(Specifications are subject to change without notice. Items pictured may only be
representative.)
Specifications
TYAN Business Unit
MITAC INTERNATIONAL CORP.
S7020
S7020WAGM2NR / S7020AGM2NR
Block Diagram
USA
Tel: +1-510-651-8868
Fax: +1-510-651-7688
Taiwan
Tel: +886-2-2652-5888
Fax: +886-2-2652-5805
China
Shanghai Tel: +86-21-61431188 Ext 1366
China Tel:-86-010-62555015 Ext 8302
Japan
Tel: +81-3-3769-8311
Fax: +81-3-3769-8328
Europe
Sales: +32 2456 1721
Technical Support: +32 2456 1722
ESI
6.4GT/s
6.4GT/s
CPU0
QPI
6.4GT/s
QPI
VRD 11.11.1
for CPU 0 for CPU 0
VRD 11.1 VRD 11.1
for CPU 1 for CPU 1
Intel Xeon
Quad-Core
5520 Series
Intel Xeon
Quad-Core
5520 Series
QPI
QPI
CHA CHA
CHB CHB
CHC CHC
CHD CHD
CHF CHF
CHE CHE
CPU1
DDR3 MEMORY*2
DDR3 MEMORY*2
DDR3 MEMORY*2
DDR3 MEMORY*2
DDR3 MEMORY*2
DDR3 MEMORY*2
5520
IOH
TPM
PCI-X 64/133
PCI-X 64/133
6702PXH
PCI-E Gen.2 x8 (x8)
PCI-E Gen.2 x16 (x16)
ICH10R
SIO
W83627DHG
USB2.0 port *4
USB2.0 header *4 (Front Panel)
(Rear I/O)
(onboard)
USB2.0 Type A *1
D-sub VGA
82574L
82574L
RJ45
RJ45
AST2050
BMC
ALC262
Serial Port *2
PS/2
FDD CONN
LPT Port
HWM W83793G
SATA *6
GLCI
GLCI
PCI-E x8 (x4)
LSI
1068E SAS
(Optional)
Mini SAS Conn
Mini SAS Conn
Intel® Xeon®
5500/5600 series QC/DC processors
LGA1366 / (2)
130W
Up to 4.8/ 5.86/ 6.4GT/s with Intel QuickPath
Interconnect (QPI) support
Intel® 5520 / ICH10R
Winbond W83627DHG
Intel® 6702PXH
(12) DIMM sockets
DDR3 800/1066/1333 RDIMM/UDIMM
Up to 96GB at launch w/ dual rank RDIMMs
6 Channels (3 Channels per CPU)
1.5V
(1) PCI-E Gen.2 x16 slot
(1) PCI-E Gen.2 x8 slot
(1) PCI-E x8 slot (w/ x4 link)
(2) PCI-X 64-bit 133MHz/100MHz slots
(2)
Intel® 82574L
Connector (2) Mini-SAS connectors (support 8 ports)
Controller LSI SAS1068E (S7020WGM2NR only)
Speed 3.0 Gb/s
RAID RAID 0/1/1E (LSI Integrated RAID)
Connector (6) SATA
Controller ICH10R
Speed 3.0 Gb/s
RAID RAID 0/1/10/5 (Intel® Matrix RAID)
D-Sub 15-pin
1600x1200@60Hz
Aspeed AST2050
Realtek ALC262
HDA 2.0 spec. complaint
(9) USB2.0 ports (4 at rear, 4 via cable, 1 type
A onboard)
(2) ports (1 at rear, 1 via cable)
(2) Mini-SAS (4-in-1) connectors
(S7020WGM2NR only)
(1) D-Sub 15-pin VGA port
(1) CD_IN header
(1) 2x5-pin front panel audio header
(1) 2x6-pin rear audio header
(2) GbE ports
(1) LPT header
SSI 24-pin + 8-pin + 8-pin power connectors /
EPS12V
(1) 2x12-pin SSI front panel header
(1) FDD connector
(6) SATA-II connectors
Winbond W83793G
Monitors voltage for CPU, memory, chipset &
power supply
Total (5) 4-pin headers
Total (5) 8-pin headers
PCI-E
Input /Output
PCI-X
Expansion Slots
COM
LPT
SATA
Graphic
Connector type
Audio Chipset
Feature
Feature
Voltage
Fan
SAS
(opt.)
Audio
FDD
Chipset
System
Monitoring
LAN Port Q'ty
Controller
USB
VGA
RJ-45
Power
Front Panel
SATA
Resolution
Chipset
Storage
SAS
(opt.)
Memory
Supported DIMM Qty
DIMM Type / Speed
Capacity
Memory channel
Memory voltage
Chipset
PCI-X Bridge
IOH / ICH
Super I/O
Processor
Supported CPU Series
Socket Type / Q'ty
Thermal Design Power
(TDP) wattage
System Bus (MHz)
Monitors temperature for CPU & system
environment
Chassis intrusion detection
Watchdog timer support
Aspeed AST2050
IPMI 2.0 compliant baseboard management
controller (BMC)
BIOS update
USB 2.0 virtual hub
24-bit high quality video compression
Dual 10/100 Mb/s MAC interfaces
AMI / 4MB
Plug and Play (PnP) / PCI2.3
WfM2.0 / SMBIOS2.3 / PXE boot
ACPI 2.0 power management
Power on mode after power recovery
User-configurable H/W monitoring
Auto-configurable of hard disk types
Multiple boot options
SSI EEB
12"x13" (305x330mm)
Operation
System Please refer to our OS supported list.
Class B
Yes
10° C ~ 35° C (50° F~ 95° F)
- 40° C ~ 70° C (-40° F ~ 158° F)
90%, non-condensing at 35° C
RoHS Yes
System
Monitoring
RoHS 6/6 Complaint
Temperature
Others
Operating
Environment
Operating Temp.
Non-operating Temp.
In/Non-operating
Humidity
OS supported list
Regulation FCC (DoC)
CE (DoC)
Brand / ROM size
Form Factor Form Factor
Board Dimension
Feature
BIOS
Server
Management
Onboard Chipset
AST2050 iKVM Feature
AST2050 IPMI Feature
3-port audio bracket cable is optional
Notice