CDSOT23-SLVU2.8 — Surface Mount TVS Diode
Features
RoHS compliant*
Low capacitance - 2.5 pF
ESD protection
Surge protection
Applications
Personal Digital Assistants (PDAs)
Mobile phones & accessories
Memory card protection
SIM card port protection
Portable electronics
General Information
Electrical Characteristics (@ TA= 25 °C Unless Otherwise Noted)
The CDSOT23-SLVU2.8 device provides ESD, EFT and Surge protection for
high speed data ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and
IEC 61000-4-5 (Surge) requirements. The Transient Voltage Suppressor Array offers a
Working Peak Reverse Voltage of 2.8 V and Minimum Breakdown Voltage of 3 V.
The SOT23 packaged device will mount directly onto the industry standard SOT23
footprint. Bourns®Chip Diodes conform to JEDEC standards, are easy to handle with
standard pick and place equipment and the flat configuration minimizes roll away.
Note:
1. See Peak Pulse Power vs. Pulse Time.
3
1
2
*RoHS COMPLIANT
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Parameter Symbol Value Unit
Peak Pulse Power (tp= 8/20 µs)1PPK 600 W
Peak Pulse Current (tp= 8/20 µs) IPPM 30 A
Storage Temperature TSTG -55 to +150 °C
Operating Temperature TOPR -55 to +150 °C
Minimum Breakdown Voltage @ 1 mA VBR 3.0 V
Minimum Snap Back Voltage @ 50 mA VBR 2.8 V
Maximum Working Peak Voltage VWM 2.8 V
Maximum Leakage Current @ VWM ID1.0 µA
(Pin 3 to Pin 1) or (Pin 2 to Pin 1)
Maximum Clamping Voltage @ IP= 2 A VC5.5 V
Maximum Clamping Voltage @ IP= 5 A VC7.0 V
(Pin 2 to in 1) 8.5
Maximum Clamping Voltage @ IP= 30 A VC21.0 V
Typical Junction Capacitance @ 0 V, 1 MHz
(Pin 3 to Pin 1 & Pin 2) CD20 pF
(Pin 2 to Pin 1 with Pin 3 NC) 2.5
Maximum Junction Capacitance @ 0 V, 1 MHz CD3pF
Maximum Peak Reverse Voltage @ I = 10 uA VRRM 40 V
Maximum Reverse Leakage Current @ VWM IDR 0.1 uA
Maximum Forward Voltage @ IF= 1 A, 120 µS VF2V
CDSOT23-SLVU2.8 — Surface Mount TVS Diode
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
A B
C
E
D
MILLIMETERS
(INCHES)
DIMENSIONS =
Dimensions
A0.95
(0.037)
B0.95
(0.037)
C2.00
(0.079)
D0.85
(0.033)
E0.85
(0.033)
This is a molded JEDEC SOT-23 package with100 % Matte Sn
plating on the lead frame. It weighs approximately 8 mg and has a
flammability rating of UL 94V-0.
Recommended Footprint
How To Order
CD S0T23 - SLVU 2.8
Common Code
Chip Diode
Package
• S0T23 = S0T23 Package
Model
SLVU = Special Model
Working Peak Reverse Voltage
2.8 = 2.8 VRWM (Volts)
Product Dimensions
CDSOT23-SLVU2.8 .................................................................. SLA
Typical Part Marking
12
3
B
CD
HL
0 ° TO 8 °
I
GAUGE
PLANE
K
J
SEATING PLANE
SEE
DETAIL
A
DETAIL
A
G
E
F
A
Dimensions
A2.80 - 3.00
(0.110 - 0.118)
B0.95
(0.037)
C1.20 - 1.40
(0.047 - 0.055)
D2.10 - 2.49
(0.083 - 0.098)
E1.90
(0.075)
F0.30 - 0.50
(0.012 - 0.019)
G0.89 - 1.17
(0.035 - 0.046)
H0.05 - 0.015
(0.002 - 0.006)
I0.25
(0.010)
J0.46 - 0.64
(0.018 - 0.025)
K0.40 - 0.58
(0.016 - 0.023)
L0.08 - 0.20
(0.003 - 0.008)
BSC
BSC
BSC
MILLIMETERS
(INCHES)
DIMENSIONS =
CDSOT23-SLVU2.8 — Surface Mount TVS Diode
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Performance Graphs
Peak Pulse Power vs Pulse Time
100
1,000
10,000
10
10.1 10,000
PPP – Peak Pulse Power (W)
td – Pulse Duration (µs)
10 100 1,000
20
40
60
80
100
120
0
03025201510
5
IPP – Peak Pulse Current (% of IPP)
t – Time (µs)
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
et
td = t|IPP/2
20
40
60
80
100
0
0 150125100755025
% of Rated Power
TL = Lead Temperature - °C
Peak Pulse Power
8/20 µs
Average Power
2
0.2
35
25
15
5
-5
-72.000 ns 28.000 ns
20.0 ns/div
128.000 ns
real time
5 Volts per Division
ESD Test Pulse: 25 kilovolt, 1/30 ns (waveshape)
200 W, 8/20 µs Waveform
Pulse Waveform
Power Derating Curve
Overshoot & Clamping Voltage
CDSOT23-SLVU2.8 — Surface Mount TVS Diode
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Packaging Information
The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-A standard.
.......
.......
....... ..............
....... ..............
T
120 °
D2
DD
1
W1
C
10 pitches (min.)
Direction of Feed
10 pitches (min.)
End
Trailer Device Leader
Start
PA
F
E
Index
Hole
P
0
P
1
W
B
d
Item Symbol SOT23
Carrier Width A2.25 ±0.10
(0.088 - 0.004)
Carrier Length B2.34 ±0.10
(0.092 - 0.004)
Carrier Depth C1.22 ±0.10
(0.048 - 0.004)
Sprocket Hole d1.55 ±0.05
(0.061 - 0.002)
Reel Outside Diameter D178
(7.008)
Reel Inner Diameter D1
50.0
(1.969) Min.
Feed Hole Diameter D213.0 ±0.20
(0.512 - 0.008)
Sprocket Hole Position E1.75 ±0.10
(0.069 - 0.004)
Punch Hole Position F3.50 ±0.05
(0.138 - 0.002)
Punch Hole Pitch P4.00 ±0.10
(0.157 - 0.004)
Sprocket Hole Pitch P04.00 ±0.10
(0.157 - 0.004)
Embossment Center P12.00 ±0.05
(0.079 - 0.002)
Overall Tape Thickness T0.20 ±0.10
(0.008 - 0.004)
Tape Width W8.00 ±0.20
(0.315 - 0.008)
Reel Width W1
14.4
(0.567) Max.
Quantity per Reel —3,000
REV. 07/12
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
