AR0130CSSM00SPCA0-DRBR1 - ON SEMICONDUCTOR

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

‡

AR0130 DS Rev. L Pub. 6/15 EN 1©Semiconductor Components Industries, LLC 2015,

1/3-Inch CMOS Digital Image Sensor

AR0130 Datasheet, Rev. L

For the latest datasheet, please visit www.onsemi.com

Features

• Superior low-light performance both in VGA mode

and HD mode

• Excellent Near IR performance

• HD video (720p60)

• On-chip AE and statistics engine

• Auto black level calibration

•Context switching

• Progressive Scan

• Supports 2:1 scaling

• Internal master clock generated by on-chip phase

locked loop (PLL) oscillator.

• Parallel output

Applications

• Gaming systems

• Video surveillance

• 720p60 video applications

General Description

ON Semiconductor's AR0130 is a 1/3-inch CMOS digi-

tal image sensor with an active-pixel array of 1280H x

960V. It captures images with a rolling-shutter readout.

It includes sophisticated camera functions such as

auto exposure control, windowing, and both video and

single frame modes. It is programmable through a sim-

ple two-wire serial interface. The AR0130 produces

extraordinarily clear, sharp digital pictures, and its

ability to capture both continuous video and single

frames makes it the perfect choice for a wide range of

applications, including gaming systems, surveillance,

and HD video.

Table 1: Key Parameters

Parameter Typical Value

Optical format 1/3-inch (6 mm)

Active pixels 1280 x 960 = 1.2 Mp

Pixel size 3.75 m

Color filter array Monochrome, RGB Bayer

Shutter type Electronic rolling shutter

Input clock range 6 – 50 MHz

Output clock maximum 74.25 MHz

Output Parallel 12-bit

Max.

Frame

rates

1.2 Mp (full FOV) 45 fps

720pHD (reduced FOV) 60 fps

VGA (full FOV) 45 fps

VGA (reduced FOV) 60 fps

800 x 800 (reduced

FOV) 60 fps

Responsivity at 550 nm (Mono) 6.5 V/lux-sec

Responsivity at 550 nm (RGB

green) 5.6 V/lux-sec

SNRMAX 44 dB

Dynamic range 82 dB

Supply

voltage

I/O 1.8 or 2.8 V

Digital 1.8 V

Analog 2.8 V

Power consumption 270 mW (1280x720 60

fps)

Operating temperature –30°C to + 70°C (ambient)

–30°C to + 80°C (junction)

Package option Bare die, iLCC, PLCC

AR0130 DS Rev. L Pub. 6/15 EN 2©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Ordering Information

See the ON Semiconductor Device Nomenclature document (TND310/D) for a full

description of the naming convention used for image sensors. For reference documenta-

tion, including information on evaluation kits, please visit our web site at

www.onsemi.com.

Table 2: Available Part Numbers

Part Number Base Description Variant Description

AR0130CSSC00SPBA0-DP RGB Bayer 48-Pin PLCC Dry Pack with Protective Film

AR0130CSSC00SPBA0-DR RGB Bayer 48-Pin PLCC Dry Pack without Protective Film

AR0130CSSC00SPCA0-DPBR RGB Bayer 48-Pin iLCC Dry Pack with Protective Film, Double Side BBAR Glass

AR0130CSSC00SPCA0-DRBR RGB Bayer 48-Pin iLCC Dry Pack without Protective Film, Double Side BBAR Glass

AR0130CSSC00SPCAD3-GEVK RGB Bayer demo kit iLCC

AR0130CSSC00SPCAD3-S115-GEVK RGB Bayer demo kit iLCC

AR0130CSSC00SPCAD3-S213A-GEVK RGB Bayer demo kit iLCC

AR0130CSSC00SPCAD-GEVK RGB Bayer demo kit iLCC

AR0130CSSC00SPCAD-S115-GEVK RGB Bayer demo kit iLCC

AR0130CSSC00SPCAD-S213A-GEVK RGB Bayer demo kit iLCC

AR0130CSSC00SPCAH-GEVB RGB Bayer headboard iLCC

AR0130CSSC00SPCAH-S115-GEVB RGB Bayer headboard iLCC

AR0130CSSC00SPCAH-S213A-GEVB RGB Bayer headboard iLCC

AR0130CSSC00SPCAW-GEVB RGB Bayer headboard iLCC

AR0130CSSM00SPCA0-DRBR Monochrome 48-Pin iLCC Dry Pack without Protective Film, Double Side BBAR Glass

AR0130CSSM00SPCAD-S213A-GEVK Monochrome demo kit iLCC

AR0130CSSM00SPCAH-S213A-GEVB Monochrome headboard iLCC

AR0130 DS Rev. L Pub. 6/15 EN 3©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Table of Contents

Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Output Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Real-Time Context Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Two-Wire Serial Register Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Power-On Reset and Standby Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

AR0130 DS Rev. L Pub. 6/15 EN 4©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

List of Figures

Figure 1: Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Figure 2: Typical Configuration: Parallel Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Figure 3: 48-Pin iLCC Pinout Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Figure 4: 48-Pin PLCC Pinout Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Figure 5: Pixel Array Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Figure 6: Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Figure 7: Imaging a Scene . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Figure 8: Spatial Illustration of Image Readout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Figure 9: Default Pixel Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 10: LV Format Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 11: Line Timing and FRAME_VALID/LINE_VALID Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Figure 12: PLL-Generated Master Clock PLL Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Figure 13: Enter Standby Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Figure 14: Exit Standby Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Figure 15: Six Pixels in Normal and Column Mirror Readout Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Figure 16: Six Rows in Normal and Row Mirror Readout Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Figure 17: Frame Format with Embedded Data Lines Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Figure 18: Format of Embedded Data Output within a Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Figure 19: Format of Embedded Statistics Output within a Frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

Figure 20: Single READ from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

Figure 21: Single READ from Current Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

Figure 22: Sequential READ, Start from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

Figure 23: Sequential READ, Start from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Figure 24: Single WRITE to Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Figure 25: Sequential WRITE, Start at Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Figure 26: Quantum Efficiency – Monochrome Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Figure 27: Quantum Efficiency – Color Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Figure 28: 48 iLCC Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

Figure 29: 48 PLCC Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Figure 30: Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Figure 31: I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Figure 32: Power Supply Rejection Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

Figure 33: Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48

Figure 34: Power Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

AR0130 DS Rev. L Pub. 6/15 EN 5©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

List of Tables

Table 1: Key Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Table 2: Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

Table 3: Pad Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Table 4: Frame Time (Example Based on 1280 x 960, 45 Frames Per Second) . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Table 5: Frame Time: Long Integration Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Table 6: Real-Time Context-Switchable Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Table 7: Test Pattern Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

Table 8: Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

Table 9: I/O Timing Characteristics (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 10: I/O Timing Characteristics (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

Table 11: I/O Rise Slew Rate (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

Table 12: I/O Fall Slew Rate (2.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

Table 13: I/O Rise Slew Rate (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

Table 14: I/O Fall Slew Rate (1.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

Table 15: DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

Table 16: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

Table 17: Operating Current Consumption in Parallel Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

Table 18: Standby Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

Table 19: Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

Table 20: Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

AR0130 DS Rev. L Pub. 6/15 EN 6©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

General Description

The ON Semiconductor AR0130 can be operated in its default mode or programmed for

frame size, exposure, gain, and other parameters. The default mode output is a 960p-

resolution image at 45 frames per second (fps). It outputs 12-bit raw data over the

parallel port. The device may be operated in video (master) mode or in single frame

trigger mode.

FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a

synchronized pixel clock in parallel mode.

The AR0130 includes additional features to allow application-specific tuning:

windowing and offset, adjustable auto-exposure control, and auto black level correction.

Optional register information and histogram statistic information can be embedded in

first and last 2 lines of the image frame.

Functional Overview

The AR0130 is a progressive-scan sensor that generates a stream of pixel data at a

constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally

enabled to generate all internal clocks from a single master input clock running between

6 and 50 MHz The maximum output pixel rate is 74.25 Mp/s, corresponding to a clock

rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor.

Figure 1: Block Diagram

User interaction with the sensor is through the two-wire serial bus, which communi-

cates with the array control, analog signal chain, and digital signal chain. The core of the

sensor is a 1.2 Mp Active- Pixel Sensor array. The timing and control circuitry sequences

through the rows of the array, resetting and then reading each row in turn. In the time

interval between resetting a row and reading that row, the pixels in the row integrate

incident light. The exposure is controlled by varying the time interval between reset and

readout. Once a row has been read, the data from the columns is sequenced through an

analog signal chain (providing offset correction and gain), and then through an analog-

to-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in

the array. The ADC output passes through a digital processing signal chain (which

Control Registers

Active Pixel Sensor

(APS)

Array

PLL

Memory

OTPM

Timing and Control

(Sequencer)

Analog Processing and

A/D Conversion

Auto Exposure

and Stats Engine

Pixel Data Path

(Signal Processing)

External

Clock

Parallel

Output

Two-Wire

Serial

Interface

Trigger

Power

AR0130 DS Rev. L Pub. 6/15 EN 7©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Functional Overview

provides further data path corrections and applies digital gain). The pixel data are

output at a rate of up to 74.25 Mp/s, in parallel to frame and line synchronization

signals.

Figure 2: Typical Configuration: Parallel Pixel Data Interface

Notes: 1. All power supplies must be adequately decoupled.

2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for

slower two-wire speed.

3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.

4. ON Semiconductor recommends that VDD_SLVS pad (only available in bare die) is left unconnected.

5. ON Semiconductor recommends that 0.1μF and 10μF decoupling capacitors for each power supply

are mounted as close as possible to the pad. Actual values and results may vary depending on lay-

out and design considerations. Check the AR0130 demo headboard schematics for circuit recom-

mendations.

6. ON Semiconductor recommends that analog power planes are placed in a manner such that cou-

pling with the digital power planes is minimized.

7. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.

Master clock

(6–50 MHz)

DATA

CLK

Reserved

FRAME_VALID

OUT

[11:0]EXTCLK

GND

Digital

ground

Analog

ground

Digital

core

power

controller

From

Controller

LINE_VALID

PIXCLK

RESET_BAR

_IO

Digital

I/O

power

1.5kΩ

2, 3

_PIX

Analog

power

VDD_PLL

PLL

power

Analog

power

_PIX

_IO VDD_PLLV

TRIGGER

OE_BAR

STANDBY

AGND

SADDR

AR0130 DS Rev. L Pub. 6/15 EN 8©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Functional Overview

Table 3: Pad Descriptions

Name Type Description

STANDBY Input Standby-mode enable pin (active HIGH).

VDD_PLL Power PLL power.

VAA Power Analog power.

EXTCLK Input External input clock.

VDD_SLVS Power Digital power (do not connect).

DGND Power Digital ground.

VDD Power Digital power.

AGND Power Analog ground.

SADDR Input Two-Wire Serial Interface address select.

SCLK Input Two-Wire Serial Interface clock input.

SDATA I/O Two-Wire Serial Interface data I/O.

VAA_PIX Power Pixel power.

LINE_VALID Output Asserted when DOUT line data is valid.

FRAME_VALID Output Asserted when DOUT frame data is valid.

PIXCLK Output Pixel clock out. DOUT is valid on rising edge of this clock.

VDD_IO Power I/O supply power.

DOUT8 Output Parallel pixel data output.

DOUT9 Output Parallel pixel data output.

DOUT10 Output Parallel pixel data output.

DOUT11 Output Parallel pixel data output (MSB)

Reserved Input Connect to DGND.

DOUT4 Output Parallel pixel data output.

DOUT5 Output Parallel pixel data output.

DOUT6 Output Parallel pixel data output.

DOUT7 Output Parallel pixel data output.

TRIGGER Input Exposure synchronization input.

OE_BAR Input Output enable (active LOW).

DOUT0 Output Parallel pixel data output (LSB)

DOUT1 Output Parallel pixel data output.

DOUT2 Output Parallel pixel data output.

DOUT3 Output Parallel pixel data output.

RESET_BAR Input Asynchronous reset (active LOW). All settings are restored to factory default.

FLASH Output Flash control output.

NC Input Do not connect.

AR0130 DS Rev. L Pub. 6/15 EN 9©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Functional Overview

Figure 3: 48-Pin iLCC Pinout Diagram

123456 44 43

19 20 21 22 23 24 25 26 27 28 29 30

DOUT7

DOUT8

DOUT9

DOUT10

DOUT11

VDD_IO

PIXCLK

VDD

SCLK

SDATA

RESET_BAR

VDD_IO

VAA

AGND

VAA_PIX

VAA

AGND

VAA

VDD

STANDBY

OE_BAR

SADDR

RESERVED

FLASH

TRIGGER

FRAME_VALID

LINE_VALID

DGND

GND

EXTCLK

_PLL

OUT

GND

48 47 46 45

AR0130 DS Rev. L Pub. 6/15 EN 10 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Functional Overview

Figure 4: 48-Pin PLCC Pinout Diagram

Top View

Reserved

OE_BAR

RESET_BAR

VDD_IO

VDD

VDD_PLL

VDD

VAA_PIX

VAA

SCLK

SADDR

SDATA

DGND

AGND

DOUT9

DOUT8

DOUT7

DOUT6

DOUT5

DOUT4

DOUT3

DOUT2

DOUT1

DOUT0

DOUT11

DOUT10

TRIGGER

EXTCLK

PIXCLK

FLASH

FRAME_VALID

LINE_VALID

STANDBY

AR0130 DS Rev. L Pub. 6/15 EN 11 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Pixel Data Format

Pixel Array Structure

The AR0130 pixel array is configured as 1412 columns by 1028 rows, (see Figure 5). The

dark pixels are optically black and are used internally to monitor black level. Of the right

108 columns, 64 are dark pixels used for row noise correction. Of the top 24 rows of

pixels, 12 of the dark rows are used for black level correction. There are 1296 columns by

976 rows of optically active pixels. While the sensor's format is 1280 x 960, the additional

active columns and active rows are included for use when horizontal or vertical mirrored

readout is enabled, to allow readout to start on the same pixel. The pixel adjustment is

always performed for monochrome or color versions. The active area is surrounded with

optically transparent dummy pixels to improve image uniformity within the active area.

Not all dummy pixels or barrier pixels can be read out.

Figure 5: Pixel Array Description

2 light dummy + 4 barrier + 24 dark + 4 barrier + 6 dark dummy

Dark pixel Barrier pixel Light dummy

pixel Active pixel

2 light dummy + 4 barrier + 6 dark dummy

1412

2 light dummy + 4 barrier

2 light dummy + 4 barrier + 100 dark + 4 barrier

1028

1296 x 976 (1288 x 968 active)

4.86 x 3.66 mm

(4.83 x 3.63 mm

)

AR0130 DS Rev. L Pub. 6/15 EN 12 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Pixel Data Format

Figure 6: Pixel Color Pattern Detail (Top Right Corner)

Default Readout Order

By convention, the sensor core pixel array is shown with pixel (0,0) in the top right

corner (see Figure 6). This reflects the actual layout of the array on the die. Also, the first

pixel data read out of the sensor in default condition is that of pixel (112, 44).

When the sensor is imaging, the active surface of the sensor faces the scene as shown in

Figure 7. When the image is read out of the sensor, it is read one row at a time, with the

rows and columns sequenced as shown in Figure 7 on page 12.

Figure 7: Imaging a Scene

Active Pixel (0,0)

Array Pixel (112, 44)

Row

Reado

ut Direction

Column Readout Direction

Lens

Pixel (0,0)

Row

Readout

Order

Column Readout Order

Scene

Sensor (rear view)

AR0130 DS Rev. L Pub. 6/15 EN 13 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Output Data Format

The AR0130 image data is read out in a progressive scan. Valid image data is surrounded

by horizontal and vertical blanking (see Figure 8). The amount of horizontal row time (in

clocks) is programmable through R0x300C. The amount of vertical frame time (in rows)

is programmable through R0x300A. LINE_VALID (LV) is HIGH during the shaded region

of Figure 8. Optional Embedded Register setup information and Histogram statistic

information are available in first 2 and last row of image data.

Figure 8: Spatial Illustration of Image Readout

Readout Sequence

Typically, the readout window is set to a region including only active pixels. The user has

the option of reading out dark regions of the array, but if this is done, consideration must

be given to how the sensor reads the dark regions for its own purposes.

0,0

0,1

0,2

.....................................P

0,n-1

0,n

1,0

1,1

1,2

.....................................P

1,n-1

1,n

00 00 00 .................. 00 00 00

m-1,0

m-1,1

.....................................P

m-1,n-1

m-1,n

m,0

m,1

.....................................P

m,n-1

m,n

00 00 00 .................. 00 00 00

00 00 00 ..................................... 00 00 00

VALID IMAGE HORIZONTAL

BLANKING

VERTICAL BLANKING VERTICAL/HORIZONTAL

BLANKING

AR0130 DS Rev. L Pub. 6/15 EN 14 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Output Data Format

Parallel Output Data Timing

The output images are divided into frames, which are further divided into lines. By

default, the sensor produces 968 rows of 1288 columns each. The FV and LV signals indi-

cate the boundaries between frames and lines, respectively. PIXCLK can be used as a

clock to latch the data. For each PIXCLK cycle, with respect to the falling edge, one 12-bit

pixel datum outputs on the DOUT pins. When both FV and LV are asserted, the pixel is

valid. PIXCLK cycles that occur when FV is de-asserted are called vertical blanking.

PIXCLK cycles that occur when only LV is de-asserted are called horizontal blanking.

Figure 9: Default Pixel Output Timing

LV and FV

The timing of the FV and LV outputs is closely related to the row time and the frame time.

FV will be asserted for an integral number of row times, which will normally be equal to

the height of the output image.

LV will be asserted during the valid pixels of each row. The leading edge of LV will be

offset from the leading edge of FV by 6 PIXCLKs. Normally, LV will only be asserted if FV

is asserted; this is configurable as described below.

LV Format Options

The default situation is for LV to be de-asserted when FV is de-asserted. By configuring

R0x306E[1:0], the LV signal can take two different output formats. The formats for

reading out four lines and two vertical blanking lines are shown in Figure 10.

Figure 10: LV Format Options

The timing of an entire frame is shown in Figure 11: “Line Timing and FRAME_VALID/

LINE_VALID Signals,” on page 15.

PIXCLK

DOUT[11:0]

P0 P1 P2 P3 P4 Pn

Vertical Blanking Horiz Blanking Valid Image Data Horiz Blanking Vertical Blanking

Default

Continuous LV

AR0130 DS Rev. L Pub. 6/15 EN 15 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Output Data Format

Frame Time

The pixel clock (PIXCLK) represents the time needed to sample 1 pixel from the array.

The sensor outputs data at the maximum rate of 1 pixel per PIXCLK. One row time

(tROW) is the period from the first pixel output in a row to the first pixel output in the

next row. The row time and frame time are defined by equations in Table 4.

Figure 11: Line Timing and FRAME_VALID/LINE_VALID Signals

Sensor timing is shown in terms of pixel clock cycles (see Figure 8 on page 13). The

recommended pixel clock frequency is 74.25 MHz. The vertical blanking and the total

frame time equations assume that the integration time (coarse integration time plus fine

integration time) is less than the number of active lines plus the blanking lines:

Window Height + Vertical Blanking (EQ 1)

If this is not the case, the number of integration lines must be used instead to determine

the frame time, (see Table 5). In this example, it is assumed that the coarse integration

time control is programmed with 2000 rows and the fine shutter width total is zero.

For Master mode, if the integration time registers exceed the total readout time, then the

vertical blanking time is internally extended automatically to adjust for the additional

integration time required. This extended value is not written back to the

frame_length_lines register. The frame_length_lines register can be used to adjust

frame-to-frame readout time. This register does not affect the exposure time but it may

extend the readout time.

Table 4: Frame Time (Example Based on 1280 x 960, 45 Frames Per Second)

Parameter Name Equation Timing at 74.25 MHz

AActive data time

Context A: R0x3008 - R0x3004 + 1

Context B: R0x308E - R0x308A + 1

1280 pixel clocks

= 17.23s

P1 Frame start blanking 6 (fixed) 6 pixel clocks

= 0.08s

P2 Frame end blanking 6 (fixed) 6 pixel clocks

= 0.08s

Q Horizontal blanking R0x300C - A 370 pixel clocks

= 4.98s

A+Q (tROW) Line (Row) time R0x300C 1650 pixel clocks

= 22.22s

V Vertical blanking Context A: (R0x300A-(R0x3006-R0x3002+1)) x (A + Q)

Context B: ((R0x30AA-(R0x3090-R0x308C+1)) x (A + Q)

49,500 pixel clocks

= 666.66s

Nrows x (tROW) Frame valid time Context A: ((R0x3006-R0x3002+1)*(A+Q))-Q+P1+P2

Context B: ((R0x3090-R0x308C+1)*(A+Q))-Q+P1+P2

1,583,642 pixel clocks

= 21.33ms

F Total frame time V + (Nrows x (A + Q)) 1,633,500 pixel clocks

= 22.22ms

P1 A Q A Q A P2

Number of pixel clocks

FRAME_VALID

LINE_VALID

...

AR0130 DS Rev. L Pub. 6/15 EN 16 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Output Data Format

Note: The AR0130 uses column parallel analog-digital converters; thus short line timing is not possible.

The minimum total line time is 1390 columns (horizontal width + horizontal blanking). The mini-

mum horizontal blanking is 110.

Exposure

Total integration time is the result of Coarse_Integration_Time and Fine_Integration_-

Time registers, and depends also on whether manual or automatic exposure is selected.

The actual total integration time, tINT is defined as:

tINT = tINTCoarse - 410 - tINTFine (EQ 2)

= (number of lines of integration x line time) - (410 pixel clocks of conversion time over-

head) - (number of pixels of integration x pixel time)

where:

– Number of Lines of Integration (Auto Exposure Control: Enabled)

When automatic exposure control (AEC) is enabled, the number of lines of integra-

tion may vary from frame to frame, with the limits controlled by R0x311E (mini-

mum auto exposure time) and R0x311C (maximum auto exposure time).

– Number of Lines of Integration (Auto Exposure Control: Disabled)

If AEC is disabled, the number of lines of integration equals the value in R0x3012

(context A) or R0x3016 (context B).

– Number of Pixels of Integration

The number of fine shutter width pixels is independent of AEC mode (enabled or

disabled):

• Context A: the number of pixels of integration equals the value in R0x3014.

• Context B: the number of pixels of integration equals the value in R0x3018.

Typically, the value of the Coarse_Integration_Time register is limited to the number of

lines per frame (which includes vertical blanking lines), such that the frame rate is not

affected by the integration time. For more information on coarse and fine integration

time settings limits, please refer to the Register Reference document.

Table 5: Frame Time: Long Integration Time

Parameter Name Equation

(Number of Pixel Clock Cycles) Default Timing

at 74.25 MHz

F’ Total frame time (long

integration time)

Context A: (R0x3012 x (A + Q)) + R0x3014 + P1 + P2

Context B: (R0x3016 x (A + Q)) + V R0x3018 + P1 + P2

3,300,012 pixel clocks

= 44.44ms

AR0130 DS Rev. L Pub. 6/15 EN 17 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Real-Time Context Switching

In the AR0130, the user may switch between two full register sets (listed in Table 6) by

writing to a context switch change bit in R0x30B0[13]. This context switch will change all

registers (no shadowing) at the frame start time and have the new values apply to the

immediate next exposure and readout time.

Features

See the AR0130 Register Reference for additional details.

Reset

The AR0130 may be reset by using RESET_BAR (active LOW) or the reset register.

Hard Reset of Logic

The RESET_BAR pin can be connected to an external RC circuit for simplicity. The

recommended RC circuit uses a 10k resistor and a 0.1F capacitor. The rise time for the

RC circuit is 1s maximum.

Soft Reset of Logic

Soft reset of logic is controlled by the R0x301A Reset register. Bit 0 is used to reset the

digital logic of the sensor while preserving the existing two-wire serial interface configu-

ration. Furthermore, by asserting the soft reset, the sensor aborts the current frame it is

processing and starts a new frame. This bit is a self-resetting bit and also returns to “0”

during two-wire serial interface reads.

Clocks

The AR0130 requires one clock input (EXTCLK).

Table 6: Real-Time Context-Switchable Registers

Context A Context B

Y_Addr_Start R0x3002 R0x308C

X_Addr_Start R0x3004 R0x308A

Y_Addr_End R0x3006 R0x3090

X_Addr_End R0x3008 R0x308E

Coarse_Integration_Time R0x3012 R0x3016

Fine_Integration_Time R0x3014 R0x3018

Y_Odd_Inc R0x30A6 R0x30A8

Green1_Gain (GreenR) R0x3056 R0x30BC

Blue_Gain R0x3058 R0x30BE

Red_Gain R0x305A R0x30C0

Green2_Gain (GreenB) R0x305C R0x30C2

Global_Gain R0x305E R0x30C4

Analog Gain R0x30B0[5:4] R0x30B0[9:8]

Frame_Length_Lines R0x300A R0x30AA

Digital_Binning R0x3032[1:0] R0x3032[5:4]

AR0130 DS Rev. L Pub. 6/15 EN 18 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

PLL-Generated Master Clock

The PLL contains a prescaler to divide the input clock applied on EXTCLK, a VCO to

multiply the prescaler output, and two divider stages to generate the output clock. The

clocking structure is shown in Figure 12. PLL control registers can be programmed to

generate desired master clock frequency.

Note: The PLL control registers must be programmed while the sensor is in the software

Standby state. The effect of programming the PLL divisors while the sensor is in the

streaming state is undefined.

Figure 12: PLL-Generated Master Clock PLL Setup

The PLL is enabled by default on the AR0130.

To Configure and Use the PLL:

1. Bring the AR0130 up as normal; make sure that fEXTCLK is between 6 and 50MHz and

ensure the sensor is in software standby (R0x301A[2]= 0). PLL control registers must

be set in software standby.

2. Set pll_multiplier, pre_pll_clk_div, vt_sys_clk_div, and vt_pix_clk_div based on the

desired input (fEXTCLK) and output (fPIXCLK) frequencies. Determine the M, N, P1, and

P2 values to achieve the desired fPIXCLK using this formula:

fPIXCLK= (fEXTCLK × M) / (N × P1 x P2)

where

M = PLL_Multiplier (R0x3030)

N = Pre_PLL_Clk_Div (R0x302E)

P1 = Vt_Sys_Clk_Div (R0x302C)

P2 = Vt_PIX_Clk_Div (R0x302A)

3. Wait 1ms to ensure that the VCO has locked.

4. Set R0x301A[2]=1 to enable streaming and to switch from EXTCLK to the PLL-gener-

ated clock.

Notes: 1. The PLL can be bypassed at any time (sensor will run directly off EXTCLK) by setting

R0x30B0[14]=1. However, only the parallel data interface is supported with the PLL

bypassed. The PLL is always bypassed in software standby mode. To disable the PLL,

the sensor must be in standby mode (R0x301A[2] = 0)

2. The following restrictions apply to the PLL tuning parameters:

Pre PLL

Div

(PFD)

Pre

clk

div

EXTCLK

PLL

Multiplier

(VCO)

PLL Output

Div 1

SYSCLK

PIXCLK

clk

div vt

clk

div

PLL

Input

Clock

PLL Output

Clock

PLL Output

Div 2

pll_multiplier

32 M 255



1N63



1P116



AR0130 DS Rev. L Pub. 6/15 EN 19 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Additionally, the VCO frequency, defined as must be within

384-768MHz and the EXTCLK must be within 2MHz =< fEXTCLK /N <= 24MHz

The user can utilize the Register Wizard tool accompanying DevWare to generate PLL

settings given a supplied input clock and desired output frequency.

Spread-Spectrum Clocking

To facilitate improved EMI performance, the external clock input allows for spread spec-

trum sources, with no impact on image quality. Limits of the spread spectrum input

clock are:

• 5% maximum clock modulation

• 35 KHz maximum modulation frequency

• Accepts triangle wave modulation, as well as sine or modified triangle modulations.

Stream/Standby Control

The sensor supports two standby modes: Hard Standby and Soft Standby. In both

modes, external clock can be optionally disabled to further minimize power consump-

tion. If this is done, then the “Power-Up Sequence” on page 48 must be followed.

Soft Standby

Soft Standby is a low power state that is controlled through register R0x301A[2].

Depending on the value of R0x301A[4], the sensor will go to standby after completion of

the current frame readout (default behavior) or after the completion of the current row

readout. When the sensor comes back from Soft Standby, previously written register

settings are still maintained.

A specific sequence needs to be followed to enter and exit from Soft Standby.

To Ent er Soft Standby :

1. R0x301A[12] = 1 if serial mode was used

2. Set R0x301A[2] = 0

3. External clock can be turned off to further minimize power consumption (Optional)

To Exit Soft Standby :

1. Enable external clock if it was turned off

2. R0x301A[2] = 1

3. R0x301A[12] = 0 if serial mode is used

4P216



fVCO fEXTCLK M





AR0130 DS Rev. L Pub. 6/15 EN 20 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Figure 13: Enter Standby Timing

Figure 14: Exit Standby Timing

EXTCLK

STANDBY

50 E XTC L Ks

R egister Writes Not ValidRegisterWrites Valid

SDATA

750 E XTC L Ks

EXTCLK

STANDBY

TRIGGER

10 E XTC L Ks

1ms

28 rows + C IT

R egister Writes Not Valid R egister Writes ValidSDATA

AR0130 DS Rev. L Pub. 6/15 EN 21 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Hard Standby

Hard Standby puts the sensor in lower power state; previously written register settings

are still maintained.

A specific sequence needs to be followed to enter and exit from Hard Standby.

To Ent er Hard Standby:

1. R0x301A[8] = 1

2. R0x301A[12] = 1 if serial mode was used

3. Assert STANDBY pin

4. External clock can be turned off to further minimize power consumption (Optional)

To Exit Hard Standby:

1. Enable external clock if it was turned off

2. De-assert STANDBY pin

3. Set R0x301A[8] = 0

Window Control

Registers x_addr_start, x_addr_end, y_addr_start, and y_addr_end control the size and

starting coordinates of the image window.

The exact window height and width out of the sensor is determined by the difference

between the Y address start and end registers or the X address start and end registers,

respectively.

The AR0130 allows different window sizes for context A and context B.

Blanking Control

Horizontal blank and vertical blank times are controlled by the line_length_pck and

frame_length_lines registers, respectively.

• Horizontal blanking is specified in terms of pixel clocks. It is calculated by subtracting

the X window size from the line_length_pck register. The minimum horizontal

blanking is 110 pixel clocks.

• Vertical blanking is specified in terms of numbers of lines. It is calculated by

subtracting the Y window size from the frame_length_lines register. The minimum

vertical blanking is 26 lines.

The actual imager timing can be calculated using Table 4 on page 15 and Table 5 on

page 16, which describe the Line Timing and FV/LV signals.

AR0130 DS Rev. L Pub. 6/15 EN 22 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Readout Modes

Digital Binning

By default, the resolution of the output image is the full width and height of the FOV as

defined above. The output resolution can be reduced by digital binning. For RGB and

monochrome mode, this is set by the register R0x3032. For Context A, use bits [1:0], for

Context B, use bits [5:4]. Available settings are:

00 = No binning

01 = Horizontal binning

10 = Horizontal and vertical binning

Binning gives the advantage of reducing noise at the cost of reduced resolution. When

both horizontal and vertical binning are used, a 2x improvement in SNR is achieved

therefore improving low light performance

Bayer Space Resampling

All of the pixels in the FOV contribute to the output image in digital binning mode. This

can result in a more pleasing output image with reduced subsampling artifacts. It also

improves low-light performance. For RGB mode, resampling can be enabled by setting

of register 0x306E[4] = 1.

Mirror

Column Mirror Image

By setting R0x3040[14] = 1, the readout order of the columns is reversed, as shown in

Figure 15. The starting color, and therefore the Bayer pattern, is preserved when

mirroring the columns.

When using horizontal mirror mode, the user must retrigger column correction. Please

refer to the column correction section to see the procedure for column correction retrig-

gering. Bayer resampling must be enabled, by setting bit 4 of register 0 x 306E[4] = 1.

Figure 15: Six Pixels in Normal and Column Mirror Readout Modes

G0[1

1:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0]

G2[11:0] R2[11:0] G1[11:0] R1[11:0] G0[11:0] R0[11:0]

DOUT[11:0]

Normal readout

DOUT[11:0]

Reverse readout

AR0130 DS Rev. L Pub. 6/15 EN 23 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Row Mirror Image

By setting R0x3040[15] = 1, the readout order of the rows is reversed as shown in

Figure 16. The starting Bayer color pixel is maintained in this mode by a 1-pixel shift in

the imaging array. When using horizontal mirror mode, the user must retrigger column

correction. Please refer to the column correction section to see the procedure for

column correction retriggering.

Figure 16: Six Rows in Normal and Row Mirror Readout Modes

Row0 [11:0] Row1 [11:0] Row2 [11:0] Row3 [11:0] Row4 [11:0] Row5 [11:0]

Row5 [11:0] Row4 [11:0] Row3 [11:0] Row2 [11:0] Row1 [11:0] Row0[11:0]

OUT

[11:0]

Normal readout

OUT

[11:0]

Reverse readout

AR0130 DS Rev. L Pub. 6/15 EN 24 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Maintaining a Constant Frame Rate

Maintaining a constant frame rate while continuing to have the ability to adjust certain

parameters is the desired scenario. This is not always possible, however, because register

updates are synchronized to the read pointer, and the shutter pointer for a frame is

usually active during the readout of the previous frame. Therefore, any register changes

that could affect the row time or the set of rows sampled causes the shutter pointer to

start over at the beginning of the next frame.

By default, the following register fields cause a “bubble” in the output rate (that is, the

vertical blank increases for one frame) if they are written in video mode, even if the new

value would not change the resulting frame rate. The following list shows only a few

examples of such registers; a full listing can be seen in the AR0130 Register Reference.

•x_addr_start

• x_addr_end

• y_addr_start

• y_addr_end

• frame_length_lines

• line_length_pclk

• coarse_integration_time

• fine_integration_time

•read_mode

The size of this bubble is (Integration_Time × tROW ), calculating the row time according

to the new settings.

The Coarse_Integration_Time and Fine_Integration_Time fields may be written to

without causing a bubble in the output rate under certain circumstances. Because the

shutter sequence for the next frame often is active during the output of the current

frame, this would not be possible without special provisions in the hardware. Writes to

these registers take effect two frames after the frame they are written, which allows the

integration time to increase without interrupting the output or producing a corrupt

frame (as long as the change in integration time does not affect the frame time).

Synchronizing Register Writes to Frame Boundaries

Changes to most register fields that affect the size or brightness of an image take effect

on the frame after the one during which they are written. These fields are noted as

“synchronized to frame boundaries” in the AR0130 Register Reference. To ensure that a

after the leading edge of FV and before the trailing edge of FV.

As a special case, in single frame mode, register writes that occur after FV but before the

next trigger will take effect immediately on the next frame, as if there had been a Restart.

However, if the trigger for the next frame occurs during FV, register writes take effect as

with video mode.

Fields not identified as being frame-synchronized are updated immediately after the

to predict if they affect the shutter pointer.

AR0130 DS Rev. L Pub. 6/15 EN 25 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Restart

To restart the AR0130 at any time during the operation of the sensor, write a “1” to the

Restart register (R0x301A[1] = 1). This has two effects: first, the current frame is inter-

rupted immediately. Second, any writes to frame-synchronized registers and the shutter

width registers take effect immediately, and a new frame starts (in video mode). The

current row completes before the new frame is started, so the time between issuing the

Restart and the beginning of the next frame can vary by about tROW.

Image Acquisition Modes

The AR0130 supports two image acquisition modes: video (also known as master) and

single frame.

Video

The video mode takes pictures by scanning the rows of the sensor twice. On the first

scan, each row is released from reset, starting the exposure. On the second scan, the row

is sampled, processed, and returned to the reset state. The exposure for any row is there-

fore the time between the first and second scans. Each row is exposed for the same dura-

tion, but at slightly different point in time, which can cause a shear in moving subjects as

is typical with electronic rolling shutter sensors.

Single Frame

The single-frame mode operates similar to the video mode. It also scans the rows of the

sensor twice, first to reset the rows and second to read the rows. Unlike video mode

where a continuous stream of images are output from the image sensor, the single-frame

mode outputs a single frame in response to a high state placed on the TRIGGER input

pin. As long as the TRIGGER pin is held in a high state, new images will be read out. After

the TRIGGER pin is returned to a low state, the image sensor will not output any new

images and will wait for the next high state on the TRIGGER pin.

The TRIGGER pin state is detected during the vertical blanking period (i.e. the FV signal

is low). The pin is level sensitive rather than edge sensitive. As such, image integration

will only begin when the sensor detects that the TRIGGER pin has been held high for 3

consecutive clock cycles.

During integration time of single-frame mode and video mode, the FLASH output pin is

at high.

Continuous Trigger

In certain applications, multiple sensors need to have their video streams synchronized

(E.g. surround view or panorama view applications). The TRIGGER pin can also be used

to synchronize output of multiple image sensors together and still get a video stream.

This is called continuous trigger mode. Continuous trigger is enabled by holding the

TRIGGER pin high. Alternatively, the TRIGGER pin can be held high until the stream bit

is enabled (R0x301A[2]=1) then can be released for continuous synchronized video

streaming.

If the TRIGGER pins for all connected AR0130 sensors are connected to the same control

signal, all sensors will receive the trigger pulse at the same time. If they are configured to

have the same frame timing, then the usage of the TRIGGER pin guarantees that all

sensors will be synchronized within 1 PIXCLK cycle if PLL is disabled, or 2 PIXCLK cycles

if PLL is enabled.

AR0130 DS Rev. L Pub. 6/15 EN 26 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

With continuous trigger mode, the application can now make use of the video streaming

mode while guaranteeing that all sensor outputs are synchronized. As long as the initial

trigger for the sensors takes place at the same time, all subsequent video streams will be

synchronous.

Automatic Exposure Control

The integrated automatic exposure control (AEC) is responsible for ensuring that

optimal settings of exposure and gain are computed and updated every other frame.

AEC can be enabled or disabled by R0x3100[0].

When AEC is disabled (R0x3100[0] = 0), the sensor uses the manual exposure value in

coarse and fine shutter width registers and the manual gain value in the gain registers.

When AEC is enabled (R0x3100[0]=1), the target luma value is set by R0x3102. For the

AR0130 this target luma has a default value of 0x0800 or about half scale.

The exposure control measures current scene luminosity by accumulating a histogram

of pixel values while reading out a frame. It then compares the current luminosity to the

desired output luminosity. Finally, the appropriate adjustments are made to the expo-

sure time and gain. All pixels are used, regardless of color or mono mode.

AEC does not work if digital binning is enabled.

Embedded Data and Statistics

The AR0130 has the capability to output image data and statistics embedded within the

frame timing. There are two types of information embedded within the frame readout:

1. Embedded Data: If enabled, these are displayed on the two rows immediately before

the first active pixel row is displayed.

2. Embedded Statistics: If enabled, these are displayed on the two rows immediately

after the last active pixel row is displayed.

Note: Both embedded statistics and data must be enabled and disabled together.

Figure 17: Frame Format with Embedded Data Lines Enabled

Image

Status & Statistics Data

HBlank

VBlank

AR0130 DS Rev. L Pub. 6/15 EN 27 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Embedded Data

The embedded data contains the configuration of the image being displayed. This

includes all register settings used to capture the current frame. The registers embedded

in these rows are as follows:

Line 1: Registers R0x3000 to R0x312F

Line 2: Registers R0x3136 to R0x31BF, R0x31D0 to R0x31FF

Note: All undefined registers will have a value of 0.

In parallel mode, since the pixel word depth is 12-bits/pixel, the sensor 16-bit register

data will be transferred over 2 pixels where the register data will be broken up into 8 MSB

and 8 LSB. The alignment of the 8-bit data will be on the 8 MSB bits of the 12-bit pixel

word. For example, of a register value of 0x1234 is to be transmitted, it will be trans-

mitted over 2, 12-bit pixels as follows: 0x120, 0x340.

The first pixel of each line in the embedded data is a tag value of 0x0A0. This signifies

that all subsequent data is 8 bit data aligned to the MSB of the 12-bit pixel.

The figure below summarizes how the embedded data transmission looks like. It should

be noted that data, as shown in Figure 18, is aligned to the MSB of each word:

Figure 18: Format of Embedded Data Output within a Frame

The data embedded in these rows are as follows:

•0x0A0 - identifier

• 0xAA0

• Register Address MSB of the first register

•0xA50

• Register Address LSB of the first register

•0x5A0

• Register Value MSB of the first register addressed

•0x5A0

• Register Value LSB of the first register addressed

•0x5A0

• Register Value MSB of the register at first address + 2

•0x5A0

• Register Value LSB of the register at first address + 2

•0x5A0

•etc.

{register_

value_LSB} 8'h5A

Data line 1

Data line 2

8'h5A

8'hAA {register_

address_MSB} 8'hA5 {register_

address_LSB} 8'h5A {register_

value_MSB} 8'h5A

{register_

value_LSB}

data_format_

code =8'h0A

8'hAA

{register_

address_MSB} 8'hA5 {register_

address_LSB} 8'h5A {register_

value_MSB} 8'h5A

data_format_

code =8'h0A

AR0130 DS Rev. L Pub. 6/15 EN 28 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Embedded Statistics

The embedded statistics contain frame identifiers and histogram information of the

image in the frame. This can be used by downstream auto-exposure algorithm blocks to

make decisions about exposure adjustment.

This histogram is divided into 244 bins with a bin spacing of 64 evenly spaced bins for

digital code values 0 to 212, 120 evenly spaced bins for values 212 to 216, 60 evenly spaced

bins for values 216 to 220.

The first pixel of each line in the embedded statistics is a tag value of 0x0B0. This signi-

fies that all subsequent statistics data is 10 bit data aligned to the MSB of the 12-bit pixel.

The figure below summarizes how the embedded statistics transmission looks like. It

should be noted that data, as shown in Figure 19, is aligned to the msb of each word:

Figure 19: Format of Embedded Statistics Output within a Frame

The statistics embedded in these rows are as follows:

Line 1:

• 0x0B0 - identifier

• Register 0x303A - frame_count

• Register 0x31D2 - frame ID

• Histogram data - histogram bins 0-243

Line 2:

•0x0B0 (identifier)

•Mean

•Histogram Begin

•Histogram End

•Low End Histogram Mean

• Percentage of Pixels Below Low End Mean

• Normal Absolute Deviation

lowEndMean

[19:10]

stats line 1

stats line 2

histogram

bin1 [9:0]

#words =

10’h1EC

{2’b00, frame

_count MSB}

{2’b00, frame

_ID MSB}

{2’b00, frame

_ID LSB}

histogram

bin0 [19:10]

histogram

bin0 [9:0]

histogram

bin1 [19:10]

data_format_

code =8'h0B

#words =

10’h1C mean [ 19:10] mean [9:0] hist_begin

[19:10]

hist_begin

[9:10]

8'h07

data_format_

code =8'h0B

{2’b00, frame

_count LSB}

8'h07

histogram

bin243 [19:10]

histogram

bin243 [9:0]

8'h07

hist_end

[19:10] hist_end

[9:10]

lowEndMean

[9:0]

perc_lowEnd

[19:10]

perc_lowEnd

[9:0]

norm_abs_dev

[19:10]

lnorm_abs_dev

[9:0]

AR0130 DS Rev. L Pub. 6/15 EN 29 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Gain

Digital Gain

Digital gain can be controlled globally by R0x305E (Context A) or R0x30C4 (Context B).

There are also registers that allow individual control over each Bayer color (GreenR,

GreenB, Red, Blue).

The format for digital gain setting is xxx.yyyyy where 0b00100000 represents a 1x gain

setting and 0b00110000 represents a 1.5x gain setting. The step size for yyyyy is 0.03125

while the step size for xxx is 1. Therefore to set a gain of 2.09375 one would set digital

gain to 01000011.

Analog Gain

The AR0130 has a column parallel architecture and therefore has an Analog gain stage

per column.

There are two stages of analog gain, the first stage can be set to 1x, 2x, 4x or 8x. This is can

be set in R0x30B0[5:4](Context A) or R0x30B0[9:8] (Context B). The second stage is

capable of setting an additional 1x or 1.25x gain which can be set in R0x3EE4[8].

This allows the maximum possible analog gain to be set to 10x.

Black Level Correction

Black level correction is handled automatically by the image sensor. No adjustments are

provided except to enable or disable this feature. Setting R0x30EA[15] disables the auto-

matic black level correction. Default setting is for automatic black level calibration to be

enabled.

The automatic black level correction measures the average value of pixels from a set of

optically black lines in the image sensor. The pixels are averaged as if they were light-

sensitive and passed through the appropriate gain. This line average is then digitally

low-pass filtered over many frames to remove temporal noise and random instabilities

associated with this measurement. The new filtered average is then compared to a

minimum acceptable level, low threshold, and a maximum acceptable level, high

threshold. If the average is lower than the minimum acceptable level, the offset correc-

tion value is increased by a predetermined amount. If it is above the maximum level, the

offset correction value is decreased by a predetermined amount. The high and low

thresholds have been calculated to avoid oscillation of the black level from below to

above the targeted black level. At high gain, long exposure, and high temperature condi-

tions, the performance of this function can degrade.

Row-wise Noise Correction

Row (Line)-wise Noise Correction is handled automatically by the image sensor. No

adjustments are provided except to enable or disable this feature. Clearing R0x3044[10]

disables the row noise correction. Default setting is for row noise correction to be

enabled.

Row-wise noise correction is performed by calculating an average from a set of optically

black pixels at the start of each line and then applying each average to all the active

pixels of the line.

AR0130 DS Rev. L Pub. 6/15 EN 30 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Column Correction

The AR0130 uses column parallel readout architecture to achieve fast frame rate.

Without any corrections, the consequence of this architecture is that different column

signal paths have slightly different offsets that might show up on the final image as

structured fixed pattern noise.

AR0130 has column correction circuitry that measures this offset and removes it from

the image before output. This is done by sampling dark rows containing tied pixels and

measuring an offset coefficient per column to be corrected later in the signal path.

Column correction can be enabled/disabled via R0x30D4[15]. Additionally, the number

of rows used for this offset coefficient measurement is set in R0x30D4[3:0]. By default

this register is set to 0x7, which means that 8 rows are used. This is the recommended

value. Other control features regarding column correction can be viewed in the AR0130

sensor streaming is disabled and the appropriate triggering sequence must be followed

as described below.

Column Correction Triggering

Column correction requires a special procedure to trigger depending on which state the

sensor is in.

Column Triggering on Startup

When streaming the sensor for the first time after power-up, a special sequence needs to

be followed to make sure that the column correction coefficients are internally calcu-

lated properly.

1. Follow proper power up sequence for power supplies and clocks

2. Apply sequencer settings if needed

3. Apply frame timing and PLL settings as required by application

4. Set analog gain to 1x and low conversion gain

5. Enable column correction and settings

6. Disable auto re-trigger for change in conversion gain or col_gain, and enable column

correction always. (R0x30BA = 0x0008).

7. Enable streaming (R0x301A[2] = 1) or drive the TRIGGER pin HIGH.

8. Wait 9 frames to settle. (First frame after coming up from standby is internally column

correction disabled.)

9. Disable streaming (R0x301A[2] = 0) or drive the TRIGGER pin LOW.

After this, the sensor has calculated the proper column correction coefficients and the

sensor is ready for streaming. Any other settings (including gain, integration time and

conversion gain etc.) can be done afterwards without affecting column correction.

Column Correction Retriggering Due to Mode Change

Since column offsets is sensitive to changes in the analog signal path, such changes

require column correction circuitry to be retriggered for the new path. Examples of such

mode changes include: horizontal mirror, vertical mirror, changes to column correction

settings.

When such changes take place, the following sequence needs to take place:

1. Disable streaming (R0x301A[2]=0) or drive the TRIGGER pin LOW.

2. Enable streaming (R0x301A[2]=1) or drive the TRIGGER pin HIGH.

3. Wait 9 frames to settle.

AR0130 DS Rev. L Pub. 6/15 EN 31 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Features

Note: The above steps are not needed if the sensor is being reset (soft or hard reset) upon

the mode change.

Test Patterns

The AR0130 has the capability of injecting a number of test patterns into the top of the

datapath to debug the digital logic. With one of the test patterns activated, any of the

datapath functions can be enabled to exercise it in a deterministic fashion. Test patterns

are selected by Test_Pattern_Mode register (R0x3070). Only one of the test patterns can

be enabled at a given point in time by setting the Test_Pattern_Mode register according

to Table 7. When test patterns are enabled the active area will receive the value specified

by the selected test pattern and the dark pixels will receive the value in Test_Pat-

tern_Green (R0x3074 and R0x3078) for green pixels, Test_Pattern_Blue (R0x3076) for

blue pixels, and Test_Pattern_Red (R0x3072) for red pixels.

Note: Turn off black level calibration (BLC) when Test Pattern is enabled.

Color Field

When the color field mode is selected, the value for each pixel is determined by its color.

Green pixels will receive the value in Test_Pattern_Green, red pixels will receive the value

in Test_Pattern_Red, and blue pixels will receive the value in Test_Pattern_Blue.

Vertical Color Bars

When the vertical color bars mode is selected, a typical color bar pattern will be sent

through the digital pipeline.

Walking 1s

When the walking 1s mode is selected, a walking 1s pattern will be sent through the

digital pipeline. The first value in each row is 1.

Table 7: Test Pattern Modes

Test_Pattern_Mode Test Pattern Output

0 No test pattern (normal operation)

1 Solid color test pattern

2 100% color bar test pattern

3 Fade-to-gray color bar test pattern

256 Walking 1s test pattern (12-bit)

AR0130 DS Rev. L Pub. 6/15 EN 32 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Two-Wire Serial Register Interface

The two-wire serial interface bus enables read/write access to control and status regis-

ters within the AR0130. This interface is designed to be compatible with the electrical

characteristics and transfer protocols of the two-wire serial interface specification.

The interface protocol uses a master/slave model in which a master controls one or

more slave devices. The sensor acts as a slave device. The master generates a clock (SCLK)

that is an input to the sensor and is used to synchronize transfers. Data is transferred

between the master and the slave on a bidirectional signal (SDATA). SDATA is pulled up to

VDD_IO off-chip by a 1.5k resistor. Either the slave or master device can drive SDATA

LOW—the interface protocol determines which device is allowed to drive SDATA at any

given time.

The protocols described in the two-wire serial interface specification allow the slave

device to drive SCLK LOW; the AR0130 uses SCLK as an input only and therefore never

drives it LOW.

Protocol

Data transfers on the two-wire serial interface bus are performed by a sequence of low-

level protocol elements:

1. a (repeated) start condition

2. a slave address/data direction byte

3. an (a no) acknowledge bit

4. a message byte

5. a stop condition

The bus is idle when both SCLK and SDATA are HIGH. Control of the bus is initiated with a

start condition, and the bus is released with a stop condition. Only the master can

generate the start and stop conditions.

Start Condition

A start condition is defined as a HIGH-to-LOW transition on SDATA while SCLK is HIGH.

At the end of a transfer, the master can generate a start condition without previously

generating a stop condition; this is known as a “repeated start” or “restart” condition.

Stop Condition

A stop condition is defined as a LOW-to-HIGH transition on SDATA while SCLK is HIGH.

Data Transfer

Data is transferred serially, 8 bits at a time, with the MSB transmitted first. Each byte of

data is followed by an acknowledge bit or a no-acknowledge bit. This data transfer

mechanism is used for the slave address/data direction byte and for message bytes.

One data bit is transferred during each SCLK clock period. SDATA can change when SCLK

is LOW and must be stable while SCLK is HIGH.

Slave Address/Data Direction Byte

Bits [7:1] of this byte represent the device slave address and bit [0] indicates the data

transfer direction. A “0” in bit [0] indicates a WRITE, and a “1” indicates a READ. The

default slave addresses used by the AR0130 are 0x20 (write address) and 0x21 (read

AR0130 DS Rev. L Pub. 6/15 EN 33 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Two-Wire Serial Register Interface

address) in accordance with the specification. Alternate slave addresses of 0x30 (write

address) and 0x31 (read address) can be selected by enabling and asserting the SADDR

input.

An alternate slave address can also be programmed through R0x31FC.

Message Byte

Message bytes are used for sending register addresses and register write data to the slave

device and for retrieving register read data.

Acknowledge Bit

Each 8-bit data transfer is followed by an acknowledge bit or a no-acknowledge bit in the

SCLK clock period following the data transfer. The transmitter (which is the master when

writing, or the slave when reading) releases SDATA. The receiver indicates an acknowl-

edge bit by driving SDATA LOW. As for data transfers, SDATA can change when SCLK is

LOW and must be stable while SCLK is HIGH.

No-Acknowledge Bit

The no-acknowledge bit is generated when the receiver does not drive SDATA LOW

during the SCLK clock period following a data transfer. A no-acknowledge bit is used to

terminate a read sequence.

Typical Sequence

A typical READ or WRITE sequence begins by the master generating a start condition on

the bus. After the start condition, the master sends the 8-bit slave address/data direction

byte. The last bit indicates whether the request is for a read or a write, where a “0” indi-

cates a write and a “1” indicates a read. If the address matches the address of the slave

device, the slave device acknowledges receipt of the address by generating an acknowl-

edge bit on the bus.

If the request was a WRITE, the master then transfers the 16-bit register address to which

the WRITE should take place. This transfer takes place as two 8-bit sequences and the

slave sends an acknowledge bit after each sequence to indicate that the byte has been

received. The master then transfers the data as an 8-bit sequence; the slave sends an

acknowledge bit at the end of the sequence. The master stops writing by generating a

(re)start or stop condition.

If the request was a READ, the master sends the 8-bit write slave address/data direction

byte and 16-bit register address, the same way as with a WRITE request. The master then

generates a (re)start condition and the 8-bit read slave address/data direction byte, and

clocks out the register data, eight bits at a time. The master generates an acknowledge

bit after each 8-bit transfer. The slave’s internal register address is automatically incre-

mented after every 8 bits are transferred. The data transfer is stopped when the master

sends a no-acknowledge bit.

AR0130 DS Rev. L Pub. 6/15 EN 34 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Two-Wire Serial Register Interface

Single READ from Random Location

This sequence (Figure 20) starts with a dummy WRITE to the 16-bit address that is to be

used for the READ. The master terminates the WRITE by generating a restart condition.

The master then sends the 8-bit read slave address/data direction byte and clocks out

one byte of register data. The master terminates the READ by generating a no-acknowl-

edge bit followed by a stop condition. Figure 20 shows how the internal register address

maintained by the AR0130 is loaded and incremented as the sequence proceeds.

Figure 20: Single READ from Random Location

Single READ from Current Location

This sequence (Figure 21) performs a read using the current value of the AR0130 internal

followed by a stop condition. The figure shows two independent READ sequences.

Figure 21: Single READ from Current Location

Sequential READ, Start from Random Location

This sequence (Figure 22) starts in the same way as the single READ from random loca-

tion (Figure 20). Instead of generating a no-acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge bit and continues to

perform byte READs until “L” bytes have been read.

Figure 22: Sequential READ, Start from Random Location

S = start condition

P = stop condition

Sr = restart condition

A = acknowledge

A = no-acknowledge

slave to master

master to slave

Slave Address 0

S A Reg Address[15:8] A Reg Address[7:0] Slave Address AA 1Sr Read Data P

Previous Reg Address, N Reg Address, M M+

Slave Address 1S A Read Data Slave Address A1SP Read Data P

Previous Reg Address, N Reg Address, N+1 N+2

Slave Address 0

S Sr

AReg Address[15:8]

Read Data Read Data

AReg Address[7:0] ARead DataSlave Address

Previous Reg Address, N Reg Address, M

M+1 M+2

M+1

M+3

Read Data Read Data

M+L-2 M+L-1 M+L

AAA

AR0130 DS Rev. L Pub. 6/15 EN 35 ©Semiconductor Components Industries, LLC, 2015.

AR0130: 1/3-Inch CMOS Digital Image Sensor

Two-Wire Serial Register Interface

Sequential READ, Start from Current Location

This sequence (Figure 23) starts in the same way as the single READ from current loca-

tion (Figure 21). Instead of generating a no-acknowledge bit after the first byte of data

has been transferred, the master generates an acknowledge bit and continues to

perform byte READs until “L” bytes have been read.

Figure 23: Sequential READ, Start from Current Location

Single WRITE to Random Location

This sequence (Figure 24) begins with the master generating a start condition. The slave

address/data direction byte signals a WRITE and is followed by the HIGH then LOW

bytes of the register address that is to be written. The master follows this with the byte of

write data. The WRITE is terminated by the master generating a stop condition.

Figure 24: Single WRITE to Random Location

Sequential WRITE, Start at Random Location

This sequence (Figure 25) starts in the same way as the single WRITE to random location

(Figure 24). Instead of generating a no-acknowledge bit after the first byte of data has

been transferred, the master generates an acknowledge bit and continues to perform

byte WRITEs until “L” bytes have been written. The WRITE is terminated by the master

generating a stop condition.

Figure 25: Sequential WRITE, Start at Random Location

Read Data Read Data

Previous Reg Address, N N+1 N+2 N+L-1 N+L

Read DataSlave Address A1 Read Data A PS A A A

Slave Address 0

SAReg Address[15:8] AReg Address[7:0] AP

Previous Reg Address, N Reg Address, M M+

Write Data

Slave Address 0

SAReg Address[15:8]

AReg Address[7:0] A

Previous Reg Address, N Reg Address, M

M+1 M+2

M+1

M+3

M+L-2 M+L-1 M+L

Write Data

Write Data Write Data Write DataWrite Data

AR0130: 1/3-Inch CMOS Digital Image Sensor

Spectral Characteristics

Figure 26: Quantum Efficiency – Monochrome Sensor

350 450 550 650 750 850 950 1050 1150

Quantum Efficiency (% )

Wavelength (nm)

AR0130: 1/3-Inch CMOS Digital Image Sensor

Spectral Characteristics

Figure 27: Quantum Efficiency – Color Sensor

350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050 1100 1150

Quantum Efficiency (%)

Wavelength (nm)

red

green

blue

AR0130: 1/3-Inch CMOS Digital Image Sensor

Package Dimensions

Figure 28: 48 iLCC Package Outline Drawing

0.2±0.1

1.250±0.125

1.35±0.05

0.725 TYP

4.45

4.15

0.525 TYP

0.125 TYP

8.9

4.45

Die

Center

Optical

Center

Optical

Area

First

Clear

Pixel

(4.87 CTR)

6.40 CTR CTR

7.28 = 0.10 CTR

(3.67 CTR)

5.2 CTR

6.227 CTR

10±0.075

5±0.075

0.4±0.05

48X

3.85

7.7

0.15

0.15 A

3.85

7.7

0.15 A BC

10±0.075

0.7 TYP

ENCAPSULANT: EPOXY

SUBSTRATE MATERIAL: PLASTIC LAMINATE 0.50 THICKNESS

LID MATERIAL: BOROSILICATE GLASS 0.4 THICKNESS

REFRACTIVE INDEX AT 20°C = 1.5255 @ 546nm & 1.5231 @ 588nm

DOUBLE SIDE AR COATING: 530-570nm R<1%; 420-700nm R<2%

LEAD FINISH: GOLD PLATING, 0.5 MICRONS MINIMUM THICKNESS

IMAGE SENSOR DIE

DIMENSIONS IN MM. DIMENSIONS IN () ARE FOR REFERENCE ONLY.

DO NOT MEASURE PRINTED DRAWING.

NOTES

OPTICAL CENTER = PACKAGE CENTER. DIE CENTER OFFSET FROM PACKAGE CENTER:

X = 0.018, Y = -0.277MM

MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1°

MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A: 35 MICRONS

MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 50 MICRONS

AR0130: 1/3-Inch CMOS Digital Image Sensor

Package Dimensions

Figure 29: 48 PLCC Package Outline Drawing

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

Unless otherwise stated, the following specifications apply to the following conditions:

VDD = 1.8V – 0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8V ± 0.3V;

VDD_SLVS = 0.4V – 0.1/+0.2; TA = -30°C to +70°C; output load = 10pF;

frequency = 74.25 MHz.

Two-Wire Serial Register Interface

The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are

shown in Figure 30 and Table 8.

Figure 30: Two-Wire Serial Bus Timing Parameters

Note: Read sequence: For an 8-bit READ, read waveforms start after READ command and register

address are issued.

SSr

tSU;STO

tSU;STA

tHD;STA tHIGH

tLOW tSU;DAT

tHD;DAT

SDATA

SCLK

tBUF

trtHD;STA

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

Notes: 1. This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.

2. Two-wire control is I2C-compatible.

3. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXTCLK = 27 MHz.

4. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the

undefined region of the falling edge of SCLK.

5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of

the SCLK signal.

6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement

tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch

the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it

must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according

to the Standard-mode I2C-bus specification) before the SCLK line is released.

7. Cb = total capacitance of one bus line in pF.

Table 8: Two-Wire Serial Bus Characteristics

fEXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V;

VDD_PLL = 2.8V; TA = 25°C

Parameter Symbol

Standard-Mode Fast-Mode

UnitMin Max Min Max

SCLK Clock Frequency fSCL 0 100 0 400 KHz

After this period, the first clock pulse is

generated

tHD;STA 4.0 - 0.6 - s

LOW period of the SCLK clock tLOW 4.7 - 1.3 - s

HIGH period of the SCLK clock tHIGH 4.0 - 0.6 - s

Set-up time for a repeated START

condition

tSU;STA 4.7 - 0.6 - s

Data hold time: tHD;DAT 043.455060.95s

Data set-up time tSU;DAT 250 - 1006-ns

Rise time of both SDATA and SCLK signals tr - 1000 20 + 0.1Cb7300 ns

Fall time of both SDATA and SCLK signals tf - 300 20 + 0.1Cb7300 ns

Set-up time for STOP condition tSU;STO 4.0 - 0.6 - s

Bus free time between a STOP and START

condition

tBUF 4.7 - 1.3 - s

Capacitive load for each bus line Cb - 400 - 400 pF

Serial interface input pin capacitance CIN_SI - 3.3 - 3.3 pF

SDATA max load capacitance CLOAD_SD - 30 - 30 pF

SDATA pull-up resistor RSD 1.5 4.7 1.5 4.7 K

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

I/O Timing

By default, the AR0130 launches pixel data, FV, and LV with the falling edge of PIXCLK.

The expectation is that the user captures DOUT[11:0], FV, and LV using the rising edge of

PIXCLK.

See Figure 31 and Table 9 below and Table 10 on page 43 for I/O timing (AC) characteris-

tics.

Figure 31: I/O Timing Diagram

Table 9: I/O Timing Characteristics (2.8V VDD_IO)1

Conditions: fPIXCLK=74.25MHz (720P60fps) VDD_IO=2.8V;

slew rate setting = 4 for PIXCLK; slew rate setting = 7 for parallel ports

Symbol Definition Condition Min Typ Max Unit

fEXTCLK Input clock frequency PLL enabled 6 50 MHz

tEXTCLK Input clock period PLL enabled 20 166 ns

tR Input clock rise time 3ns

tF Input clock fall time 3ns

Input clock duty cycle 45 50 55 %

tJITTER2 Input clock jitter at 27 MHz 600 ps

tCP EXTCLK to PIXCLK propagation delay Nominal voltages, PLL Disabled, slew setting =4 12 20 ns

tPIXCLK PIXCLK frequency26 74.25 ns

tRP PIXCLK rise time Slew rate setting = 4 1.60 2.70 7.50 ns

tFP PIXCLK fall time Slew rate setting = 4 1.50 2.60 7.20 ns

PIXCLK duty cycle PLL enabled 45 50 55 %

tPIXJITTER Jitter on PIXCLK 1ns

tPD PIXCLK to Data[11:0] PIXCLK slew rate = 4

Parallel slew rate = 7

-2.5 3.5 ns

tPFH PIXCLK to FV HIGH PIXCLK slew rate = 4

Parallel slew rate = 7

-2.5 0.5 ns

tPLH PIXCLK to LV HIGH PIXCLK slew rate = 4

Parallel slew rate = 7

-3.0 0.0 ns

Data[11:0]

LINE_VALID/

PIXCLK

EXTCLK

tEXTCLK

FRAME_VALID leads LINE_VALID by 6 PIXCLKs.

FRAME_VALID trails

LINE_VALID by 6 PIXCLKs.

tPLH

tPFH

tPFL

tPLL

tPD

Pxl_0 Pxl_1 Pxl _2 Pxl_n

90%

10%

tRP tFP

90%

10%

FRAME_VALID

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

Notes: 1. Minimum and maximum values are for the spec limits: 3.1V, -30C and 2.50V, 70C. All values are

taken at the 50% transition point.

2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.

Notes: 1. Minimum and maximum values are for the spec limits: 1.95V, -30C and 1.70V, 70C. All values are

taken at the 50% transition point.

2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.

tPFL PIXCLK to FV LOW PIXCLK slew rate = 4

Parallel slew rate = 7

-2.5 0.5 ns

tPLL PIXCLK to LV LOW PIXCLK slew rate = 4

Parallel slew rate = 7

-3.0 0.0 ns

CLOAD Output load capacitance 10 pF

CIN Input pin capacitance 2.5 pF

Table 10: I/O Timing Characteristics (1.8V VDD_IO)1

Conditions: fPIXCLK=74.25MHz (720P60fps) VDD_IO=1.8V;

slew rate setting = 4 for PIXCLK; slew rate setting = 7 for parallel ports

Symbol Definition Condition Min Typ Max Unit

fEXTCLK Input clock frequency PLL enabled 6 - 50 MHz

tEXTCLK Input clock period PLL enabled 20 - 166 ns

tRInput clock rise time -3-ns

tFInput clock fall time -3-ns

Input clock duty cycle 45 50 55 %

tJITTER2 Input clock jitter at 27 MHz – 600 – ps

tCP EXTCLK to PIXCLK propagation

delay

Nominal voltages, PLL Disabled,

slew setting =4

12 20 ns

fPIXCLK PIXCLK frequency2674.25MHz

tRP Pixel rise time Slew rate setting = 4 2.50 4.30 7.10 ns

tFP Pixel fall time Slew rate setting = 4 2.20 3.80 6.50 ns

PIXCLK duty cycle PLL enabled 45 50 55 %

tPIXJITTER Jitter on PIXCLK 1 ns

tPD PIXCLK to data valid PIXCLK slew rate = 4

Parallel slew rate = 7

–4.5 – 2.0 ns

tPFH PIXCLK to FV HIGH PIXCLK slew rate = 4

Parallel slew rate = 7

–4.0 – –0.5 ns

tPLH PIXCLK to LV HIGH PIXCLK slew rate = 4

Parallel slew rate = 7

–4.0 – –0.5 ns

tPFL PIXCLK to FV LOW PIXCLK slew rate = 4

Parallel slew rate = 7

–4.0 – –0.5 ns

tPLL PIXCLK to LV LOW PIXCLK slew rate = 4

Parallel slew rate = 7

–4.0 – –0.5 ns

CLOAD Output load capacitance 10 pF

CIN Input pin capacitance 2.5 pF

Table 9: I/O Timing Characteristics (2.8V VDD_IO)1 (continued)

Conditions: fPIXCLK=74.25MHz (720P60fps) VDD_IO=2.8V;

slew rate setting = 4 for PIXCLK; slew rate setting = 7 for parallel ports

Symbol Definition Condition Min Typ Max Unit

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

Note: 1. Minimum and maximum values are taken at 70°C, 2.5V, and -30°C, 3.1V. The loading used is 10pF.

Note: 1. Minimum and maximum values are taken at 70°C, 1.7V, and -30°C, 1.95V. The loading used is 10pF.

Table 11: I/O Rise Slew Rate (2.8V VDD_IO)1

Parallel Slew Rate Conditions Min Typ Max Units

7 Default 1.50 2.50 3.90 V/ns

6 Default 0.98 1.62 2.52 V/ns

5 Default 0.71 1.12 1.79 V/ns

4 Default 0.52 0.82 1.26 V/ns

3 Default 0.37 0.58 0.88 V/ns

2 Default 0.26 0.40 0.61 V/ns

1 Default 0.17 0.27 0.40 V/ns

0 Default 0.10 0.16 0.23 V/ns

Table 12: I/O Fall Slew Rate (2.8V VDD_IO)1

Parallel Slew Rate Conditions Min Typ Max Units

7 Default 1.40 2.30 3.50 V/ns

6 Default 0.97 1.61 2.48 V/ns

5 Default 0.73 1.21 1.86 V/ns

4 Default 0.54 0.88 1.36 V/ns

3 Default 0.39 0.63 0.88 V/ns

2 Default 0.27 0.43 0.66 V/ns

1 Default 0.18 0.29 0.44 V/ns

0 Default 0.11 0.17 0.25 V/ns

Table 13: I/O Rise Slew Rate (1.8V VDD_IO)1

Parallel Slew Rate Conditions Min Typ Max Units

7 Default 0.57 0.91 1.55 V/ns

6 Default 0.39 0.61 1.02 V/ns

5 Default 0.29 0.46 0.75 V/ns

4 Default 0.22 0.34 0.54 V/ns

3 Default 0.16 0.24 0.39 V/ns

2 Default 0.12 0.17 0.27 V/ns

1 Default 0.08 0.11 0.18 V/ns

0 Default 0.05 0.07 0.10 V/ns

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

Note: 1. Minimum and maximum values are taken at 70°C, 1.7V, and -30°C, 1.95V. The loading used is 10pF.

DC Electrical Characteristics

The DC electrical characteristics are shown in the tables below.

Table 15: DC Electrical Characteristics

Table 14: I/O Fall Slew Rate (1.8V VDD_IO)1

Parallel Slew Rate Conditions Min Typ Max Units

7 Default 0.57 0.92 1.55 V/ns

6 Default 0.40 0.64 1.08 V/ns

5 Default 0.31 0.50 0.82 V/ns

4 Default 0.24 0.38 0.61 V/ns

3 Default 0.18 0.27 0.44 V/ns

2 Default 0.13 0.19 0.31 V/ns

1 Default 0.09 0.13 0.20 V/ns

0 Default 0.05 0.08 0.12 V/ns

Symbol Definition Condition Min Typ Max Unit

VDD Core digital voltage 1.7 1.8 1.95 V

VDD_IO I/O digital voltage 1.7/2.5 1.8/2.8 1.9/3.1 V

VAA Analog voltage 2.5 2.8 3.1 V

VAA_PIX Pixel supply voltage 2.5 2.8 3.1 V

VDD_PLL PLL supply voltage 2.5 2.8 3.1 V

VDD_SLVS Digital supply voltage Do not connect. – – – V

VIH Input HIGH voltage VDD_IO*0.7 – – V

VIL Input LOW voltage – – VDD_IO*0.3 V

IIN Input leakage current No pull-up resistor; VIN = VDD_IO or

DGND

20 – – A

VOH Output HIGH voltage VDD_IO-0.3 – – V

VOL Output LOW voltage – – 0.4 V

IOH Output HIGH current At specified VOH -22 – – mA

IOL Output LOW current At specified VOL ––22mA

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

Caution Stresses greater than those listed in Table 16 may cause permanent damage to the device.

This is a stress rating only, and functional operation of the device at these or any other con-

ditions above those indicated in the operational sections of this specification is not implied.

Notes: 1. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

2. To keep dark current and shot noise artifacts from impacting image quality, keep operating tem-

perature at a minimum.

Notes: 1. Operating currents are measured at the following conditions:

VAA=VAA_PIX=VDD_IO=VDD_PLL=2.8V

VDD=1.8V

PLL Enabled and PIXCLK=74.25MHz

TA = 25°C

Table 16: Absolute Maximum Ratings

Symbol Parameter Minimum Maximum Unit

VSUPPLY Power supply voltage (VDD and VAA

supplies)

–0.3 4.5 V

ISUPPLY Total power supply current – 200 mA

IGND Total ground current – 200 mA

VIN DC input voltage –0.3 VDD_IO + 0.3 V

VOUT DC output voltage –0.3 VDD_IO + 0.3 V

TSTG1Storage temperature –40 +85 °C

Table 17: Operating Current Consumption in Parallel Output

Definition Condition Symbol Min Typ Max Unit

Digital operating current Streaming, 1280x960 45fps IDD1 – 40 65 mA

I/O digital operating current Streaming, 1280x960 45fps IDD_IO –35– mA

Analog operating current Streaming, 1280x960 45fps IAA –3055mA

Pixel supply current Streaming, 1280x960 45fps IAA_PIX – 10 15 mA

PLL supply current Streaming, 1280x960 45fps IDD_PLL – 7 – mA

Digital operating current Streaming, 720p 60fps IDD1 –40– mA

I/O digital operating current Streaming, 720p 60fps IDD_IO - 35 – mA

Analog operating current Streaming, 720p 60fps IAA –30– mA

Pixel supply current Streaming, 720p 60fps IAA_PIX – 10 15 mA

PLL supply current Streaming, 720p 60fps IDD_PLL – 7 – mA

AR0130: 1/3-Inch CMOS Digital Image Sensor

Electrical Specifications

Notes: 1. Analog – VAA + VAA_PIX + VDD_PLL

2. Digital – VDD + VDD_IO + VDD_SLVS

Figure 32: Power Supply Rejection Ratio

Table 18: Standby Current Consumption

Definition Condition Symbol Min Typ Max Unit

Hard standby (clock off) Analog, 2.8V - – 70 200 μA

Digital, 1.8V - – 640 900 μA

Hard standby (clock on) Analog, 2.8V - – 275 – μA

Digital, 1.8V - – 1.55 – mA

Soft standby (clock off) Analog, 2.8V - – 70 200 μA

Digital, 1.8V - – 640 900 μA

Soft standby (clock on) Analog, 2.8V - – 275 – μA

Digital, 1.8V - – 1.55 – mA

1000 10000 100000 1000000



(

)

Frequency(Hz)

PowerSupplyRejectionRatio

AR0130: 1/3-Inch CMOS Digital Image Sensor

Power-On Reset and Standby Timing

Power-Up Sequence

The recommended power-up sequence for the AR0130 is shown in Figure 33. The avail-

able power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the

separation specified below.

1. Turn on VDD_PLL power supply.

2. After 0–10s, turn on VAA and VAA_PIX power supply.

3. After 0–10s, turn on VDD power supply.

4. After 0–10s, turn on VDD_IO power supply.

5. After the last power supply is stable, enable EXTCLK.

6. Assert RESET_BAR for at least 1ms.

7. Wait 150000 EXTCLKs (for internal initialization into software standby.

8. Configure PLL, output, and image settings to desired values.

9. Wait 1ms for the PLL to lock.

10. Set streaming mode (R0x301a[2] = 1).

Figure 33: Power Up

VDD_PLL (2.8)

VAA_PIX

VAA (2.8)

VDD_IO (1.8/2.8)

VDD (1.8)

VDD_SLVS

EXTCLK

RESET_BAR

t5 t6

Hard Reset Internal

Initialization

Software

Standby PLL Lock Streaming

AR0130: 1/3-Inch CMOS Digital Image Sensor

Power-On Reset and Standby Timing

Notes: 1. Xtal settling time is component-dependent, usually taking about 10 – 100 mS.

2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard

reset is held down by RC circuit, then the RC time must include the all power rail settle time and

Xtal settle time.

3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered

before or at least at the same time as the others. If the case happens that VDD_PLL is powered after

other supplies then sensor may have functionality issues and will experience high current draw on

this supply.

4. For the case where VDD_IO is 2.8V and VDD is 1.8V, it is recommended that the minimum time be

5s.

Table 19: Power-Up Sequence

Definition Symbol Minimum Typical Maximum Unit

VDD_PLL to VAA/VAA_PIX3t0 0 10 – s

VAA/VAA_PIX to VDD t1 0 10 – s

VDD to VDD_IO t2 0410 – s

VDD_IO to VDD_SLVS t3 0 10 – s

Xtal settle time tx – 301–ms

Hard Reset t4 12–– ms

Internal Initialization t5 150000 – – EXTCLKs

PLL Lock Time t6 1 – – ms

AR0130: 1/3-Inch CMOS Digital Image Sensor

Power-On Reset and Standby Timing

Power-Down Sequence

The recommended power-down sequence for the AR0130 is shown in Figure 34. The

available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have

the separation specified below.

1. Disable streaming if output is active by setting standby R0x301a[2] = 0

2. The soft standby state is reached after the current row or frame, depending on config-

uration, has ended.

3. Turn off VDD_SLVS, if used.

4. Turn off VDD_IO.

5. Turn off VDD.

6. Turn off VAA/VAA_PIX.

7. Turn off VDD_PLL.

Figure 34: Power Down

Note: t4 is required between power down and next power up time; all decoupling caps from regulators

must be completely discharged.

Table 20: Power-Down Sequence

Definition Symbol Minimum Typical Maximum Unit

VDD_SLVS to VDD_IO t0 0 – – s

VDD_IO to VDD t1 0 – – s

VDD to VAA/VAA_PIX t2 0 – – s

VAA/VAA_PIX to VDD_PLL t3 0 – – s

PwrDn until Next PwrUp Time t4 100 – – ms

VDD_IO (1.8/2.8)

t 0

EXTCLK

_SLVS

(1.8)

_PIX

(2.8)

_PLL (2.8)

Power Down until next Power up cycle

AR0130: 1/3-Inch CMOS Digital Image Sensor

Revision History

Rev. L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/9/15

• Updated “Ordering Information” on page 2

Rev. K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/13/15

• Updated “Ordering Information” on page 2

Rev. J. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/25/15

• Removed Confidential marking

• Updated Table of Contents format

Rev. H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/11/14

• Updated to ON Semiconductor template

Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/25/14

• Updated Table 1, “Key Parameters,” on page 1

• Updated Table 3, “,” on page 2

• Updated Figure 6, Pixel Color Pattern Detail (Top Right Corner)

• Updated “Default Readout Order” on page 12

• Updated note to Table 5, “Frame Time: Long Integration Time,” on page 16

• Updated Equation 2 on page 16

• Updated “Hard Standby” on page 21

• Updated “I/O Timing” on page 42

• Replaced Table 9, “I/O Timing Characteristics with Table 9, “I/O Timing Characteris-

tics (2.8V Vdd_IO)1,” on page 42 and Table 10, “I/O Timing Characteristics (1.8V

Vdd_IO)1,” on page 43

• Added Table 11, “I/O Rise Slew Rate (2.8V Vdd_IO)1,” on page 44

• Added Table 12, “I/O Fall Slew Rate (2.8V Vdd_IO)1,” on page 44

• Added Table 13, “I/O Rise Slew Rate (1.8V Vdd_IO)1,” on page 44

• Added Table 14, “I/O Fall Slew Rate (1.8V Vdd_IO)1,” on page 45

• Added Figure 32: “Power Supply Rejection Ratio,” on page 47

Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/14/13

• Updated Table 1, “Key Parameters,” on page 1

• Updated Table 2, “Available Part Numbers,” on page 1

• Updated Note 1 in “General Description” on page 6

• Updated “PLL-Generated Master Clock” on page 18

• Added Figure 13, Enter Standby Timing and Figure 14: “Exit Standby Timing,” on

page 20

• Updated “Bayer Space Resampling” on page 22

• Updated Figure 15: “Six Pixels in Normal and Column Mirror Readout Modes,” on

page 22

• Updated Figure 16: “Six Rows in Normal and Row Mirror Readout Modes,” on page 23

• Updated “Image Acquisition Modes” on page 25

• Updated “Automatic Exposure Control” on page 26

• Updated “Embedded Data and Statistics” on page 26

• Updated “Analog Gain” on page 29

• Updated “Black Level Correction” on page 29

• Updated “Column Triggering on Startup” on page 30

AR0130: 1/3-Inch CMOS Digital Image Sensor

Revision History

• Updated “Column Correction Retriggering Due to Mode Change” on page 30

• Updated Figure 26: “Quantum Efficiency – Monochrome Sensor,” on page 36

• Updated Note 4 in Figure 28: “48 iLCC Package Outline Drawing,” on page 38

Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/5/12

• Updated Table 2, “Available Part Numbers,” on page 1

• Updated “General Description” on page 6

Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/19/12

• Updated to Production

• Removed section “Defective Pixel Correction

• Updated Table 9, “I/O Timing Characteristics,” on page 41

• Updated Table 17, “Operating Current Consumption in Parallel Output ,” on page 46

• Updated Table 18, “Standby Current Consumption ,” on page 47

Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/16/12

• Updated “Features” on page 17

• Updated Table 1, “Key Parameters,” on page 1

• Updated Table 2, “Available Part Numbers,” on page 1

• Updated “General Description” on page 6

• Updated Figure 1: “Block Diagram,” on page 6

• Deleted Figure 2: “Typical Configuration: Serial Four-Lane HiSPi Interface” from p.6

and renumbered remaining figures.

• Updated notes for Figure 2: “Typical Configuration: Parallel Pixel Data Interface,” on

page 7

• Updated Table 3, “Pad Descriptions,” on page 8

• Updated Figure 3: “48-Pin iLCC Pinout Diagram,” on page 9

• Added Figure 4: “48-Pin PLCC Pinout Diagram,” on page 10

• Deleted section “Serial Output Data Timing”

• Updated title of Figure 26: “Quantum Efficiency – Monochrome Sensor,” on page 36

• Updated Figure 27: “Quantum Efficiency – Color Sensor,” on page 37

• Added Figure 29: “48 PLCC Package Outline Drawing,” on page 39

• Updated “Electrical Specifications” on page 40

• Updated Table 8, “Two-Wire Serial Bus Characteristics,” on page 41

• Updated Table 15, “DC Electrical Characteristics,” on page 45

• Updated Table 16, “Absolute Maximum Ratings,” on page 46

• Deleted Table 13: Operating Currents in HiSPi Output and renumbered succeeding

tables

• Deleted section “HiSPi Electrical Specifications”

• Updated Figure 33: “Power Up,” on page 48

• Updated “Power-Down Sequence” on page 50

• Updated Figure 34: “Power Down,” on page 50

Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9/12/11

• Updated “Features” on page 17

• Updated Table 1, “Key Parameters,” on page 1

• Updated Table 2, “Available Part Numbers,” on page 1

• Added note to Figure 2: “Typical Configuration: Parallel Pixel Data Interface,” on

page 7

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AR0130: 1/3-Inch CMOS Digital Image Sensor

Revision History

• Updated note 4 in Figure 2: “Typical Configuration: Parallel Pixel Data Interface,” on

page 7

• Added Figure 3: “48-Pin iLCC Pinout Diagram,” on page 9

• Updated “Parallel Output Data Timing” on page 14

• Updated Figure 12: “Timing Diagram,” on page 15

• Updated Table 4, “Frame Time (Example Based on 1280 x 960, 45 Frames Per

Second),” on page 15

• Updated Table 6, “Real-Time Context-Switchable Registers,” on page 17

• Updated “To Configure and Use the PLL:” on page 18

• Updated “To Enter Soft Standby:” on page 19

• Updated “Single Frame” on page 25

• Deleted “Temperature Sensor”

• Updated “Embedded Statistics” on page 27

• Updated “Column Correction Retriggering Due to Mode Change” on page 30

• Added Figure 28: “48 iLCC Package Outline Drawing,” on page 38

• Updated Figure 30: “Two-Wire Serial Bus Timing Parameters,” on page 40

• Updated Table 8, “Two-Wire Serial Bus Characteristics,” on page 41

• Updated note 1 in Table 18, “Standby Current Consumption ,” on page 47

• Updated “Power-Up Sequence” on page 48

• Updated Figure 33: “Power Up,” on page 48

• Updated Table 19, “Power-Up Sequence,” on page 49

• Updated “Power-Down Sequence” on page 50

• Updated Figure 34: “Power Down,” on page 50

• Updated Table 20, “Power-Down Sequence,” on page 50

Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3/1/11

•Initial release