BAT54T/AT/CT/ST
Document number: DS30259 Rev. 16 - 2
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© Diodes Incorporated
BAT54T/AT/CT/ST
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
Ultra-Small Surface Mount Package
Low Forward Voltage Drop
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT523
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Annealed over Alloy 42 Leadframe.
Solderable per MIL-STD-202, Method 208
Lead-Free Plating
Polarity: See Diagrams Below
Weight: 0.002 grams (Approximate)
Top View
BAT54T
BAT54AT
BAT54ST
Ordering Information (Note 4)
Part Number
Case
Packaging
BAT54T-7-F
SOT523
3,000/Tape & Reel
BAT54AT-7-F
SOT523
3,000/Tape & Reel
BAT54CT-7-F
SOT523
3,000/Tape & Reel
BAT54ST-7-F
SOT523
3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
Date Code Key
Year
2002
…
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
Code
N
…
B
C
D
E
F
G
H
I
J
K
L
M
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
xx = Product Type Marking Code
L1 = BAT54T
L2 = BAT54AT
L3 = BAT54CT
L4 = BAT54ST
YM or YM = Date Code Marking
Y or Y = Year (ex: F = 2018)
M = Month (ex: 9 = September)
xx YM
BAT54T/AT/CT/ST
Document number: DS30259 Rev. 16 - 2
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www.diodes.com
May 2018
© Diodes Incorporated
BAT54T/AT/CT/ST
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30
V
Forward Continuous Current (Note 5)
IFM
200
mA
Repetitive Peak Forward Current
IFRM
300
mA
Non-Repetitive Peak Forward Surge Current
8.3ms Single Half Sine-Wave Superimposed on Rated Load
IFSM
600
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 5)
PD
150
mW
Typical Thermal Resistance, Junction to Ambient (Note 5)
RJA
490
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 6)
V(BR)R
30
V
IR = 100µA
Forward Voltage
VF
240
320
400
500
1,000
mV
IF = 0.1mA
IF = 1mA
IF = 10mA
IF = 30mA
IF = 100mA
Reverse Leakage Current (Note 6)
IR
2.0
µA
VR = 25V
Total Capacitance
CT
10
pF
VR = 10V, f = 1.0MHz
Reverse Recovery Time
tRR
5.0
ns
IF = IR = 10mA，
IRR = 0.1 x IR, RL = 100Ω
Notes: 5. Device mounted on FR-4 substrate PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/package-outlines.html.
6. Short duration pulse test used to minimize self-heating effect.
0.1
0.01
1
0.001
0.0001 01.00.4 0.6 0.8
0.2
I , INSTANTANEOUS FORWARD CURRENT (A)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Typical Forward Characteristics
F
0.001
0.01
0.1
10
1
100
0510 15 20 25 30
V , INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 2 Typical Reverse Characteristics
R
BAT54T/AT/CT/ST
Document number: DS30259 Rev. 16 - 2
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May 2018
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BAT54T/AT/CT/ST
0
2
4
10
8
6
12
010 15
520 30
25
C , TOTAL CAPACITANCE (pF)
T
V , DC REVERSE VOLTAGE (V)
Fig. 3 Total Capacitance vs. Reverse Voltage
R
0
100
025 50 75 100 125
P , POWER DISSIPATION (mW)
D
T , AMBIENT TEMPERATURE ( C)
Fig. 4 Power Derating Curve
A°
200
Note 5
BAT54T/AT/CT/ST
Document number: DS30259 Rev. 16 - 2
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May 2018
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BAT54T/AT/CT/ST
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT523
E1
E
b
e1
D
A3
e
A2
A1 L
ca
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT523
Y1
X
Y
X1
C
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These dimensions
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by
adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns,
and for International grid details, please see document IEC, Publication 97.
Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between
device Terminals and PCB tracking.
SOT523
Dim
Min
Max
Typ
A1
0.00
0.10
0.05
A2
0.60
0.80
0.75
A3
0.45
0.65
0.50
b
0.15
0.30
0.22
c
0.10
0.20
0.12
D
1.50
1.70
1.60
E
1.45
1.75
1.60
E1
0.75
0.85
0.80
e
0.50 BSC
e1
0.90
1.10
1.00
L
0.20
0.40
0.33
a
0°
--
8°
All Dimensions in mm
Dimensions
Value
(in mm)
C
1.29
X
0.40
X1
0.70
Y
0.51
Y1
1.80
BAT54T/AT/CT/ST
Document number: DS30259 Rev. 16 - 2
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May 2018
© Diodes Incorporated
BAT54T/AT/CT/ST
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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website, harmless against all damages.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
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