TS12001
nanoSmart® Battery Managemen
t
Under-Voltage Load Swit
ch
TRIUNE PRODUCTS
Features
Description
The TS12001 O
ff-
A
c
tiv
e™
battery management load switch
is
used
to protect
a
battery
from
excessive
dischar
ge
.
It
c
onsists
of
an internally gener
a
t
ed
threshold voltage
(
V
THRESH),
comparator
with
h
yster
esis
,
slew
r
a
t
e
control for the load
switch, a P-Channel load switch, and an open-drain
indicator
pin.
When
the input
battery voltage
is above
VTHRESH,
the
load switch is on-ac
tiv
e
.
When
the input
battery voltage
falls
to
VTHRESH,
the
load switch is
O
ff-
A
c
tiv
e™
and
the quiescen
t
current draw
is
approximately
100pA.
•
•
•
•
•
O
ff-
A
c
tiv
e™
feature
with ultra-low
pico-amp
current
Best-in-class O
ff-ac
tiv
e™
quiescen
t
current
of 100pA
Ultra-low on-active
quiescen
t
current
of 70nA
A
c
cur
a
t
e
on to
O
ff-ac
tiv
e™
voltage
threshold
Threshold voltage options
of
1.2V
-
4.2V
in
100mV
st
eps
(programmed
at manufacturing)
Supervisory
over-current
limit shutdown
Low Rds(on): 175mΩ
typical
@
5V
Low
drop out
disc
onnec
t
from
VBAT
to loads
Turn-on slew
r
a
t
e
controlled
500mV
off to
on-active
hysteresis
•
•
•
•
•
Applications
Summary Specifications
•
•
•
Wide
input
voltage range: 1.2V –
5.5V
Packaged
in
a
8pin
DFN
(2x2)
Product is lead-free, Halogen Free,
RoHS / WEEE compliant
•
•
•
•
•
•
Industrial
Medical
Smar
tCar
d
RFID
Block Diagram
VCC
V OU T
nPG
G N D
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
1 of 11
Rev 1.4
Semtech
R e
g u
la
te
d
T h
re
sh
o ld
Typical Applications
Disconnect
the
Battery
VOUT
Note: When the TS12001 is Off-Active™, the battery will continue to charge through the body diode between VOUT and VCC.
Disconnect
the
Loa
d
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
2 of 11
Rev 1.4
Semtech
Charge
r
TS12001
Load
VOUT
VCC
C
BY
P
nP
G
GND
Charge
r
Load
TS12001
VCC
C
BY
P
nPG
GND
Pin Description
(1) I = Input, O = Output, P = Power
Absolute Maximum Ratings
Over operating free–air
temperature range
unless otherwise noted
(2, 3,
4)
(2)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con-
ditions” is not implied. Exposure to
absolute–maximum–rated
conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
ESD testing is performed according to the respective JESD22 JEDEC standard.
(3)
(4)
Thermal Characteristics
(5) This assumes a FR4 board only.
(6) This assumes a 1 Oz. Copper JEDEC standard board with thermal vias – See Exposed Pad section and application note
for more information.
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
3 of 11
Rev 1.4
Semtech
Package DFN θJA (°C/W)
(See Note 5)
θJC (°C/W)
(See Note 6)
8 pin
73.1
10.7
Parameter Value Unit
VCC, VOUT,
nPG
-0.3
to
6.0
V
Electrostatic Discharge – Human Body
Model
2
kV
Operating Junction Temperature
Range, T
J
-40
to
85
°C
S
t
or
age
Temperature
Range,
T
S
TG
-65
to
150
°C
Lead Temperature
(solder
ing
,
10
seconds)
260
°C
Pin # Pin Name Pin Type (1) Description
1
GND
P
GND
2
V
OUT
O
Output to
S
yst
em
L
oad
3
NC
No
C
onnec
t
(c
onnec
t
to
GND
or float)
4
NC
No
C
onnec
t
(c
onnec
t
to
GND
or float)
5
NC
No
C
onnec
t
(c
onnec
t
to
GND
or float)
6
V
CC
I/P
Supply
I
nput
7
V
CC
I/P
Supply
I
nput
8
nPG
O
Open-Drain N-Channel
Output (low
indica
t
es
Power
G
ood)
Recommended Operating Conditions
(7) TA Max shown here is a guideline. Higher T can be tolerated if T does not exceed the Absolute Maximum Rating.
A
J
Characteristics
Electrical char
ac
t
eristics
,
V
CC
=
1.2V
to
5.5V, TJ
=
25C,
unless otherwise
noted
OUT
THRESH
THRESH
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
4 of 11
Rev 1.4
Semtech
Symbol Parameter Condition Min Typ Max Unit
Input Supply
V
CC
Input
Supply
V
oltage
1.2
5.5
V
Iq-ON
Q
uiesc
en
t
cur
r
ent:
on-active Mode
V
CC
=
5V, No
Load
70
150
nA
Iq-OFF
Q
uiesc
en
t
current:
O
ff-
A
c
tiv
e™
Mode
V
CC
<
V
THRESH
, No
Load
100
pA
Load Switch
IOC
Over
C
urr
en
t
Shutdown
V
CC
=
5.0V
3
A
T
OC
Over
C
urr
en
t
R
etr
y
P
er
iod
V
CC
=
5.0V
1.7
ms
ILEAK-SW
Output
S
wit
ch
Leakage
C
urr
en
t
V
CC
<
V
THRESH
;
V
Gr
ounded
100
pA
R
ds-
on
S
wit
ch
On
R
esistanc
e
V
CC
=
5.0V
175
mΩ
V
CC
=
3.3V
200
mΩ
V
CC
=
1.8V
350
mΩ
Transition Times
t
d1
Transition delay
:
on-active
to
O
ff-
A
c
tiv
e™
V
OFF
=
2.0V, V
CC
=
3.0V
→
1.5V
650
μs
t
d2
Transition delay
:
O
ff-
A
c
tiv
e™
to
on-ac
tiv
e
V
OFF
=
2.0V, V
CC
=
1.5V
→
3.0V
1.7
ms
t
ON
Output turn-on
rise
time
V
CC
=
2.5V, R
LOAD
= 50Ω
200
μs
nPG Output
I
LEAK-nPG
Output Leakage
V
CC
=
5.0V, V
nPG
= 5.5V
100
nA
V
OL-nPG
Low-Level
Output
V
oltage
I
nPG
= 5
mA
0.4
V
Off-Active Thresholds
V
OFF
O
ff-
A
c
tiv
e™
T
hr
eshold
V
THRESH
=
1.2V
to 3.3V
0.95*
V
V
THRESH
1.05*
V
V
V
H
ys
O
ff-
A
c
tiv
e™
to
on-active
Hysteresis
R
ising
T
r
ansition:
O
ff-
A
c
tiv
e™
to
on-ac
tiv
e
500
mV
Parameter
Min
Typ
Max
Unit
Unr
egula
t
ed
Supply
Input
Voltage
(
V
CC
)
1.2
5.5
V
Operating Ambient
T
emper
a
tur
e
,
T
A
(Note
7)
-40
55
°C
Operating Junction
T
emper
a
tur
e
,
T
J
-40
85
°C
Input
Bypass Capacitor
(
C
BY
P
)
100
nF
Typical Characteristics
On-Active
/
Off-Active™
Characteristics
On-Active Switching
Behavior
Off-Active™ V
THRESH
Temperature
Per
f
ormance
On-Active
/
Off-Active™ I
q
On-Active
/
Off-Active™
Transition
Delay
Over Current Retry
Performance
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
5 of 11
Rev 1.4
Semtech
Package Mechanical Drawings (all dimensions in mm)
Notes:
Dimensions and tolerances per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact values shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information only.
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
6 of 11
Rev 1.4
Semtech
Units
MILLIMETERS
Dimension Limits
MIN
NOM
M
AX
Number
of
P
ins
N
8
P
it
ch
e
0.50 BSC
Overall
Height
A
0.80
0.90
1.00
S
tandoff
A1
0.00
0.02
0.05
C
on
tac
t
T
hick
ness
A3
0.20 REF
Overall
Length
D
2.00 BSC
Exposed Pad
Width
E2
0.75
0.90
1.00
Overall
Width
E
2.00 BSC
Exposed Pad
Length
D2
1.55
1.70
1.80
C
on
tac
t
Width b
0.18
0.25
0.30
C
on
tac
t
Length
L
0.20
0.30
0.40
C
on
tac
t
-t
o
-Exposed
P
ad
K
0.20
-
-
Recommeded PCB Land Pattern
DIMENSIONS IN
MILLIME
TERS
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
7 of 11
Rev 1.4
Semtech
Units
MILLIMETERS
Dimension Limits
MIN
NOM
M
AX
C
on
tac
t
P
it
ch
E
0.50 BSC
Optional
C
en
t
er
Pad
Width
W2
-
-
1.70
Optional
C
en
t
er
Pad
Length
T2
-
-
0.90
C
on
tac
t
Pad
Spacing
C1
-
2.00
-
C
on
tac
t
Pad
Spacing
C2
-
-
-
C
on
tac
t
Pad
Width (X8)
X1
-
-
0.35
C
on
tac
t
Pad Length
(X8)
Y1
-
-
0.65
Distance Between
P
ads
G
0.15
-
-
Application Using A Multi-Layer PCB
To maximize
the
efficiency
of
this package
for
application
on
a single layer
or
multi-layer
PCB,
certain guidelines must
be followed
when laying
out
this
part on the
PCB
.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
JEDEC standard FR4 PCB Cross-section:
Package Solder Pad
(square)
Component Traces
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
1.0142 - 1.0502 mm
Ground Plane (1oz
Cu)
1.5748mm
4 Plane
0.5246 - 0.5606 mm
Power Plane (1oz
Cu)
0.0 - 0.071 mm Board Base
& Bottom Pad
Package Solder Pad
(bottom trace)
Multi-Layer Board (Cross-sectional View)
In a multi-layer board application,
the
thermal vias are
the
primary
method of
hea
t
transfer
from the
package thermal pad
t
o
the
internal
ground
plane
.
The efficiency
of
this
method
depends
on
several fac
t
ors
,
including die
area, number
of
thermal
vias
,
thickness
of
c
opper
,
et
c
.
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
8 of 11
Rev 1.4
Semtech
2
Pla
ne
Thermal Via
Thermal Isolation
Power plane only
Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
10% Cu coverage
Thermal Vias with Cu plating
90% Cu coverage
20% Cu coverage
Note: NOT to Scale
The above drawing is a representation
of how the
hea
t
can
be
conducted
away
from the die
usin g an exposed pad package
.
Each
application
will
have
different
requirements and limitations and therefore
the
user should use
sufficient copper
to
dissipa
t
e
the
power
in the
system. The
output
current
rating for the
linear
r
egula
t
ors
may have
to be
de-r
a
t
ed
for
ambient
t
emper
a
tur
es
above
85C. The
de-r
a
t
e
value
will
depend
on
calcula
t
ed
worst case
power dissipation and
the
thermal management implementation
in
the application.
Application Using A Single Layer PCB
Use as much Copper Area
as possible for heat spread
Package Thermal Pad
Package Outline
Layout recommendations
for
a Single Layer PCB:
utilize as much Copper Area
for
Power
M
anagemen
t
.
In a single layer
board
application
the
thermal pad is attached
to
a
hea
t
spreader (copper areas)
by
using
low
thermal impedance attachment
method
(solder paste
or
thermal conductive
epoxy).
In
both of the
methods mentioned above
it
is advisable
to
use as much copper traces as possible
to
dissipa
t
e
the
hea
t
.
IMPORTANT:
If the
attachment
method
is NOT
implemented
c
orr
ec
tly
,
the functionality of the product
is
not
guar
an
t
eed
.
Power
dissipa
tion
capability
will be
adversely
aff
ec
t
ed
if the
device is incorrectly
mounted onto the
circuit boar
d
.
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
9 of 11
Rev 1.4
Semtech
5% -
Single Layer, 2oz Cu
Ground Layer, 1oz Cu
Signal Layer, 1oz Cu
Bottom Layer, 2oz Cu
Ordering Information
TS12001-CvvvDFNR
* Custom values also available (1.2V - 4.2V typical in 100mV
increments)
RoHS and Reach Compliance
Triune
S
yst
ems
is
fully committed to
environmental qualit
y
.
All Triune
S
yst
ems
ma
t
er
ials
and suppliers are
fully complian
t
with
RoHS
(European Union Directive 2011/65/EU),
REA
CH
SVHC
Chemical
R
estric
tions
(EC
1907/2006), IPC-1752
Level
3
ma
t
er
ials
declar
a
tions
,
and
their
subsequen
t
amendmen
ts
.
Triune
S
yst
ems
maintains certified laboratory reports
for
all
product
ma
t
er
ials
,
from
all
suppliers
,
which show
full
compliance
to
restrictions
on the following:
•
•
•
•
•
•
•
•
•
•
•
•
Cadmium
(
C
d)
Chlorofluorocarbons
(
CFCs)
Chlor
ina
t
e
Hydrocarbons
(
CHCs)
Halons (Halogen
free)
He
xa
v
alen
t
Chromium
(
C
rVI)
Hydrobromofluorocarbons
(HBFCs)
Hydrochlorofluorocarbons
(HCFCs)
Lead
(P
b
)
Mercury (Hg)
P
er
fluor
ocar
bons
(PFCs) P
olybr
omina
t
ed
biphen
yls
(PBB)
P
olybr
omina
t
ed
Diphenyl
E
thers
(PBDEs)
TS12001
Final Datasheet
June 19, 2017
www.semtech.com
10 of 11
Rev 1.4
Semtech
Part Number Description
vvv
Threshold Voltage
(
V
THRESH
)*
017
1.7 V
021
2.1 V
023
2.3 V
024
2.4 V
025
2.5 V
026
2.6 V
028
2.8 V
030
3.0 V
IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the righ
t
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing or
ders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the
time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF
LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERT
AKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer
shall
indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorne
y
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and
names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this documen
t
without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for an
y
particular purpose. All rights reserved.
© Semtech 2017
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-
3804
www.semtech.com
TS12001
Final Datasheet
June 19, 2017
11 of 11
Rev 1.4
Semtech
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Semtech:
TS12001-C010DFNR TS12001-C021DFNR TS12001-C023DFNR TS12001-C026DFNR TS12001-C028DFNR
TS12001-C040DFNR TS12001-C024DFNR TS12001-C030DFNR TS12001-C017DFNR TS12001-C012DFNR
TS12001-C018DFNR TS12001-C025DFNR TS12001-C033DFNR TS12001-C000DFNR