BF998@215 - NXP SEMICONDUCTORS

TLP781/TLP781F

2014-09-08

TOSHIBA Photocoupler GaAs IRED & Photo−Transistor

TLP781, TLP781F

Office Equipment

Household Appliances

Solid State Relays

Switching Power Supplies

Various Controllers

Signal Transmission between Different Voltage

Circuits

The TOSHIBA TLP781 consists of a silicone photo−transistor

optically coupled to a gallium arsenide infrared emitting diode in a

four lead plastic DIP (DIP4) with having high isolation voltage

(AC: 5kVRMS (min)).

• TLP781 : 7.62mm pitch type DIP4

• TLP781F : 10.16mm pitch type DIP4

• Collector-emitter voltage: 80V (min)

• Current transfer ratio: 50% (min)

Rank GB: 100% (min)

• Isolation voltage: 5000Vrms (min)

• UL recognized: UL1577, file No. E67349

• BSI approved: BS EN60065:2002

Approved no.8961

BS EN60950-1:2006

Approved no.8962

• SEMKO approved:EN60065:2002

Approved no.800514

EN60950-1:2001, EN60335-1:2002

Approved no.800517

• Option(D4)type

VDE approved : DIN EN60747-5-5

Certificate No. 40021173

(Note): When an EN60747-5-5 approved type is needed,

Please designate “Option (D4)”

• Construction mechanical rating

7.62mm Pitch

Standard Type

10.16mm Pitch

TLPxxxF Type

Creepage distance 6.5mm (min) 8.0mm (min)

Clearance 6.5mm (min) 8.0mm (min)

Insulation thickness 0.4mm (min) 0.4mm (min)

Unit: mm

TOSHIBA

Weight: 0.25g (typ.)

Unit: mm

TOSHIBA

Weight: 0.25g (typ.)

Pin Configurations

(top view)

TLP781

TLP781F

1 : Anode

2 : Cathode

3 : Emitte

4 : Collecto

Start of commercial production

2007/07

TLP781/TLP781F

2014-09-08

Current Transfer Ratio

Type Classification

(Note 1)

Current Transfer Ratio (%)

(IC / IF) Marking Of Classification

IF = 5mA, VCE = 5V, Ta = 25°C

Min Max

TLP781

(None) 50 600 Blank, Y+, YE, G, G+, GR, B, BL,GB

Rank Y 50 150 YE

Rank GR 100 300 GR

Rank BL 200 600 BL

Rank GB 100 600 GB

Rank YH 75 150 Y+

Rank GRL 100 200 G

Rank GRH 150 300 G+

Rank BLL 200 400 B

(Note 1): Ex. rank GB: TLP781 (GB)

(Note 2): Application type name for certification test, please use standard product type name, i. e.

TLP781 (GB): TLP781

Absolute Maximum Ratings (Ta = 25°C)

Characteristic Symbol Rating Unit

LED

Forward current IF 60 mA

Forward current derating (Ta ≥ 39°C) ∆IF / °C −0.7 mA / °C

Pulse forward current (Note 3) IFP 1 A

Power dissipation PD 100 mW

Power dissipation derating ∆PD / °C −1.0 mW / °C

Reverse voltage VR 5 V

Junction temperature Tj 125 °C

Detector

Collector−emitter voltage VCEO 80 V

Emitter−collector voltage VECO 7 V

Collector current IC 50 mA

Power dissipation PC 150 mW

Power dissipation derating (Ta ≥ 25°C) ∆PC / °C −1.5 mW / °C

Junction temperature Tj 125 °C

Operating temperature range Topr −55 to 110 °C

Storage temperature range Tstg −55 to 125 °C

Lead soldering temperature (10s) Tsol 260 °C

Total package power dissipation PT 250 mW

Total package power dissipation derating

(Ta ≥ 25°C) ∆PT / °C −2.5 mW / °C

Isolation voltage (Note 4) BVS 5000

Vrms

(Note): Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if

the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc.).

(Note 3): 100 μs pulse, 100 Hz frequency

(Note 4): AC, 1 minute, R.H.≤ 60%. Apply voltage to LED pin and detector pin together.

TLP781/TLP781F

2014-09-08

Recommended Operating Conditions

Characteristic Symbol Min Typ. Max Unit

Supply voltage VCC ― 5 24 V

Forward current IF ― 16 25 mA

Collector current IC ― 1 10 mA

Operating temperature Topr −25 ― 85 °C

(Note): Recommended operating conditions are given as a design guideline to obtain

expected performance of the device.

Additionally, each item is an independent guideline respectively.

In developing designs using this product, please confirm specified characteristics

shown in this document.

Individual Electrical Characteristics (Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

LED

Forward voltage VF I

F = 10 mA 1.0 1.15 1.3 V

Reverse current IR V

R = 5 V ― ― 10 μA

Capacitance CT V = 0, f = 1 MHz ― 30 ― pF

Detector

Collector−emitter

breakdown voltage V(BR) CEO I

C = 0.5 mA 80 ― ― V

Emitter−collector

breakdown voltage V(BR) ECO I

E = 0.1 mA 7 ― ― V

Collector dark current ID(ICEO)

VCE = 24 V ― 0.01 0.1 μA

VCE = 24 V, Ta = 85°C ― 0.6 50 μA

Capacitance (collector to emitter) CCE V = 0, f = 1 MHz ― 10 ― pF

Coupled Electrical Characteristics (Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Current transfer ratio IC / IF

IF = 5 mA, VCE = 5 V

Rank GB

50 ― 600

100 ― 600

Saturated CTR IC / IF (sat)

IF = 1 mA, VCE = 0.4 V

Rank GB

― 60 ―

30 ― ―

Collector−emitter saturation voltage VCE (sat)

IC = 2.4 mA, IF = 8 mA ― ― 0.4

IC = 0.2 mA, IF = 1 mA

Rank GB

― 0.2 ―

― ― 0.4

Isolation Characteristics (Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Capacitance

(input to output) CS VS = 0, f = 1 MHz ― 0.8 ― pF

Isolation resistance RS VS = 500 V 1×1012 1014 ― Ω

Isolation voltage BVS

AC, 1 minute 5000 ― ―

Vrms

AC, 1 second, in oil ― 10000 ―

DC, 1 minute, in oil ― 10000 ― Vdc

TLP781/TLP781F

2014-09-08

Switching Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Rise time tr

VCC = 10 V, IC = 2 mA

RL = 100Ω

― 2 ―

μs

Fall time tf ― 3 ―

Turn−on time ton ― 3 ―

Turn−off time toff ― 3 ―

Turn−on time tON

RL = 1.9 kΩ (Note 5)

VCC = 5 V, IF = 16 mA

― 2 ―

μs

Storage time ts ― 25 ―

Turn−off time tOFF ― 50 ―

Surface-Mount Lead Form Options

TOSHIBA ―

Weight: 0.24g (typ.)

TOSHIBA ―

Weight: 0.24g (typ.)

(Note 5): Switching time test circuit

VCE

VCC

tON

4.5V

0.5V

tOFF

VCC

VCE

Unit: mm Unit: mm

TLP781F(LF7)

TLP781(LF6)

TLP781/TLP781F

2014-09-08

Specifications for Embossed-Tape Packing: (TP6), (TP7)

1. Applicable Package

Package Name Product Type

DIP4LF6 TLP781

DIP4LF7 TLP781F

2. Product Naming System

Type of package used for shipment is denoted by a symbol suffix after a product number. The method of

classification is as below.

(Example 1)

ＴＬＰ７８１（ＢＬ－ＴＰ６）

Tape type

CTR rank

Device name

(Example 2)

ＴＬＰ７８１F（ＢＬ－ＴＰ７）

Tape type

CTR rank

Device name

3. Tape Dimensions

3.1 Orientation of Device in Relation to Direction of Tape Movement

Device orientation in the recesses is as shown in Figure 1.

Figure1 Device Orientation

3.2 Tape Packing Quantity: 2000 devices per reel

3.3 Empty Device Recesses Are as Shown in Table 1.

Table1 Empty Device Recesses

Standard Remarks

Occurrences of 2 or more

successive empty device

recesses

0 Within any given 40-mm section of

tape, not including leader and trailer

Single empty device

recesses 6 devices (max.) per reel Not including leader and trailer

3.4 Start and End of Tape

The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes.

Tape feed

TLP781/TLP781F

2014-09-08

3.5 Tape Specification

[1] TLP781 (TP6)

(1)Tape material: Plastic

(2)Dimensions: The tape dimensions are as shown in Figure 2.

Figure 2 Tape Forms

[2] TLP781F (TP7)

(1)Tape material: Plastic

(2)Dimensions: The tape dimensions are as shown in Figure 3.

Figure 3 Tape Forms

7.5±0.1

0.33±0.02

4.45±0.1

10.6±0.1

4.2±0.1

1.75±0.1

8.0±0.1 4.0±0.1

2.0±0.1

φ1.5

+0.2

-0

φ1.5

+0.1

-0

16.0

+0.2

-0.1

11.5±0.1

0.33±0.02

5.05±0.1

12.35±0.1

24.0

4.4±0.1

1.75±0.1

8.0±0.1 4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

+0.3

-0.1

φ1.5

+0.25

-0

TLP781/TLP781F

2014-09-08

3.6 Reel Specification

[1] TLP781 (TP6)

(1)Material: Plastic

(2)Dimensions: The reel dimensions are as shown in Figure 4.

Figure 4 Reel Forms

[2] TLP781F (TP7)

(1)Material: Plastic

(2)Dimensions: The reel dimensions are as shown in Figure 5.

Figure 5 Reel Forms

4. Packing

One reel of photocouplers is packed in a shipping carton.

5. Label Indication

The carton bears a label indicating the product number, the symbol representing classification of standard, the

quantity, the lot number and the Toshiba company name.

6. Ordering Information

When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as

shown in the following example.

(Example)

ＴＬＰ７８１（ＢＬ－ＴＰ６）2000Pcs.

Quantity (must be a multiple of 2000)

Tape type

CTR rank

Device name

(Note): The order code may be suffixed with wither a letter or a digit.

Please contact your nearest Toshiba sales representative for more details.

16.4

23max

332 max

102±1.5

13.0±0.5

3.6±0.8

1.5±0.5

+2.0

-0

Unit: mm

330 max

100±1.5

13.0±0.5

31max

1.9±0.5

4.0±0.3

24.4

+2.0

-0

TLP781/TLP781F

2014-09-08

Soldering and Storage

1. Soldering

1.1 Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflow

·Temperature profile example of lead (Pb) solder

·Temperature profile example of using lead (Pb)-free solder

2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)

・Please preheat it at 150°C between 60 and 120 seconds.

・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iron

Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated

at most once.

Time (s)

(°C)

240

210

160

60 to 120s less than 30s

Package surface temperature

140

Time (s)

(°C)

260

230

190

60 to 120s 30 to 50s

180

Package surface temperature

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type

used by the customer within the

described profile.

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type

used by the customer within the

described profile.

TLP781/TLP781F

2014-09-08

2. Storage

1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.

2) Follow the precautions printed on the packing label of the device for transportation and storage.

3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%, respectively.

4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions.

5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can

cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads.

6) When restoring devices after removal from their packing, use anti-static containers.

7) Do not allow loads to be applied directly to devices while they are in storage.

8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you

check the leads for ease of soldering prior to use.

TLP781/TLP781F

2014-09-08

EN60747 Isolation Characteristics

Types: TLP781, TLP781F

Type designations for ‘option: (D4) ’, which are tested under EN60747 requirements.

Ex.: TLP781 (D4-GR-LF6) D4: EN60747 option

GR: CTR rank name

LF6: standard lead bend name

Note: Use TOSHIBA standard type number for safety standard application.

Ex. TLP781 (D4-GR-LF6) → TLP781

Description Symbol Rating Unit

Application classification

for rated mains voltage ≤ 300 Vrms

for rated mains voltage ≤ 600 Vrms

I−IV

I−III

―

Climatic classification 55 / 115 / 21 ―

Pollution degree 2 ―

Maximum operating insulation voltage VIORM 890 Vpk

Input to output test voltage,

Vpr = 1.5×VIORM, type and sample test

p = 10s, partial discharge < 5pC

Vpr 1335 Vpk

Input to output test voltage,

Vpr = 1.875×VIORM, 100% production test

p = 1s, partial discharge < 5pC

Vpr 1670 Vpk

Highest permissible overvoltage

(transient overvoltage, tpr = 60s) VTR 6000 Vpk

Safety limiting values (max. permissible ratings in case of fault)

current (input current IF, Psi = 0)

power (output or total power dissipation)

temperature

Isi

Psi

Tsi

300

500

150

°C

Insulation resistance, VIO = 500V, Ta=25℃ Rsi ≥1012 Ω

TLP781/TLP781F

2014-09-08

Insulation Related Specifications

7.62mm pitch

TLPxxx type

10.16mm pitch

TLPxxxF type

Minimum creepage distance Cr 6.5mm 8.0mm

Minimum clearance Cl 6.5mm 8.0mm

Minimum insulation thickness ti 0.4 mm

Comparative tracking index CTI 175

(1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this

value. (e.g. at a standard distance between soldering eye centres of 7.5mm). If this is not permissible,

the user shall take suitable measures.

(2) This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

VDE test sign: Marking on product

for EN60747

Marking on packing

for EN60747

Marking Example: TLP781, TLP781F

CTR Rank Marking

Lot No.

Device Name

4: Mark for option (D4)

1pin indication

TLP781/TLP781F

2014-09-08

100

1000

0.00 0.40 0.80 1.20 1.60 2.00 2.40

IFP – VFP

Pulse forward current IFP (mA)

Pulse forward voltage VFP (V)

0.1

1.0

10.0

100.0

0.40 0.60 0.80 1.00 1.20 1.40 1.60

100

-20 0 20 40 60 80 100 120

IF – Ta

Allowable forward current

F (mA)

Ambient temperature Ta (℃)

120

PC – Ta

Allowable collector power

dissipation PC (mW)

Ambient temperature Ta (℃)

200

100

160

80 60

20 40 0 −20

120

IF – VF

Forward current IF (mA)

Forward voltage VF (V)

Pulse width ≤ 10μs

Repetitive

frequency=100Hz

Ta = 25℃

-3.0

-2.6

-2.2

-1.8

-1.4

-1.0

-0.6

0 1 10 100

Forward voltage temperature

coefficient ∆VF / ∆Ta ( mV / ℃)

∆VF / ∆Ta

–

Forward current IF (mA)

0.1

*: The above graphs show typical characteristics.

TLP781/TLP781F

2014-09-08

0.0 0.2 0.4 0.6 0.8 1.0 1.2

0.01

0.10

1.00

10.00

100.00

0.1 1 10 100

100

1000

0.1 1 10 100

Collector-emitter voltage VCE (V)

Collector current IC (mA)

IC – VCE

0246810

0.0001

0.001

0.01

0.1

0 20406080100

Collector-emitter voltage VCE (V)

Collector current IC (mA)

IC – VCE

IC – IF

Collector current IC (mA)

Forward current IF (mA)

Ta = 25°C

VCE = 5V

VCE = 0.4V

IC /IF – IF

Current transfer ratio IC / IF (%)

Ta = 25°C

VCE = 5V

VCE = 0.4V

ID – Ta

Ambient tem

erature Ta

(

℃

)

Collector dark current ID (μA)

IF= 2 mA

Forward current IF (mA)

*: The above graphs show typical characteristics.

TLP781/TLP781F

2014-09-08

0.00

0.04

0.08

0.12

0.16

0.20

-40 -20 0 20 40 60 80 100

100

-40 -20 0 20 40 60 80 100

100

1000

1 10 100

Ambient temperature Ta (℃)

Collector-emitter saturation

voltage VCE(sat) (V)

VCE(sat) – Ta

Switching Time – RL

Switching time (μs)

Load resistance RL (kΩ)

tON

Ta = 25°C

IF = 16mA

VCC = 5V

tOFF

IF = 5 mA

IC = 1 mA

Ambient temperature Ta (℃)

Collector current IC (mA)

IC – Ta

VCE = 5V

IF= 0.5 mA

1mA

5mA

10mA

20mA

0.1

*: The above graphs show typical characteristics.

TLP781/TLP781F

2014-09-08

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,

or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all

relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for

Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for

the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product

design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or

applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,

programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for

such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology

products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export

laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export

Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in

compliance with all applicable export laws and regulations.

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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.