SVA-1268123
SVA-1268101
SVA-1268102
LM60/LM60-Q1
LM60/LM60-Q1
www.ti.com
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
LM60/LM60-Q1 2.7V, SOT-23 or TO-92 Temperature Sensor
Check for Samples: LM60/LM60-Q1
1FEATURES DESCRIPTION
The LM60/LM60-Q1 is a precision integrated-circuit
• Calibrated linear scale factor of +6.25 mV/°C temperature sensor that can sense a −40°C to
• Rated for full −40°C to +125°C range +125°C temperature range while operating from a
• Suitable for remote applications single +2.7V supply. The LM60/LM60-Q1's output
voltage is linearly proportional to Celsius (Centigrade)
• Available in SOT-23 and TO-92 packages temperature (+6.25 mV/°C) and has a DC offset of
• LM60Q is AEC-Q100 Grade 1 qualified and is +424 mV. The offset allows reading negative
manufactured on an Automotive Grade flow. temperatures without the need for a negative supply.
The nominal output voltage of the LM60/LM60-Q1
APPLICATIONS ranges from +174 mV to +1205 mV for a −40°C to
+125°C temperature range. The LM60/LM60-Q1 is
• Automotive calibrated to provide accuracies of ±2.0°C at room
• Cell Phones & Computers temperature and ±3°C over the full −25°C to +125°C
• Power Supply Modules temperature range.
• Battery Management The LM60/LM60-Q1's linear output, +424 mV offset,
• FAX Machines & Printers and factory calibration simplify external circuitry
required in a single supply environment where
• HVAC & Disk Drives reading negative temperatures is required. Because
• Appliances the LM60/LM60-Q1's quiescent current is less than
110 μA, self-heating is limited to a very low 0.1°C in
KEY SPECIFICATIONS still air in the SOT-23 package. Shutdown capability
for the LM60/LM60-Q1 is intrinsic because its
• Accuracy at 25°C: ±2.0°C and ±3.0°C (max) inherent low power consumption allows it to be
• Accuracy for −40°C to +125°C: ±4.0°C (max) powered directly from the output of many logic gates.
• Accuracy for −25°C to +125°C: ±3.0°C (max) TYPICAL APPLICATION
• Temperature Slope: +6.25mV/°C
• Power Supply Voltage Range: +2.7V to +10V
• Current Drain at 25°C: 110μA (max)
• Nonlinearity: ±0.8°C (max)
• Output Impedance: 800Ω(max)
CONNECTION DIAGRAMS
SOT-23 (TOP VIEW)
VO= (+6.25 mV/°C × T°C) + 424 mV
Temperature (T) Typical VO
+125°C +1205 mV
+100°C +1049 mV
+25°C +580 mV
TO-92 (BOTTOM VIEW) 0°C +424 mV
–25°C +268 mV
–40°C +174 mV
Figure 1. Full-Range Centigrade Temperature Sensor
(−40°C to 125°C) Operating from a Single Li-Ion
Battery Cell
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
ACCURACY OVER SPECIFIED SPECIFIED
ORDER NUMBER DEVICE TOP MARK TEMPERATURE RANGE TEMPERATURE RANGE
LM60BIM3 T6B ±3 –25°C ≤TA≤+125°C
LM60BIM3X T6B
LM60CIM3 T6C ±4 –40°C ≤TA≤+125°C
LM60CIM3X T6C
LM60QIM3 L60Q ±4 –40°C ≤TA≤+125°C
LM60QIM3X L60Q
LM60BIZ LM60BIZ ±3 –25°C ≤TA ≤+125°C
LM60CIZ LM60CIZ ±4 –40°C ≤TA ≤+125°C
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) VALUE UNIT
Supply voltage +12 to −0.2 V
Output voltage (+VS+ 0.6) to −0.6 V
Output current 10 mA
Input Current at any pin (2) 5 mA
Human Body Model 2500 V
ESD Susceptibility(3) SOT-23 250 V
Machine Model TO-92 200 V
Storage temperature −65 to +150 °C
Maximum junction temperature (TJMAX) 125 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI< GND or VI> +VS), the current at that pin should be limited to 5 mA.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
RECOMMENDED OPERATING CONDITIONS(1)
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
TMIN ≤TA≤TMAX
Specified Temperature Range: LM60B –25 ≤TA≤+125 °C
LM60C/LM60-Q1 –40 ≤TA≤+125 °C
Supply Voltage Range (+VS) 2.7 10 V
Thermal Resistance, θJA (2) SOT-23 450 °C/W
TO-92 180 °C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
2Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated
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SNIS119D –MAY 2004–REVISED NOVEMBER 2012
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, these specifications apply for +VS= +3.0 VDC and ILOAD = 1 μA. Boldface limits apply for TA= TJ=
TMIN to TMAX; all other limits TA= TJ= 25°C. LM60B LM60C/LM60-Q1
PARAMETER CONDITIONS TYPICAL(1) UNITS (Limit)
Limits(2) Limits(2)
±2.0 ±3.0 °C (max)
Accuracy(3) ±3.0 ±4.0 °C (max)
Output Voltage at 0°C +424 mV
Nonlinearity(4) ±0.6 ±0.8 °C (max)
+6.25 6.06 6 mV/°C (min)
Sensor Gain (Average Slope) 6.44 6.5 mV/°C (max)
Output Impedance 800 800 Ω(max)
+3.0 V ≤+VS≤+10 V ±0.3 ±0.3 mV/V (max)
Line Regulation(5) +2.7 V ≤+VS≤+3.3 V ±2.3 ±2.3 mV (max)
+2.7 V ≤+VS≤+10 V 82 110 110 μA (max)
Quiescent Current 125 125 μA (max)
Change of Quiescent Current +2.7 V ≤+VS≤+10 V ±5.0 μA (max)
Temperature Coefficient of Quiescent Current 0.2 μA/°C
TJ= TMAX = +125°C
Long Term Stability(6) ±0.2 °C
for 1000 hours
(1) Typicals are at TJ= TA= 25°C and represent most likely parametric norm.
(2) Limits are specified to National's AOQL (Average Outgoing Quality Level).
(3) Accuracy is defined as the error between the output voltage and +6.25 mV/°C times the device's case temperature plus 424 mV, at
specified conditions of voltage, current, and temperature (expressed in °C).
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's
rated temperature range.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature
cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;
allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after
1000 hours will not continue at the first 1000 hour rate.
Copyright © 2004–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM60/LM60-Q1
SVA-1268109
SVA-1268110
SVA-1268107
SVA-1268108
0
SVA-1268105
SVA-1268106
SVA-1268103
SVA-1268104
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
TYPICAL CHARACTERISTICS
To generate these curves the LM60/LM60-Q1 was mounted to a printed circuit board as shown in Figure 13.
Thermal Resistance Junction to Air Thermal Time Constant
Figure 2. Figure 3.
Thermal Response in Still Air Thermal Response in Stirred
with Heat Sink Oil Bath with Heat Sink
Figure 4. Figure 5.
Thermal Response in Still Air
Start-Up Voltage vs Temperature without a Heat Sink
Figure 6. Figure 7.
Quiescent Current vs Temperature Accuracy vs Temperature
Figure 8. Figure 9.
4Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM60/LM60-Q1
SVA-1268122
SVA-1268111
SVA-1268112
LM60/LM60-Q1
www.ti.com
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
TYPICAL CHARACTERISTICS (continued)
To generate these curves the LM60/LM60-Q1 was mounted to a printed circuit board as shown in Figure 13.
Noise Voltage Supply Voltage vs Supply Current
Figure 10. Figure 11.
Start-Up Response
Figure 12.
Copyright © 2004–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM60/LM60-Q1
SVA-1268114
LM60/LM60-Q1
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
APPLICATION INFORMATION
NOTE: 1/2" Square Printed Circuit Board with 2 oz. Copper Foil or Similar.
Figure 13. Printed Circuit Board Used for Heat Sink to Generate All Curves
Mounting
The LM60/LM60-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It
can be glued or cemented to a surface. The temperature that the LM60/LM60-Q1 is sensing will be within about
+0.1°C of the surface temperature that LM60/LM60-Q1's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature of the LM60/LM60-
Q1 die would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM60/LM60-Q1 die is directly attached to the GND pin.
The lands and traces to the LM60/LM60-Q1 will, of course, be part of the printed circuit board, which is the object
whose temperature is being measured. These printed circuit board lands and traces will not cause the
LM60/LM60-Q1's temperature to deviate from the desired temperature.
Alternatively, the LM60/LM60-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a
bath or screwed into a threaded hole in a tank. As with any IC, the LM60/LM60-Q1 and accompanying wiring and
circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may
operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as
Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM60/LM60-Q1 or
its connections.
The thermal resistance junction to ambient (θJA ) is the parameter used to calculate the rise of a device junction
temperature due to the device power dissipation. For the LM60/LM60-Q1 the equation used to calculate the rise
in the die temperature is as follows:
TJ= TA+θJA [(+VSIQ) + (+VS−VO) IL]
where IQis the quiescent current and ILis the load current on the output.
Table 1 summarizes the rise in die temperature of the LM60/LM60-Q1 without any loading, and the thermal
resistance for different conditions.
6Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM60/LM60-Q1
SVA-1268117
SVA-1268116
LM60/LM60-Q1
SVA-1268115
LM60/LM60-Q1
LM60/LM60-Q1
www.ti.com
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
Table 1. Temperature Rise of LM60/LM60-Q1 Due to Self-Heating and Thermal Resistance (θJA)
SOT-23(1) SOT-23(2) TO-92(1) TO-92(3)
no heat sink small heat fin no heat fin small heat fin
θJA TJ−TAθJATJ−TAθJATJ−TAθJATJ−TA
(°C/W) (°C) (°C/W) (°C)
Still air 450 0.17 260 0.1 180 0.07 140 0.05
Moving air 180 0.07 90 0.034 70 0.026
(1) Part soldered to 30 gauge wire.
(2) Heat sink used is 1/2" square printed circuit board with 2 oz. foil with part attached as shown in Figure 13.
(3) Part glued or leads soldered to 1” square of 1/16” printed circuit board with 2 oz. foil or similar.
Capacitive Loads
The LM60/LM60-Q1 handles capacitive loading well. Without any special precautions, the LM60/LM60-Q1 can
drive any capacitive load as shown in Figure 14. Over the specified temperature range the LM60/LM60-Q1 has a
maximum output impedance of 800Ω. In an extremely noisy environment it may be necessary to add some
filtering to minimize noise pickup. It is recommended that 0.1 μF be added from +V S to GND to bypass the
power supply voltage, as shown in Figure 15. In a noisy environment it may be necessary to add a capacitor
from the output to ground. A 1 μF output capacitor with the 800Ωoutput impedance will form a 199 Hz lowpass
filter. Since the thermal time constant of the LM60/LM60-Q1 is much slower than the 6.3 ms time constant
formed by the RC, the overall response time of the LM60/LM60-Q1 will not be significantly affected. For much
larger capacitors this additional time lag will increase the overall response time of the LM60/LM60-Q1.
Figure 14. LM60/LM60-Q1 No Decoupling Required Figure 15. LM60/LM60-Q1 with Filter for Noisy
for Capacitive Load Environment
Figure 16. Simplified Schematic
Copyright © 2004–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM60/LM60-Q1
SVA-1268119
LM60/LM60-Q1
R1
4.1V
R3
R2
0.1 F
U3LM4040
R4
VOUT
V+
VT
VTemp
+
-U1
LM60V+
U2
(Low = overtemp alarm)
VT1
VT2
VTEMP
VOUT
VT1 =
R1 + R2||R3
(4.1)R2
VT2 =
R2 + R1||R3
(4.1)R2||R3
LM7211
SVA-1268118
LM60/LM60-Q1
LM60/LM60-Q1
SNIS119D –MAY 2004–REVISED NOVEMBER 2012
www.ti.com
Applications Circuits
Figure 17. Centigrade Thermostat
Figure 18. Conserving Power Dissipation with Shutdown
8Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM60/LM60-Q1
PACKAGE OPTION ADDENDUM
www.ti.com 3-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM60BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -25 to 125 T6B
LM60BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B
LM60BIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -25 to 125 T6B
LM60BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B
LM60BIZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS
& no Sb/Br) SNCU | CU SN N / A for Pkg Type LM60
BIZ
LM60BIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type -25 to 125 LM60
BIZ
LM60CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 T6C
LM60CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C
LM60CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 T6C
LM60CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C
LM60CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 125 LM60
CIZ
LM60QIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L60Q
LM60QIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L60Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 3-Nov-2013
Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM60, LM60-Q1 :
•Catalog: LM60
•Automotive: LM60-Q1
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM60BIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60BIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60QIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM60QIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Oct-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM60BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM60BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM60CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM60CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM60QIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM60QIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Oct-2013
Pack Materials-Page 2
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