(0.80 mm) .0315" RU8, HSC8 SERIES
HSC8–050–02–19–DP
RU8–160–25–SE–L–DV–BL
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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A
(1.60)
.062
(7.01)
.276
(7.98)
.314
B
(12.51)
.492
SIGNAL
ROUTING
HSC8 NUMBER OF
POSITIONS PER SIDE
–040, –050, –060
–SE
= Single-Ended
–DP
= Differential Pair
Mates with:
HSEC8
For complete specifications
see www.samtec.com?HSC8
Conductor:
1/2 oz Copper
Contact Area:
Hard Gold Plated
Insulator: FR-4
RoHS Compliant:
Ye s
A
(1.60)
.062
01
Signal
Signal
No. of Positions per Side x (0.80) .0315 + (4.45) .175
Ground
Ground
–SE –DP
CARD
STYLE
–02
= (1.60 mm)
.062"
thick card
STACK
HEIGHT
–19
= (19 mm)
.748"
–25
= (25 mm)
.984"
–30
= (30 mm)
1.180"
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
SIGNAL
ROUTING
RU8 POSITIONS
PER ROW
40, 50, 60
–SE
= Single-
Ended
–DP
= Differential
Pair
DV BL
STACK
HEIGHT
PLATING
OPTION
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
(Plating for
connectors)
Plating for Card
is Hard Gold
–BL
= Board
Locks
(Bottom
Socket only)
(Not available
on –19 stack
height)
OTHER
OPTION
1
–SE –DP
(–19 Only)
–BL (Required with –25 & –30)
–19
= (19 mm) .748"
–25
= (25 mm) .984"
–30
= (30 mm) 1.180"
Leave blank
for Trays
–K
= (5.50 mm)
.217" DIA
Polyimide
Film Pick &
Place Pad
–TR
= Tape & Reel
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?RU8
Insulator Material:
Black LCP
Contact:
BeCu
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
3.1 A per pin
(6 adjacent pins powered)
Operating Temp:
-55 °C to +125 °C
Lead-Free Solderable: Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (40-60)
RoHS Compliant: Ye s
Note: Some lengths, styles and options
are non-standard, non-returnable.
HIGH-SPEED RISER CARD KIT
Note:
Other Gold plating
options available.
NO. OF
POSITIONS
PER SIDE
A B
–SE
TOTAL
SIGNAL
LINES
–DP
TOTAL
SIGNAL
PAIRS
40 (39.80)
1.567
(51.05)
2.010 40 26
50 (47.80)
1.882
(59.05)
2.325 50 32
60 (55.80)
2.197
(67.05)
2.640 60 38
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
Kit contains
two connectors
and one card.
Assembly required.
SPECIFICATIONS
CONNECTOR
PROCESSING
FILE NO. E111594
NO. OF
POSITIONS
PER SIDE
–SE
TOTAL
SIGNAL
LINES
–DP
TOTAL
SIGNAL
PAIRS
–40 40 26
–50 50 32
–60 60 38
STACK
HEIGHT A
–19 (14.84) .584
–25 (20.84) .820
–30 (25.84) 1.017
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
F-219
Note: While optimized for
50 W applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75 W applications.
