2001 National Semiconductor Corporation www.national.com
8-pin Lead-Less-Package (LLP)
Dual Op Amp Evaluation Board
Part Number CLC 730114
.
June 2001
The CLC730114 evaluation board is designed to aid in the characterization of National’s 8-pin Dual Op Amps in LLP
package. This board uses all surface-mount components for maximum speed and performance.
Figure 1 shows the schematic:
Figure 1: Complete Evaluation Board Schematic
This board is designed with versatility in mind; that is, by selective insertion of components, the device can be put into an
Inverting, non-inverting, or differential configuration. In addition, single supply operation can be tested with simple board
modifications (please see below).
C5-8 (4 places) are de-coupling caps essential to be installed for good high frequency behavior. 0.1µF and 6.8µF are
good values in most cases. Note that C7-8 are polar caps. Use Tantalum capacitors for lowest ESR.
The CLC730114 evaluation board uses a thermally dissipation pad soldered to the exposed die attach paddle (DAP) of
the device under test (DUT) to enable heat transfer out of the package.
SINGLE SUPPLY OPERATION:
In order to allow maximum flexibility, it is possible to test the Op Amp in a single supply arrangement as well. To do so,
R16, R17, and C9 can be installed to form a “virtual ground” which would be tied to the non-inverting terminal as biasing.
A convenient way to connect C9 (positive side) to the inputs is by performing the following:
1. Cut R7 and R10 connection to ground plane, on component side.
2. Install 0Ω resistances for R7 and R10
3. Tie C9 (positive side) to the cut side of R7 and R10.
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DAP Connection:
IMPORTANT: BOARD MODIFICATIONS BELOW MUST BE MADE PRIOR TO APPLYING POWER TO THE BOARD
CLC730114 evaluation board can be used with two types of Op Amps:
1. Op Amp’s with DAP internally floating. (see modification for “type 1” below)
2. Op Amp’s with DAP internally tied to V- (see modification for “type 2” below)
CLC730114 DAP heatsink connection is tied to both ground and V-. It is very important to make the necessary
modifications outlined below BEFORE powering up the board. Otherwise, there will be excess current flow from V-
due to a direct short to ground through the copper under device used for heatsink. Consult the data sheet for
each device for information on DAP connection and which of the modifications below is required for the particular device.
BOARD MODIFICATION FOR PROPER BIASING ON DAP:
“TYPE 1” MODIFICATION
“TYPE 2” MODIFICATION
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Bottom Side
Top Side
R11
C3
C4
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2.
A critical component is any component of a life
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can be reasonably expected to cause the failure of
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said circuitry and specifications.