GO2918
SINGLE CHANNEL VIDEO OPTICAL TRANSMITTER MODULE
Datasheet name: GO2918_55602_doc2.pdf
Contact information: info@embrionix.com
www.embrionix.com
1 of 26GO2918 1310nm Single Channel Optical Transmitter www.gennum.com
Data Sheet
55602 - 2 April 2011
GO2918 1310nm Single Channel Optical Transmitter
Features
• Supports video pathological patterns for SD-SDI,
HD-SDI and 3G-SDI
• Hot-pluggable
•Laser disable pins
• User writeable EEPROM
• Digital diagnostics and control via I2C interface
including:
Monitoring laser bias current, average output
power, supply voltage and temperature
Alarm reporting
Module ID polling
• Single +3.3V power supply
• RoHS compliant
• Telcordia GR-468 compliant
• 56.5mm x 13.4mm x 8.6mm SFP Package
• SMPTE 297-2006 compatible
Applications
• SMPTE 297-2006 compatible electrical-to-optical
interfaces
Description
The GO2918 is a single channel optical transmitter module
designed to transmit optical serial digital signals as defined
in SMPTE 297-2006. The GO2918 is specifically designed
for robust performance in the presence of SDI pathological
patterns for SMPTE 259M, SMPTE 344M, SMPTE 292M and
SMPTE 424M serial rates.
The GO2918 contains a 1310nm transmitter designed to
provide error-free transmission of signals from 50Mbps to
3Gbps over single mode fiber (9/125). It is also
hot-pluggable.
The GO2918 provides extensive operational status
monitoring through an I2C interface. Output optical power,
bias current, supply voltage and operating temperature are
are monitored. If a parameter monitored is outside the
pre-defined range, the alarm flag associated with the
parameter will be raised.
Ordering Information
Part Number Package Temperature Range
GO2918-31CM SFP TCASE= 0°C to 70°C
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Revision History
Contents
Features.................................................................................................................................................................1
Description...........................................................................................................................................................1
Ordering Information .......................................................................................................................................1
Revision History .................................................................................................................................................2
1. Functional Block Diagram..........................................................................................................................3
2. Pin Specifications ..........................................................................................................................................4
2.1 Pin Configuration .............................................................................................................................4
2.2 Pin Descriptions ................................................................................................................................5
2.3 Host Board Power Supply Requirements .................................................................................5
2.4 Optical Connector Requirements ................................................................................................6
3. Product Specifications .................................................................................................................................7
3.1 Absolute Maximum Ratings ..........................................................................................................7
3.2 Optical Performance Specifications ...........................................................................................7
3.3 DC Electrical Specifications ..........................................................................................................9
3.4 AC Electrical Specifications ....................................................................................................... 10
3.5 Supporting Circuit Specifications ............................................................................................ 10
3.5.1 In-Rush Current Control Circuit ................................................................................... 10
4. Digital Diagnostics ..................................................................................................................................... 11
4.1 I2C Bus Interface ............................................................................................................................ 11
4.2 Serial Interface Memory Map .................................................................................................... 13
5. Application Reference Design ............................................................................................................... 21
5.1 Typical Application Circuit ........................................................................................................ 21
6. References and Relevant Standards .................................................................................................... 22
7. Package Information ................................................................................................................................. 23
7.1 Package Dimensions ..................................................................................................................... 23
7.2 PCB Layout Recommendations .................................................................................................24
Version ECR Date Changes and/or Modifications
0 154502 July 2010 New document.
1 155910 March 2011 Added EEPROM tables.
2 156192 April 2011 Updated EEPROM Table 4-4 Block 110 and
Table 4-5.
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1. Functional Block Diagram
Figure 1-1: GO2918 Functional Block Diagram
I2C Bus Digital
Diagnostics
Laser
Driver
Tx1_Disable
Tx provision and
analog maintenance
TOSA_1
Laser + PINmon
Feedback
1310nm
Differential Electrical
Input
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2. Pin Specifications
2.1 Pin Configuration
Figure 2-1 shows the host board pad configurations for the GO2918. Figure 2-2 shows
the edge connector pad configuration for the GO2918.
Figure 2-1: GO2918 Pin Configuration
Figure 2-2: GO2918 Edge Connector Pad Configuration
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Towards
Bezel
Towards
ASIC
VEE
NC
NC
I
2
C CLK
VEE
I
2
C DATA
VEE
NC
NC
NC
TX_DIS
TD-
TD+
VEE
VEE
VEE
NC
NC
NC
VCC_TX
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
VEE
VEE
VEE
NC
NC
NC
VCC_TX
TD+
TD-
TX_DIS
VEE
NC
VEE
NC
NC
I2C DATA
I2C CLK
NC
NC
VEE
Top of Board Bottom of Board
(as viewed through top of board)
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2.2 Pin Descriptions
Table 2-1 lists the pin descriptions for the GO2918.
2.3 Host Board Power Supply Requirements
The host board is required to provide a regulated and filtered power supply of 3.3V +/-
5% for the GO2918 via the on board SFP connector. The host board is required to filter
the VCC_TX power supply as recommended by the SFP MSA. Figure 2-3 shows the
Table 2-1: Pin Descriptions
Number Name Typ e Description
1 VEE Ground Ground connection
2 NC No Connect No Connection
3 NC No Connect No Connection
4 VEE Ground Ground connection
5I2C CLK Digital (Input) I2C Clock
6I2C DATA Digital
(Bi-Directional)
I2C Data
7 VEE Ground Ground connection
8 NC No Connect No Connection
9 NC No Connect No Connection
10 NC No Connect No Connection
11 VEE Ground Ground connection
12 NC No Connect No Connection
13 NC No Connect No Connection
14 VEE Ground Ground connection
15 NC No Connect No Connection
16 VCC_TX Power Transmitter Power Supply
17 VEE Ground Ground connection
18 TD+ Input Positive Differential Input (AC-coupled
internally)
19 TD- Input Negative Differential Input (AC-coupled
internally)
20 TX_DIS Digital (Input) Transmitter Disable. The laser is disabled on
channel 1 if TX_DIS = HIGH. Internal 4.7kΩ
pull-up.
NOTES:
1. All VEE signals are connected together inside the module.
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recommended board supply filtering. When the host board is loaded with a resistive
load in place of the SFP module and sourcing the maximum rated current, the
peak-to-peak power supply noise measured on the SFP connector should comply to
Table 2-2.
Figure 2-3: Recommended Host Board Supply Filtering
2.4 Optical Connector Requirements
An LC connector with PC/UPC polish is required the optical port.
Table 2-2: Host Board Power Supply Noise Requirement at VCC_Tx
Frequency (MHz) Peak-to-Peak Noise Amplitude (%)
0.02-1 2
1-10 3
VCC_Tx
GO2918
0.1µF10µF0.1µF10µF
1µH
Host Board
3.3V
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3. Product Specifications
3.1 Absolute Maximum Ratings
Table 3-1 lists the absolute maximum ratings for the GO2918. Conditions exceeding the
limits listed may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those listed in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
3.2 Optical Performance Specifications
Table 3-2 lists the optical performance specifications for the GO2918.
Table 3-1: Absolute Maximum Ratings
Parameter Conditions Value/Units
Supply Voltage – 4V
Operating Case Temperature – -20°C < TCASE < 80°C
Storage Temperature – -40°C < TSTG < 100°C
ESD tolerance on all pins – ±1kV HBM
Relative Humidity
(non-condensing)
– 5% - 95% RH
Table 3-2: Optical Performance Specifications
VCC = 3.3V ±5%, TC = 0oC to 70oC. Typical values are at VCC = 3.3V, TA = 25oC unless otherwise specified.
Parameter Symbol Condition Min Ty p Max Units Notes
Wavelength λ– 1280 1310 1340 nm 1
Spectral Line Width (RMS) –––1.53nm–
Average Optical Output
Power
Pout –-5-20dBm–
Extinction Ratio ER – 7 – – dB –
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Optical Signal Intrinsic Jitter – 2.97Gbps, 1.485Gbps,
270Mbps PRBS
–3060ps–
2.97Gbps
SMPTE 424M
Pathological
–4570ps–
1.485Gbps
SMPTE 292M
Pathological
– 60 100 ps –
270Mbps
SMPTE 259M
Pathological
– 110 180 ps –
Optical Signal Rise Time tr2.97Gbps
SMPTE 424M
– 105 165 ps –
Optical Signal Fall Time tf2.97Gbps
SMPTE 424M
– 120 180 ps –
Laser Power Monitoring
Accuracy
––-2–+2dB–
NOTE
1. Measured at 25°C.
Table 3-2: Optical Performance Specifications (Continued)
VCC = 3.3V ±5%, TC = 0oC to 70oC. Typical values are at VCC = 3.3V, TA = 25oC unless otherwise specified.
Parameter Symbol Condition Min Ty p Max Units Notes
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3.3 DC Electrical Specifications
Table 3-3 lists the DC electrical specifications for the GO2918. Figure 3-1 shows the
definition of the differential signal level.
Figure 3-1: Definition of Differential Signal Level
Table 3-3: DC Electrical Specifications
VCC = 3.3V ±5%, TC = 0oC to 70oC. Typical values are at VCC = 3.3V, TA = 25oC unless otherwise specified.
Parameter Symbol Condition Min Ty p Max Units Notes
Operating Temperature
Range
TCASE –0–70°C1
Power Supply Voltage VCC – 3.13 3.3 3.47 V 1
Total Power Consumption – – – – 550 mW –
Differential Input Data
Amplitude
Vp-pDiff –0.4–2.4V2
Digital Input Low VIL –0 0.8V–
Digital Input High VIH –2 V
cc V–
NOTES
1. Outside the specified range, performance is not guaranteed.
2. Signals are AC coupled internally within the module and terminated to a 50Ω (single-ended) termination.
DATAP
DATAN
DATAP - DATAN
0V
VSE
V p-pDIFF = 2 x VSE
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3.4 AC Electrical Specifications
Table 3-4 lists the AC electrical specifications for the GO2918.
3.5 Supporting Circuit Specifications
3.5.1 In-Rush Current Control Circuit
Due to the hot-pluggable requirement, the GO2918 has built-in circuits to limit the
in-rush current upon hot insertion. The specifications of the in-rush limiting circuits are
summarized in Table 3-5.
Table 3-4: Timing Specifications
Parameter Symbol Condition Min Max Units
Bit Rate BR – 50 3000 Mbps
Time to Initialize t_init From power on – 300 ms
Tx_Disable Assert Time t_off Time from rising edge of Tx_Disable to when
the optical output falls below 10% of nominal.
–10μs
Tx_Disable Negate Time t_on Time from falling edge of Tx_Disable to when
the modulated optical output rises above 90%
of nominal.
–1ms
Serial ID Clock Rate f_serial_clock – – 400 kHz
Table 3-5: In-rush Current Limiting Circuits Specifications
Parameter Value
Maximum in-rush current ramp rate 50mA/ms
Maximum in-rush current 30mA over steady state
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4. Digital Diagnostics
4.1 I2C Bus Interface
The I2C interface allows reading of diagnostic information from the module. It is
comprised of I2C DATA and I2C CLK pins. All address and data bytes are transmitted
through the I2C DATA pin. The I2C DATA and I2C CLK pins are open-collector and they
must be pulled high (4.75kΩ recommended) externally to the module. Data on the I2C
DATA pin may only change during I2C CLK 'low' time periods. Data changes during I2C
CLK 'high' periods will indicate either a START or STOP condition. Operations and
conditions are described as follows:
START Condition
The START condition is originated by the host. A high-to-low transition of I2C DATA
while I2C CLK 'high' defines a START condition that must precede any other command,
see Figure 4-1.
STOP Condition
The STOP condition is originated by the host. A low-to-high transition of I2C DATA while
I2C CLK 'high' defines a STOP condition, see Figure 4-1.
Figure 4-1: I2C START and STOP Condition
Acknowledge or ACK Condition
The acknowledge condition occurs when the I2C DATA pin is pulled 'low' during the
ninth clock pulse following an address or data byte. The module originates this
condition after it has received a block or data address. The host originates this condition
during a sequential address read operation.
Addressing Operation
The module must receive a block address following a START condition to enable a read
operation. The block address is clocked into the module MSB to LSB. There are three read
operations: current address read, random read, and sequential address read.
Note that by the convention specified in the SFP MSA, 7-bit block addresses are left
shifted by one bit when expressing them in hex. Block addresses for the different
I2C DATA
I2C CLK
STOPSTART
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memory regions are specified in Section 4.2. Block addresses A0h, A2h, and B2h would
therefore be transmitted defined as binary 1010000, 1011001 and 1011001 respectively.
Current Address Read Operation
The module has an internal register that maintains the data address used during the last
read operation, incremented by one. If the most recent data address was FFh, then the
register resets to 00h. Once the block address is clocked in by the host with the R/W bit
set 'high', the module follows with an ACK condition, and the data byte located at the
current data address is serially clocked out of the module MSB to LSB. The operation is
terminated when the host does not provide an ACK condition and initiates a STOP
condition. See Figure 4-2.
Figure 4-2: I2C Current Address Read Operation
Random Address Read Operation
A random read operation requires a dummy write sequence to load in the data address.
Once the block and data addresses are clocked in by the host followed by an ACK
condition provided by the module, the host must generate another START condition. The
host now initiates a current address read operation by sending the block address with
the R/W bit set 'high'. The module provides an ACK condition and serially clocks out the
data byte. The operation is terminated when the host does not provide an ACK condition
and initiates a STOP condition. See Figure 4-3.
Figure 4-3: I2C Random Access Read Operation
Sequential Address Read Operation
The sequential address read operation is initiated by either a current address read or
random address read operation. After the host receives the first data byte, it responds
with an ACK condition. As long as the module receives the ACK condition after a data
byte is read, the host can clock out additional data bytes from the module. After the data
address reaches FFh, it resets to 00h. The operation is terminated when the host does not
provide an ACK condition and initiates a STOP condition. See Figure 4-4.
I
2
C DATA 7 65432176543210R A
Host driving data line Module driving data line
Block AddressSTART STOPRead
ACK NO ACK
Data Byte
I
2
C DATA 7 65432176543210W A
Host driving data line Module driving data line
Block AddressSTART Write
ACK
A
ACK
Data Address
76543217 6 5 43210R A
Block AddressSTART STOPRead
ACK NO ACK
Data Byte
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Figure 4-4: I2C Sequential Read Access Operation
4.2 Serial Interface Memory Map
Module identification and digital diagnostic monitoring information is accessible
through the memory map addresses shown in this section. The items below outline the
different block addresses of the module:
• Block address A0h contains serial ID information of the module.
• Block address A2h contains alarm flags, warning flags, thresholds and real-time
digital diagnostic features set for the module.
The 16-bit digital diagnostic monitoring information is internally calibrated over
Gennum’s specified operating temperature and voltage.Alarm and warning threshold
values are calibrated in the same manner and can be interpreted as defined below.
Internally measured module temperature is represented as a 16-bit signed two’s
complement value in increments of 1/256°C, yielding a total range of -128°C to +128°C.
To calculate the temperature, treat the two’s complement value as a 16-bit unsigned
integer and divide it by 256. If the result is greater or equal to 128, subtract 256 from the
result. See Table 4-1 for temperature conversion examples.
Internally measured module supply voltage is represented as a 16-bit unsigned integer
with the voltage defined as the full 16-bit value with the LSB equal to 100μV, yielding a
total range of 0 to +6.55V. To calculate the supply voltage, multiply the 16-bit unsigned
integer by 100μV.
Internally measured laser bias current is represented as a 16-bit unsigned integer with
the current defined as the full 16-bit value with the LSB equal to 2μA, yielding a total
range of 0 to 131 mA. To calculate the laser bias current, multiply the 16-bit unsigned
integer by 2μA.
I
2
C DATA 7 65432176543210R A
Host driving data line Module driving data line
Block AddressSTART STOPRead
ACK NO ACK
Data Byte (N)
76543210A
ACK
Data Byte (N+1)
76 5 43210A
ACK
Data Byte (N+M)
Table 4-1: Temperature Conversion Examples
MSB (BIN) LSB (BIN) Temperature (°C)
01000000 00000000 64°C
01000000 00001111 64.059°C
01011111 00000000 95°C
11110110 00000000 -10°C
11011000 00000000 -40°C
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Internally measured Tx optical power is represented as a 16-bit unsigned integer with
the power defined as the full 16-bit value with the LSB equal to 0.1μW, yielding a total
range of 0 to 6.5535mW (~ -40 to +8.2dBm). To calculate the Tx optical power, multiply
the 16-bit unsigned integer by 0.1μW.
Table 4-2: Modules Identification Fields
Block Address: A0h
Address Size Name Description and Value of the Field
0 1 Identifier Type of serial transceiver. 83h
1 1 Ext. Identifier Extended identifier of type of serial
transceiver. 04h
2 1 Connector Code for connector type. 07h for LC
connectors.
3 1 Standards
Compliance
41h, for SMPTE259M/344M/292M/424M and
SMPTE 297M.
4-10 8 Transceiver Code Code for electronic compatibility or optical
compatibility. Not applicable for GO2918.
11 1 Encoding Code for serial encoding algorithm. Value:
03H for NRZ.
12 1 BR, Nominal Nominal bit rate, units of 100 MBits/sec, 1Eh
for 3Gbps.
13 1 Reserved Xxh
14 1 Length(9mm) -
km
Link length supported for standard SMF,
units of km, 1Eh (30km at HD-SDI with
GO2910).
15 1 Length(9mm) Link length supported for standard SMF,
units of 100 m, 00h
16 1 Length (50mm) Link length supported for 50/125 mm fiber,
units of 10 m. 00h
17 1 Length (62.5mm) Link length supported for 62.5/125 mm
fiber, units of 10 m. 00h
18 1 Length (Copper) Link length supported for copper, units of
meters. 00h
19 1 Reserved Xxh
20-35 16 Vendor name SFP with OM transceiver vendor name
(ASCII). G E N N U M
20 1 G 47h
21 1 E 45h
22 1 N 4Eh
23 1 N 4Eh
24 1 U 55h
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25 1 M 4Dh
26-35 10 – 20h for each byte
36 1 Reserved –
37-39 3 Vendor OUI SFP with OM transceiver vendor IEEE
company ID. 00 0A DF
40-55 16 Vendor PN Part number provided by SFP with OM
transceiver vendor. G O 2 9 1 8 - 3 1 C M
40 1 G 47h
41 1 O 4Fh
42 1 2 32h
43 1 9 39h
44 1 1 31h
45 1 8 38h
46 1 – 2Dh
47 1 3 33h
48 1 1 31h
49 1 C 43h
50 1 M 4Dh
51-55 5 – 20h
56-58 3 – Reserved
59 1 Vendor Rev Revision level for part number provided by
vendor.
60 1 Wavelength 1Fh for the middle two digits of 1310.
61 1 Wavelength 1Fh for the middle two digits of 1310.
62 1 Reserved Xxh
63 1 CC_BASE Check code for Base ID fields. (The value of
the lower 8 bits of the sum of the contents
from address 0 to 62.)
64-65 2 Options Indicates which optional SFP with OM
signals are implemented.
64 1 – 00h
65 1 – 18h
66 1 BR, max Upper bit rate margin, units of %, 5h.
67 1 BR, min Lower bit rate margin, units of %, 5Fh.
Table 4-2: Modules Identification Fields (Continued)
Block Address: A0h
Address Size Name Description and Value of the Field
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68-83 16 Vendor SN Serial number provided by vendor (ASCII)
84-85 2 Year Manufacturing date code (ASCII).
86-87 2 Month Manufacturing date code (ASCII).
88-89 2 Day Manufacturing date code (ASCII).
90-91 2 Blank –
92 1 Calibration flag 20h for calibrated average output power
93 1 – E0h, Enhanced alarm/warning flags.
94 1 Reserved Xxh
95 1 CC_EXT Check code for the Extended ID fields. (The
value of the lower 8 bits of the sum of the
contents from address 64 to 94.)
96-255 160 Reserved –
Table 4-3: Alarm and Warning Thresholds
Block Address: A2h
Address Size Name Description and Value of the Field
0-1 2 Temp High Alarm MSB at lower address. 78°C case temp.
2-3 2 Temp Low Alarm MSB at lower address. -8°C case temp.
4-5 2 Temp High
Warning
MSB at lower address. 73°C case temp.
6-7 2 Temp Low
Warning
MSB at lower address. -3°C case temp.
8-9 2 Supply Voltage
High Alarm
MSB at lower address. 3.6V
10-11 2 Supply Voltage
Low Alarm
MSB at lower address. 3.0V
12-13 2 Supply Voltage
High Warning
MSB at lower address. 3.47V
14-15 2 Supply Voltage
Low Warning
MSB at lower address. 3.14V
16-17 2 Laser Bias High
Alarm
MSB at lower address. 100mA.
18-19 2 Laser Bias Low
Alarm
MSB at lower address. 5mA.
Table 4-2: Modules Identification Fields (Continued)
Block Address: A0h
Address Size Name Description and Value of the Field
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20-21 2 Laser Bias High
Warning
MSB at lower address. 90mA.
22-23 2 Laser Bias Low
Warning
MSB at lower address. 10mA
24-25 2 Tx Power High
Alarm
MSB at lower address. 0dBm.
26-27 2 Tx Power Low
Alarm
MSB at lower address. -7dBm.
28-29 2 Tx Power High
Warning
MSB at lower address. -1dBm.
30-31 2 Tx Power Low
Warning
MSB at lower address. -6dBm.
32-94 64 Reserved. –
95 1 CC_EXT Byte 95 contains the low order 8 bits of the
check sum of byte 0 -94
Table 4-4: Alarms and Real time Diagnostic information
Block Address: A2h
Address Size Name Description and Value of the Field
96 1 Temperature
MSB
Internally measure module temperature
(approximately equal to case temperature)
97 1 Temperature LSB Internally measure module temperature
(approximately equal to case temperature)
98 1 VCC MSB Internally measure module supply voltage
99 1 VCC LSB Internally measure module supply voltage
100 1 Laser Bias MSB Internally measure laser bias current. 7530h
corresponds to 60mA. All other readings
should be scaled linearly using this factor.
101 1 Laser Bias LSB Internally measure laser bias current. 7530h
corresponds to 60mA. All other readings
should be scaled linearly using this factor.
102 1 Tx Power MSB Internally measure Tx Power.
103 1 Tx Power LSB Internally measure Tx Power.
104-109 11 Reserved –
Table 4-3: Alarm and Warning Thresholds (Continued)
Block Address: A2h
Address Size Name Description and Value of the Field
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110 1 Tx Disable State Bit 7: State of TX_DIS input pin
Tx Disable Select Bit 6: Read/write bit that allows software
disable of laser. Writing “1” disables laser.
Reserved Bit 5-3
Tx Fault Bit 2: State of TX_FAULT output
Rx LOS Bit 1: State of RX_LOS output
Data_Ready Bit 0
111 1 Conversion
Update
–
Temp Update Bit 7 goes to high after a temperature
update
VCC Update Bit 6 goes to high after a VCC update
Mon1 Update Bit 5 goes to high after a Tx bias current
update
Mon2 Update Bit 4 goes to high after a Tx power update
Mon3 Update Bit 3 goes to high after a Tx modulation
current update.
Reserved Bit 0 to Bit 2.
112 1 Temp High Alarm
Flag
Bit 7, set when the internal temperature
exceeds the high temp alarm threshold.
Temp Low Alarm
Flag
Bit 6, set when the internal temperature
goes below the low temp alarm threshold.
Supply Voltage
High Alarm Flag
Bit 5, set when the internal VCC exceeds the
supply voltage high alarm threshold.
Supply Voltage
Low Alarm Flag
Bit 4, set when the internal VCC goes below
the supply voltage low alarm threshold.
Laser Bias High
Alarm Flag
Bit 3, set when the monitored laser bias
current exceeds the laser bias high alarm
threshold.
Laser Bias Low
Alarm Flag
Bit 2, set when monitored laser bias current
goes below the laser bias low alarm
threshold.
Tx Power High
Alarm Flag
Bit 1, set when the monitored Tx power
exceeds the Tx power high alarm threshold.
Tx Power Low
Alarm Flag
Bit 0, set when monitored Tx power current
goes below the Tx power low alarm
threshold.
Table 4-4: Alarms and Real time Diagnostic information (Continued)
Block Address: A2h
Address Size Name Description and Value of the Field
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113 1 Mod Current
High Alarm Flag
Bit 7, set when the monitored laser
modulation current exceeds the laser bias
high alarm threshold.
Mod Current
Low Alarm Flat
Bit 6, set when monitored laser bias current
goes below the laser modulation low alarm
threshold.
Reserved Bit 0 - 5.
114-115 2 Reserved –
116 1 Temp High
Warning Flag
Bit 7, set when the internal temperature
exceeds the high temp warning threshold.
Temp Low
Warning Flag
Bit 6, set when the internal temperature
goes below the low temp warning
threshold.
Supply Voltage
High Warning
Flag
Bit 5, set when the internal VCC exceeds the
supply voltage high warning threshold.
Supply Voltage
Low Warning
Flag
Bit 4, set when the internal VCC goes below
the supply voltage low warning threshold.
Laser Bias High
Warning Flag
Bit 3, set when the monitored laser bias
current exceeds the laser bias high warning
threshold.
Laser Bias Low
Warning Flag
Bit 2, set when monitored laser bias current
goes below the laser bias low warning
threshold.
Tx Power High
Warning Flag
Bit 1, set when the monitored Tx power
exceeds the Tx power high warning
threshold.
Tx Power Low
Warning Flag
Bit 0, set when monitored Tx power current
goes below the Tx power low warning
threshold.
117 1 Mod Current
High Warning
Flag
Bit 7, set when the monitored laser
modulation current exceeds the laser bias
high alarm threshold.
Mod Current
Low Warning
Flag
Bit 6, set when monitored laser bias current
goes below the laser modulation low alarm
threshold.
Reserved Bit 0 - 5
118-127 10 Reserved –
Table 4-4: Alarms and Real time Diagnostic information (Continued)
Block Address: A2h
Address Size Name Description and Value of the Field
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Table 4-5: Writeable Area
Block Address: A2h
Address Size Name Description and Value of the Field
128-247 120 User Writeable
Area
–
248-255 8 Reserved –
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5. Application Reference Design
5.1 Typical Application Circuit
Figure 5-1 shows a typical application circuit for the GO2918.
Figure 5-1: GO2918 Typical Application Circuit
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6. References and Relevant Standards
Table 6-1: References and Relevant Standards
INF-8074i Rev 1.0 SFP (Small Formfactor Pluggable) Transceiver
SMPTE 259M-2008 SDTV Digital Signal/Data – Serial Digital Interface
SMPTE 292M-2008 1.5 Gbps Signal / Data Serial Interface
SMPTE 297-2006 Serial Digital Fiber Transmission System for SMPTE 259M, SMPTE 344M, SMPTE 292 and SMPTE
424M Signals
SMPTE 344M-2000 540 Mbps Serial Digital Interface
SMPTE 424M-2006 3 Gbps Signal/Data Serial Interface
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7. Package Information
7.1 Package Dimensions
A common mechanical outline, as shown in Figure 7-1, is used for all SFP modules.
Since the GO2918 is a single channel device, the receptacle for channel 2 is plugged with
a plastic insert.
Figure 7-1: Common SFP Package Outline
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7.2 PCB Layout Recommendations
Figure 7-2: Host PCB Layout – Part 1
Notes:
1. Datum and basic dimensions
established by customer
2. Pads and vias are chassis-ground
in 11 places
3. Through-holes and plating are optional
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Figure 7-3: Host PCB Layout – Part 2
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26
Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of
the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent
infringement.
All other trademarks mentioned are the properties of their respective owners.
GENNUM and the Gennum logo are registered trademarks of Gennum Corporation.
© Copyright 2010 Gennum Corporation. All rights reserved.
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Phone: +1 (905) 632-2996 Fax: +1 (905) 632-2055
E-mail: corporate@gennum.com www.gennum.com
DOCUMENT IDENTIFICATION
DATA SHEET
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the product at any time without notice to improve reliability, function or
design, in order to provide the best product possible.
CAUTION
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A
STATIC-FREE WORKSTATION
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