(Clip Mount) -43 .750 .500 Various -107 .810 .910 .170 .147
TO-126 -50 .437 .312 .140 093 Various -110 .984 .787
Various -51 .687 .562 .218 .125 Various -114 .827 .945 .197 .150
Various -52 .855 .630 .230 .093 Various -116 .855 .630 .228 .122
TO-220 -54 .750 .500 .187 .147 Various -117 .827 .709 .256 .126
TO-202 -55 .610 .560 .245 .125 Various -118 .748 .551 .217 .126
Various -56 .855 .562 .218 .125 Various -119 .437 .311 .142 .110
TO-220 -58 .750 .500 .187 .125 Various -120 .728 .472 .157 .098
TO-126 -60 .437 .312 .140 .122 TO-3P -122 1.140 .810 .355 .147
Various -61 .750 .410 .225 .156 Various -126 .945 .748 .256 .162
TO-220 -62 .750 .600 .240 .150 Various -128 .984 1.654 .315 .157
Various -63 .750 .600 .240 .115 Various -131 .709 .512 .177 .122
Various -64 .500 .385 .170 .120 Various -132 .472 .315 .157 .126
TO-218 -68 1.125 .625 .200 .145 Various -133 .866 .709 .256 .126
Various -70 1.410 .810 .355 .147 Various -134 .945 .709 .228 .126
Various -90 .860 .740 .200 .160 Various -136 1.250 1.000
Various -102 .866 .650 .217 .142 Various -137 1.250 1.000 .258 .127
Various -103 .750 .800 .150 .160 Various -138 1.250 1.000 .258 .148
Power Part Number
Module Suffix "A" "B" "C" "D" "E" "F"
-67 1.500 .900 .150 1.200 .450 .075
-101 2.500 2.000 .344 1.812 1.000 .156
Plastic Part Number
Power Suffix "A" "B" "C" "D" "E" "F" "G"
-57 .910 .500 .200 .125 .580 .046 .265
-89 .983 .750 .432 .156 .665 .101 .217
Plastic Part Number
Power Suffix "A" "B" "C" "D" "E" "F" "G" "H"
-66 1.000 .500 .200 .141 .626 .046 .219 .032
Power Part Number
Resistors Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"
RH-25 -94 1.187 1.205 .234 .469 .212 .156 .719 .781 .140
RH-50 -95 2.093 1.265 .265 .530 .210 .255 1.563 .845 .140
RH-5 -96 .725 .771 .140 .280 .140 .156 .445 .491 .093
RH-10 -97 .805 .890 .127 .250 .130 .190 .551 .630 .121
RH-25 -98 1.150 1.180 .231 .425 .190 .270 .688 .800 .147
RH-50 -99 1.965 1.236 .198 .404 .132 .263 1.569 .972 .130
TO-220 Part Number
Multiples Suffix "A" "B" "C" "D" "E" "F" # Of Holes
2 Parts -34 1.000 .750 .187 .125 .250 .500 2
3 Parts -36 1.500 .750 .187 .125 .250 .500 3
-37 2.000 .750 .187 .125 .250 .500 4
-38 2.500 .750 .187 .125 .250 .500 5
-39 3.000 .750 .187 .125 .250 .500 6
-40 3.500 .750 .187 .125 .250 .500 7
-41 4.000 .750 .187 .125 .250 .500 8
Power Part Number
Module Suffix "A" "B" "C" "D" "E" "F"
-108 4.600 2.400 2.125 .500 1.800 .125
-140 4.598 2.402 2.098 0.500 1.799 0.150
-141 2.279 2.402 2.102 0.488 0.650 0.150
-142 2.280 1.450 1.270 0.490 0.650 0.130
TO-220
70
Sil-Pad®Configurations
ORDERING
Sil-Pad®Configurations
71
Part Number
Multiwatt Suffix "A" "B" "C" "D" "E"
-124 .872 .790 .160 .148 .118 x 45°
-125 .866 .787 .157 .154 .079 x 45°
Multi-Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F"
-93 1.350 .800 .140 .400 .960 .480
Diode Part Number Dimensions Part Number Dimensions
Washer Suffix "A" "B" Suffix "A" "B"
Various -19 .510 .140 Various -75 .360 .260
DO-4 -20 .510 .200 Various -76 .750 .125
DO-5 -21 .800 .260 Various -77 .800 .190
DO-4 (oversized) -22 .625 .200 DO-8 -78 .875 .313
DO-5 (oversized) -25 1.000 .260 Various -79 1.180 .515
Various -26 .812 .145 Various -80 1.250 .380
Various -27 .812 .115 Various -81 1.500 .200
Various -28 1.000 .140 Various -82 .512 .161
Various -32 1.500 .500 Various -111 .591 .217
Part Number Dimensions
TO-36 Suffix "A" "B" "C"
-08 1.063 .690 .190
Small Power Part Number
Devices Suffix "A" "B" "C"
TO-5, 3 Holes -09 .360 .200 .040
TO-18, 3 Holes -12 .250 .100 .036
TO-18, 4 Holes -13 .250 .100 .036
TO-5, 4 Holes -33 .360 .200 .040
TO-5, 3 Holes -44 .390 .200 .040
TO-5, 4 Holes -45 .390 .200 .040
Part Number Dimensions
Rectifier Suffix "A" "B" "C"
-46 1.250 1.250 .200
-47 1.125 1.125 .140
-48 1.000 1.000 .187
TIP Part Number
Packages Suffix "A" "B" "C" "D" "E"
Clip Mount -42 .984 .787 .205
TIP-36 Plastic Tip -53 .865 .650 .650 .140 .205
TO-3P -65 1.260 .787 .984 .142 .205
Plastic Clip -73 .984 .787 .708 .142 .205
Power Part Number Dimensions
Module Suffix "A" "B" "C" "D" "E" "F" "G"
-100 2.510 1.260 .630 .305 1.900 .205 .205
-123 1.614 1.102 .551 .157 1.220 .118 .118
SIP Part Number
Package Suffix "A" "B" "C" "D" "E" "F" "G"
-105 1.450 .838 .612 .245 .960 .170 .120
Part Number
Quarz Suffix "A" "B" "C" "D"
-115 .472 .197 .193 .031
Power Part Number
Module Suffix "A" "B" "C" "D" "E" "F" "G"
-109 1.350 .642 .321 .195 .960 .060 .125
B
A
D-DIA EC
A
B
C
D
A
D
C
B
(2) G Dia
F RAD
(TYP)
E
ORDERING
Sil-Pad®Configurations
TO-3 & TO-66 Part Number Dimensions
Style Suffix "A" "B" "C" "D" "E" "F" "G"
-02 1.780 1.250 .140 .093 1.187 .430 .072
-03 1.563 1.050 .140 .080 1.187 .430 .072
-04 1.650 1.140 .122 .062 1.187 .430 .072
-05 1.650 1.140 .140 .093 1.187 .430 .072
-06 1.650 1.140 .165 .062 1.187 .430 .072
-07 1.780 1.250 .165 .094 1.187 .430 .072
-10 1.440 1.000 .140 .075 .960 .200 .100
-11 1.312 .762 .140 .062 .960 .200 .100
-15 1.780 1.250 .140 .046 1.187 .430 .072
-16 2.070 1.560 .122 .062 1.187 .430 .072
-17 1.650 1.140 .140 .046 1.187 .430 .072
-18 1.563 1.050 .140 .140 1.187 .430 .072
-23 1.593 1.100 .156 .062 1.187 .430 .072
-24 1.700 1.187 .156 .062 1.187 .430 .072
-29 1.650 1.065 .140 .046 1.187 .430 .072
-30 1.250 .700 .140 .062 .960 .200 .100
-31 1.375 .825 .140 .062 .960 .200 .100
-59 Leadless 1.650 1.140 .165 1.187
-112 1.780 1.248 .165 .063 1.185 .429 .073
-113 1.563 1.051 .165 .079 1.185 .429 .073
-127 1.307 .819 .165 .063 .909 .236 .061
-129 1.654 1.063 .138 .059 1.181 .433 .071
-135 1.650 1.142 .165 .142 1.187 .429 ..072
3 LeadPart Number Dimensions
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"
-92 1.650 1.140 .140 .093 1.187 .430 .400 .155 .718
4 Lead Part Number
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G"
-86 1.560 1.050 .156 .080 1.170 .470 72°
-87 1.563 1.050 .156 .063 1.187 .470 72°
8 Lead Part Number
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G"
-88 1.655 1.187 .156 .060 1.187 40° .500
10 Lead Part Number
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G" "H"
-91 1.650 1.140 .165 .040 1.187 .593 .500 32.7°
3 Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F" "G" "H"
-85 1.275 .750 .156 .100 .960 .200 .100 .200
9 Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F" "G" "H"
-83 1.440 1.000 .140 .055 .960 .480 .325 36°
Power Part Number
Module Suffix "A" "B" "C" "D" "E"
-130 1.600 .480 .165 1.197 .240
AI
FB
E
C DIA.
(2)
D DIA.
(3)
H
G
AF DIA.
B
E
C DIA.
(2)
D DIA.
(4)
18°
G°
A
B
E
D
C - DIA.
(2)
72
ORDERING
Sil-Pad®Configurations (SI Measurements)
4 Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F" "G"
-84 33.32 19.35 3.56 1.57 24.38 5.08 2.54
Plastic Part Number Dimensions Part Number Dimensions
Power Suffix "A" "B" "C" "D" Suffix "A" "B" "C" "D"
Various -35 18.03 12.70 4.06 3.58 Various -104 25.40 19.05 7.62 3.56
(Clip Mount) -43 19.05 12.70 Various -107 20.57 23.11 4.32 3.73
TO-126 -50 11.10 7.92 3.56 2.36 Various -110 24.99 19.99
Various -51 17.45 14.27 5.54 3.18 Various -114 21.01 24.00 5.00 3.81
Various -52 21.72 16.00 5.84 2.36 Various -116 21.72 16.00 5.79 3.10
TO-220 -54 19.05 12.70 4.75 3.73 Various -117 21.01 18.01 6.50 3.20
TO-202 -55 15.49 14.22 6.22 3.18 Various -118 19.00 14.00 5.51 3.20
Various -56 21.72 14.27 5.54 3.18 Various -119 11.10 7.90 3.61 2.79
TO-220 -58 19.05 12.70 4.75 3.18 Various -120 18.49 11.99 3.99 2.49
TO-126 -60 11.10 7.92 3.56 3.10 TO-3P -122 28.96 20.57 9.02 3.73
Various -61 19.05 10.41 5.72 3.96 Various -126 24.00 19.00 6.50 4.11
TO-220 -62 19.05 15.24 6.10 3.81 Various -128 24.99 42.01 8.00 3.99
Various -63 19.05 15.24 6.10 2.92 Various -131 18.01 13.00 4.50 3.10
Various -64 12.70 9.78 4.32 3.05 Various -132 11.99 8.00 3.99 3.20
TO-218 -68 28.58 15.88 5.08 3.68 Various -133 22.00 18.01 6.50 3.20
Various -70 35.81 20.57 9.02 3.73 Various -134 24.00 18.01 5.79 3.20
Various -90 21.84 18.80 5.08 4.06 Various -136 31.75 25.40
Various -102 22.00 16.51 5.51 3.61 Various -137 31.75 25.40 6.55 3.23
Various -103 19.05 20.32 3.81 4.06 Various -138 31.75 25.40 6.55 3.76
Power Number
Module Suffix "A" "B" "C" "D" "E" "F"
-67 38.10 22.86 3.81 30.48 11.43 1.90
-101 63.50 50.80 8.74 46.02 25.40 3.96
Plastic Part Number
Power Suffix "A" "B" "C" "D" "E" "F" "G"
-57 23.11 12.70 5.08 3.18 14.73 1.17 6.73
-89 24.97 19.05 10.97 3.96 16.89 2.57 5.51
Plastic Part Number
Power Suffix "A" "B" "C" "D" "E" "F" "G" "H"
-66 25.40 12.70 5.08 3.58 15.90 1.17 5.56 0.81
Power Part Number
Resistors Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"
RH-25 -94 30.15 30.61 5.94 11.91 5.38 3.96 18.26 19.84 3.56
RH-50 -95 53.16 32.13 6.73 13.46 5.33 6.48 39.70 21.46 3.56
RH-5 -96 18.42 19.58 3.56 7.11 3.56 3.96 11.30 12.47 2.36
RH-10 -97 20.45 22.61 3.23 6.35 3.30 4.83 14.00 16.00 3.07
RH-25 -98 29.21 29.97 5.87 10.80 4.83 6.86 17.48 20.32 3.73
RH-50 -99 49.91 31.39 5.03 10.26 3.35 6.68 39.85 24.69 3.30
TO-220 Part Number
Multiples Suffix "A" "B" "C" "D" "E" "F" # Of Holes
2 Parts -34 25.40 19.05 4.75 3.18 6.35 12.70 2
3 Parts -36 38.10 19.05 4.75 3.18 6.35 12.70 3
-37 50.80 19.05 4.75 3.18 6.35 12.70 4
-38 63.50 19.05 4.75 3.18 6.35 12.70 5
-39 76.20 19.05 4.75 3.18 6.35 12.70 6
-40 88.90 19.05 4.75 3.18 6.35 12.70 7
-41 101.60 19.05 4.75 3.18 6.35 12.70 8
Power Part Number
Module Suffix "A" "B" "C" "D" "E" "F"
-108 116.84 60.96 53.97 12.70 45.72 3.18
-140 116.8 61.00 53.30 12.70 45.70 3.80
-141 57.90 61.00 53.40 12.40 16.50 3.80
-142 57.91 36.83 32.26 12.45 16.50 3.30
TO-220
73
Part Number
Multiwatt Suffix "A" "B" "C" "D" " E"
-124 22.15 20.07 4.06 3.76 3.0 x 45°
-125 22.00 19.99 3.99 3.91 2.0 x 45°
Multi-Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F"
-93 34.29 20.32 3.56 10.16 24.38 12.19
Diode Part Number Dimensions Part Number Dimensions
Washer Suffix "A" "B" Suffix "A" "B"
Various -19 12.95 3.56 Various -75 9.14 6.60
DO-4 -20 12.95 5.08 Various -76 19.05 3.18
DO-5 -21 20.32 6.60 Various -77 20.32 4.83
DO-4 (oversized) -22 15.88 5.08 DO-8 -78 22.23 7.95
DO-5 (oversized) -25 25.40 6.60 Various -79 29.97 13.08
Various -26 20.62 3.68 Various -80 31.75 9.65
Various -27 20.62 2.92 Various -81 38.10 5.08
Various -28 25.40 3.56 Various -82 13.00 4.09
Various -32 38.10 12.70 -111 15.01 5.51
Part Number Dimensions
TO-36 Suffix "A" "B" "C"
-08 27.00 17.53 4.83
Small Power Part Number
Devices Suffix "A" "B" "C"
TO-5, 3 Holes -09 9.14 5.08 1.02
TO-18, 3 Holes -12 6.35 2.54 0.91
TO-18, 4 Holes -13 6.35 2.54 0.91
TO-5, 4 Holes -33 9.14 5.08 1.02
TO-5, 3 Holes -44 9.91 5.08 1.02
TO-5, 4 Holes -45 9.91 5.08 1.02
Part Number Dimensions
Rectifier Suffix "A" "B" "C"
-46 31.75 31.75 5.08
-47 28.58 28.58 3.56
-48 25.40 25.40 4.75
TIP Part Number
Packages Suffix "A" "B" "C" "D" "E"
Clip Mount -42 24.99 19.99 5.21
TIP-36 Plastic Tip -53 21.97 16.51 16.51 3.56 5.21
TO-3P -65 32.00 19.99 24.99 3.61 5.21
Plastic Clip -73 24.99 19.99 17.98 3.61 5.21
Power Part Number Dimensions
Module Suffix "A" "B" "C" "D" "E" "F" "G"
-100 63.75 32.00 16.00 7.75 48.26 5.21 5.21
-123 41.00 27.99 14.00 3.99 30.99 3.00 3.00
SIP Part Number
Package Suffix "A" "B" "C" "D" "E" "F" "G"
-105 36.83 21.29 15.54 6.22 24.38 4.32 3.05
Power Part Number
Module Suffix "A" "B" "C" "D"
-115 11.99 5.00 4.90 0.79
Power Part Number
Module Suffix "A" "B" "C" "D" "E" "F" "G"
-109 34.29 16.31 8.15 4.95 24.38 1.52 3.18
B
A
D-DIA EC
A
B
C
D
A
D
C
B
(2) G Dia
F RAD
(TYP)
E
Sil-Pad®Configurations (SI Measurements)
74
ORDERING
ORDERING
TO-3 Part Number Dimensions
Style Suffix "A" "B" "C" "D" "E" "F" "G"
-02 45.21 31.75 3.56 2.36 30.15 10.92 1.83
-03 39.70 26.67 3.56 2.03 30.15 10.92 1.83
-04 41.91 28.96 3.10 1.57 30.15 10.92 1.83
-05 41.91 28.96 3.56 2.36 30.15 10.92 1.83
-06 41.91 28.96 4.19 1.57 30.15 10.92 1.83
-07 45.21 31.75 4.19 2.39 30.15 10.92 1.83
-10 36.58 25.40 3.56 1.90 24.38 5.08 2.54
-11 33.32 19.35 3.56 1.57 24.38 5.08 2.54
-15 45.21 31.75 3.56 1.17 30.15 10.92 1.83
-16 52.58 39.62 3.10 1.57 30.15 10.92 1.83
-17 41.91 28.96 3.56 1.17 30.15 10.92 1.83
-18 39.70 26.67 3.56 3.56 30.15 10.92 1.83
-23 40.46 27.94 3.96 1.57 30.15 10.92 1.83
-24 43.18 30.15 3.96 1.57 30.15 10.92 1.83
-29 41.91 27.05 3.56 1.17 30.15 10.92 1.83
-30 31.75 17.78 3.56 1.57 24.38 5.08 2.54
-31 34.92 20.96 3.56 1.57 24.38 5.08 2.54
-59 Leadless 41.91 28.96 4.19 30.15
-112 45.21 31.70 4.19 1.60 30.10 10.90 1.85
-113 39.70 26.70 4.19 2.01 30.10 10.90 1.85
-127 33.20 20.80 4.19 1.60 23.09 5.99 1.55
-129 42.01 27.00 3.51 1.50 30.00 11.00 1.80
-135 41.91 29.01 4.19 3.61 30.15 10.90 1.83
Dimensions
3 Lead Part Number
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"
-92 41.91 28.96 3.56 2.36 30.15 10.92 10.16 3.94 18.24
4 Lead Part Number
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G"
-86 39.62 26.67 3.96 2.03 29.72 11.94 72°
-87 39.70 26.67 3.96 1.60 30.15 11.94 72°
8 Lead Part Number
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G"
-88 42.04 30.15 3.96 1.52 30.15 40° 12.70
10 Lead Part Number
TO-3 Suffix "A" "B" "C" "D" "E" "F" "G" "H"
-91 41.91 28.96 4.19 1.02 30.15 15.06 12.70 32.7°
3 Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F" "G" "H"
-85 32.38 19.05 3.96 2.54 24.38 5.08 2.54 5.08
9 Lead Part Number
TO-66 Suffix "A" "B" "C" "D" "E" "F" "G""H"
-83 36.58 25.40 3.56 1.40 24.38 12.19 8.26 36°
Power Part Number
Module Suffix "A" "B" "C" "D" "E"
-130 40.64 12.19 4.19 30.40 6.10
AI
FB
E
C DIA.
(2)
D DIA.
(3)
H
G
AF DIA.
B
E
C DIA.
(2)
D DIA.
(4)
18°
G°
A
B
E
D
C - DIA.
(2)
Sil-Pad®Configurations (SI Measurements)
75
ORDERING
Part “A” +/-.015 “B” +/-.015 “C” +/-.015 MIN. PCS/ROLL
Number
BG411595 1.650 1.650 2.650 3000
BG411594 1.500 1.500 2.500 5000
BG411550 1.375 1.375 2.375 5000
BG411549 1.250 1.250 2.250 5000
BG411548 1.000 1.000 2.000 7500
BG411547 .700 .700 1.700 10000
BG411546 .500 .500 1.500 15000
CONFIGURATIONS
HI-FLOW 225U
Hi-Flow®Configurations
MATERIAL
("B")
-.500+.030
LINER
LINER
PSA STRIP .080+.000
.040
("B")
("C")
("A") ("A")
Part “A” +/-.015 “B” +/-.015 “C” +/-.015 MIN. PCS/ROLL
Number
BG409490 1.500 1.500 2.500 5 0 00
BG410344 1.378 1.378 2.378 5000
BG411198 1.250 1.250 2.250 5000
BG410345 1.000 1.000 2.000 7500
BG410346 .700 .700 1.700 10000
BG410347 .500 .500 1.500 15000
BG411444 .300 1.000 2.000 22500
CONFIGURATIONS
YELLOW PSA TAPE
CLEAR PSA TAPE
PSA STRIP
MATERIAL
LINER
LINER
.750+.063
.750+.063
.500+.030
.250+.125
("B")
("B")
("C")
("A") ("A")
HI-FLOW 225UT
HI-FLOW 225F-AC
76
HF 225F-AC Die Size Minimum, 0.7 x 0.7 inches.
Corporate Headquarters and Sales Office:
18930 West 78th Street
Chanhassen,MN 55317
Manufacturing Facility:
301 Washington Street
Cannon Falls,MN 55009
DOMESTIC AGENTS
For a complete list of Bergquist sales representatives in the U.S. contact
The Bergquist Company: 1-800-347-4572.
INTERNATIONAL SALES OFFICES
THE NETHERLANDS
The Bergquist Company
European Headquarters
Bramenberg 9a
3755 BT Eemnes
The Netherlands
Tel: 31-35-5380684
Fax: 31-35-5380295
Peter de Vries,
European Sales Director
GERMANY
Bergquist ITC GmbH
Haderslebener Str. 19A,
D-25421
Pinneberg
Tel: 49-4101-803-230
Fax: 49-4101-803-100
ENGLAND
Bergquist UK Ltd.
Unit 27 Darin Court
Crownhill Ind. Est.
Milton Keynes MK80AD
Tel: 44-1908-263663
Fax: 44-1908-263773
TAIWAN
Asian Headquarters
The Bergquist Company
Greater China Operations
9F-1, No. 314, Section 4
Ren Ai Road
Taipei, Taiwan ROC 106
Tel: 886-2-2700-7796
Fax: 886-2-2700-7795
Da vid Liang,
General Manager
KOREA
#5303 Dongil Technotown
Anyang 7 Dong
Manan Ku, Anyang Si
Kyunggi Do
Korea, 430-817
Tel: 82-31-448-0382
Fax: 82-31-448-0383
CHINA
The Bergquist Company
Rm. 1118, Block B,
Lucky To w er
No. 3 Dong San Huan Beilu
Chao Yang District,
Beijing, China 100027
Tel: 86-10-6462-9755
Fax: 86-10-6462-9754
Michael Cheng Wei Jun,
Sales Manager
HONG KONG
The Bergquist Company
Room 15, 8/F
Wah Wai Industrial Centre
No. 38-40,
Au Pui Wan Street
Fotan, Shatin, N.T.
Hong Kong
Tel: 852-2690-9296
Fax: 852-2690-2344
INTERNATIONAL
AGENTS
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Toll Free:(800) 347-4572 • Main: (952) 835-2322 • Fax:(952) 835-0430 • www.bergquistcompany.com
Thermal Products • Membrane Switches • Touchscreens • Electronic Components
The Bergquist Company K orea, Ltd.
For access to 38 technical papers on Sil-Pad Products go to the "Technical Corner" in the Bergquist
web site. Here's a sample of the technical papers available from The Bergquist Company:
• What is Thermal Management at Bergquist by Staff
Topic: Insulation
Published by Bergquist
• Comparison of Semiconductor Isolation Materials by Hanson
Topic: Insulation; Compares Sil-Pad type materials
Published by PCIM
• Thermal Testing Procedures by Hanson
Topic: TSP
Published by Bergquist
• Two La yer Thermal Clad®,Thermal Clad Bond-Ply®,and Low Modulus Bond-Ply®
by Fick
Topic: Thermal Clad, Two Layer
Published by Bergquist
http://www.bergquistcompany.com
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