BU90104GWZ-E2 - ROHM SEMICONDUCTOR

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

1/14 TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・14・001

Single-chip Type with Built-in FET Switching Regulator Series

1.0A, Step-down Switching regulators

with Built-in Power MOSFET

BU90104GWZ

●General Description

The BU90104GWZ are a high efficiency 6MHz

synchronous step-down switching regulator with ultra

low current PFM mode.

It provides up to 1.0A load current and an input voltage

range from 3.0V to 5.5V, optimized for battery powered

portable applications.

BU90104GWZ has a mode control pin that allows the

user to select Forced PWM(Pulse Width Modulation)

mode or PFM(Pulse Frequency Modulation) and PWM

auto change mode utilized power save operation at light

load current.

●Features

Fast transient response

Automatic PFM/PWM operation

Forced PWM operation

Internal Soft Start

Under voltage lockout

Over current protection

Thermal shutdown

●Lineup

●Pin Configuration(s)

●Applications

Smart phones, Cell phones, Portable applications and

Micro DC/DC modules, USB accessories

●Package(s) W(Typ.) x D(Typ.) x H(Max.)

UCSP35L1 1.30mm x 0.90mm x 0.40mm

●Typical Application Circuit(s)

●Pin Description(s)

Part No. Output

voltage Input voltage Switching frequency Operating mode

MODE=L MODE=H

BU90104GWZ 1.80V 2.3V to 5.5V 4.8MHz to 6.0MHz Automatic

PFM/PWM Forced PWM

Pin No. Symbol Function

A1 VIN Power supply input pin

A2 EN Enable pin

A3 GND GND pin

B1 MODE Forced PWM mode pin

B2 LX Inductor connection pin

B3 FB Feedback voltage input pin

Figure 1. Typical Application Circuit(s)

(BOTTOM VIEW)

Figure 2. Pin Configuration(s)

Datashee

2/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Block Diagram(s)

●Description of Block(s)

The BU90104GWZ are a syn c hronous step-down DC/DC converter that achieves fast transient response from light load to

heavy load by hysteretic PWM control system and current constant PFM control system.

○PWM control

BU90104GWZ operates by hysteretic PW M control. This scheme ensures fast switching, high efficiency, and fast transient

response.

When the output voltage is belo w the VREF voltage, the error comparator output is low to high and turning on P-chan nel

MOSFET until above the VREF voltage and minimum on time.

○PFM control

At light load the regulator and MODE=low, the regulator operates with reduced switching frequ ency and improves the

efficiency. During PFM operation, the output voltage slightly higher than typical output voltage.

Figure 4. Operation of PFM mode and PWM mode

Figure 3. Block Diagram(s)

3/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Description of operations

1) Shutdown

If the EN input pin set to low (<0.4V), all circuit are shut down and the regulator is standby mode. Do not leave the EN pin

floating.

2) Soft start function

The regulator has a soft start circuit that reduces in-rush current at start-up. Typical start up times with a 4.7uF output

capacitor is (400usec).

3) Current limit

The BU90104GWZ has a current limit circuit that protects itself and external components during overloa d condition.

4) UVLO

The BU90104GWZ has an Under Voltage Lock Out circuit that turn off device when VIN>2.05V(typ.)

5) FORCED PWM MODE

Setting MODE pin high (>1.4V) places the regulator in forced PWM.This control provides noise r eduction and output

stability. Do not leave the MODE pin floating.

6) TSD

The BU90104GWZ has a thermal shutdo wn feature to prote ct the device if the junction temperature exceeds 150℃.

In thermal shutdown, the DRIVER is disabled.

This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC.

Therefore, the user should not plan to activate this circuit with continued operation in mind.

●Absolute Maximum Ratings (Ta=25℃)

(*1) When mounted on the specified PCB (55mm x 63mm), Deducted by 3.9m W/c when used over Ta=25c

●Recommended Operatin g Rating(s)

Parameter Symbol Rating Unit

Maximum input po wer supply voltage VIN 7 V

Maximum voltage at EN, FB, LX, MODE VEN, VFB,

VLX, VMODE 7 V

Power dissipation Pd 0.39 *1 W

Operating temperature range Topr -40 to +85 ℃

Storage temper ature range Tstg -55 to +125 ℃

Junction temperature Tjmax +125 ℃

Parameter Symbol

Rating Unit

Min. Typ. Max.

Input voltage VIN 2.3 - 5.5 V

4/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Electrical Characteristic(s) (unless otherwise specified VIN=3.6V, Ta=25℃)

Item Symbol

Rating Unit Condition

Min. Typ. Max.

【Switching regulator】

Output voltage accuracy VOUTA 1.764 1.800 1.836 V MODE:H(PWM Operation)

1.764 1.800 1.854 MODE:L(PFM Operation)

Maximum load current IoutMAX1 - - 1.0 A 3.0V≦VIN＜5.5V

IoutMAX2 - - 0.8 A

2.7V≦VIN＜3.0V

IoutMAX3 - - 0.6 A 2.3V≦VIN＜2.7V

【Soft start】

Soft start time Tss 200 400 800 usec

【Frequency control】

Switching frequency fosc 4.8 5.4 6.0 MHz No load, MODE:H

【Driver】

PchFET on resistance RonP1 - 250 400 mOhm VIN=5.0V

RonP2 300 450 mOhm VIN=3.6V

NchFET on resistance RonN1 - 220 350 mOhm VIN=5.0V

RonN2 250 380 mOhm VIN=3.6V

【Control】

EN pin control

voltage Operation VENH 1.4 - VIN V

Non Operation VENL 0 - 0.4 V

MODE pin

control voltage Operation VMODEH 1.4 - VIN V Forced PWM

Non Operation VMODEL 0 - 0.4 V Automatic PFM/PWM

【UVLO】

Protect threshold voltage Uvth 1.95 2.05 2.15 V

Hysteresis Uvhy 50 100 150 mV

【Current limit】

Current limit threshold ILIMIT 1.5 1.7 1.9 A

PMOS current detect,

Open loop

【Output discharge】

Output discharge resistance DRES 15 30 60 Ohm EN=0V

【Circuit current】

Operating quiescent current IINS1 - 45 65 uA EN:H, MODE:L,

VOUT=3.6V forced

Not switching

Shutdown current SHD - 0 1 uA EN=0V

5/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Electrical characteristic curves (Reference data)

Parts

L:LQM21MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata)

COUT:GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata)

Figure 5. Start up

Figure 7. Load transient response 5mA to 50mA

tr=tf=100ns, MODE : Low

Figure 8. Load transient response 50mA to 350mA

tr=tf=100ns, MODE : Low

Figure 6. Shut down

VOUT

1V/div

2V/div

200mA/div

2V/di

VOUT

500mV/div

Vout

50mV/div

ac coupled

IOUT

100mA/div

Vout

50mV/div

ac coupled

IOUT

200mA/div

100us 100us

20us 20us

6/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

Figure 9. Load transient response 150mA to 500mA

tr=tf=100ns, MODE : High Figure 10. PFM mode Operation

Iout=50mA

Figure 12. Mode Change Response

MODE : High to Low

Figure 11. PW M mode Operation

Iout=100mA

Vout

50mV/div

ac coupled

IOUT

200mA/div

Vout

20mV/div

ac coupled

2V/div

200mA/di

200mA/div

Vout

20mV/div

ac coupled

2V/div

MODE

2V/di

Vout

50mV/div

ac coupled

200mA/div

20us

1us

200ns

4us

7/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

100

0.1 1 10 100 1000

E ffi ci e n c y [% ]

Load current [mA ]

VIN=2.7V

VIN=3.6V

VIN=4.2V

1.764

1.782

1.800

1.818

1.836

1.854

0 200 400 600 800 1000

Output Voltage[V]

Load current[mA ]

VIN=2.7V

VIN=3.6V

VIN=4.2V

Figure 13. Mode Change Response

MODE : Low to High Figure 14. Efficiency vs Load current

PWM/PFM Auto mode

Figure 15. Load regulation

PWM/PFM Auto mode

MODE

2V/div

Vout

50mV/div

ac coupled

200mA/div

4us

8/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●PC Board layout

The suggested PCB layout for the BU90104GWZ are shown in Figure. The following guidelines should be used to ensure a

proper layout.

1) The input capacitor CIN should be connect as closely possible to VIN pin and GND pin .

2) From the output voltage to the FB pin line should be as s eparate as possible.

3) COUT and L should be connected as closely as possible. The connection of L to the LX pin should be as short as

possible.

Figure 16. PCB layout

●External parts selection

Inductor selection

The inductance significantly depends on output ripple current. As shown by following equation, the ripple current decreases

as the inductor and/or switching frequency increase.

f: switching frequency L: inductance ⊿IL: inductor current ripple

As a minimum requirement, the DC current rating of the i nd uctor should be equ al to the maximum load current plus half of

the inductor current ripple as shown by the following equation.

(VIN-VOUT)×VOUT

⊿IL= L×VIN×f

⊿IL

ILPEAK= 2

IOUTMAX +

9/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

1) Recommended inductor selection

・Iout≦1A

LQM2MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata)

MIPSZ2016D1R0FH (2.0mm×1.6mm×1.0mm FDK)

DFE252012C1R0 (2.5mm×2.0mm×1.2mm TOKO)

DFE252010C1R0 (2.5mm×2.0mm×1.0mm TOKO)

・Iout≦0.6A

LQM21PN1R0NGC (2.0mm×1.2mm×1.0mm Murata)

MIPSZ2012D1R0 (2.0mm×1.2mm×1.0mm FDK)

MIPSTZ1608D1R0 (1.6mm×0.8mm×0.8mm FDK)

MLP2012H1R0M (2.0mm×1.2mm×1.0mm TDK)

CKP2012N1R0N (2.0mm×1.2mm×1.0mm Taiyo Yuden)

2) Recommended input capacitor(CIN) selection

GRM155R60J225M (1.0mm×0.5mm×0.5mm Murata)

GRM155R60J475M (1.0mm×0.5mm×0.5mm Murata)

GRM155R60G106M (1.0mm×0.5mm×0.5mm Murata)

3) Recommended output capacitor(COUT) selection

GRM155R60J475M (1.0mm×0.5mm×0.5mm Murata)

GRM155R60G106M (1.0mm×0.5mm×0.5mm Murata)

○Cautions on the output capacitor selection

The BU90104GWZ is designed to fixed soft-start time and operate with a maximum output capacitance of (100uF).

If the capacitance connected to the output is larger than (100uF), an overshoot of the output voltage will be caused.

It is possible to cause damage on the conne cted device.

10/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●I/O equivalence circuit(s)

A2 EN B1 MODE

B2 LX B3 FB

VIN VIN

VINVIN

11/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Caution of use

1) Absolute maximum ratings

An excess in the absolute maximum rating, such as supp ly voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

2) GND voltage

The potential of GND pin must be minimum pot ential in all condition. As an exc eption, the circuit design allows voltages

up to -0.3 V to be applied to the IC pin.

3) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

4) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted togeth er.

5) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

6) Mutual impedance

Power supply and grou nd wiring should refl ect consideration of the need to lo wer mutual impedance and minimize rip ple

as much as possible (by maki ng wiring as short and thick as possib le or rejecting ripple by incorporatin g inductance and

capacitance).

7) Thermal shutdown Circuit (TSD Circuit)

This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been

design to protect or guarantee the IC. Therefore, the user should not pla n to activate this circuit with continued operation

in mind.

8) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated.

P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic

diode or transistor. For example, as shown in the figures below, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes

operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

9) Disturbance light

In a device where a portion of silicon is e xposed to light such as in a WL-CSP, IC characteristics may be affected due to

photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from

being exposed to light.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a

reference to help reading the formal versi on.

If there are any differences in translation version of this document formal version takes priority

12/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Ordering Information

B U 9 0 1 0 4 G W Z E 2

Part Number Package

GWZ: UCSP35L1

Packaging and forming specifi cation

E2: Embossed tape and reel

(UCSP35L1)

●Marking Diagram(s)(TOP VIEW)

13/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Physical Dimension Tape and Reel Information

Package Name UCSP35L1 ( BU90104GWZ )

< Tape and Reel Information >

Tape Embossed carrier tape

Quantity 3000pcs

Direction of feed E2

The direction is the pin 1 of p roduct is at the upper left when you hold

reel on the left hand and you pull o ut the tape on the right h and

Reel Direction of feed

1pin

1234 1234 1234 1234 1234 1234

（Unit：mm）

14/14

Datasheet

BU90104GWZ

TSZ02201-0F1F0AG00080-1-2

www.rohm.com

TSZ22111・15・001

●Revision History

Date Revision Changes

22.Jul.2015 001 New Release.

Datasheet

Notice-PGA-E Rev.001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (No te 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliabili ty, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radi ation-proof design.

5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd ) dependi ng on Ambient temp erature (T a). When used i n sealed area, co nfirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the prod uct specification.

9. ROHM shall not be in any way responsible or liable for fail ure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM represe ntative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice-PGA-E Rev.001

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information

contained in this document. ROHM shall not be in an y way responsible or liable for any damages, e xpenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).

Precaution for Storage / Transportati on

1. Product performance and soldered connections may deteriorate if the Products are store d in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommende d b y ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive s t ress applied when dropping o f a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before us ing Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products pl ease dispose them properly using a n authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated compani es or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or

concerning such information.

Datasheet

Part Number bu90104gwz

Package UCSP35L1

Unit Quantity 3000

Minimum Package Quantity 3000

Packing Type Taping

Constitution Materials List inquiry

RoHS Yes

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