© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
CSPEMI201A
2 Channel Headset Speaker EMI Filter with ESD Protection
Features
• Two channels of EMI filtering
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Greater than 40dB attenuation at 1GHz
•+8kV ESD protection on each channel
• (IEC 61000-4-2 Level 4, contact discharge)
•+15kV ESD protection in each channel (HBM)
• Supports AC signals—ideal for
audio applications
• Extremely low lead inductance for optimum filter
and ESD performance
• 5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• EMI filtering and ESD protection for headset
speaker ports
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
Product Description
The CSPEMI201A is a dual low-pass filter array inte-
grating two pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD pro-
tection. This part is custom-designed to interface with a
speaker port on a cellular telephone or similar device.
Each high quality filter provides more than 35dB atten-
uation in the 800-2700 MHz range. These pi-style fil-
ters support bidirectional filtering, controlling EMI both
to and from a speaker element. They also support
bipolar signals with a cutoff frequency of 31MHz,
enabling audio signals to pass through without distor-
tion.
In addition, the CSPEMI201A provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge (ESD).
The CSPEMI201A can safely dissipate ESD strikes of
8kV, the maximum requirement of the IEC 61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for contact
discharges to greater than 15kV.
The CSPEMI201A is particularly well suited for porta-
ble electronics (e.g., cellular telephones, PDAs, note-
book computers) because of its small package format
and low weight. The CSPEMI201A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
10
Ω
100pF100pF
10
Ω
C1
C3
A1
A3
B2
SPKR_OUT1
SPKR_OUT2
GND
SPKR_IN2
SPKR_IN1
100pF100pF
© 2003 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI201A
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 SPKR_IN1 Speaker Input 1 (from audio circuitry)
A3 SPKR_IN2 Speaker Input 2 (from audio circuitry)
B2 GND Device Ground
C1 SPKR_OUT1 Speaker Output 1 (to speaker)
C3 SPKR_OUT2 Speaker Output 2 (to speaker)
SPKR_IN1 SPKR_IN2
SPKR_OUT1 SPKR_OUT2
A1 A3
C3C1
GND
B2
Pin "A1"
Marking
A1
AB
231
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
CSPEMI201A
CSP Package
TOP VIEW BOTTOM VIEW
(Bumps Down View) (Bumps Up View)
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
1) These drawings are not to scale.
PART NUMBERING INFORMATION
Pins Package
Standard Finish Lead-free Finish2
Ordering Part
Number1Part Marking
Ordering Part
Number1Part Marking
5 CSP CSPEMI201A AB CSPEMI201AG AB
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
CSPEMI201A
Specifications
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 200 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R Resistance 9 10 11 Ω
C Capacitance 80 100 120 pF
ILEAK Diode Leakage Current VIN=5.0V 1.0 µA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5
-5
7
-10
15
-15
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
±15
±8
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+15
-19
V
V
fCCut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 10Ω, C = 100pF 31 MHz
© 2003 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI201A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
CSPEMI201A
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time
(
minutes
)
Temperature (°C)
© 2003 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI201A
Mechanical Details
CSP Mechanical Specifications
CSPEMI201A devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
Package Dimensions for
CSPEMI201A Chip Scale Package
CSP Tape and Reel Specifications
Figure 6. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 5
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 0.905 0.950 0.995 0.0356 0.0374 0.0392
A2 1.365 1.410 1.455 0.0537 0.0555 0.0573
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.175 0.225 0.275 0.0069 0.0089 0.0108
C2 0.220 0.270 0.320 0.0087 0.0106 0.0126
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
12
C1
B1
A1
B3
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
3
B2
B4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL P0P1
CSPEMI201A 1.41 X 0.95 X 0.6 1.52 X 1.07 X 0.72 8mm 178mm (7") 3500 4mm 4mm
Top
For Tape Feeder Reference
Cover
Tape
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
