m
XPC107A RELIABILITY DATA SUMMARY
XPC107A - Chaparral - Information
Fab: MOS13, Austin, TX
Mask: J82X
Process: HiP3
Package: 503 pin, FC-PBGA, Flip Chip on Organic
Assy: BAT-1, Austin, Texas
MPC107- TECHNOLOGY:
MOS13 on the 0.29µm HiP3 process
DYNAMIC LIFETEST (3.3V, 125°C)
168 HRS 504 HRS 1008 HRS 2016 HRS
0/231 0 /231 0 /231 /
ESD (HBM)
1KV 2KV
/0/9
ESD (MM)
75V 100V
0/6 6 /6
All pins on part pass 100V except one, AVDD, which passes up to 75V.
ESD waiver granted without corrective action required due to high risk/low benefit.
Improving ESD of the AVDD supply has high probability of impacting the functionality of the device.
ESD (CDM)
500V 1KV
/0/6
LATCHUP
150 mA 200 mA
0/3 0 /6
Last Updated CL Dec 2000
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XPC107A RELIABILITY DATA SUMMARY
TECHNOLOGY FAILURE RATES - HiP3
FITs vs Junction Temperature: XPC107
Thermal and Voltage Acceleration
eA = 0.5 eV, Beta = 4.88, 60% Confidence
0.10
1.00
10.00
100.00
0 20 40 60 80 100 120
Junction Temperature (°C)
Fit Rate (Failures/1E9 Device Hours)
2.4 V
2.5 V
2.6 V
M
Tj 2.4 V 2.5 V 2.6 V
65 °C 2 4 7
85 °C 711 19
105 °C 17 27 45
MTBF vs Junction Temperature: XPC107
Thermal and Voltage Acceleration
eA = 0.5 eV, Beta = 4.88, 60% Confidence
1.00E+00
1.00E+01
1.00E+02
1.00E+03
1.00E+04
1.00E+05
1.00E+06
1.00E+07
0 20 40 60 80 100 120
Junction Temperature (°C)
MTBF (years)
2.4 V
2.5 V
2.6 V
m
Tj 2.4 V 2.5 V 2.6 V
65 °C 1.1E+5 6.7E+4 4.1E+4
85 °C 4.2E+4 2.6E+4 1.6E+4
105 °C 1.8E+4 1.1E+4 6.7E+3
Last Updated CL Dec 2000
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XPC107A RELIABILITY DATA SUMMARY
PACKAGE: 503 Pin 33 x 33mm FC-PBGA - BAT1
MOISTURE CZ
PRECOND MSL3
0/248
TEMPERATURE CYCLING (-40°C/+125°C)
PRECOND MSL3 100 CYC 500 CYC 1000 CYC
0/231 0 /231 0 /231 0 /231
TEMPERATURE CYCLING (0°C/+125°C)
PRECOND MSL3 500 CYC 1000 CYC 2000 CYC
0/231 0 /231 0 /231 0 /231
AUTOCLAVE (+121°C, 100% RH, 2 atm)
PRECOND MSL3 48 HRS
0/231 0 /231
THB (+85°C/85% RH/1.8V)
PRECOND MSL3 168 HRS 504 HRS 1008 HRS
0/231 0 /231 0 /231 0 /231
BAKE (175°C)
168 HRS 504 HRS
0/231 0 /231
Last Updated CL Dec 2000
