HEF4028B BCD to decimal decoder Rev. 06 -- 25 November 2009 Product data sheet 1. General description The HEF4028B is a 4-bit BCD to decimal decoder, a 4-bit BCO to octal decoder with active LOW enable or an 8-output (Y0 to Y7) inverting demultiplexer. The outputs are fully buffered for best performance. When used as a BCD to decimal decoder a 1-2-4-8 BCD code applied to inputs A0 to A3 causes the selected output to be HIGH. The other nine outputs will be LOW. To use the HEF4028B as a BCO to octal decoder, input A3 is an active LOW enable pin and outputs Y8 and Y9 are not used. A 1-2-4 BCO code applied to inputs A0 to A2 causes the selected output (Y0 to Y7) to be HIGH. The other seven outputs will be LOW. When A3 is HIGH outputs (Y0 to Y7) will be forced LOW. When used as an 8-output (Y0 to Y7) inverting demultiplexer A0 to A2 are used as address inputs and A3 is the data input. Outputs Y8 and Y9 are not used. It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS (usually ground). Unused inputs must be connected to VDD, VSS, or another input. It is also suitable for use over the full industrial (-40 C to +85 C) temperature range. 2. Features Fully static operation 5 V, 10 V, and 15 V parametric ratings Standardized symmetrical output characteristics Operates across the full industrial temperature range -40 C to +85 C Complies with JEDEC standard JESD 13-B 3. Applications Industrial 4. Ordering information Table 1. Ordering information All types operate from -40 C to +85 C. Type number Package Name Description Version HEF4028BP DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 HEF4028BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 HEF4028B NXP Semiconductors BCD to decimal decoder 5. Functional diagram A0 A1 10 13 A2 12 A3 11 DECODER 3 Y0 14 Y1 2 Y2 15 Y3 1 6 7 4 9 Y4 Y5 Y6 Y7 Y8 5 Y9 001aae598 Fig 1. Functional diagram Y0 Y1 A0 Y2 Y3 A1 Y4 Y5 A2 Y6 Y7 A3 Y8 Y9 001aae600 Fig 2. Logic diagram HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 2 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder 6. Pinning information 6.1 Pinning HEF4028B Y4 1 16 VDD Y2 2 15 Y3 Y0 3 14 Y1 Y7 4 13 A1 Y9 5 12 A2 Y5 6 11 A3 Y6 7 10 A0 VSS 8 9 Y8 001aae599 Fig 3. Pin configuration 6.2 Pin description Table 2. Pin description Symbol Pin Description Y0 to Y9 3, 14, 2, 15, 1, 6, 7, 4, 9, 5 output (active HIGH) VSS 8 ground supply voltage A0 to A3 10, 13, 12, 11 address input VDD 16 supply voltage 7. Functional description Function table [1] Table 3. Inputs Outputs A3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 L L L L H L L L L L L L L L L L L H L H L L L L L L L L L L H L L L H L L L L L L L L L H H L L L H L L L L L L L H L L L L L L H L L L L L L H L H L L L L L H L L L L L H H L L L L L L L H L L L L H H H L L L L L L L H L L H L L L L L L L L L L L H L HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 3 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder Function table [1] ...continued Table 3. Inputs Outputs A3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 H L L H L L L L L L L L L H H L H X L L L L L L L L L L [2] H H X X L L L L L L L L L L [2] [1] H = HIGH voltage level; L = LOW voltage level; X = don't care. [2] Extraordinary states. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage IIK input clamping current VI input voltage Conditions VI < -0.5 V or VI > VDD + 0.5 V Min Max -0.5 +18 V - 10 mA -0.5 V IOK output clamping current - 10 mA II/O input/output current - 10 mA IDD supply current - 50 mA Tstg storage temperature -65 +150 C Tamb ambient temperature -40 +85 C Ptot total power dissipation P power dissipation VO < -0.5 V or VO > VDD + 0.5 V VDD + 0.5 Unit Tamb = -40 C to +85 C DIP16 package [1] - 750 mW SO16 package [2] - 500 mW - 100 mW per output [1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C. [2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. 9. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VDD supply voltage Conditions Min Typ Max Unit 3 - 15 V VI input voltage 0 - VDD V Tamb ambient temperature in free air -40 - +85 C t/V input transition rise and fall rate VDD = 5 V - - 6.25 s/V VDD = 10 V - - 0.5 s/V VDD = 15 V - - 0.08 s/V HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 4 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder 10. Static characteristics Table 6. Static characteristics VSS = 0 V; VI = VSS or VDD. Symbol Parameter VIH VIL VOH VOL IOH IOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage HIGH-level output current LOW-level output current II input leakage current IDD supply current CI Conditions VDD Tamb = -40 C Tamb = 25 C Tamb = 85 C Unit Min Max Min Max Min Max 5V 3.5 - 3.5 - 3.5 - V 10 V 7.0 - 7.0 - 7.0 - V 15 V 11.0 - 11.0 - 11.0 - V |IO| < 1 A |IO| < 1 A 5V - 1.5 - 1.5 - 1.5 V 10 V - 3.0 - 3.0 - 3.0 V 15 V - 4.0 - 4.0 - 4.0 V 5V 4.95 - 4.95 - 4.95 - V |IO| < 1 A 10 V 9.95 - 9.95 - 9.95 - V 15 V 14.95 - 14.95 - 14.95 - V 5V - 0.05 - 0.05 - 0.05 V 10 V - 0.05 - 0.05 - 0.05 V V |IO| < 1 A 15 V - 0.05 - 0.05 - 0.05 VO = 2.5 V 5V -1.7 - -1.4 - -1.1 - mA VO = 4.6 V 5V -0.52 - -0.44 - -0.36 - mA VO = 9.5 V 10 V -1.3 - -1.1 - -0.9 - mA VO = 13.5 V 15 V -3.6 - -3.0 - -2.4 - mA VO = 0.4 V 5V 0.52 - 0.44 - 0.36 - mA VO = 0.5 V 10 V 1.3 - 1.1 - 0.9 - mA VO = 1.5 V 15 V 3.6 - 3.0 - 2.4 - mA 15 V - 0.3 - 0.3 - 1.0 A 5V - 20 - 20 - 150 A 10 V - 40 - 40 - 300 A 15 V - 80 - 80 - 600 A - - - - 7.5 - - pF Extrapolation formula Min Typ Max Unit 73 ns + (0.55 ns/pF)CL - 100 200 ns 29 ns + (0.23 ns/pF)CL - 40 80 ns 22 ns + (0.16 ns/pF)CL - 30 60 ns 63 ns + (0.55 ns/pF)CL - 90 180 ns 10 V 29 ns + (0.23 ns/pF)CL - 40 80 ns 15 V 22 ns + (0.16 ns/pF)CL - 30 60 ns IO = 0 A input capacitance 11. Dynamic characteristics Table 7. Dynamic characteristics VSS = 0 V; Tamb = 25 C. Symbol Parameter tPHL Conditions HIGH to LOW propagation delay An to Yn; see Figure 4 LOW to HIGH propagation delay An to Yn; see Figure 4 VDD 5V [1] 10 V 15 V tPLH 5V [1] HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 5 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder Table 7. Dynamic characteristics ...continued VSS = 0 V; Tamb = 25 C. Symbol Parameter tt [1] Conditions transition time VDD see Figure 4 Extrapolation formula Min 10 ns + (1.00 ns/pF)CL 10 V 15 V 5V [1] Typ Max Unit - 60 120 ns 9 ns + (0.42 ns/pF)CL - 30 60 ns 6 ns + (0.28 ns/pF)CL - 20 40 ns The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF). Table 8. Dynamic power dissipation PD PD can be calculated from the formulas shown. VSS = 0 V; tr = tf 20 ns; Tamb = 25 C. Symbol Parameter VDD dynamic power dissipation PD Typical formula for PD (W) where: 5V PD = 350 x fi + (fo x CL) x VDD 10 V PD = 2200 x fi + (fo x CL) x VDD 15 V PD = 7350 x fi + (fo x CL) x VDD2 2 fi = input frequency in MHz; 2 fo = output frequency in MHz; CL = output load capacitance in pF; VDD = supply voltage in V; (fo x CL) = sum of the outputs. 12. Waveforms VI An input VM VSS tPHL VOH tt tPLH 90 % VM Yn output VOL 10 % tTHL tTLH 001aah859 Output shown going high when address input goes low, see Table 3. Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 4. Input rise and fall times, propagation delays and output transition times Table 9. Measurement points Supply voltage Input Output VDD VM VM 5 V to 15 V 0.5VDD 0.5VDD HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 6 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder tW VI 90 % negative pulse VM VM 10 % 0V VI tf tr tr tf 90 % positive pulse VM VM 10 % 0V tW 001aaj781 a. Input waveforms VDD VI VO G DUT CL RT 001aag182 b. Test circuit Test data is given in Table 10. Definitions for test circuit: DUT = Device Under Test; CL = load capacitance including jig and probe capacitance; RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig 5. Test circuit for switching times Table 10. Test data Supply voltage Input Load VDD VI tr, tf CL 5 V to 15 V VSS or VDD 20 ns 50 pF HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 7 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.03 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-01-14 03-02-13 SOT38-4 Fig 6. EUROPEAN PROJECTION Package outline SOT38-4 (DIP16) HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 8 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 7. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT109-1 (SO16) HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 9 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder 14. Abbreviations Table 11. Abbreviations Acronym Description BCD Binary Coded Decimal BCO Binary Coded Octal 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes HEF4028B_6 20091125 Product data sheet - HEF4028B_5 Modifications: * Section 9 "Recommended operating conditions", t/V values updated. HEF4028B_5 20090707 Product data sheet HEF4028B_4 20090304 Product data sheet - HEF4028B_CNV_3 HEF4028B_CNV_3 19950101 Product specification - HEF4028B_CNV_2 HEF4028B_CNV_2 19950101 Product specification - - HEF4028B_6 Product data sheet - HEF4028B_4 (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 10 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com HEF4028B_6 Product data sheet (c) NXP B.V. 2009. All rights reserved. Rev. 06 -- 25 November 2009 11 of 12 HEF4028B NXP Semiconductors BCD to decimal decoder 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 November 2009 Document identifier: HEF4028B_6