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©2009 by RF Monolithics, Inc. SF2145B - 7/9/09
Electric al Char ac teristi cs
Characteristic Sym Notes Min Typ Max Units
Center Frequency fC1 895 MHz
Source Impedance, single ended 50 Ω
Load Impedance, single ended 50 Ω
1 dB Bandwidth 18 MHz
Insertion Loss, 894 to 895.5 MHz IL 8.5 9.0 dB
Insertion Loss Variation: Any point within 894 to 895.5 MHz
measured at a constant temperature with the
RF input level varying from +10 to +20 dBm 0.3 ∆dB
Amplitude Ripple, 894 to 895.5 MHz .35 .75 dB
Average Group Delay, 894 to 895.5 MHz 804 814 824 ns
Group Delay Variation, 894.0 to 895.5 MHz 10 25 nsP-P
Input / Output Return Loss at fC10 15 dB
Temperature Coefficient -18 ppm/K
Case Style SMP-03 7.0 x 5.0 mm Nominal Footprint
Lid Symbolization (YY=year, WW=week) See note 4 RFM SF2145B YYWW
SMP-03
895 MHz
SAW Filter
SF2145B
1. Unless noted otherwise, al l spe cifications apply over the operating tem-
peratur e range with filter soldered to the specified demonstrat ion board
with impedance matching to 50 Ω and measured with 50 Ω network ana-
lyzer.
2. Unless noted otherwise, all frequenc y specifications are referenced to the
nominal cent er frequency, fc.
3. Rejection is measured as attenuation below the minimum IL point in the
passband. Rejection in final user application is dependent on PCB layout
and exter nal impeda nce matching design. Se e Applicat ion Note No . 42 for
details.
4. "LRIP" or "L" after the part number indicates "low rate initial production"
and "ENG" or "E" indicates "engineering prototypes."
5. The design, manufacturing process, and specifications of this filter are
subject to change.
6. Either Port 1 or Por t 2 may be us ed for eit her inpu t or out put in th e desig n.
However, i mpeda nces and impe dance matc hi ng may va ry between Port 1
and Port 2, so that the filter mus t always be installed in one directi on per
the circuit design.
7. US and international patents may apply.
8. RFM, stylized RFM logo , and RF Monolithics, Inc., are registered
trademark s of RF Mon olithics, Inc.
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
• SAW Filter, 895 MHz, 15 MHz BW
• 7.0 X 5.0 mm 10 pin Surface-Mount Case
• Complies with Directive 2002/95/EC (RoHS)
Absolute Maximum Ratings
Rating Value Units
Maximum Incident Power in Passband +20 dBm
Maximum DC Voltage Between any Two Terminals 0 VDC
Operating Temperature Range -20 to +70 °C
Pb
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©2009 by RF Monolithics, Inc. SF2145B - 7/9/09
Tesi ng Envi ronment
CH1 S11 1 U FS
CENTR 899 . 700 MHz SPAN 50 . 000 MHz
Cor
PRm
CH2 S21 LOG 1 dB/ REF -10 dB
CENTER 899 . 700 000 MHz SPAN 50 . 000 000 MHz
Cor
PRm
CH3 S22 1 U FS
CENTR 899 . 700 MHz SPAN 50 . 000 MHz
Cor
18 Feb 2008 13:27:10
1
1 : 60 . 025 -1 . 6348 108 . 21 pF
899 . 700 000 MHz
1
2
3 4
1 : 0. 0000 dB 0. 000 000 MHz
Max REF=1
CH2 Markers
BW: 26 . 232706 MHz
cent : 900 . 034584 MHz
Q: 34 . 310
1_ loss : -7 . 7333 dB
1
1 : 55 . 941 -5 . 0742 34 . 862 pF
899 . 700 000 MHz
SF2145B DEMO
DEVICE # 49
Full
Full
38
Note: Unmatched Filter to 50Ω Input / Output.
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©2009 by RF Monolithics, Inc. SF2145B - 7/9/09
CH1 S21 DE L 100 ns/ REF 800 ns
Cor
Smo
PRm
CH2 S21 LOG 1 dB/ REF -10 dB
CH2 CENTER 899 . 700 000 MHz SPAN 50 . 000 000 MHz
Cor
PRm
18 Feb 2008 13:26:55
1
2
2 : 667 . 57 ps 1. 500 000 MHz
REF=1
CH1 Markers
mean : 812 . 88 ns
s. dev : 1. 2799 ns
p-p : 4. 4631 ns
1
2
2 : . 11980 dB 1. 500 000 MHz
REF=1
CH2 Markers
mean : -8 . 0196 dB
s. dev : . 06000 dB
p-p : . 24780 dB
SF2145B DEMO
DEVICE # 49
Resp
Resp
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©2009 by RF Monolithics, Inc. SF2145B - 7/9/09
Tape and Reel Specifications
“B “
Nominal Size Quantity Per Reel
Inches millimeters
7 178 500
13 330 2000
USER DIRECTION OF FEED
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
Ao 5.5 mm
Bo 7.5 mm
Ko 2.0 mm
Pitch 8.0 mm
W16.0 mm
PIN #1
See Detail "A"
13.0
20.2
2.0
12.0
100 REF.
"B" REF.
16.0
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©2009 by RF Monolithics, Inc. SF2145B - 7/9/09
SMP-03 Case
Recommended PCB Footprint
Case Dimensions
Dimension mm Inches
Min Nom Max Min Nom Max
A6.80 7.00 7.20 0.268 0.276 0.283
B4.80 5.00 5.20 0.189 0.197 0.205
C1.65 2.00 0.065 0.079
D.47 0.60 .73 0.019 0.024 0.029
E2.41 2.54 2.67 0.095 0.100 0.105
H0.87 1.0 1.13 0.034 0.039 0.044
J4.87 5.00 5.13 0.192 0.197 0.202
K2.87 3.00 3.13 0.113 0.118 0.123
P1.14 1.27 1.40 0.045 0.050 0.055
Electrical Connections
Connection Terminals
Inp u t (P o rt 1) 3
Output (Port 2) 8
Case Ground 2, 4, 7, 9
To Be Grounded 1, 2, 4, 5, 6, 7, 9, 10
Materials
Solder Pad
Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating 2.0 to 3.0 µm Nickel
Body Al2O3 Ceramic
Pb Free
A
BCHE
P
D
H
J
K
10-Terminal Ceramic Surface-Mount Case
7 x 5 mm Nominal Footprint
