m XPC107A RELIABILITY DATA SUMMARY XPC107A - Chaparral - Information Fab: MOS13, Austin, TX Mask: J82X Process: HiP3 Package: 503 pin, FC-PBGA, Flip Chip on Organic Assy: BAT-1, Austin, Texas MPC107- TECHNOLOGY: MOS13 on the 0.29m HiP3 process DYNAMIC LIFETEST (3.3V, 125C) 504 HRS 1008 HRS 0 / 231 0 / 231 168 HRS 0 / 231 2016 HRS / ESD (HBM) 1KV / 2KV 0 / 9 ESD (MM) 75V 100V 0 / 6 6 / 6 All pins on part pass 100V except one, AVDD, which passes up to 75V. ESD waiver granted without corrective action required due to high risk/low benefit. Improving ESD of the AVDD supply has high probability of impacting the functionality of the device. ESD (CDM) 500V / 1KV 0 / 6 LATCHUP 150 mA 0 / 3 200 mA 0 / 6 Last Updated CL Dec 2000 m XPC107A RELIABILITY DATA SUMMARY TECHNOLOGY FAILURE RATES - HiP3 FITs vs Junction Temperature: XPC107 Thermal and Voltage Acceleration eA = 0.5 eV, Beta = 4.88, 60% Confidence M Fit Rate (Failures/1E9 Device Hours) 100.00 10.00 2.4 V 2.5 V 2.6 V 1.00 Tj 65 C 85 C 105 C 2.4 V 2.5 V 2 7 17 2.6 V 4 11 27 7 19 45 0.10 0 20 40 60 80 100 120 Junction Temperature (C) m MTBF vs Junction Temperature: XPC107 Thermal and Voltage Acceleration eA = 0.5 eV, Beta = 4.88, 60% Confidence 1.00E+07 1.00E+06 MTBF (years) 1.00E+05 1.00E+04 1.00E+03 1.00E+02 2.4 V Tj 65 C 85 C 105 C 1.00E+01 2.4 V 1.1E+5 4.2E+4 1.8E+4 2.5 V 6.7E+4 2.6E+4 1.1E+4 2.6 V 4.1E+4 1.6E+4 6.7E+3 2.5 V 2.6 V 1.00E+00 0 20 40 60 80 100 120 Junction Temperature (C) Last Updated CL Dec 2000 m XPC107A RELIABILITY DATA SUMMARY PACKAGE: 503 Pin 33 x 33mm FC-PBGA - BAT1 MOISTURE CZ PRECOND MSL3 0 / 248 PRECOND MSL3 0 / 231 TEMPERATURE CYCLING (-40C/+125C) 100 CYC 500 CYC 0 / 231 0 / 231 1000 CYC 0 / 231 PRECOND MSL3 0 / 231 TEMPERATURE CYCLING (0C/+125C) 500 CYC 1000 CYC 0 / 231 0 / 231 2000 CYC 0 / 231 AUTOCLAVE (+121C, 100% RH, 2 atm) PRECOND MSL3 48 HRS 0 / 231 0 / 231 PRECOND MSL3 0 / 231 THB (+85C/85% RH/1.8V) 168 HRS 504 HRS 0 / 231 0 / 231 1008 HRS 0 / 231 BAKE (175C) 168 HRS 0 / 231 504 HRS 0 / 231 Last Updated CL Dec 2000