Precision, Low Noise FGATM Voltage References ISL21007 Features The ISL21007 FGATM voltage references are extremely low power, high precision, and low noise voltage references fabricated on Intersil's proprietary Floating Gate Analog technology. The ISL21007 features very low noise (4.5VP-P for 0.1Hz to 10Hz) and very low operating current (150A, Max). In addition, the ISL21007 family features guaranteed initial accuracy as low as 0.5mV. * Reference Output Voltage . . . .1.250V, 2.048V, 2.500V, 3.000V This combination of high initial accuracy, low drift, and low output noise performance of the ISL21007 enables versatile high performance control and data acquisition applications with low power consumption. * Initial Accuracy . . . . . . . . . . . . . . . . . . . . . . . 0.5mV (B grade) * Input Voltage Range ISL21007-12, 20, 25. . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V ISL21007-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2V to 5.5V * Low Output Voltage Noise . . . . . . . . 4.5VP-P (0.1Hz to 10Hz) * Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 150A (Max) * Temperature Coefficient . . . . . . . . . . . . . . 3ppm/C (B grade) * Operating Temperature Range. . . . . . . . . . .-40C to +125C * Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ld SOIC * Pb-Free (RoHS Compliant) Available Options Applications VOUT OPTION (V) INITIAL ACCURACY (mV) TEMPCO. (ppm/C) ISL21007BFB812Z (Note 1) 1.250 0.5 3 ISL21007CFB812Z 1.250 1.0 5 ISL21007DFB812Z 1.250 2.0 10 ISL21007BFB820Z (Note 2) 2.048 0.5 3 ISL21007CFB820Z 2.048 1.0 5 * AN1533, "X-Ray Effects on Intersil FGA References" ISL21007DFB820Z 2.048 2.0 10 ISL21007BFB825Z (Note 1) 2.500 0.5 3 * AN1494, "Reflow and PC Board Assembly Effects on Intersil FGA References" ISL21007CFB825Z 2.500 1.0 5 ISL21007DFB825Z 2.500 2.0 10 ISL21007BFB830Z (Note 3) 3.000 0.5 3 ISL21007CFB830Z 3.000 1.0 5 ISL21007DFB830Z 3.000 2.0 10 PART NUMBER NOTES: 1. Not recommended for new designs. Recommended replacement part ISL21009. * High Resolution A/Ds and D/As * Digital Meters * Bar Code Scanners * Basestations * Battery Management/Monitoring * Industrial/Instrumentation Equipment Related Literature Pin Configuration ISL21007 (8 LD SOIC) TOP VIEW GND or NC 1 8 DNC VIN 2 7 DNC DNC 3 6 VOUT GND 4 5 TRIM 2. Not recommended for new designs. Recommended replacement part ISL21007CFB820Z. 3. Not recommended for new designs. Recommended replacement part ISL21007CFB830Z. March 27, 2012 FN6326.10 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2007, 2011, 2012. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL21007 Ordering Information PART NUMBER (Notes 4, 5, 6) PART MARKING VOUT OPTION (V) GRADE TEMP. RANGE (C) PACKAGE (Pb-Free) PKG. DWG. # ISL21007BFB812Z (Note 7) 21007BF Z12 1.250 0.5mV, 3ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007CFB812Z 21007CF Z12 1.250 1.0mV, 5ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007DFB812Z 21007DF Z12 1.250 2.0mV, 10ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007BFB820Z (Note 8) 21007BF Z20 2.048 0.5mV, 3ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007CFB820Z 21007CF Z20 2.048 1.0mV, 5ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007DFB820Z 21007DF Z20 2.048 2.0mV, 10ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007BFB825Z (Note 7) 21007BF Z25 2.500 0.5mV, 3ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007CFB825Z 21007CF Z25 2.500 1.0mV, 5ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007DFB825Z 21007DF Z25 2.500 2.0mV, 10ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007BFB830Z (Note 9) 21007BF Z30 3.000 0.5mV, 3ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007CFB830Z 21007CF Z30 3.000 1.0mV, 5ppm/C -40 to +125 8 Ld SOIC M8.15 ISL21007DFB830Z 21007DF Z30 3.000 2.0mV, 10ppm/C -40 to +125 8 Ld SOIC M8.15 NOTES: 4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 5. Add "-T*" suffix for tape and reel. Please refer to TB347 for details on reel specifications. 6. For Moisture Sensitivity Level (MSL), please see device information page for ISL21007. For more information on MSL please see techbrief TB363. 7. Not recommended for new designs. Recommended replacement part ISL21009. 8. Not recommended for new designs. Recommended replacement part ISL21007CFB820Z. 9. Not recommended for new designs. Recommended replacement part ISL21007CFB830Z. 2 FN6326.10 March 27, 2012 ISL21007 Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION 1 GND or NC 2 VIN Power Supply Input Connection 4 GND Ground 5 TRIM Allows user trim VOUT 2.5% 6 VOUT Voltage Reference Output Connection 3, 7, 8 DNC Do Not Connect; Internal Connection - Must Be Left Floating Ground or No Connection Typical Application Circuit 1 GND +3V C1 10F 2 VIN 3 NC 4 GND NC 8 NC 7 VOUT 6 TRIM 5 ISL21007-12, 20, 25, 30 SPI BUS X79000 1 SCK 2 A0 3 A1 4 A2 5 SI 6 SO 7 RDY 8 UP 9 DOWN 10 OE CS 20 CLR 19 VCC 18 VH 17 VL 16 C1 0.001F VREF 15 VSS 14 VOUT 13 VBUF 12 LOW NOISE DAC OUTPUT VFB 11 FIGURE 1. TYPICAL APPLICATION PRECISION 12-BIT SUBRANGING DAC 3 FN6326.10 March 27, 2012 ISL21007 Absolute Voltage Ratings Thermal Information Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . .-65C to +150C Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V Max Voltage VOUT to GND (10s). . . . . . . . . . . . . . . . . . . . . . -0.5V to VOUT + 1 Voltage on "DNC" pins . . . . . . . . . No connections permitted to these pins. ESD Rating Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6kV Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V Charged Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV Thermal Resistance (Typical, Note 11) Environmental Operating Conditions Temperature Range (Full Range Industrial) . . . . . . . . . . .-40C to +125C JA (C/W) 8 Ld SOIC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.12 Continuous Power Dissipation (Note 11). . . . . . . . . . . . . . . . . . .TA = +70C 8 Ld SOIC Derate 5.88mW/C above +70C. . . . . . . . . . . . . . . . . . 471mW Pb-Free Reflow Profile (Note 12) . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions X-Ray Exposure (Note 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mRem CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA NOTES: 10. Measured with no filtering, distance of 10" from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure levels should be analyzed for Output Voltage drift effects. See "Applications Information" on page 16. 11. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 12. Post-reflow drift for the ISL21007 devices will range from 100V to 1.0mV based on experimental results with devices on FR4 double sided boards. The design engineer must take this into account when considering the reference voltage after assembly. Common Electrical Specifications (ISL21007-12, -20, -25, -30) specified. Boldface limits apply over the operating temperature range, -40C to +125C. PARAMETER VOA TC VOUT IIN DESCRIPTION VOUT Accuracy @ TA = +25C Output Voltage Temperature Coefficient (Note NOTES:) TA = -40C to +125C, unless otherwise MIN MAX (Note 16) TYP (Note 16) CONDITIONS ISL21007B -0.5 +0.5 mV ISL21007C -1.0 +1.0 mV ISL21007D -2.0 +2.0 mV ISL21007B 3 ppm/C ISL21007C 5 ppm/C ISL21007D 10 ppm/C 150 A Supply Current 75 Trim Range tR UNIT 2.0 2.5 % 120 s Turn-on Settling Time VOUT = 0.1% Ripple Rejection f = 10kHz 60 dB eN Output Voltage Noise 0.1Hz f 10Hz 4.5 VP-P VN Broadband Voltage Noise 10Hz f 1kHz 2.2 VRMS Noise Density f = 1kHz 60 nV/Hz Electrical Specifications (ISL21007-12, VOUT = 1.250V) specified. Boldface limits apply over the operating temperature range, -40C to +125C. PARAMETER DESCRIPTION VIN Input Voltage Range VOUT Output Voltage VOUT /VIN Line Regulation 4 CONDITIONS VIN = 3.0V, TA = -40C to +125C, unless otherwise MIN (Note 16) TYP 2.7 MAX (Note 16) UNIT 5.5 V 1.250 2.7V < VIN < 5.5V 100 V 700 V/V FN6326.10 March 27, 2012 ISL21007 Electrical Specifications (ISL21007-12, VOUT = 1.250V) VIN = 3.0V, TA = -40C to +125C, unless otherwise specified. Boldface limits apply over the operating temperature range, -40C to +125C. (Continued) PARAMETER VOUT/IOUT DESCRIPTION Load Regulation CONDITIONS MIN (Note 16) TYP MAX (Note 16) UNIT Sourcing: 0mA IOUT 7mA 10 100 V/mA Sinking: -7mA IOUT 0mA 20 150 V/mA ISC Short Circuit Current TA = +25C, VOUT tied to GND 40 mA VOUT/TA Thermal Hysteresis (Note 14) TA = +165C 50 ppm VOUT/t Long Term Stability (Note 15) TA = +25C 100 ppm Electrical Specifications (ISL21007-20, VOUT = 2.048V) Boldface limits apply over the operating temperature range, -40C to +125C. PARAMETER DESCRIPTION CONDITIONS VIN = 3.0V, TA = -40C to +125C, unless otherwise specified. MIN (Note 16) TYP 2.7 MAX (Note 16) UNIT 5.5 V VIN Input Voltage Range VOUT Output Voltage VOUT /VIN Line Regulation 2.7V < VIN < 5.5V 50 200 V/V VOUT/IOUT Load Regulation Sourcing: 0mA IOUT 7mA 10 100 V/mA Sinking: -7mA IOUT 0mA 20 150 V/mA 2.048 V ISC Short Circuit Current TA = +25C, VOUT tied to GND 50 mA VOUT/TA Thermal Hysteresis (Note 14) TA = +165C 50 ppm VOUT/t Long Term Stability (Note 15) TA = +25C 75 ppm Electrical Specifications (ISL21007-25, VOUT = 2.500V) Boldface limits apply over the operating temperature range, -40C to +125C. PARAMETER DESCRIPTION CONDITIONS VIN = 3.0V, TA = -40C to +125C, unless otherwise specified. MIN (Note 16) TYP MAX (Note 16) UNIT 5.5 V VIN Input Voltage Range VOUT Output Voltage VOUT /VIN Line Regulation 2.7V < VIN < 5.5V 50 200 V/V VOUT/IOUT Load Regulation Sourcing: 0mA IOUT 5mA 10 100 V/mA Sinking: -5mA IOUT 0mA 20 150 V/mA 2.7 2.500 V ISC Short Circuit Current TA = +25C, VOUT tied to GND 50 mA VOUT/TA Thermal Hysteresis (Note 14) TA = +165C 50 ppm VOUT/t Long Term Stability (Note 15) TA = +25C 50 ppm Electrical Specifications (ISL21007-30, VOUT = 3.000V) Boldface limits apply over the operating temperature range, -40C to +125C. PARAMETER DESCRIPTION CONDITIONS VIN = 5.0V, TA = -40C to +125C, unless otherwise specified. MIN (Note 16) TYP UNIT 5.5 V VIN Input Voltage Range VOUT Output Voltage VOUT /VIN Line Regulation 3.2V < VIN < 5.5V 50 200 V/V VOUT/IOUT Load Regulation Sourcing: 0mA IOUT 7mA 10 100 V/mA Sinking: -7mA IOUT 0mA 20 150 V/mA 5 3.2 MAX (Note 16) 3.000 V FN6326.10 March 27, 2012 ISL21007 Electrical Specifications (ISL21007-30, VOUT = 3.000V) VIN = 5.0V, TA = -40C to +125C, unless otherwise specified. Boldface limits apply over the operating temperature range, -40C to +125C. (Continued) PARAMETER DESCRIPTION CONDITIONS MIN (Note 16) TYP MAX (Note 16) UNIT ISC Short Circuit Current TA = +25C, VOUT tied to GND 50 mA VOUT/TA Thermal Hysteresis (Note 14) TA = +165C 50 ppm VOUT/t Long Term Stability (Note 15) TA = +25C 50 ppm NOTES: 13. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the temperature range; in this case, -40C to +125C = +165C. 14. Thermal Hysteresis is the change of VOUT measured at TA = +25C after temperature cycling over a specified range, TA. VOUT is read initially at TA = +25C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25C. The difference between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For TA = +165C, the device under test is cycled from +25C to +125C to -40C to +25C. 15. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/(1kHrs). 16. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 6 FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-12) (REXT = 100k) 95 120 UNIT 3 90 100 IIN (A) IIN (A) +125C 85 80 UNIT 2 60 UNIT 1 40 80 +25C 75 70 20 -40C 65 0 2.5 3.0 3.5 4.0 4.5 VIN (V) 5.0 5.5 60 2.5 6.0 1.25015 UNIT 3 1.25005 1.25000 UNIT 2 1.24995 1.24990 UNIT 1 1.24985 2.5 3.0 3.5 4.0 VIN (V) 4.5 5.0 100 4.5 5.0 5.5 +125C 50 0 +25C -50 5.5 -40C -100 -150 -200 -250 -300 2.5 1.24980 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VIN (V) FIGURE 5. LINE REGULATION OVER TEMPERATURE FIGURE 4. LINE REGULATION (3 UNITS) 0.15 1.25010 +125C +25C UNIT 1 1.25005 0.10 1.25000 0.05 0.00 VOUT (V) VOUT (mV) 4.0 VIN (V) 150 1.25010 -40C -0.05 1.24995 UNIT 2 1.24990 UNIT 3 1.24985 -0.10 -0.15 3.5 FIGURE 3. I IN vs VIN OVER TEMPERATURE VO (V) (NORMALIZED TO VIN = 3.0V) VOUT (V) (NORMALIZED TO 1.250V AT VIN = 3.0V) FIGURE 2. IIN vs VIN (3 UNITS) 3.0 1.24980 -7 -6 -5 -4 SINKING -3 -2 -1 0 1 2 3 OUTPUT CURRENT (mA) 4 5 6 7 SOURCING FIGURE 6. LOAD REGULATION OVER TEMPERATURE 7 1.24975 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (C) FIGURE 7. VOUT vs TEMPERATURE (3 UNITS) FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-12) (REXT = 100k) (Continued) X: 200mV/DIV Y: 10s/DIV 0 10nF LOAD 100nF LOAD PSRR (dB) -20 VIN = +0.3V -40 -60 VIN = -0.3V 1F LOAD -80 1nF LOAD NO LOAD -100 1.00E+00 1.00E+02 1.00E+04 1.00E+0 FREQUENCY (Hz) FIGURE 9. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD FIGURE 8. PSRR vs CAPACITIVE LOADS X: 20s/DIV Y: 1V/DIV X: 200mV/DIV Y: 10s/DIV VIN = +0.3V VIN VOUT = 1.25V VIN = -0.3V FIGURE 11. TURN-ON TIME FIGURE 10. LINE TRANSIENT RESPONSE, 0.001F LOAD CAPACITANCE GAIN IS x1000, NOISE IS 4.5VP-P 140 1nF 10nF 120 100nF 2mV/DIV ZOUT () 100 NO LOAD 80 60 40 20 0 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04 1.00E+05 1.00E+06 FREQUENCY (Hz) FIGURE 12. ZOUT vs FREQUENCY 8 FIGURE 13. VOUT NOISE, 0.1Hz TO 10Hz FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-12) NO OUTPUT CAPACITANCE X: 50s/DIV Y: 1V/DIV (REXT = 100k) (Continued) +7mA -7mA FIGURE 14. LOAD TRANSIENT RESPONSE Typical Performance Curves (ISL21007-20) 95 95 90 90 UNIT 2 +125C 85 80 IIN (uA) 85 IIN (A) (REXT = 100k) 80 UNIT 1 75 75 70 -40C 65 +25C 60 70 UNIT 3 65 2.7 3.1 55 3.5 3.9 4.3 4.7 5.1 50 2.7 5.5 3.1 3.5 3.9 2.04815 UNIT 2 2.04810 2.04805 UNIT 1 UNIT 3 2.04795 2.04790 2.5 3.0 3.5 4.0 4.5 VIN(V) FIGURE 17. LINE REGULATION (3 UNITS) 9 4.7 5.1 5.5 FIGURE 16. IIN vs VIN OVER TEMPERATURE 5.0 5.5 VOUT (V) (NORMALIZED TO 2.048V AT VIN = 3V) VOUT (V) NORMALIZED TO 2.048V AT VIN = 3.0V FIGURE 15. IIN vs VIN (3 UNITS) 2.04800 4.3 VIN (V) VIN (V) 2.04815 -40C 2.04810 +125C 2.04805 +25C 2.04800 2.04795 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VIN(V) FIGURE 18. LINE REGULATION OVER TEMPERATURE FN6326.10 March 27, 2012 ISL21007 VOUT (mV) NORMALIZED TO 0mA 1.6 1.2 +125C 0.0 0.4 -40C 0.0 -0.4 +25C -0.8 -1.2 -7 -6 -5 -4 SINKING -3 -2 -1 0 1 2 3 OUTPUT CURRENT (mA) 4 5 6 SOURCING FIGURE 19. LOAD REGULATION OVER TEMPERATURE 7 VOUT(V) NORMALIZED TO 2.048V AT +25C Typical Performance Curves (ISL21007-20) (REXT = 100k) (Continued) 2.0496 2.0492 2.0488 UNIT 2 UNIT 1 2.0484 2.0480 2.0476 UNIT 3 2.0472 -40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (C) FIGURE 20. VOUT vs TEMPERATURE (3 UNITS) X: 200mV/DIV Y: 10s/DIV 0 10nF LOAD 100nF LOAD -20 PSRR (dB) VIN = +0.3V -40 1F LOAD -60 -80 VIN = -0.3V NO LOAD -100 1.0E+01 1.0E+03 1.0E+05 FREQUENCY (Hz) FIGURE 21. PSRR vs CAPACITIVE LOADS FIGURE 22. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD X: 100s/DIV Y: 2V/DIV X: 200mV/DIV Y: 10s/DIV VIN = +0.3V VIN VOUT = 2.048V VIN = -0.3V FIGURE 23. LINE TRANSIENT RESPONSE, 0.001F LOAD CAPACITANCE 10 FIGURE 24. TURN-ON TIME FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-20) (REXT = 100k) (Continued) GAIN IS x1000, NOISE IS 4.5VP-P 140 1nF 10nF 120 100nF 2mV/DIV ZOUT () 100 NO LOAD 80 60 40 20 0 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04 1.00E+05 1.00E+06 FREQUENCY (Hz) FIGURE 25. ZOUT VS FREQUENCY FIGURE 26. VOUT NOISE, 0.1Hz TO 10Hz X: 20s/DIV Y: 200mV/DIV X: 20s/DIV Y: 200mV/DIV +7mA -7mA -7mA FIGURE 27. LOAD TRANSIENT RESPONSE, 0.001F LOAD CAPACITANCE FIGURE 28. LOAD TRANSIENT RESPONSE, NO CAPACITIVE LOAD Typical Performance Curves (ISL21007-25) (REXT = 100k) 100 120 UNIT 3 95 100 +125C 90 UNIT 2 85 IIN (A) 80 IIN (A) +7mA UNIT 1 60 80 +25C -40C 75 40 70 20 65 60 0 2.5 3.0 3.5 4.0 4.5 5.0 VIN (V) FIGURE 29. IIN vs VIN (3 UNITS) 11 5.5 6.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VIN (V) FIGURE 30. IIN vs VIN OVER TEMPERATURE FN6326.10 March 27, 2012 ISL21007 2.5002 (REXT = 100k) (Continued) 100 VO (V) (NORMALIZED TO VIN = 3.0V) VOUT (V) (NORMALIZED TO 2.500V AT VIN = 3V) Typical Performance Curves (ISL21007-25) UNIT 1 2.5001 2.5000 UNIT 2 2.4999 UNIT 3 2.4998 2.4997 2.4996 2.5 3.0 3.5 4.0 4.5 5.0 50 0 -50 -100 -150 +125C -200 -250 -300 -40C -350 -400 2.5 5.5 +25C 3.0 4.0 3.5 VIN (V) FIGURE 31. LINE REGULATION (3 UNITS) 5.0 5.5 6.0 FIGURE 32. LINE REGULATION OVER TEMPERATURE 2.5003 0.6 +125C 2.5001 -40C 0.2 2.5000 VOUT (V) +25C 0 UNIT 2 2.5002 0.4 VOUT (mV) 4.5 VIN (V) -0.2 -0.4 UNIT 1 2.4999 2.4998 2.4997 2.4996 -0.6 2.4995 -0.8 2.4994 -1.0 -7 -6 -5 -4 2.4993 -40 SINKING -3 -2 -1 0 1 2 3 OUTPUT CURRENT (mA) 4 5 6 7 UNIT 3 -20 0 FIGURE 33. LOAD REGULATION OVER TEMPERATURE 20 40 60 80 100 120 140 TEMPERATURE (C) SOURCING FIGURE 34. VOUT vs TEMPERATURE (3 UNITS) X: 200mV/DIV Y: 10s/DIV 10 NO LOAD 1nF 10nF 100nF 0 -10 PSRR (dB) -20 -30 VIN = +0.3V 1F -40 -50 VIN = -0.3V -60 -70 -80 -90 -100 1.E+00 1.E+02 1.E+04 1.E+06 FREQUENCY (Hz) FIGURE 35. PSRR vs CAPACITIVE LOADS 12 FIGURE 36. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-25) X: 200mV/DIV Y: 10s/DIV (REXT = 100k) (Continued) X: 20s/DIV Y: 1V/DIV VIN = +0.3V VIN VIN = -0.3V VOUT = 2.5V FIGURE 37. LINE TRANSIENT RESPONSE, 0.001F LOAD CAPACITANCE FIGURE 38. TURN-ON TIME GAIN IS x1000, NOISE IS 4.5VP-P 140 1nF 10nF 120 100nF 2mV/DIV ZOUT () 100 NO LOAD 80 60 40 20 0 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04 1.00E+05 1.00E+06 FREQUENCY (Hz) FIGURE 40. VOUT NOISE, 0.1Hz TO 10Hz FIGURE 39. ZOUT vs FREQUENCY NO OUTPUT CAPACITANCE X: 50s/DIV Y: 500mV/DIV +5mA -5mA FIGURE 41. LOAD TRANSIENT RESPONSE 13 FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-30) (REXT = 100k) 120 120 UNIT 2 100 80 80 IIN (A) IIN (A) +125C 100 UNIT 3 UNIT 1 60 60 40 40 20 20 0 3.2 3.7 4.2 4.7 +25C 0 3.2 5.2 -40C 3.7 4.2 UNIT 2 UNIT 3 2.9975 2.9965 2.9955 3.2 3.6 4.0 4.4 4.8 5.2 5.6 3.001 VOUT (V) NORMALIZED TO 3.0V AT 5.0VIN VOUT(V) NORMALIZED TO 3.0V AT 5.0VIN 2.9985 FIGURE 43. IIN vs VIN OVER TEMPERATURE UNIT 1 2.9995 3.000 2.999 +125C +25C 2.998 2.997 -40C 2.996 2.995 2.994 3.2 3.6 4.0 VIN (V) -0.05 -0.10 +125C -0.15 -0.20 -0.25 -7 -6 -5 -4 -3 -2 -1 SINKING 0 1 LOAD (mA) 2 3 4 5 6 SOURCING FIGURE 46. LOAD REGULATION OVER TEMPERATURE 14 7 VOUT (V) NORMALIZED TO 3.0V AT +25C VOUT (mV) NORMALIZED TO 0mA -40C +25C 4.8 5.2 5.6 FIGURE 45. LINE REGULATION OVER TEMPERATURE 0.10 0.05 4.4 VIN (V) FIGURE 44. LINE REGULATION (3 UNITS) 0.00 5.2 VIN (V) VIN (V) FIGURE 42. IIN vs VIN (3 UNITS) 3.0005 4.7 3.0006 3.0004 3.0002 UNIT 3 3.0000 2.9998 UNIT 2 2.9996 2.9994 UNIT 1 2.9992 2.9990 -40 -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (C) FIGURE 47. VOUT vs TEMPERATURE (3 UNITS) FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-30) (REXT = 100k) (Continued) PSRR (dB) X: 200mV/DIV Y: 10s/DIV 10 0 VIN (DC) = 5.0V -10 VIN (AC) = 50mVP-P -20 -30 -40 -50 -60 -70 -80 -90 -100 1.E+00 1.E+02 NO LOAD 1nF 10nF 100nF VIN = +0.5V 1F VIN = -0.5V 1.E+04 1.E+06 FREQUENCY (Hz) FIGURE 48. PSRR vs CAPACITIVE LOADS FIGURE 49. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD X: 200mV/DIV Y: 10s/DIV VIN = 5.0V VIN = +0.5V 1V/DIV VOUT = 3.0V VIN = -0.5V 20s/DIV FIGURE 51. TURN-ON TIME FIGURE 50. LINE TRANSIENT RESPONSE, 0.001F LOAD CAPACITANCE GAIN IS x1000, NOISE IS 4.5VP-P 140 1nF 10nF 120 100nF 2mV/DIV ZOUT () 100 NO LOAD 80 60 40 20 0 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04 1.00E+05 1.00E+06 FREQUENCY (Hz) FIGURE 52. ZOUT vs FREQUENCY 15 FIGURE 53. VOUT NOISE, 0.1Hz TO 10Hz FN6326.10 March 27, 2012 ISL21007 Typical Performance Curves (ISL21007-30) (REXT = 100k) (Continued) 200mV/DIV +7mA -7mA 100s/DIV FIGURE 54. LOAD TRANSIENT RESPONSE Applications Information FGA Technology The ISL21007 voltage reference uses floating gate technology to create references with very low drift and supply current. Essentially, the charge stored on a floating gate cell is set precisely in manufacturing. The reference voltage output itself is a buffered version of the floating gate voltage. The resulting reference device has excellent characteristics which are unique in the industry: very low temperature drift, high initial accuracy, and almost zero supply current. Also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). The process used for these reference devices is a floating gate CMOS process, and the amplifier circuitry uses CMOS transistors for amplifier and output transistor circuitry. While providing excellent accuracy, there are limitations in output noise level and load regulation due to the MOS device characteristics. These limitations are addressed with circuit techniques discussed in other sections. Micropower Operation The ISL21007 consumes extremely low supply current due to the proprietary FGA technology. Low noise performance is achieved using optimized biasing techniques. Supply current is typically 75A and noise is 4.5VP-P benefitting precision, low noise portable applications such as handheld meters and instruments. Data Converters in particular can utilize the ISL21007 as an external voltage reference. Low power DAC and ADC circuits will realize maximum resolution with lowest noise. Handling and Board Mounting FGA references provide excellent initial accuracy and low temperature drift at the expense of very little power drain. There are some precautions to take to insure this accuracy is not compromised. Excessive heat during solder reflow can cause excessive initial accuracy drift, so the recommended +260C 16 max temperature profile should not be exceeded. Expect up to 1mV drift from the solder reflow process. FGA references are susceptible to excessive X-radiation like that used in PC board manufacturing. Initial accuracy can change 10mV or more under extreme radiation. If an assembled board needs to be X-rayed, care should be taken to shield the FGA reference device. Board Mounting Considerations For applications requiring the highest accuracy, board mounting location should be reviewed. Placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to die stresses. It is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limited at that location. Obviously, mounting the device on flexprint or extremely thin PC material will likewise cause loss of reference accuracy. Board Assembly Considerations FGA references provide high accuracy and low temperature drift but some PC board assembly precautions are necessary. Normal Output voltage shifts of 100V to 1mV can be expected with Pb-free reflow profiles or wave solder on multi-layer FR4 PC boards. Precautions should be taken to avoid excessive heat or extended exposure to high reflow or wave solder temperatures, this may reduce device initial accuracy. Post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or avoided. If x-ray inspection is required, it is advisable to monitor the reference output voltage to verify excessive shift has not occurred. If large amounts of shift are observed, it is best to add an X-ray shield consisting of thin zinc (300m) sheeting to allow clear imaging, yet block x-ray energy that affects the FGA reference. Special Applications Considerations In addition to post-assembly examination, there are also other Xray sources that may affect the FGA reference long term accuracy. Airport screening machines contain X-rays and will FN6326.10 March 27, 2012 ISL21007 have a cumulative effect on the voltage reference output accuracy. Carry-on luggage screening uses low level X-rays and is not a major source of output voltage shift, however, if a product is expected to pass through that type of screening over 100 times, it may need to consider shielding with copper or aluminum. Checked luggage X-rays are higher intensity and can cause output voltage shift in much fewer passes, thus devices expected to go through those machines should definitely consider shielding. Note that just two layers of 1/2 ounce copper planes will reduce the received dose by over 90%. The leadframe for the device which is on the bottom also provides similar shielding. If a device is expected to pass through luggage X-ray machines numerous times, it is advised to mount a 2-layer (minimum) PC board on the top, along with a ground plane underneath, which will effectively shield it from 50 to 100 passes through the machine. Since these machines vary in X-ray dose delivered, it is difficult to produce an accurate maximum pass recommendation. Noise Performance and Reduction The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically 4.5VP-P. The noise measurement is made with a bandpass filter made of a 1-pole high-pass filter with a corner frequency at 0.1Hz and a 2-pole low-pass filter with a corner frequency at 12.6Hz to create a filter with a 9.9Hz bandwidth. Noise in the 10kHz to 1MHz bandwidth is approximately 40VP-P with no capacitance on the output. This noise measurement is made with a 2 decade bandpass filter made of a 1-pole high-pass filter with a corner frequency at 1/10 of the center frequency and 1-pole low-pass filter with a corner frequency at 10 times the center frequency. Load capacitance up to 1000pF can be added but will result in only marginal improvements in output noise and transient response. The output stage of the ISL21007 is not designed to drive heavily capacitive loads, so for load capacitances above 0.001F, the noise reduction network shown in Figure 55 is recommended. This network reduces noise significantly over the full bandwidth. Noise is reduced to less than 20VP-P from 1Hz to 1MHz using this network with a 0.01F capacitor and a 2k resistor in series with a 10F capacitor. Also, transient response is improved with higher value output capacitor. The 0.01F value can be increased for better load transient response with little sacrifice in output stability. 17 Turn-On Time The ISL21007 devices have low supply current and thus the time to bias up internal circuitry to final values will be longer than with higher power references. Normal turn-on time is typically 120s. This is shown in Figure 10. Circuit design must take this into account when looking at power-up delays or sequencing. Temperature Coefficient The limits stated for temperature coefficient (tempco) are governed by the method of measurement. The overwhelming standard for specifying the temperature drift of a reference is to measure the reference voltage at two temperatures, take the total variation, (VHIGH - VLOW), and divide by the temperature extremes of measurement (THIGH - TLOW). The result is divided by the nominal reference voltage (at T = +25C) and multiplied by 106 to yield ppm/C. This is the "Box" method for specifying temperature coefficient. Output Voltage Adjustment The output voltage can be adjusted up or down by 2.5% by placing a potentiometer from VOUT to ground, and connecting the wiper to the TRIM pin. The TRIM input is high impedance, so no series resistance is needed. The resistor in the potentiometer should be a low tempco (<50ppm/C) and the resulting voltage divider should have very low tempco <5ppm/C. A digital potentiometer such as the ISL95810 provides a low tempco resistance and excellent resistor and tempco matching for trim applications. See Figure 59 and TB473 for further information. VIN = 5.0V 10F 0.1F VIN VO ISL21007 GND 2k 0.01F 10F FIGURE 55. HANDLING HIGH LOAD CAPACITANCE FN6326.10 March 27, 2012 ISL21007 Typical Application Circuits VIN = +5.0V R = 200 2N2905 VIN ISL21007 VOUT VOUT = 2.500V 2.5V/50mA 0.001F GND FIGURE 56. PRECISION 2.500V 50mA REFERENCE +2.7 TO 5.5V 10F 0.1F VIN VOUT ISL21007-25 VOUT = 2.500V GND 0.001F VCC RH VOUT X9119 (UNBUFFERED) + SDA 2-WIRE BUS EL8178 SCL VSS - VOUT (BUFFERED) RL FIGURE 57. 2.500V FULL SCALE LOW-DRIFT, LOW NOISE, 10-BIT ADJUSTABLE VOLTAGE SOURCE +2.7 TO 5.5V 0.1F 10F VIN EL8178 VOUT ISL21007-12 + VOUT SENSE - LOAD GND FIGURE 58. KELVIN SENSED LOAD 18 FN6326.10 March 27, 2012 ISL21007 Typical Application Circuits (Continued) 10F +2.7 TO 5.5V 0.1F VIN 2.5V 2.5% VOUT ISL21007-12 TRIM GND VCC I2C BUS RH SDA SCL ISL95810 VSS RL FIGURE 59. OUTPUT ADJUSTMENT USING THE TRIM PIN For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 19 FN6326.10 March 27, 2012 ISL21007 Package Outline Drawing M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8 0 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW "B" TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW "A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1994. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. 20 FN6326.10 March 27, 2012